CN104392977A - Packaging triode - Google Patents

Packaging triode Download PDF

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Publication number
CN104392977A
CN104392977A CN201410549230.3A CN201410549230A CN104392977A CN 104392977 A CN104392977 A CN 104392977A CN 201410549230 A CN201410549230 A CN 201410549230A CN 104392977 A CN104392977 A CN 104392977A
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CN
China
Prior art keywords
triode
groove
fin
pin
pins
Prior art date
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Granted
Application number
CN201410549230.3A
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Chinese (zh)
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CN104392977B (en
Inventor
崔华生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN GOODPAL ELECTRONIC TECHNOLOGY Co Ltd
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SHENZHEN GOODPAL ELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN201410549230.3A priority Critical patent/CN104392977B/en
Publication of CN104392977A publication Critical patent/CN104392977A/en
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Publication of CN104392977B publication Critical patent/CN104392977B/en
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Disclosed in the invention is a packaging triode comprising a pedestal, a triode body, three pins, a cooling fin, and a sealing cap. A triode groove, three pin grooves, a communicating groove of the pin grooves and the triode groove, and a cooling fin groove are formed in the pedestal. Buckles are arranged at the edges of the pedestal. The sealing cap is clamped at the pedestal; and a triode clamping block, three pin clamping blocks and cooling fin clamping block are arranged at the bottom surface of the sealing cap. According to the technical scheme, the triode body is clamped in the triode groove by the triode clamping block at the sealing cap bottom surface; the pins are clamped in the pin grooves by the three pin clamping blocks; and the cooling fin is clamped in the cooling fin groove by the cooling fin clamping block. The clamping is realized in a tight clamping mode, so that positioning stability of the triode, the three pins, and the cooling fin are guaranteed. Therefore, when the packaging triode needs to be dismounted, the triode body, the three pins, and the cooling fin can be taken out only by removing the sealing cap from the pedestal, so that dismounting of the packaging diode becomes convenient.

Description

A kind of encapsulation triode
Technical field
The present invention relates to triode manufacturing technology field, in particular to one encapsulation triode.
Background technology
At present, the encapsulation triode be connected on electronic circuit board plays the effect of switch and amplification.The whole region, paster base island corresponding to three pins of existing encapsulation triode is all provided with silver-plated district, and triode is mounted on by conducting resinl and is provided with on the paster Ji Dao in silver-plated district; And this structure exists certain shortcoming, because whole region, paster base island is all provided with silver-plated district, thus cause pin production cost higher, and triode is mounted on to be provided with on silver-plated district paster Ji Dao and easily produces layering, reliability is low.
For solving the problems of the technologies described above, Authorization Notice No. CN201838584U, a kind of encapsulation triode of the disclosure of the invention in authorized announcement date on May 18th, 2011, comprise triode, three pins and packaging body, first paster Ji Dao of described first pin and the 3rd paster Ji Dao of the 3rd pin is respectively equipped with corresponding silver-plated district, the collector electrode of described triode is mounted on the second paster Ji Dao of the second pin, the base stage of triode is electrically connected with the silver-plated district on the first paster Ji Dao by metal lead wire, the collector electrode of triode is electrically connected with the silver-plated district on the 3rd paster Ji Dao by metal lead wire, described triode, first paster Ji Dao of the first pin, 3rd paster Ji Dao of the back side of the second paster Ji Dao of the second pin and dual-side and the 3rd pin is all encapsulated in packaging body, the back side of the second pin is exposed outside packaging body, the area in the silver-plated district on the silver-plated district on the first paster Ji Dao and the 3rd paster Ji Dao is less than or equal to the half of the first paster Ji Dao and the 3rd paster base island area respectively.
Although technique scheme decreases the consumption of silver-plated district silver, save cost, the collector electrode of described triode is mounted on the second paster Ji Dao of the second pin by conductive adhesive, so, be extremely inconvenient to the dismounting of triode.
Summary of the invention
Technical problem solved by the invention: encapsulation triode of the prior art because the electrode of triode is connected with pin by conducting resinl, so, is extremely inconvenient to the dismounting of triode.
The invention provides following technical scheme: a kind of encapsulation triode, comprise base, triode, three pins, fin, capping.Described base is offered triode groove, the connectivity slot of three pin grooves, pin groove and triode grooves, fin groove, described base edge is provided with buckle.Described triode is arranged in triode groove, described three pins are arranged in pin groove, and described three pins are by the Electrode connection of wire and triode, and described wire is arranged in connectivity slot, described fin is arranged in fin groove, and described fin contacts with triode.Described capping is fastened on base, described capping bottom surface is established triode fixture block, three pin fixture blocks, fin fixture blocks, described triode fixture block is fastened in triode groove, and described pin fixture block is fastened in pin groove, and described fin fixture block is fastened in fin groove.
By technique scheme, triode is fastened in triode groove by the triode fixture block on capping bottom surface, and pincard is combined in pin draw-in groove by three pin fixture blocks, and fin is fastened in fin groove by fin fixture block.Above-mentioned engaging is tight engaging, with the steadiness ensureing triode, three pins, fin are located.
By technique scheme, to dismantle described encapsulation triode, only capping need be taken away from base, can take out triode, three pins, fin, so, the dismounting of described encapsulation triode is more convenient.
As a further improvement on the present invention, described cover rim offers draw-in groove, and described buckle coordinates with draw-in groove.Design like this, when capping is fastened on base, buckle coordinates with draw-in groove, is fastened on stability on base to improve capping.
As a further improvement on the present invention, protuberance is established in described pin groove.Described pin is established the groove matched with pin groove inner bulge, so design, even if there is external force pull pin, pin also can not from base by pull out.
As a further improvement on the present invention, recess is established in described fin groove.Accordingly, fin is provided with protuberance, so, to ensure that fin is positioned in fin groove exactly.
As a further improvement on the present invention, described fin is positioned at bottom triode, and fin contacts with bottom triode, and the fin of outstanding base edge can dispel the heat better.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the present invention is described further:
Fig. 1 is a kind of structural representation encapsulating triode of the present invention;
Fig. 2 is the structural representation of base in Fig. 1;
Fig. 3 is the structural representation of capping in Fig. 1;
Fig. 4 is the structural representation observing described capping gained in Fig. 3 from below;
Fig. 5 is the structural representation in Fig. 2 after floor installation fin and pin.
Symbol description in figure:
10-base; 11-buckle; 101-triode groove; 102-pin groove; 103-connectivity slot; 104-fin groove;
30-pin;
40-fin;
50-capping; 501-triode fixture block; 502-pin fixture block; 503-fin fixture block; 504-draw-in groove.
Embodiment
As shown in Figure 1, a kind of encapsulation triode, comprises base 10, triode, three pins 30, fin 40, capping 50.
As shown in Figure 2, described base 10 is offered connectivity slot 103, the fin groove 104 of triode groove 101, three pin grooves 102, pin groove 102 and triode groove 101.Wherein, described triode groove 101 is communicated with fin groove 104; Protuberance 1020 is established in described pin groove 102; Recess 1040 is established in described fin groove 104.Described base 10 edge is provided with buckle 11.
As shown in Figure 5, first described fin 40 is arranged in fin groove 104, and described fin 40 extends in triode groove 101, and fin 40 gives prominence to base 10 edge.Afterwards, triode is arranged in triode groove 101, and triode is positioned at the top of fin 40, and triode bottom surface contacts with fin 40 upper surface.Described three pins 30 are arranged in pin groove 102, and described three pins 30 are connected respectively by the base stage of wire and triode, collector electrode, emitter, and described wire is arranged in connectivity slot 103.
As shown in Figure 3, Figure 4, described capping 50 bottom surface is established triode fixture block 501, three pin fixture blocks 502, fin fixture blocks 503, described capping 50 edge draw-in groove 504.Described capping 50 is fastened on base 10, and described buckle 11 coordinates with draw-in groove 504.Described triode fixture block 501 is fastened in triode groove 101, and triode is stabilized in triode groove 101 by triode fixture block 501 securely; Described pin fixture block 502 is fastened in pin groove 102, and pin 30 is stabilized in pin groove 102 by pin fixture block 502 securely; Described fin fixture block 503 is fastened in fin groove 104, and fin 40 is stabilized in fin groove 104 by fin fixture block 503 securely.
During actual assembled encapsulation triode of the present invention, three pins 30 all offer recess, and the protuberance 1020 of described recess and pin groove 102 matches.Fin 40 establishes protuberance, and the recess 1040 of described protuberance and fin groove 104 matches.Design like this, is not pulled out base 10 by external force to avoid three pins 30 and fin 40.
Above content is only better embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.

Claims (5)

1. an encapsulation triode, comprise base (10), triode, three pins (30), fin (40), described triode is arranged on base (10), the Electrode connection of described three pins (30) and triode, described fin (40) contacts with triode, it is characterized in that: also comprise capping (50), described base (10) is offered triode groove (101), three pin grooves (102), the connectivity slot (103) of pin groove (102) and triode groove (101), fin groove (104), described base (10) edge is provided with buckle (11), described triode is arranged in triode groove (101), described three pins (30) are arranged in pin groove (102), described three pins (30) are by the Electrode connection of wire and triode, described wire is arranged in connectivity slot (103), described fin (40) is arranged in fin groove (104), described capping (50) is fastened on base (10), described capping (50) bottom surface is established triode fixture block (501), three pin fixture blocks (502), fin fixture block (503), described triode fixture block (501) is fastened in triode groove (101), described pin fixture block (502) is fastened in pin groove (102), described fin fixture block (503) is fastened in fin groove (104).
2. a kind of encapsulation triode as claimed in claim 1, it is characterized in that: described capping (50) edge draw-in groove (504), described buckle (11) coordinates with draw-in groove (504).
3. a kind of encapsulation triode as claimed in claim 1, is characterized in that: establish protuberance (1020) in described pin groove (102).
4. a kind of encapsulation triode as claimed in claim 1, is characterized in that: establish recess (1040) in described fin groove (104).
5. a kind of encapsulation triode as claimed in claim 1, it is characterized in that: described fin (40) is positioned at bottom triode, described fin (40) gives prominence to base (10) edge.
CN201410549230.3A 2014-10-16 2014-10-16 Packaging triode Active CN104392977B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410549230.3A CN104392977B (en) 2014-10-16 2014-10-16 Packaging triode

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Application Number Priority Date Filing Date Title
CN201410549230.3A CN104392977B (en) 2014-10-16 2014-10-16 Packaging triode

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CN104392977A true CN104392977A (en) 2015-03-04
CN104392977B CN104392977B (en) 2017-04-12

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449568A (en) * 2016-09-28 2017-02-22 上海斐讯数据通信技术有限公司 Triode and cooling fin-combined material assembly structure
CN107742641A (en) * 2017-10-27 2018-02-27 温州市洞头立德电子有限公司 A kind of triode with shock-absorbing function
CN113035807A (en) * 2021-03-08 2021-06-25 广东神思半导体有限公司 Triode with stable heat radiation structure
CN113257745A (en) * 2021-04-22 2021-08-13 东莞市柏尔电子科技有限公司 Triode convenient to encapsulation

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030193080A1 (en) * 2002-04-16 2003-10-16 Cabahug Elsie Agdon Robust leaded molded packages and methods for forming the same
CN201820750U (en) * 2010-09-15 2011-05-04 晶诚(郑州)科技有限公司 Packaging structure of high-power tube
CN202034361U (en) * 2010-09-15 2011-11-09 晶诚(郑州)科技有限公司 Semiconductor packaging structure
CN103413792A (en) * 2013-07-19 2013-11-27 昆山维金五金制品有限公司 Cooling fin convenient to install
CN103617979A (en) * 2013-11-08 2014-03-05 张轩 Plastic package lead frame convenient to package
CN204216030U (en) * 2014-10-16 2015-03-18 东莞市柏尔电子科技有限公司 A kind of encapsulation triode

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030193080A1 (en) * 2002-04-16 2003-10-16 Cabahug Elsie Agdon Robust leaded molded packages and methods for forming the same
CN201820750U (en) * 2010-09-15 2011-05-04 晶诚(郑州)科技有限公司 Packaging structure of high-power tube
CN202034361U (en) * 2010-09-15 2011-11-09 晶诚(郑州)科技有限公司 Semiconductor packaging structure
CN103413792A (en) * 2013-07-19 2013-11-27 昆山维金五金制品有限公司 Cooling fin convenient to install
CN103617979A (en) * 2013-11-08 2014-03-05 张轩 Plastic package lead frame convenient to package
CN204216030U (en) * 2014-10-16 2015-03-18 东莞市柏尔电子科技有限公司 A kind of encapsulation triode

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449568A (en) * 2016-09-28 2017-02-22 上海斐讯数据通信技术有限公司 Triode and cooling fin-combined material assembly structure
CN106449568B (en) * 2016-09-28 2019-07-05 上海斐讯数据通信技术有限公司 The two-in-one materials and parts package assembly of triode and cooling fin
CN107742641A (en) * 2017-10-27 2018-02-27 温州市洞头立德电子有限公司 A kind of triode with shock-absorbing function
CN113035807A (en) * 2021-03-08 2021-06-25 广东神思半导体有限公司 Triode with stable heat radiation structure
CN113257745A (en) * 2021-04-22 2021-08-13 东莞市柏尔电子科技有限公司 Triode convenient to encapsulation
CN113257745B (en) * 2021-04-22 2022-06-17 东莞市柏尔电子科技有限公司 Triode convenient to encapsulation

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Denomination of invention: A packaged transistor

Effective date of registration: 20230406

Granted publication date: 20170412

Pledgee: China Co. truction Bank Corp Dongguan branch

Pledgor: DONGGUAN GOODPAL ELECTRONIC TECHNOLOGY CO.,LTD.

Registration number: Y2023980037464