CN103617980A - Plastic package lead frame with sawtooth indentations - Google Patents
Plastic package lead frame with sawtooth indentations Download PDFInfo
- Publication number
- CN103617980A CN103617980A CN201310549993.3A CN201310549993A CN103617980A CN 103617980 A CN103617980 A CN 103617980A CN 201310549993 A CN201310549993 A CN 201310549993A CN 103617980 A CN103617980 A CN 103617980A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- plastic package
- plastic packaging
- base body
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a plastic package lead frame with sawtooth indentations. The plastic package lead frame is composed of multiple lead frame units in a single-row mode. All the lead frame units are mutually connected through connection ribs. Each lead frame unit comprises a base body and a lead pin, wherein the joint of the base body and the lead pin is bent, the base body is provided with a piece sticking area, a cooling fin is arranged on the end portion of the lead pin, the periphery of the piece sticking area is provided with the sawtooth indentations, the cooling fin is provided with a notch, the angle of the notch is 90 degrees, the depth of the notch is 0.05mm, and a round hole is formed in the base body. According to the plastic package lead frame, combination of plastic package materials and a frame body is enhanced, fragments generated by vibration of a chip are avoided, the heat dissipation effect is better, and the plastic package lead frame is applicable to high-temperature electric appliances which work for a long time with large power, safe and reliable.
Description
Technical field
The present invention relates to a kind of plastic packaging lead frame.
Background technology
Plastic packaging lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of plastic packaging lead frame of band saw tooth pressure trace.
In order to solve the problems of the technologies described above, the invention provides a kind of plastic packaging lead frame of band saw tooth pressure trace, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, described lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, described matrix is provided with bonding die district, and terminal pin end is provided with fin.
As a further improvement on the present invention, described bonding die district is provided with sawtooth impression around.
As a further improvement on the present invention, described fin is provided with breach, and Notch angle is 90 °, and the degree of depth is 0.05mm.
As a further improvement on the present invention, described matrix is provided with circular hole.
Adopt said structure, its beneficial effect is: this plastic packaging lead frame bonding die district is provided with sawtooth impression, on matrix, establish round orifices orientation, can strengthen the combination of plastic packaging material and framework, prevent that chip from producing fragment because of vibrations, radiating effect is better simultaneously, is applicable to long-time, powerful high temperature electrical equipment and uses, safe and reliable.
Accompanying drawing explanation
Fig. 1 is the structural representation of plastic packaging lead frame of the present invention.
Fig. 2 be in Fig. 1 A-A to view.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin ，4-bonding die district, 5-fin, 6-sawtooth impression, 7-breach, 8-circular hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As illustrated in fig. 1 and 2, a kind of plastic packaging lead frame of band saw tooth pressure trace, by 1 single composition of a plurality of lead frames unit, the width of lead frame unit 1 is 11.405 ± 0.03mm, between each lead frame unit 1, by dowel, interconnect, described lead frame unit 1 comprises matrix 2 and terminal pin 3, matrix 2 thickness are 1.25 ± 0.015mm, terminal pin 3 thickness are 0.45 ± 0.015mm, bend in matrix 2 and terminal pin 3 junctions, make matrix 2 and terminal pin 3 place planes at a distance of 2.65 ± 0.15mm, described matrix 2 is provided with bonding die district 4, terminal pin 3 ends are provided with fin 5, described bonding die district 4 is provided with sawtooth impression 6 around, described fin 5 is provided with breach 7, breach 7 angles are 90 °, the degree of depth is 0.05mm, described matrix 2 is provided with circular hole 8, circular hole 8 diameters are 3.79 ± 0.05mm.
This plastic packaging lead frame has strengthened the combination of plastic packaging material and framework, can prevent that chip from producing fragment because of vibrations, and radiating effect is better simultaneously, is applicable to long-time, powerful high temperature electrical equipment and uses, safe and reliable.
Within the similar designed plastic packaging lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (4)
1. the plastic packaging lead frame of a band saw tooth pressure trace, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, it is characterized in that: described lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, described matrix (2) is provided with bonding die district (4), and terminal pin (3) end is provided with fin (5).
2. the plastic packaging lead frame of a kind of band saw tooth pressure trace according to claim 1, is characterized in that: described bonding die district (4) is provided with sawtooth impression (6) around.
3. the plastic packaging lead frame of a kind of band saw tooth pressure trace according to claim 1, is characterized in that: described fin (5) is provided with breach (7), and breach (7) angle is 90 °, and the degree of depth is 0.05mm.
4. the plastic packaging lead frame of a kind of band saw tooth pressure trace according to claim 1, is characterized in that: described matrix (2) is provided with circular hole (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310549993.3A CN103617980A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with sawtooth indentations |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310549993.3A CN103617980A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with sawtooth indentations |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617980A true CN103617980A (en) | 2014-03-05 |
Family
ID=50168683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310549993.3A Pending CN103617980A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with sawtooth indentations |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617980A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943597A (en) * | 2014-03-28 | 2014-07-23 | 张轩 | Lead frame applicable to high-temperature electric equipment |
| CN103943587A (en) * | 2014-03-20 | 2014-07-23 | 张轩 | Lead frame for high-power electrical appliance |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006202976A (en) * | 2005-01-20 | 2006-08-03 | Nippon Inter Electronics Corp | Resin sealed semiconductor device and lead frame |
| CN2929961Y (en) * | 2006-04-15 | 2007-08-01 | 宁波康强电子股份有限公司 | Improved triode lead frame |
| CN201549495U (en) * | 2009-12-22 | 2010-08-11 | 宁波华龙电子股份有限公司 | Directly inserted triode lead frame |
| CN201868419U (en) * | 2010-11-08 | 2011-06-15 | 宁波康强电子股份有限公司 | Lead frame for manufacture of semiconductor discrete devices |
| CN203617287U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame with sawtooth pressing marks |
-
2013
- 2013-11-08 CN CN201310549993.3A patent/CN103617980A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006202976A (en) * | 2005-01-20 | 2006-08-03 | Nippon Inter Electronics Corp | Resin sealed semiconductor device and lead frame |
| CN2929961Y (en) * | 2006-04-15 | 2007-08-01 | 宁波康强电子股份有限公司 | Improved triode lead frame |
| CN201549495U (en) * | 2009-12-22 | 2010-08-11 | 宁波华龙电子股份有限公司 | Directly inserted triode lead frame |
| CN201868419U (en) * | 2010-11-08 | 2011-06-15 | 宁波康强电子股份有限公司 | Lead frame for manufacture of semiconductor discrete devices |
| CN203617287U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame with sawtooth pressing marks |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943587A (en) * | 2014-03-20 | 2014-07-23 | 张轩 | Lead frame for high-power electrical appliance |
| CN103943597A (en) * | 2014-03-28 | 2014-07-23 | 张轩 | Lead frame applicable to high-temperature electric equipment |
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Legal Events
| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |