CN207719147U - A kind of semiconductor plastic package mold with heat dissipation - Google Patents
A kind of semiconductor plastic package mold with heat dissipation Download PDFInfo
- Publication number
- CN207719147U CN207719147U CN201721623885.6U CN201721623885U CN207719147U CN 207719147 U CN207719147 U CN 207719147U CN 201721623885 U CN201721623885 U CN 201721623885U CN 207719147 U CN207719147 U CN 207719147U
- Authority
- CN
- China
- Prior art keywords
- frame
- wire lead
- heat dissipation
- lead slot
- plastic package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model is related to a kind of semiconductor plastic package molds with heat dissipation, including frame, mold slots, wire lead slot and heat sink, it is characterized in that, the mold slots in the frame between position, mold slots are each up and down, and there are two wire lead slots, the wire lead slot is inclined-plane from top to bottom, and cross section is in pyramid-shaped, and wire lead slot has overflow pipe in the junction of frame；There are through-hole in heat sink position among frame and mold slots, heat sink both sides；The heat sink has the bevel edge that epoxyn is formed with mold slots connecting portion.The utility model has the advantages that simple in structure, easy to operate, reliability is high, improves product quality, saves fund input, and manufacturing cost is low, and service life is long.
Description
Technical field
The utility model is related to field of semiconductor processing, especially a kind of semiconductor plastic package mold with heat dissipation.
Background technology
In the prior art, plastic packaging die for plastic packaging of semiconductors, structure include die cavity, and die cavity includes copper frame, setting
Cavity in copper lower portion and the wire lead slot that is connected with cavity, when plastic packaging, capsulation material is full of wire lead slot, this structure
Plastic packaging die for plastic packaging of semiconductors, be also easy to produce excessive glue exception in product sealing and be attached to product frame, also will produce a large amount of
Heat, semiconductor is had an impact.Therefore, one kind can avoid being also easy to produce excessive glue exception when product sealing and be attached to product frame
The plastic packaging die for plastic packaging of semiconductors technology that frame problem generates is particularly important.
Utility model content
Utility model aims to solve above-mentioned existing defect, provide a kind of simple in structure, input cost is few, has
The semiconductor plastic package mold with heat dissipation of high use value.
In order to solve the above technical problems, the structure of the utility model includes frame, mold slots, wire lead slot and heat sink,
The mold slots in the frame between position, mold slots are each there are two wire lead slot up and down, and the wire lead slot is inclined-plane from top to bottom, horizontal
Section is in pyramid-shaped, and wire lead slot has overflow pipe in the junction of frame；Heat sink position among frame and mold slots dissipates
There are through-hole in hot plate both sides；The heat sink has the bevel edge that epoxyn is formed with mold slots connecting portion.
Further, the frame is monel frame.
Further, the mold slots and wire lead slot are in the same horizontal position.
Further, there is the groove that can place semiconductor at position among the mold slots.
Further, there is gap between the wire lead slot and frame.
Further, the overflow pipe of the wire lead slot lower end can be dismantled from wire lead slot.
Further, the heat sink can be dismantled from frame.
A kind of semiconductor plastic package mold with heat dissipation of the utility model, simple in structure, easy to operate, reliability is high,
The heat generated when encapsulation can be reduced using heat sink, damage is generated to semiconductor, improve product quality, save fund throwing
Enter, manufacturing cost is low, and service life is long.
Description of the drawings
Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality
Novel embodiment for explaining the utility model, does not constitute limitations of the present invention together.In the accompanying drawings：
Fig. 1 is the structural schematic diagram of the utility model
Specific implementation mode
The preferred embodiment of the utility model is illustrated below in conjunction with attached drawing, it should be understood that described herein excellent
It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
As shown in Figure 1, the utility model is related to a kind of semiconductor plastic package mold with heat dissipation, including frame 1, mold
Slot 2, wire lead slot 3 and heat sink 4, the mold slots 2 are in 1 centre position of frame, and respectively there are two wire lead slot 3, institutes for about 2 mold slots
It is inclined-plane to state wire lead slot 3 from top to bottom, and cross section is in pyramid-shaped, and wire lead slot 3 has overflow pipe in the junction of frame 1；It is described to dissipate
Hot plate 4 has through-hole 5 in frame 1 and 2 intermediate position of mold slots, 4 both sides of heat sink；The heat sink 4 and 2 connecting portion of mold slots
There is the bevel edge that epoxyn is formed.
Frame 1 is monel frame 1, and with wire lead slot 3 in the same horizontal position, 2 intermediate position of mold slots has mold slots 2
The groove of semiconductor can be placed, has gap, the overflow pipe of 3 lower end of wire lead slot that can be torn open from wire lead slot 3 between wire lead slot 3 and frame 1
It unloads, heat sink 4 can be dismantled from frame 1.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, although ginseng
The utility model is described in detail according to previous embodiment, it for those skilled in the art, still can be with
Technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features.It is all
Within the spirit and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this practicality
Within novel protection domain.
Claims (7)
1. a kind of semiconductor plastic package mold with heat dissipation, including frame, mold slots, wire lead slot and heat sink, feature exist
In, mold slots in the frame between position, mold slots are each up and down, and there are two wire lead slots, and the wire lead slot is oblique from top to bottom
Face, cross section are in pyramid-shaped, and wire lead slot has overflow pipe in the junction of frame；The heat sink is in frame and mold slots middle part
Position, there are through-hole in heat sink both sides；The heat sink has the bevel edge that epoxyn is formed with mold slots connecting portion.
2. the semiconductor plastic package mold according to claim 1 with heat dissipation, it is characterised in that：The frame is ambrose alloy
Alloy framework.
3. the semiconductor plastic package mold according to claim 1 with heat dissipation, it is characterised in that：The mold slots with draw
Wire casing is in the same horizontal position.
4. the semiconductor plastic package mold according to claim 1 with heat dissipation, it is characterised in that：Among the mold slots
There is the groove that can place semiconductor at position.
5. the semiconductor plastic package mold according to claim 1 with heat dissipation, it is characterised in that：The wire lead slot and frame
There is gap between frame.
6. the semiconductor plastic package mold according to claim 1 with heat dissipation, it is characterised in that：The wire lead slot lower end
Overflow pipe can be dismantled from wire lead slot.
7. the semiconductor plastic package mold according to claim 1 with heat dissipation, it is characterised in that：The heat sink can be from
It is dismantled on frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721623885.6U CN207719147U (en) | 2017-11-29 | 2017-11-29 | A kind of semiconductor plastic package mold with heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721623885.6U CN207719147U (en) | 2017-11-29 | 2017-11-29 | A kind of semiconductor plastic package mold with heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207719147U true CN207719147U (en) | 2018-08-10 |
Family
ID=63057464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721623885.6U Active CN207719147U (en) | 2017-11-29 | 2017-11-29 | A kind of semiconductor plastic package mold with heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207719147U (en) |
-
2017
- 2017-11-29 CN CN201721623885.6U patent/CN207719147U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207719147U (en) | A kind of semiconductor plastic package mold with heat dissipation | |
| CN202111076U (en) | High-heat-conduction semi-conductor sealing element | |
| CN104900625A (en) | High-density IDF SOP8 lead frame structure | |
| CN203910845U (en) | Lambert type LED large power packaging structure | |
| CN207441685U (en) | A kind of new stack type chip packaging structure | |
| CN203641955U (en) | LED lamp structure | |
| CN208985979U (en) | A kind of novel total incapsulation TO-220MFK1 lead frame | |
| CN209561386U (en) | A kind of TO-220IR-3L lead frame convenient for plastic packaging processing | |
| CN100490138C (en) | Semiconductor encapsulation structure for improving wafer shift upon pressing | |
| CN207947273U (en) | A kind of lead frame for diode package | |
| CN207217517U (en) | A kind of SMC lead frames | |
| CN206849834U (en) | A kind of lead frame of shock resistance | |
| CN209658163U (en) | Total incapsulation TO-220MF-DGLP-3L lead frame | |
| CN208014690U (en) | A kind of improved 220FW-2L lead frames easy to process | |
| CN103617971A (en) | Injection molding-facilitating lead frame | |
| CN203812869U (en) | Multi-chip SOP packaging structure | |
| CN204424316U (en) | A kind of SOP8 encapsulating lead of great power LED driving chip | |
| CN203617277U (en) | Lead frame convenient for injection molding | |
| CN204178863U (en) | A kind of heat radiation of transformer and fixture | |
| CN209561391U (en) | One kind is novel partly to encapsulate powerful TO-247-2L lead frame | |
| CN103775875B (en) | A kind of LED lamp structure | |
| CN203800034U (en) | Semiconductor device packaging lead frame | |
| CN202332834U (en) | Packaging lead frame for power integrated circuit and packaged unit | |
| CN103130173B (en) | For MEMS chip encapsulation without little island lead frame, array of leadframes and encapsulating structure | |
| CN208000914U (en) | A kind of improved 263-5H lead frames |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |