CN100391319C - Single board able to realize live-wire insertion and its realizing method - Google Patents
Single board able to realize live-wire insertion and its realizing method Download PDFInfo
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- CN100391319C CN100391319C CNB03143326XA CN03143326A CN100391319C CN 100391319 C CN100391319 C CN 100391319C CN B03143326X A CNB03143326X A CN B03143326XA CN 03143326 A CN03143326 A CN 03143326A CN 100391319 C CN100391319 C CN 100391319C
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- veneer
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- lead
- golden finger
- fingers
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Abstract
The present invention discloses a single board of realizing live-wire insertion and a realizing method thereof. The single board comprises a single board (3), golden fingers (5) and an electroplating wire (1). The present invention is characterized in that after the electroplating wire is short-circuited on an electroplating wire led out of the outer end of the longest golden finger in the golden fingers (5), an electric welding disk is connected for electroplating; a conducting wire (7) for connecting all the golden fingers together is also arranged in the single board; the corresponding conducting wire between two adjacent golden fingers on the single board is provided with a wire breaking hole (6); after the electroplating of the golden fingers is finished, the corresponding conducting wire is drilled off by the wire breaking hole. The present invention does not need to drill holes on short fingers; the manufacturing process of the single board is shortened; the present invention does not need the working procedure of manual grinding; the present invention saves the cost, enhances the production efficiency, avoids the problems of scraping and oxidizing the golden fingers in a grinding process, and makes the product quality stable.
Description
Technical field
The present invention relates to the veneer technology in the electronic applications, specifically refer to a kind of veneer and its implementation that realizes warm swap.
Background technology
Along with the develop rapidly that science and technology is maked rapid progress, the quality of IT product and capacity improve day by day and increase.Usually in order to increase the capacity of product, generally to use the storage medium of extrapolations such as expansion card, memory bar.Memory bar, expansion card are generally finger with the connected mode of veneer and are connected.Because finger section branch often plugs, the resistance to wear of this part surface coating there is very high requirement, generally take the way of some special coating to achieve the goal.
The finger surface processing mode of plug has multiple, as is coated with coat of metal modes such as tin lead, copper, gold, nickel.Gold plate is various button, the plug occasions of needing owing to its distinctive low contact resistance and highly corrosion resistant are used in.And the resistance to wear of gold is very good, so the selective electroplating gold process is generally adopted in the design that plug-in card wrench finger is divided, the gold grain after the plating is thinner, has increased resistance to wear.
In order to improve the resistance to wear of coating, reduce contact resistance, the reliability that anti-oxidation (copper) is connected with raising needs thicker gold plate, and general industry requires the golden layer thickness 〉=0.8 μ m of Insert Card Here.
The processing mode that gold-plated processing mode is general has: chemical nickel and gold, chemistry soak gold, electrogilding.Chemistry Ni/Au and chemistry soak the surface treatment mode of gold, and too thin i.e. 0.08～0.23 μ m of gold layer can not meet the demands; Adopt the mode of electrogilding, gold plate thickness can reach 0.5-1.5 μ m, can reach the requirement of Insert Card Here to golden layer thickness, guarantees the resistance to wear of Insert Card Here.Simultaneously owing to adopt the surface treatment mode of electrogilding, thickness of coating is even, and coplanarity is good, can guarantee that contacting between plug-in card and the socket is the line contact, can effectively guarantee the electric property at place, contact.
Gold-plated electrolyte is divided into cyano group and non-cyano group solution.Share the gold-plated electrolyte good stability of cyano group, so past attempts is used it for a long time.Their cyano group, alkalescence, neutrality and acid differentiation.
Plug gold-plated employed be the acid gold-plated electrolyte that low contact resistance and resistance to wear require.The neutral gold-plated electrolyte of the employing that has welding performance to require.
Acid gold-plated electrolyte quota, gold is dissolved in the solution with golden potassium cyanide and goes; And interpolation organic acid and conducting salt.In order to improve gold plate resistance to wear and slickness, and add metallic additions such as Fe, Co, Ni.
The plating of the golden finger veneer of plug is generally finished in acid electroplating solution, and its plating flow process is:
Dress extension-sulfuric acid-washing-electronickelling-washing-electrogilding-recovery washing-washing-drying-unloading.
On electric, be separate between each golden finger, insulated from each other.In order to raise the efficiency and guarantee consistency, uniformity, the actual man-hour producer of adding can form a current potential according to as shown in Figure 1 with all finger short circuits.Draw electrical bonding pads 2 from electroplating connecting line 1, begin above-mentioned plating flow process then.In the time of electronickelling and electrogilding, the place powers up at last electrical bonding pads, as negative electrode, separates out needed metal by electroplating at negative electrode, finishes plating.Because all fingers are negative electrode, so electroplate simultaneously.After plating was finished, the auxiliary limit below remove at segmentation lines 4 places with the end polishing, just obtained needed golden finger again.
If customer requirement veneer plug-in card tenaculum hot-line insertion and extraction, like this product design just necessarily require power supply,, electric sequence is inconsistent signal pins ground can realize.The fabrication scheme of realizing at present this purpose has multiple, and wherein a kind of scheme is to take that the golden finger structural design that causes different in size realizes warm swap in the veneer.The prior art golden finger processing scheme that causes different in size is still according to the golden finger processing scheme of routine design and makes.As shown in Figure 2, producer will point plating line 1 short circuit outside veneer 3, form an electrode, electroplate by last electrical bonding pads 2.Plating finishes, and it is disconnected to utilize the broken-line hole that designs on the plate that plating line is bored, and the plating connecting line that also needs then to lack the finger front end of length removes, otherwise does not have the inconsistent effect that powers on.The way of industry is with broken-line hole line to be bored to break at present, with special tool(s) remaining the end of a thread manual grinding is fallen again.This traditional manufacture method makes that the golden finger work flow is tediously long, and wasting time and energy of manual grinding can not be satisfied large batch of production requirement; Need the manual grinding short hand to refer to the connecting line of front end, difficulty is big, and consistency is bad, is easy to golden finger mill flower, influence attractive in appearancely, even can cause oxidation, loose contact, the reduction product quality.
Summary of the invention
The invention provides a kind of veneer and its implementation that realizes warm swap, the realization difficulty that exists with the solution prior art is big, the problem that product quality is lower.
For addressing the above problem, the invention provides following technical scheme:
A kind of veneer of realizing warm swap, comprise veneer, golden finger, plating line, wherein, described plating line is the plating line that the longest golden finger one end is drawn from described golden finger, also be provided with the lead that all golden fingers are linked together in the described veneer, be provided with broken-line hole corresponding to the lead between the two adjacent golden fingers on the described veneer, lead that should broken-line hole is disconnected.
Described lead connects together the other end of golden finger in all veneers.
Described lead links together the golden finger in all veneers in twos by its middle part.
A kind of implementation method of above-mentioned veneer, this step of stating implementation method is as follows:
A, after the longest golden finger one end is drawn the plating line short circuit from described golden finger, last electrical bonding pads;
B, all golden fingers in the described veneer are linked together with lead, and broken-line hole is placed on the lead between the two adjacent golden fingers;
C, described veneer dress hung and place in the electrolyte of electroplating bath and electroplate;
D, plating finish and take out described veneer;
E, excise the auxiliary limit of its bottom along the segmentation lines of veneer:
F, by the broken-line hole in the veneer lead between the two adjacent golden fingers is disconnected again.
The present invention adopts plating line is drawn as electrode access electrical bonding pads from the longest golden finger, also all golden fingers in the veneer are linked together with lead, again the lead between the two adjacent golden fingers is placed the structural design within the broken-line hole, after making veneer electroplating technology being made routinely, the short hand that need not go by hand again to polish refers to the connecting line of front end, reduce processing step, improved production efficiency; Reduce manual operations, improved the stability of product quality.
Description of drawings
Below in conjunction with drawings and Examples the present invention is described in further detail, wherein:
Fig. 1 is that the prior art gold finger galvanizing is made structural representation;
Fig. 2 is that prior art gold finger galvanizing different in size is made structural representation;
Fig. 3 is a preferred embodiment of the present invention golden finger implementation structure schematic diagram;
Fig. 4 is another embodiment of the present invention golden finger implementation structure schematic diagram.
Embodiment
Shown in Figure 3, be a preferred embodiment of the present invention.A kind of veneer of realizing warm swap, comprise veneer 3, golden finger 5, plating line 1, described plating line is the plating line that the longest golden finger one end is drawn from described golden finger 5, also be provided with the lead 7 that all golden finger the other end are connected together in the described veneer, be provided with broken-line hole 6 corresponding to the lead between the two adjacent golden fingers on the described veneer, lead that should broken-line hole is disconnected.
Shown in Figure 4, be another embodiment of the present invention.Lead 7 described in this embodiment links together the golden finger in all veneers in twos by its middle part, and other structures are all same as the previously described embodiments.
