CN205335250U - Six pin SOT23 integrated circuit package's lead wire frame construction - Google Patents
Six pin SOT23 integrated circuit package's lead wire frame construction Download PDFInfo
- Publication number
- CN205335250U CN205335250U CN201620024988.XU CN201620024988U CN205335250U CN 205335250 U CN205335250 U CN 205335250U CN 201620024988 U CN201620024988 U CN 201620024988U CN 205335250 U CN205335250 U CN 205335250U
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- lead frame
- frame unit
- pin
- base plate
- sot23
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Abstract
The utility model discloses a six pin SOT23 integrated circuit package's lead wire frame construction, including base plate and a plurality of lead frame unit of evenly arranging on the base plate, 24 rows are arranged into along the width direction of base plate to a plurality of lead frame units, arrange into 66 along the length direction of base plate, and per three classify as a set of, shang mian 12 rows the lead frame unit is with following 12 rows be provided with between the lead frame unit along the well muscle of base plate length direction extension, thereby the utility model discloses 1584 circuit can be adorned to totally 1584 lead frame units, have improved the packaging efficiency greatly, have reduced manufacturing cost moreover, guarantee the stability and the reliability of encapsulation moreover.
Description
Technical field
This utility model relates to a kind of integrated circuit packaging lead frame structure, particularly relates to the lead frame structure of a kind of six pin SOT23 integrated antenna packages。
Background technology
Lead frame structure must be used during integrated antenna package, lead frame structure includes substrate and some lead frame unit being evenly spaced on substrate, in prior art, the substrate previous column of the packaging lead frame structure of six pin SOT23 integrated antenna packages can only arrange at most eight lead frame unit, a piece of six pin SOT23 encapsulating leads can fill 288 circuit, every mould can seal at most 12 six pin SOT23 encapsulating leads, so every mould can go out at most 3456, circuit, thus efficiency comparison is low。And tended to slight diarrhea due to chip package, therefore how to improve packaging efficiency, save cost have become as unavoidable problem, therefore, existing six pin SOT23 packaging lead frame structures can not meet demand, it is necessary to improve。
Utility model content
The purpose of this utility model is in that the lead frame structure of the six pin SOT23 integrated antenna packages providing a kind of packaging efficiency high。
For achieving the above object, this utility model be the technical scheme is that
A kind of lead frame structure of six pin SOT23 integrated antenna packages, including substrate and some lead frame unit being evenly spaced on substrate, described some lead frame unit are arranged in 24 rows along the width of substrate, length direction along substrate is arranged in 66 row, and every three be classified as one group, above 12 arrange described lead frame unit and following 12 and arrange and between described lead frame unit, be provided with the middle muscle extended along zig direction。
The outer pin of the adjacent two described lead frame unit of row is intersected with each other to be staggered。
The multiple fabrication holes formed a line it are provided with between lead frame unit described in two adjacent groups。
The beneficial effects of the utility model are: be placed with 24 row X66 row totally 1584 lead frame unit on the whole substrate of lead frame structure of these practical six pin SOT23 integrated antenna packages altogether, 1584 circuit can be filled, and often mould can go out 4 six pin SOT23 encapsulating leads, circuit number can be gone out altogether and reach 6336, thus substantially increasing packaging efficiency, greatly reduce production cost, and described middle muscle can lift frame bulk strength, prevent generation warpage in encapsulation process, thus the package reliability ensured in lead frame element number increase situation and stability。
Accompanying drawing explanation
Fig. 1 is the lead frame structure schematic diagram of this utility model six pin SOT23 integrated antenna package；
Fig. 2 is according to the enlarged diagram of part A in Fig. 1。
Detailed description of the invention
As shown in Figure 1, 2, the lead frame structure of this utility model six pin SOT23 integrated antenna package includes substrate 1 and some lead frame unit 2 being evenly spaced on substrate 1, described some lead frame unit 2 are arranged in 24 rows along the width of substrate 1, length direction along substrate 1 is arranged in 66 row, and every three be classified as one group, above 12 arrange described lead frame unit 2 and following 12 and arrange and between described lead frame unit 2, be provided with the middle muscle 4 extended along substrate 1 length direction。
So, one piece of six whole substrate 1 of pin SOT23 encapsulating lead is placed with 24 row X66 row totally 1584 lead frame unit 2 altogether, 1584 circuit can be filled。And often mould can go out 4 six pin SOT23 encapsulating leads, thus can go out altogether circuit number to reach 6336, comparing six pin SOT23 package lead mount structures of existing 8 row's structures, production efficiency improves 183%, thus greatly reducing production cost；And described middle muscle 4 can lift frame bulk strength, it is prevented that warpage occurs in encapsulation process, thus the package reliability ensured in lead frame unit 2 quantity increase situation and stability。
In the present embodiment, preferably, the multiple fabrication holes 3 formed a line it are provided with between lead frame unit 2 described in two adjacent groups, the described fabrication hole 3 maximized saving material of energy, and the effect of dispersive stress can also be played in plastic packaging and rib cutting operation effect, avoid frame deformation to affect the quality of product, and conveniently carry out substrate 1 identifying flexibly and installing to apply neatly being in that each mounting location。
In the present embodiment, it is advantageous to, adjacent two arrange the outer pin mistake intersected with each other of described lead frame unit 2
Open, it is thus possible to save potting resin consumption further, reduce production cost。
Claims (3)
1. the lead frame structure of a pin SOT23 integrated antenna package, including substrate and some lead frame unit being evenly spaced on substrate, it is characterized in that: described some lead frame unit are arranged in 24 rows along the width of substrate, length direction along substrate is arranged in 66 row, and every three be classified as one group, above 12 arrange described lead frame unit and following 12 and arrange and between described lead frame unit, be provided with the middle muscle extended along zig direction。
2. the lead frame structure of six pin SOT23 integrated antenna packages according to claim 1, it is characterised in that: the outer pin of the adjacent two described lead frame unit of row is intersected with each other to be staggered。
3. the lead frame structure of six pin SOT23 integrated antenna packages according to claim 1 and 2, it is characterised in that: it is provided with the multiple fabrication holes formed a line described in two adjacent groups between lead frame unit。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620024988.XU CN205335250U (en) | 2016-01-12 | 2016-01-12 | Six pin SOT23 integrated circuit package's lead wire frame construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620024988.XU CN205335250U (en) | 2016-01-12 | 2016-01-12 | Six pin SOT23 integrated circuit package's lead wire frame construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205335250U true CN205335250U (en) | 2016-06-22 |
Family
ID=56209630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620024988.XU Active CN205335250U (en) | 2016-01-12 | 2016-01-12 | Six pin SOT23 integrated circuit package's lead wire frame construction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205335250U (en) |
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2016
- 2016-01-12 CN CN201620024988.XU patent/CN205335250U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |