CN103617979A - Plastic package lead frame convenient to package - Google Patents
Plastic package lead frame convenient to package Download PDFInfo
- Publication number
- CN103617979A CN103617979A CN201310549944.XA CN201310549944A CN103617979A CN 103617979 A CN103617979 A CN 103617979A CN 201310549944 A CN201310549944 A CN 201310549944A CN 103617979 A CN103617979 A CN 103617979A
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- Prior art keywords
- lead frame
- package
- convenient
- lead
- fin
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a plastic package lead frame convenient to package. The plastic package lead frame convenient to package is composed of a single row of a plurality of lead frame units, wherein the lead frame units are connected through connection ribs. Each lead frame unit comprises a base body and lead pins, wherein the position where the base body is connected with the lead pins is bent, the lead pins are provided with bonding areas, each bonding area is provided with two creases, the base body is divided into a cooling fin and a fin carrier area, a round hole is formed in the center of the cooling fin, and the fin carrier area is provided with a U-shaped groove. According to the plastic package lead frame convenient to package, each bonding area of one lead pin is additionally provided with the two creases, base points can be targeted conveniently when a line is bound to the bonding areas, the packaging efficiency is high, and meanwhile the plastic package lead frame convenient to package is good in cooling effect and can be located accurately.
Description
Technical field
The present invention relates to a kind of plastic packaging lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of plastic packaging lead frame.
In order to solve the problems of the technologies described above, the invention provides a kind of plastic packaging lead frame of being convenient to encapsulation, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, described terminal pin is provided with bonding region, and bonding region is provided with twice impression.
As a further improvement on the present invention, described matrix is divided into fin and slide glass district.
As a further improvement on the present invention, described fin central authorities are provided with circular hole.
As a further improvement on the present invention, described slide glass district is provided with U-shaped groove.
Adopt said structure, its beneficial effect is: this lead frame increases twice impression in the bonding region of terminal pin, while being convenient to bonding region routing, finds basic point accurately, makes packaging efficiency high, this framework good heat dissipation effect of while, accurate positioning.
Accompanying drawing explanation
Fig. 1 is the structural representation of plastic packaging lead frame of the present invention.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-bonding region, 5-impression, 6-fin ，7-slide glass district, 8-circular hole, 9-U type groove.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Figure 1, a kind of plastic packaging lead frame of being convenient to encapsulation, by 1 single composition of a plurality of lead frames unit, lead frame unit 1 width is 11.405 ± 0.03mm, between each lead frame unit 1, by dowel, interconnect, lead frame unit 1 comprises matrix 2 and terminal pin 3, matrix 2 thickness are 1.27 ± 0.015mm, terminal pin 3 thickness are 0.38 ± 0.015mm, bend in matrix 2 and terminal pin 3 junctions, make matrix 2 and terminal pin 3 planes at a distance of 2.67 ± 0.1mm, described terminal pin 3 is provided with bonding region 4, bonding region 4 is provided with twice impression 5, the dark 0.05mm of described impression 5, wide 1.23 ± 0.05mm, described matrix 1 is divided into fin 6 and slide glass district 7, described fin 6 central authorities are provided with circular hole 8, circular hole 8 diameters are 3.85 ± 0.05mm, described slide glass district 7 is provided with U-shaped groove 9.
This lead frame increases twice impression in the bonding region of terminal pin, while being convenient to bonding region routing, finds basic point accurately, makes packaging efficiency high, this framework good heat dissipation effect of while, accurate positioning.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (4)
1. be convenient to the plastic packaging lead frame encapsulating for one kind, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, it is characterized in that: lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, described terminal pin (3) is provided with bonding region (4), and bonding region (4) are provided with twice impression (5).
2. a kind of plastic packaging lead frame of being convenient to encapsulation according to claim 1, is characterized in that: described matrix (1) is divided into fin (6) and slide glass district (7).
3. a kind of plastic packaging lead frame of being convenient to encapsulation according to claim 2, is characterized in that: described fin (6) central authorities are provided with circular hole (8).
4. a kind of plastic packaging lead frame of being convenient to encapsulation according to claim 2, is characterized in that: described slide glass district (7) is provided with U-shaped groove (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310549944.XA CN103617979A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame convenient to package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310549944.XA CN103617979A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame convenient to package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617979A true CN103617979A (en) | 2014-03-05 |
Family
ID=50168682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310549944.XA Pending CN103617979A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame convenient to package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617979A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943594A (en) * | 2014-03-26 | 2014-07-23 | 张轩 | Lead framework suitable for high-power electric appliance |
| CN104392977A (en) * | 2014-10-16 | 2015-03-04 | 东莞市柏尔电子科技有限公司 | Packaging triode |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201229942Y (en) * | 2008-11-07 | 2009-04-29 | 宁波华龙电子股份有限公司 | Dual row dual column thin type lead frame board |
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| CN203617281U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame convenient for packaging |
-
2013
- 2013-11-08 CN CN201310549944.XA patent/CN103617979A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| CN201229942Y (en) * | 2008-11-07 | 2009-04-29 | 宁波华龙电子股份有限公司 | Dual row dual column thin type lead frame board |
| CN203617281U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame convenient for packaging |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943594A (en) * | 2014-03-26 | 2014-07-23 | 张轩 | Lead framework suitable for high-power electric appliance |
| CN104392977A (en) * | 2014-10-16 | 2015-03-04 | 东莞市柏尔电子科技有限公司 | Packaging triode |
| CN104392977B (en) * | 2014-10-16 | 2017-04-12 | 东莞市柏尔电子科技有限公司 | Packaging triode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |