CN203850286U - Plastic-sealed lead frame suitable for high-temperature environment - Google Patents

Plastic-sealed lead frame suitable for high-temperature environment Download PDF

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Publication number
CN203850286U
CN203850286U CN201420142935.9U CN201420142935U CN203850286U CN 203850286 U CN203850286 U CN 203850286U CN 201420142935 U CN201420142935 U CN 201420142935U CN 203850286 U CN203850286 U CN 203850286U
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CN
China
Prior art keywords
lead frame
fin
heat radiating
plastic
plastic packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420142935.9U
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Chinese (zh)
Inventor
张轩
Original Assignee
张轩
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 张轩 filed Critical 张轩
Priority to CN201420142935.9U priority Critical patent/CN203850286U/en
Application granted granted Critical
Publication of CN203850286U publication Critical patent/CN203850286U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a plastic-sealed lead frame suitable for a high-temperature environment, which is composed of a plurality of lead frame units in one row. The lead frame units are interconnected through a connecting rib. Each lead frame unit comprises a heat radiating fin and lead legs. The connecting parts between the heat radiating fin and the lead legs are bent. The middle part of the heat radiating fin is provided with a plurality of regularly arranged heat radiating small holes. Because the plurality of heat radiating small holes are arranged at the central part of the heat radiating fin of the plastic-sealed lead frame, heat radiating effect of the heat radiating fin can be greatly improved, so that the plastic-sealed lead frame can be applied in the high-power circuit board in high environment temperature.

Description

A kind of plastic packaging lead frame that is applicable to hot environment
Technical field
The utility model relates to a kind of plastic packaging lead frame.
Background technology
Plastic packaging lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging plastic packaging lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of plastic packaging lead frame that is applicable to hot environment.
In order to solve the problems of the technologies described above, the utility model provides a kind of plastic packaging lead frame that is applicable to hot environment, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, described lead frame unit comprises fin and terminal pin, bending in fin and terminal pin junction, is provided with the heat radiation aperture of a plurality of regular distribution in the middle of described fin is provided with.
As further improvement of the utility model, the width of described lead frame unit is 11.405 ± 0.03mm.
As further improvement of the utility model, described lead frame unit is provided with location hole, and the diameter of location hole is 1.524 ± 0.05mm.
As further improvement of the utility model, described fin thickness is 1.27 ± 0.015mm, and terminal pin thickness is 0.38 ± 0.015mm, and fin and terminal pin plane of living in is at a distance of 2.7 ± 0.07mm.
Adopt said structure, its beneficial effect is: in the middle of the fin of this plastic packaging lead frame, set up a plurality of heat radiation apertures, can significantly improve the effect of fin heat radiation, plastic packaging lead frame can be applied to powerful, in the high wiring board of ambient temperature.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is A place enlarged drawing in Fig. 1.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, the 4-aperture that dispels the heat, 5-location hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Fig. 1 and 2, a kind of plastic packaging lead frame that is applicable to hot environment, by 1 single composition of a plurality of lead frames unit, between each lead frame unit 1, by dowel, interconnect, described lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, in the middle of being provided with, described fin 2 is provided with the heat radiation aperture 4 of a plurality of regular distribution, the width of described lead frame unit 1 is 11.405 ± 0.03mm, described lead frame unit 1 is provided with location hole 5, the diameter of location hole 5 is 1.524 ± 0.05mm, described fin 2 thickness are 1.27 ± 0.015mm, terminal pin 3 thickness are 0.38 ± 0.015mm, fin 2 and terminal pin 3 plane of living in are at a distance of 2.7 ± 0.07mm.
In the middle of the fin 2 of this plastic packaging lead frame, set up a plurality of heat radiation apertures 4, can significantly improve the effect of fin 2 heat radiations, plastic packaging lead frame can be applied to powerful, in the high wiring board of ambient temperature.
Within the similar designed plastic packaging lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.

Claims (4)

1. a plastic packaging lead frame that is applicable to hot environment, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, described lead frame unit (1) comprises fin (2) and terminal pin (3), bending in fin (2) and terminal pin (3) junction, it is characterized in that: the heat radiation aperture (4) that is provided with a plurality of regular distribution in the middle of described fin (2) is provided with.
2. a kind of plastic packaging lead frame that is applicable to hot environment according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.03mm.
3. a kind of plastic packaging lead frame that is applicable to hot environment according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (5), and the diameter of location hole (5) is 1.524 ± 0.05mm.
4. a kind of plastic packaging lead frame that is applicable to hot environment according to claim 1, it is characterized in that: described fin (2) thickness is 1.27 ± 0.015mm, terminal pin (3) thickness is 0.38 ± 0.015mm, and fin (2) and terminal pin (3) plane of living in are at a distance of 2.7 ± 0.07mm.
CN201420142935.9U 2014-03-27 2014-03-27 Plastic-sealed lead frame suitable for high-temperature environment Expired - Fee Related CN203850286U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420142935.9U CN203850286U (en) 2014-03-27 2014-03-27 Plastic-sealed lead frame suitable for high-temperature environment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420142935.9U CN203850286U (en) 2014-03-27 2014-03-27 Plastic-sealed lead frame suitable for high-temperature environment

Publications (1)

Publication Number Publication Date
CN203850286U true CN203850286U (en) 2014-09-24

Family

ID=51563266

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420142935.9U Expired - Fee Related CN203850286U (en) 2014-03-27 2014-03-27 Plastic-sealed lead frame suitable for high-temperature environment

Country Status (1)

Country Link
CN (1) CN203850286U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103928422A (en) * 2014-03-27 2014-07-16 张轩 Lead frame suitable for high-temperature environment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103928422A (en) * 2014-03-27 2014-07-16 张轩 Lead frame suitable for high-temperature environment

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140924

Termination date: 20170327