CN203850274U - A thin plastic packaging lead wire framework - Google Patents
A thin plastic packaging lead wire framework Download PDFInfo
- Publication number
- CN203850274U CN203850274U CN201420125852.9U CN201420125852U CN203850274U CN 203850274 U CN203850274 U CN 203850274U CN 201420125852 U CN201420125852 U CN 201420125852U CN 203850274 U CN203850274 U CN 203850274U
- Authority
- CN
- China
- Prior art keywords
- lead wire
- heat radiating
- plastic packaging
- lead frame
- thin plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a thin plastic packaging lead wire framework composed of a plurality of lead wire frame units arranged in a single-row mode. The lead wire frame units are connected with each other through connection ribs. The lead wire frame units comprise heat radiating fins and lead wire pins. The thickness of each heat radiating fin is 0.9+-0.015mm. The thickness of each lead pin is 0.45+-0.01mm. The width of each lead wire frame unit is 11.405+-0.03mm. The lead wire frame units are provided with positioning holes. The diameter of each positioning hole is 1.2+-0.03mm. The heat radiating fins are provided with heat radiating holes. The diameter of each heat radiating hole is 3.84+-0.04mm. Connection portions between the heat radiating fins and the lead wire pins are bent. A plane where the heat radiating fins are and a plane where the conductive wire pins are stagger for 2.67+-0.05mm. The thickness of each heat radiating fin of the plastic packaging lead wire framework decreases from 1.3mm to 0.9mm. Materials are saved; costs are reduced; the thin plastic packaging lead wire framework are with two modes in which a single chip or double chips can be installed; market competitiveness is raised; and the framework can be widely applied to high-grade electronic equipment.
Description
Technical field
The utility model relates to a kind of plastic packaging lead frame.
Background technology
Plastic packaging lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging plastic packaging lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of thin plastic packaging lead frame.
In order to solve the problems of the technologies described above, the utility model provides a kind of thin plastic packaging lead frame, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, described lead frame unit comprises fin and terminal pin, the thickness of fin is 0.9 ± 0.015mm, and terminal pin thickness is 0.45 ± 0.01mm.
As further improvement of the utility model, the width of described lead frame unit is 11.405 ± 0.03mm.
As further improvement of the utility model, described lead frame unit is provided with location hole, and the diameter of location hole is 1.2 ± 0.03mm.
As further improvement of the utility model, described fin is provided with louvre, and louvre diameter is 3.84 ± 0.04mm.
As further improvement of the utility model, bend in described fin and terminal pin junction, fin and the terminal pin plane of living in 2.67 ± 0.05mm that staggers.
Adopt said structure, its beneficial effect is: the fin thickness of this plastic packaging lead frame is reduced to 0.9mm by original 1.3mm, saves material, reduces costs, and can fill equally two kinds of forms of single, double chip, improved the market competitiveness, this framework can be widely used in high-grade electronic equipment.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, 4-location hole, 5-louvre.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Fig. 1, a kind of thin plastic packaging lead frame, by 1 single composition of a plurality of lead frames unit, between each lead frame unit 1, by dowel, interconnect, described lead frame unit 1 comprises fin 2 and terminal pin 3, the thickness of fin 2 is 0.9 ± 0.015mm, terminal pin 3 thickness are 0.45 ± 0.01mm, the width of described lead frame unit 1 is 11.405 ± 0.03mm, described lead frame unit 1 is provided with location hole 4, the diameter of location hole 4 is 1.2 ± 0.03mm, described fin 2 is provided with louvre 5, louvre 5 diameters are 3.84 ± 0.04mm, bend in described fin 2 and terminal pin 3 junctions, fin 2 and the terminal pin 3 plane of living in 2.67 ± 0.05mm that staggers.
Fin 2 thickness of this plastic packaging lead frame are reduced to 0.9mm by original 1.3mm, save material, reduce costs, and can fill equally two kinds of forms of single, double chip, have improved the market competitiveness, and this framework can be widely used in high-grade electronic equipment.
Within the similar designed plastic packaging lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.
Claims (5)
1. a thin plastic packaging lead frame, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, it is characterized in that: described lead frame unit (1) comprises fin (2) and terminal pin (3), the thickness of fin (2) is 0.9 ± 0.015mm, and terminal pin (3) thickness is 0.45 ± 0.01mm.
2. a kind of thin plastic packaging lead frame according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.03mm.
3. a kind of thin plastic packaging lead frame according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (4), and the diameter of location hole (4) is 1.2 ± 0.03mm.
4. a kind of thin plastic packaging lead frame according to claim 1, is characterized in that: described fin (2) is provided with louvre (5), and louvre (5) diameter is 3.84 ± 0.04mm.
5. a kind of thin plastic packaging lead frame according to claim 1, is characterized in that: bend in described fin (2) and terminal pin (3) junction, fin (2) and terminal pin (3) the plane of living in 2.67 ± 0.05mm that staggers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420125852.9U CN203850274U (en) | 2014-03-20 | 2014-03-20 | A thin plastic packaging lead wire framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420125852.9U CN203850274U (en) | 2014-03-20 | 2014-03-20 | A thin plastic packaging lead wire framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203850274U true CN203850274U (en) | 2014-09-24 |
Family
ID=51563254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420125852.9U Expired - Fee Related CN203850274U (en) | 2014-03-20 | 2014-03-20 | A thin plastic packaging lead wire framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203850274U (en) |
-
2014
- 2014-03-20 CN CN201420125852.9U patent/CN203850274U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TAIZHOU YOURUN ELECTRONIC CO., LTD. Free format text: FORMER OWNER: ZHANG XUAN Effective date: 20150731 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150731 Address after: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Taizhou Yourun Electronic Co., Ltd. Address before: 225324, Jiangsu Taizhou hi tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard workshop area 126 Patentee before: Zhang Xuan |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Friends of Taizhou run electronic Polytron Technologies Inc Address before: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee before: Taizhou Yourun Electronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20170320 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |