CN205232565U - Anti printed circuit board that tears - Google Patents
Anti printed circuit board that tears Download PDFInfo
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- CN205232565U CN205232565U CN201521026886.3U CN201521026886U CN205232565U CN 205232565 U CN205232565 U CN 205232565U CN 201521026886 U CN201521026886 U CN 201521026886U CN 205232565 U CN205232565 U CN 205232565U
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- layer
- circuit board
- printed circuit
- strengthening course
- tear
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Abstract
The utility model provides an anti printed circuit board that tears, includes: strengthening course, after that layer, anti layer and the circuit sheet layer torn. The strengthening course is connected with the bottom of substrate layer through after that layer, and the bottom of the top and gate sheet layer of substrate layer is connected, the anti bottom of locating the substrate layer in the layer of tearing, and the anti layer of tearing layer bonds on the circuit sheet layer through catching. The utility model discloses with the soft or hard land between aluminum plate and the FPC, the adagio increases the anti layer of tearing, adopts the thin high temperature pressfitting solidification mode that adopts of polyimide of high strength. Under the not influenced prerequisite of pliability, to a great extent improves its anti ability of tearing. Thoroughly solve the finished product and harmfully produce, reduce to scrap.
Description
Technical field
The utility model relates to a kind of circuit board, is specifically related to a kind of tear-proof printed circuit board.
Background technology
Printed circuit board is widely used in all kinds of automobile, electric equipment, is the substrate that all kinds of electronic devices and components carry out being electrically connected; Ordinary printed circuit board comprises insulating base and is overlying on the copper foil layer on insulating base surface.Along with the raising of the development and application demand of science and technology, and wiring board assembles in three-dimensional environment, disturbs and is folded in journey, and upper meeting forms damage to wiring board.
Therefore, a series of improvement has been carried out in order to solve the problem.
Utility model content
The purpose of this utility model is, provides a kind of tear-proof printed circuit board, to overcome the above-mentioned shortcoming and defect existing for prior art.
A kind of tear-proof printed circuit board, it is characterized in that, comprise: strengthening course, following layer, tear resistant layer, pcb layer, described strengthening course is connected with the bottom of pcb layer by following layer, described tear resistant layer is located at the bottom of substrate layer, and described tear resistant layer is bonded on pcb layer by following layer.
Further, described strengthening course is aluminum layer, and described strengthening course is provided with reinforcement louvre.
Further, described tear resistant layer is located at adagio and is disturbed folding area, and described tear resistant layer is polyimides thin material.
Further, described pcb layer comprises: substrate layer and solder mask, and described substrate layer is connected with strengthening course by following layer, and bottom and the tear resistant layer of described substrate layer touch, and the bottom of described solder mask is connected with the top of substrate layer.
Further, described substrate layer is copper coin.
The beneficial effects of the utility model:
The utility model is by the soft or hard land between aluminium sheet and FPC, and adagio increases tear resistant layer, adopts the polyimides thin employing high-temperature laminating curing mode of high strength.Under the impregnable prerequisite of pliability, improve its lear energy to a great extent.The bad generation of thorough solution finished product, reduces to scrap.
Accompanying drawing explanation
Fig. 1 is structure chart of the present utility model.
Reference numeral:
Strengthening course 100 and reinforcement louvre 110.
Following layer 200 and tear resistant layer 300.
Folding area 500 disturbed by pcb layer 400, substrate layer 410, solder mask 420 and adagio.
Embodiment
Below in conjunction with specific embodiment, progressive explanation is done to the utility model.Should be understood that following examples only for illustration of the utility model but not for limiting scope of the present utility model.
Embodiment 1
Fig. 1 is structure chart of the present utility model.
As shown in Figure 1, a kind of tear-proof printed circuit board comprises: strengthening course 100, following layer 200, tear resistant layer 300 and pcb layer 400, strengthening course 100 is connected with the bottom of pcb layer 400 by following layer 200, tear resistant layer 300 is located at the bottom of substrate layer 410, and tear resistant layer 300 is bonded on pcb layer 400 by following layer 200.
Strengthening course 100 is aluminum layer, and strengthening course 100 is provided with reinforcement louvre 110.Strengthening course 100 increases soft board Da Jian district hardness, using aluminium sheet strengthening course for improving heat dispersion, setting up louvre 110 simultaneously and improving radiating effect further.Traditional strengthening course, in order to avoid Splitting, can not adopt this design, and the utility model just can be realized by tear resistant layer 300.
Strengthening course 100 and pcb layer 400 are suppressed formation finished product by high-temperature high-pressure craft by following layer 200.
Tear resistant layer 300 is located at adagio and is disturbed folding area 500, and tear resistant layer 300 is polyimides thin material.
Pcb layer 400 comprises: substrate layer 410 and solder mask 420, substrate layer 410 being connected with strengthening course 100 by following layer 200, and bottom and the tear resistant layer 300 of substrate layer 410 touch, and the bottom of solder mask 420 is connected with the top of substrate layer 410.
Substrate layer 410 is copper coin, and what this layer of Copper base material used is fine copper, and its Main Function is in Copper base material, make the circuit and assemble welding part that meet required for product function.
The effect of solder mask 420 is anti-oxidant, the anti-scolding tin of protection circuit, and insulate and add flexible circuit board pliability etc.
The problem of what the utility model mainly solved is metal reinforcement, be folded in journey disturbing of 3 D stereo assembling, problem is torn in soft or hard land.By by the soft or hard land between strengthening course 100 and substrate layer 410, namely folding area 500 disturbed by adagio, by increasing tear resistant layer 300, adopts the polyimides thin employing high-temperature laminating curing mode of high strength.Under the impregnable prerequisite of pliability, improve its lear energy to a great extent.The bad generation of thorough solution finished product, reduces to scrap.
Be illustrated embodiment of the present utility model above, but the utility model is not as limit, only otherwise depart from aim of the present utility model, the utility model can also have various change.
Claims (5)
1. a tear-proof printed circuit board, it is characterized in that, comprise: strengthening course (100), following layer (200), tear resistant layer (300) and pcb layer (400), described strengthening course (100) is connected by the bottom of following layer (200) with pcb layer (400), described tear resistant layer (300) is located at the bottom of substrate layer (410), and described tear resistant layer (300) is bonded on pcb layer (400) by following layer (200).
2. a kind of tear-proof printed circuit board according to claim 1, it is characterized in that, comprising: described strengthening course (100) is aluminum layer, described strengthening course (100) is provided with reinforcement louvre (110).
3. a kind of tear-proof printed circuit board according to claim 1, is characterized in that, comprising: described tear resistant layer (300) is located at adagio and is disturbed folding area (500), described tear resistant layer (300) is polyimides thin material.
4. a kind of tear-proof printed circuit board according to claim 1, it is characterized in that, comprise: described pcb layer (400) comprising: substrate layer (410) and solder mask (420), described substrate layer (410) being connected with strengthening course (100) by following layer (200), bottom and the tear resistant layer (300) of described substrate layer (410) touch, and the bottom of described solder mask (420) is connected with the top of substrate layer (410).
5. a kind of tear-proof printed circuit board according to claim 4, is characterized in that, comprising: described substrate layer (410) is copper coin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521026886.3U CN205232565U (en) | 2015-12-10 | 2015-12-10 | Anti printed circuit board that tears |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521026886.3U CN205232565U (en) | 2015-12-10 | 2015-12-10 | Anti printed circuit board that tears |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205232565U true CN205232565U (en) | 2016-05-11 |
Family
ID=55907602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521026886.3U Active CN205232565U (en) | 2015-12-10 | 2015-12-10 | Anti printed circuit board that tears |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205232565U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770478A (en) * | 2019-11-04 | 2021-05-07 | 联想（新加坡）私人有限公司 | Electronic substrate and method for manufacturing electronic substrate |
-
2015
- 2015-12-10 CN CN201521026886.3U patent/CN205232565U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770478A (en) * | 2019-11-04 | 2021-05-07 | 联想（新加坡）私人有限公司 | Electronic substrate and method for manufacturing electronic substrate |
| CN112770478B (en) * | 2019-11-04 | 2024-08-27 | 联想（新加坡）私人有限公司 | Electronic substrate and method for manufacturing electronic substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |