CN107742641A - A kind of triode with shock-absorbing function - Google Patents
A kind of triode with shock-absorbing function Download PDFInfo
- Publication number
- CN107742641A CN107742641A CN201711020705.XA CN201711020705A CN107742641A CN 107742641 A CN107742641 A CN 107742641A CN 201711020705 A CN201711020705 A CN 201711020705A CN 107742641 A CN107742641 A CN 107742641A
- Authority
- CN
- China
- Prior art keywords
- base
- groove
- pin
- lid shell
- triode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000011229 interlayer Substances 0.000 claims abstract description 9
- 238000005260 corrosion Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 6
- 229920000742 Cotton Polymers 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- AXQKVSDUCKWEKE-UHFFFAOYSA-N [C].[Ge].[Si] Chemical compound [C].[Ge].[Si] AXQKVSDUCKWEKE-UHFFFAOYSA-N 0.000 claims description 3
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 claims description 3
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- -1 bubble bags Polymers 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000004745 nonwoven fabric Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000002023 wood Substances 0.000 claims description 3
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 238000013016 damping Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Micromachines (AREA)
Abstract
A kind of triode with shock-absorbing function, including base, lid shell, pin and support, described base are provided with groove, and the edge of its base is provided with buckle；The edge side of lid shell is provided with neck, and it is in hollow state, referred to as the first cavity that lid shell is internal after engaging with base, chip is provided with first cavity, chip is located in the groove of base, is welded and fixed between the two, and its chip is divided into three regions, three regions are respectively launch site, base and collecting zone, launch site, base and collecting zone laid out in parallel, lid shell inwall are provided with interlayer, are in hollow state in interlayer, referred to as the second cavity, the second cavity is interior to be filled with vibration-absorptive material；Described pin has three, and respectively the first pin, second pin and the 3rd pin, three pins are located at the side of base side by side；Described support is located at the bottom of base；The present invention provides a kind of triode that can slow down damping.
Description
Technical field
The invention belongs to the triode manufacturing process technology field in integrated circuit, more particularly to one kind to have shock-absorbing function
Triode.
Background technology
Transistor promotes and brings " solid-state revolution ", and then has promoted the semiconductor electronics industry in global range；Make
For critical piece, it in time, be generally applied first in terms of communication tool, and generates huge economic benefit；By
The structure of electronic circuit is revolutionized in transistor, integrated circuit and large scale integrated circuit arise at the historic moment, and so manufacture
As the high-accuracy device of high-speed electronic computer etc has reformed into reality；Transistor, it is the most frequently used basic component
One of, the effect of transistor is mainly Current amplifier, and he is the core parts of electronic circuit, and present large-scale integrated is electric
The element i.e. transistor on road；Its triode substantially makes two apart on a block semiconductor substrate
Bulk semiconductor is divided into three parts by close PN junction, two PN junctions, and center section is base, two side portions be launch site and
Collecting zone, arrangement mode have two kinds of PNP and NPN, and corresponding electrode, respectively ground level b, emitter e, He Ji are drawn from three areas
Electrode c, the PN junction between launch site and base is emitter junction, and the PN junction between collecting zone and base is basic point knot.
Now, existing triode mainly have low-power transistor, middle pliotron and large power triode, thereon
The triode for stating three power is problematic in that triode is easily damaged in collision and can not used, that is, needs manufacture one kind to subtract
Shake the triode of function.
The content of the invention
It is an object of the invention to provide a kind of triode with shock-absorbing function, its lid shell and internal stent are designed with subtracting
Blanket, that is, the effect of damping compression-resistant is reached, the assembling fin being internally provided with serves the effect of radiating.
In order to solve the above technical problems, the present invention is addressed by following technical proposals：It is a kind of with shock-absorbing function
Triode, including base, lid shell, pin and support, described base are provided with groove, and the edge of its base is provided with buckle；Lid
The edge side of shell is provided with neck, and its lid shell is fastened by the buckle of neck and base, and lid shell is internal after engaging with base to be in
Hollow state, referred to as the first cavity, the first cavity is interior to be provided with chip, and chip is located in the groove of base, and welding is solid between the two
Fixed, its chip is divided into three regions, and three regions are respectively launch site, base and collecting zone, and launch site, base and collecting zone are simultaneously
Row arrangement, and base be located among launch site and collecting zone, and lid shell inwall is provided with interlayer, and it is in hollow state that interlayer is interior, and referred to as the
Two cavitys, the second cavity is interior to be filled with vibration-absorptive material；Described pin has three, respectively the first pin, second pin and
Three pins, three pins are located at the side of base side by side；Described support is located at the bottom of base.
Further, described base is made up of frivolous semi-conducting material, and base is in cuboid, and described lid shell is by moulding
Material material is made, and lid shell is also cuboid, and the side of lid shell is provided with three openings, and opening is rectangle；What base was provided with
Groove has at 4, respectively the first groove, the second groove, the 3rd groove and the 4th groove, and is communicated with groove between each groove,
Its first groove, the second groove and the 3rd groove laid out in parallel, its 4th groove with remaining at 3 texturearunaperpendicular arrange, base
Side is provided with assembling fin, in the installation of assembling fin and the 4th groove, and assembles fin one end and raises up, along lid
The inwall of shell is protruding upward, leads to outer surface through lid shell bottom, assembles and is provided with admittedly between fin and the 4th groove and lid shell
Determine connector, described fixedly connected part is mode connects for screw, and assembles and be provided with copper gasket, copper pad between fin and chip
Piece is provided with connectivity slot.
Further, described assembling fin is referred to as radiating surface backwards to chip-side, otherwise object chip side is referred to as
Heat build-up face, assemble the screw hole connected between fin and lid shell and be provided with insulating barrier, it is emerging in the part group outside lid shell
Dress fin outer surface scribbles finish paint made of insulating materials.
Further, described launch site, base and collecting zone divide chip area equally, and its launch site is located at the first groove
Interior, base is located in the second groove, and collecting zone is located in the 3rd groove, and the chip of launch site is thick relative to base chip, transmitting
Area's impurity concentration is big also relative to base impurity concentration, is provided with PN junction between its launch site and base, and the PN junction is emitter junction, base
PN junction is provided between area and collecting zone, the PN junction is collector junction, and each PN junction is each located in the connectivity slot between two grooves, each core
Wiring board is provided between piece, wiring board is provided with line pattern region and logicalnot circuit graphics field.
Further, set on described wiring board and coat anti-corruption on one layer of anti-corrosion film of covering, including assembling fin
Film is lost, by exposed and developed step, the anti-corrosion film that the logicalnot circuit graphics field on line map is covered removes, reserved line
The anti-corrosion film covered on graphics field.
Further, the side of described launch site, base and collecting zone away from assembling fin be each provided with emitter stage,
Base stage and colelctor electrode, its emitter stage are connected with the first pin, and base stage is connected with second pin, colelctor electrode and the 3rd pin phase
Connection, and by seamless welding between emitter stage, base stage and colelctor electrode and each pin；First pin, second pin and the 3rd pin
Volume it is identical, and cross sectional shape is all oblong openings in rectangle, with lid shell just as three pin other ends lead to respectively
Cross oblong openings and lead to outside.
Further, described support has two, and respectively positioned at base both sides, the support of its both sides is all L-shaped, and support
On be designed with fixedly connected part, rack shell is made up of soft metal material, and its internal stent is filled with vibration-absorptive material.
Further, described fixedly connected part is mode connects for screw, bolt connection or adhesive tape connection therein one
Kind, circular screwhole is respectively equipped with the L-type support of its both sides, the bottom of L-type support is that circular screwhole bottom side is provided with ring washer.
Further, described emitter stage, base stage and colelctor electrode are respectively by germanium, silicon, carbon, germanium silicon, silicon-carbon or germanium silicon-carbon
In one or more kinds of materials be made.
Further, described vibration-absorptive material be single, double surface band glue EVA, PE, CR, PU foam, band glue non-woven fabrics, suede paper,
The one or more therein such as compound pearl cotton, bubble bags, rubber, wood chip.
It is in place of the technological merit of the present invention：
1. a kind of triode with shock-absorbing function, its lid shell and internal stent are designed with vibration-absorptive material, have reached and have worked as triode
The effect of damping when collision is dropped, greatly alleviate the damaged condition of triode.
2. a kind of triode with shock-absorbing function, when triode works for a long time, high temperature caused by electric current can not
Radiating causes the element inside triode to burn, and the assembling fin being internally provided with, serves thermolysis well, prevents
Electrical equipment caused by high temperature damages.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the structural representation of bottom plate of the present invention.
Fig. 3 is the structural representation of middle cover shell of the present invention.
Fig. 4 is the structural representation of chips of the present invention and groove.
Attached mark：Base 1, lid shell 2, support 3, buckle 4, neck 5, the first cavity 6, launch site 7, base 8, collecting zone
9th, interlayer 10, the second cavity 11, vibration-absorptive material 12, the first pin 13, second pin 14, the 3rd pin 15, the first groove 16,
Two grooves 17, the 3rd groove 18, the 4th groove 19, connectivity slot 20, assembling fin 21, copper gasket 22, emitter junction 23, current collection
Knot 24, emitter stage 25, base stage 26, colelctor electrode 27, circular screwhole 28.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.
The reference picture 1-4 of embodiment 1, a kind of triode with shock-absorbing function, including base 1, lid shell 2, pin and support
3, described base 1 is provided with groove, and the edge of its base 1 is provided with buckle 4；The edge side of lid shell 2 is provided with neck 5, and it is covered
Shell 2 is fastened by the buckle 4 of neck 5 and base 1, and it is in hollow state that lid shell 2 is internal after engaging with base 1, and referred to as first is empty
Chamber 6, chip is provided with the first cavity 6, chip is located in the groove of base 1, is welded and fixed between the two, and its chip is divided into three
Region, three regions are respectively launch site 7, base 8 and collecting zone 9, launch site 7, base 8 and the laid out in parallel of collecting zone 9, and base
Area 8 is located among launch site 7 and collecting zone 9, and the inwall of lid shell 2 is provided with interlayer 10, is in hollow state in interlayer 10, and referred to as second is empty
Chamber 11, vibration-absorptive material 12 is filled with the second cavity 11；Described pin has three, respectively the first pin 13, second pin
14 and the 3rd pin 15, three pins be located at the side of base 1 side by side；Described support 3 is located at the bottom of base 1.
The structure and installation site of the present invention is clearly elaborated for simplicity above.
A kind of triode with shock-absorbing function, described base 1 are made up of frivolous semi-conducting material, and base 1 is in length
Cube, described lid shell 2 are made up of plastic material, and lid shell 2 is also cuboid, and the side of lid shell 2 is provided with three openings, opening
It is rectangle；The groove that base 1 is provided with has at 4, respectively the first groove 16, the second groove 17, the 3rd groove 18 and the 4th
Groove 19, and groove 20 is communicated between each groove, its first groove 16, the second groove 17 and the laid out in parallel of the 3rd groove 18,
Its 4th groove 19 with remaining at 3 texturearunaperpendicular arrange, the side of base 1 is provided with assembling fin 21, and assembling fin 21 is pacified
In dress and the 4th groove 19, and assemble the one end of fin 21 and raise up, it is protruding upward along the inwall of lid shell 2, through lid shell 2
Outer surface is led in bottom, assembles and fixedly connected part is provided between the groove 19 of fin 21 and the 4th and lid shell 2, described fixed company
Fitting is mode connects for screw, and assembles and copper gasket 22 is provided between fin 21 and chip, and copper gasket 22 is provided with connectivity slot
In 20；Its beneficial effect is：The 4th groove 19 where assembling fin 21 and remaining be disposed vertically between groove at 3, favorably
The heat of chip can be farthest absorbed in assembling fin 21, assembles and is connected between fin 21 and chip by copper gasket 22
Connect, improve the transmission of heat.
A kind of triode with shock-absorbing function, described assembling fin 21 are referred to as radiating surface backwards to chip-side, instead
Object chip side be referred to as heat build-up face, assemble the screw hole connected between fin 21 and lid shell 2 and be provided with insulating barrier, it shows
It is exposed at assembling fin 21 outer surface of the part outside lid shell 2 and scribbles finish paint made of insulating materials；Its beneficial effect is：Institute
The insulating barrier stated, which is set, can prevent electricity from being overflowed by screw, damage, and it, which scribbles insulation finish paint, can prevent voltage from passing through assembling
Fin 21 and damage.
A kind of triode with shock-absorbing function, described launch site 7, base 8 and collecting zone 9 divide chip area equally, its
Launch site 7 is located in the first groove 16, and base 8 is located in the second groove 17, and collecting zone 9 is located in the 3rd groove 18, launch site 7
Chip it is thick relative to the chip of base 8, the impurity concentration of launch site 7 is big also relative to the impurity concentration of base 8, its launch site 7 and base
PN junction is provided between area 8, the PN junction is emitter junction 23, and PN junction is provided between base 8 and collecting zone 9, and the PN junction is collector junction 24,
Each PN junction is each located in the connectivity slot 20 between two grooves, and wiring board is provided between each chip, and wiring board is provided with line map
Shape region and logicalnot circuit graphics field；Its beneficial effect is：The chip of above-mentioned launch site 7, base 8 and collecting zone 9 is put
Put in groove, PN junction be present between it, Weak current change more effectively can be converted into electric signal.
A kind of triode with shock-absorbing function, one layer of anti-corrosion film of covering, including assembling are set on described wiring board
Anti-corrosion film is coated on fin 21, by exposed and developed step, the logicalnot circuit graphics field on line map is covered anti-
Corrosive film removes, the anti-corrosion film covered on reserved line graphics field；Its beneficial effect is：Coating anti-corrosion film can prevent
Corroded and damaged in line pattern region on assembling fin 21 and wiring board.
A kind of triode with shock-absorbing function, described launch site 7, base 8 and collecting zone 9 are away from assembling fin 21
Side be each provided with emitter stage 25, base stage 26 and colelctor electrode 27, its emitter stage 25 is connected with the first pin 13, base stage 26 with
Second pin 14 is connected, and colelctor electrode 27 is connected with the 3rd pin 15, and emitter stage 25, base stage 26 and colelctor electrode 27 are with respectively drawing
By seamless welding between pin；First pin 13, second pin 14 are identical with the volume of the 3rd pin 15, and cross sectional shape is all length
It is square, with the oblong openings on lid shell 2 just as three pin other ends lead to outside by oblong openings respectively；It has
Benefit effect be：Every pin is corresponding to be connected with emitter stage 25, base stage 26 and colelctor electrode 27, has distinguished the confusion of pin
Property.
A kind of triode with shock-absorbing function, described support 3 have two, respectively positioned at the both sides of base 1, its both sides
Support 3 is all L-shaped, and fixedly connected part is designed with support 3, and the shell of support 3 is made up of soft metal material, in its support 3
Portion is filled with vibration-absorptive material 12；Its beneficial effect is：Its shell of L-type support 3 is made of metal, and inside is made by vibration-absorptive material 12
Into having reached the effect of damping.
A kind of triode with shock-absorbing function, described fixedly connected part are mode connects for screw, bolt connection or viscosity
Adhesive tape connects one kind therein, circular screwhole 28 is respectively equipped with the L-type support 3 of its both sides, the bottom of L-type support 3 is circle
The bottom side of screw 28 is provided with ring washer；Its beneficial effect is：Fixedly connected part in L-type support 3 can be a variety of, add choosing
Selecting property, the ring washer that its bottom is provided with, prevent from damaging fixedly connected part during collision.
A kind of triode with shock-absorbing function, described emitter stage 25, base stage 26 and colelctor electrode 27 respectively by germanium, silicon,
One or more kinds of materials in carbon, germanium silicon, silicon-carbon or germanium silicon-carbon are made；Its beneficial effect is：Add to emitter stage
25th, base stage 26 and the material selectivity of colelctor electrode 27.
A kind of triode with shock-absorbing function, described vibration-absorptive material 12 are single, double surface band glue EVA, PE, CR, PU bubble
The one or more therein such as cotton, band glue non-woven fabrics, suede paper, compound pearl cotton, bubble bags, rubber, wood chip；Its is beneficial
Effect is：Improve the selectivity of vibration-absorptive material 12.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
Without departing substantially from the present invention spirit or essential attributes in the case of, can realize the present invention in other specific forms, thus no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Claims (10)
1. a kind of triode with shock-absorbing function, including base, lid shell, pin and support, it is characterised in that：Described base
Groove is provided with, the edge of its base is provided with buckle；The edge side of lid shell is provided with neck, and its lid shell passes through neck and base
Buckle fastens, and it is in hollow state, referred to as the first cavity that lid shell is internal after engaging with base, and chip, core are provided with the first cavity
Piece is located in the groove of base, is welded and fixed between the two, and its chip is divided into three regions, three regions be respectively launch site,
Base and collecting zone, launch site, base and collecting zone laid out in parallel, and base is located among launch site and collecting zone, in lid shell
Wall is provided with interlayer, is in hollow state, referred to as the second cavity in interlayer, vibration-absorptive material is filled with the second cavity；Described pin
There are three, respectively the first pin, second pin and the 3rd pin, three pins are located at the side of base side by side；Described branch
Frame is located at the bottom of base.
A kind of 2. triode with shock-absorbing function according to claim 1, it is characterised in that：Described base is by frivolous half
Conductor material is made, and base is in cuboid, and described lid shell is made up of plastic material, and lid shell is also cuboid, lid shell
Side is provided with three openings, and opening is rectangle；The groove that base is provided with has at 4, respectively the first groove, the second groove,
3rd groove and the 4th groove, and groove is communicated between each groove, its first groove, the second groove and the 3rd groove are arranged side by side
Cloth, its 4th groove with remaining at 3 texturearunaperpendicular arrange, the side of base is provided with assembling fin, the installation of assembling fin with
In 4th groove, and assemble fin one end and raise up, it is protruding upward along the inwall of lid shell, lead to through lid shell bottom outer
Surface, assembling and be provided with fixedly connected part between fin and the 4th groove and lid shell, described fixedly connected part is mode connects for screw,
And copper gasket is provided between assembling fin and chip, copper gasket is provided with connectivity slot.
A kind of 3. triode with shock-absorbing function according to claim 2, it is characterised in that：The described assembling fin back of the body
It is referred to as radiating surface to chip-side, otherwise object chip side is referred to as heat build-up face, assembles the spiral shell connected between fin and lid shell
Nail is provided with insulating barrier, and its part assembling fin outer surface for being emerging in outside lid shell scribbles face made of insulating materials
Paint.
A kind of 4. triode with shock-absorbing function according to claim 1, it is characterised in that：Described launch site, base
Divide chip area equally with collecting zone, its launch site is located in the first groove, and base is located in the second groove, and collecting zone is located at the 3rd
In groove, the chip of launch site is thick relative to base chip, and emitter impurity concentration is big also relative to base impurity concentration, and it is sent out
Penetrate and PN junction is provided between area and base, the PN junction is emitter junction, and PN junction is provided between base and collecting zone, and the PN junction is current collection
Knot, each PN junction are each located in the connectivity slot between two grooves, wiring board are provided between each chip, wiring board is provided with line map
Shape region and logicalnot circuit graphics field.
A kind of 5. triode with shock-absorbing function according to Claims 2 or 3, it is characterised in that：On described wiring board
Set and coat anti-corrosion film on one layer of anti-corrosion film of covering, including assembling fin, by exposed and developed step, by line map
On the anti-corrosion film of logicalnot circuit graphics field covering remove, the anti-corrosion film covered on reserved line graphics field.
A kind of 6. triode with shock-absorbing function according to claim 1, it is characterised in that：Described launch site, base
Emitter stage, base stage and colelctor electrode are each provided with side of the collecting zone away from assembling fin, its emitter stage and the first pin phase
Connection, base stage are connected with second pin, and colelctor electrode is connected with the 3rd pin, and emitter stage, base stage and colelctor electrode are with respectively drawing
By seamless welding between pin；First pin, second pin are identical with the volume of the 3rd pin, and cross sectional shape is all rectangle,
With the oblong openings on lid shell just as three pin other ends lead to outside by oblong openings respectively.
A kind of 7. triode with shock-absorbing function according to claim 1, it is characterised in that：Described support has two,
It is located at base both sides respectively, the support of its both sides is all L-shaped, and fixedly connected part is designed with support, and rack shell is by soft
Metal material is made, and its internal stent is filled with vibration-absorptive material.
A kind of 8. triode with shock-absorbing function according to claim 7, it is characterised in that：Described fixedly connected part is
Mode connects for screw, bolt connection or adhesive tape connect one kind therein, and circular spiral shell is respectively equipped with the L-type support of its both sides
Hole, the bottom of L-type support is that circular screwhole bottom side is provided with ring washer.
A kind of 9. triode with shock-absorbing function according to claim 6, it is characterised in that：Described emitter stage, base stage
It is made up respectively of one or more kinds of materials in germanium, silicon, carbon, germanium silicon, silicon-carbon or germanium silicon-carbon with colelctor electrode.
10. according to a kind of triode with shock-absorbing function of claim 1 or 7, it is characterised in that：Described vibration-absorptive material
For single, double surface band glue EVA, PE, CR, PU foam, band glue non-woven fabrics, suede paper, compound pearl cotton, bubble bags, rubber, wood chip etc.
One or more therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711020705.XA CN107742641A (en) | 2017-10-27 | 2017-10-27 | A kind of triode with shock-absorbing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711020705.XA CN107742641A (en) | 2017-10-27 | 2017-10-27 | A kind of triode with shock-absorbing function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107742641A true CN107742641A (en) | 2018-02-27 |
Family
ID=61237052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711020705.XA Withdrawn CN107742641A (en) | 2017-10-27 | 2017-10-27 | A kind of triode with shock-absorbing function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107742641A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201663159U (en) * | 2010-04-28 | 2010-12-01 | 四川金湾电子有限责任公司 | Strong coating adhesive type plastic package lead frame |
| CN104392977A (en) * | 2014-10-16 | 2015-03-04 | 东莞市柏尔电子科技有限公司 | Packaging triode |
| CN205159857U (en) * | 2015-11-26 | 2016-04-13 | 德尔瑞（天津）机电设备有限公司 | Switch cabinet |
| CN205984997U (en) * | 2016-08-19 | 2017-02-22 | 东莞市佳骏电子科技有限公司 | Take heat abstractor's change foot preface triode |
| CN107180798A (en) * | 2017-05-12 | 2017-09-19 | 东莞市联洲知识产权运营管理有限公司 | A kind of modified triode fixing device |
-
2017
- 2017-10-27 CN CN201711020705.XA patent/CN107742641A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201663159U (en) * | 2010-04-28 | 2010-12-01 | 四川金湾电子有限责任公司 | Strong coating adhesive type plastic package lead frame |
| CN104392977A (en) * | 2014-10-16 | 2015-03-04 | 东莞市柏尔电子科技有限公司 | Packaging triode |
| CN205159857U (en) * | 2015-11-26 | 2016-04-13 | 德尔瑞（天津）机电设备有限公司 | Switch cabinet |
| CN205984997U (en) * | 2016-08-19 | 2017-02-22 | 东莞市佳骏电子科技有限公司 | Take heat abstractor's change foot preface triode |
| CN107180798A (en) * | 2017-05-12 | 2017-09-19 | 东莞市联洲知识产权运营管理有限公司 | A kind of modified triode fixing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101978493B (en) | Semiconductor assembly having reduced thermal spreading resistance and methods of making same | |
| US8294261B2 (en) | Protruding TSV tips for enhanced heat dissipation for IC devices | |
| CN104851814B (en) | Ic package and forming method thereof | |
| CN104204084B (en) | Hardening resin composition and manufacture method, highly thermal-conductive resin composition and high-termal conductivity multilayer board | |
| US20140124955A1 (en) | Package-on-package structure including a thermal isolation material and method of forming the same | |
| JP6550140B2 (en) | Semiconductor device assembly with underfill receiving cavity | |
| CN105792504B (en) | A kind of holes PCB embedding device and preparation process with shielding measure | |
| CN106601628A (en) | Chip packaging method and chip packaging structure | |
| CN104103607B (en) | A kind of welding encapsulation buried in the bga chip of hybrid package | |
| CN104538416A (en) | High-reliability fully-closed CMOS image sensor structure and production method thereof | |
| CN110024107A (en) | Integrated circuit packaging method and integration packaging circuit | |
| CN204424256U (en) | The totally-enclosed CMOS structure of high reliability | |
| CN103617991A (en) | Semiconductor encapsulation electromagnetic shielding structure and manufacturing method | |
| CN107742641A (en) | A kind of triode with shock-absorbing function | |
| CN105990304A (en) | Chip packaging structure and manufacture method thereof | |
| CN203983254U (en) | The welding encapsulation of burying in a kind of bga chip | |
| CN205177812U (en) | Lateral wall and back have insulation protection's chip package structure | |
| CN203054227U (en) | Radio frequency/baseband-integrated satellite navigation receiver chip | |
| CN104064532A (en) | Device package structure with heat radiating structure and manufacturing method thereof | |
| CN103560090B (en) | A kind of manufacture method of the radiator structure for PoP encapsulation | |
| CN206272951U (en) | A kind of circuit board of water-cooling | |
| CN205303451U (en) | Integrally -packaged power semiconductor device | |
| TW200409324A (en) | High-density multi-chip modulestructure and the forming method thereof | |
| CN103560117B (en) | A kind of radiator structure for PoP encapsulation | |
| CN103972187B (en) | Chip package and its manufacture method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180227 |