The present invention shown in Fig. 3,4 has the veneer of golden finger different in size, and its implementation is performed such:
After plating line 1 short circuit is drawn in the longest golden finger outer end from described golden finger 5, make them as same electrode, last electrical bonding pads 2;
All golden fingers in the described veneer 3 are connected together by its other end with lead 7.When the spacing between the golden finger PIN is big, also all golden fingers in the described veneer 3 can be linked together by in the middle part of it in twos with lead 7, and broken-line hole 6 is placed on the lead between the two adjacent golden fingers;
Described veneer dress hung and place in the electrolyte of electroplating bath and electroplate;
Plating finishes and takes out described veneer;
Excise the auxiliary limit of its bottoms along the segmentation lines 4 of veneer;
Lead between the two adjacent golden fingers is bored disconnected by the broken-line hole in the veneer 6 again.
Through said procedure, finished the plating that can realize the warm swap veneer and made.
Electro-plating method of the present invention adopts the electrogilding method, and the employed electrolyte of electroplating technology is for share the gold-plated electrolyte of cyano group, and this kind electrolyte is for being fit to the acid gold-plated electrolyte of low contact resistance and resistance to wear requirement.The gold-plated electrolyte of described acidity is dissolved in the solution by golden potassium cyanide, adds organic acid and conducting salt, adds some Fe, Co again, the configuration of Ni metallic addition forms.
Single plate structure of the present invention and plating manufacture method thereof need not be at short hand finger branch boreholes, and the sheet making flow process shortens, and need not to carry out the manual grinding operation, provides cost savings, and has improved production efficiency; The golden finger that can also avoid bringing in the bruting process scratches, the problem of oxidation, makes constant product quality.
Claims (9)
1. the veneer that can realize warm swap, comprise veneer (3), a plurality of golden finger (5), plating line (1), it is characterized in that, described plating line (1) is the plating line that the longest golden finger one end is drawn from described golden finger (5), also be provided with the lead (7) that golden finger (5) is linked together in the described veneer (3), described veneer (3) is gone up and to be provided with broken-line hole (6) corresponding to the lead between the two adjacent golden fingers (5), and lead that should broken-line hole (6) is disconnected.
2. veneer according to claim 1 is characterized in that, described lead (7) connects together the other end of golden finger (5) in all veneers.
3. veneer according to claim 1 is characterized in that, described lead (7) links together the golden finger (5) in all veneers (3) in twos by its middle part.
4. implementation method of veneer according to claim 1 is characterized in that the step of described implementation method is as follows:
A, after the longest golden finger one end is drawn plating line (1) short circuit from described golden finger (5), last electrical bonding pads (2);
B, all golden fingers in the described veneer (3) are linked together with lead (7), and broken-line hole (6) is placed on the lead between the two adjacent golden fingers;
C, described veneer dress hung and place in the electrolyte of electroplating bath and electroplate;
D, plating finish and take out described veneer;
E, excise the auxiliary limit of its bottom along the segmentation lines (4) of veneer:
F, by the broken-line hole in the veneer (6) lead between the two adjacent golden fingers is disconnected again.
5. implementation method according to claim 4 is characterized in that, all golden fingers in the described veneer (3) are connected together by its other end with lead (7).
6. implementation method according to claim 4 is characterized in that, all golden fingers in the described veneer (3) are linked together by its middle part in twos with lead (7).
7. according to claim 5 or 6 described implementation methods, it is characterized in that described electro-plating method is the electrogilding method, described electrolyte is for share the gold-plated electrolyte of cyano group.
8. implementation method according to claim 7 is characterized in that, the described gold-plated electrolyte of cyano group that share is for being fit to the acid gold-plated electrolyte that low contact resistance and resistance to wear require.
9. implementation method according to claim 8 is characterized in that, the gold-plated electrolyte of described acidity is dissolved in the solution by golden potassium cyanide, adds organic acid and conducting salt, adds some Fe, Co again, the configuration of Ni metallic addition forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03143326XA CN100391319C (en) | 2003-09-25 | 2003-09-25 | Single board able to realize live-wire insertion and its realizing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03143326XA CN100391319C (en) | 2003-09-25 | 2003-09-25 | Single board able to realize live-wire insertion and its realizing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1602141A CN1602141A (en) | 2005-03-30 |
| CN100391319C true CN100391319C (en) | 2008-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB03143326XA Expired - Lifetime CN100391319C (en) | 2003-09-25 | 2003-09-25 | Single board able to realize live-wire insertion and its realizing method |
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| CN (1) | CN100391319C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442952C (en) * | 2005-04-07 | 2008-12-10 | 华为技术有限公司 | Single plate and its processing method |
| CN100429965C (en) * | 2005-09-15 | 2008-10-29 | 艾默生网络能源有限公司 | Printing circuit board with plate edged long and short contacts and its processing method |
| JP2008181702A (en) * | 2007-01-23 | 2008-08-07 | Mitsumi Electric Co Ltd | Battery pack, battery protection module, and manufacturing method of base board for battery protection module |
| CN101795543B (en) * | 2010-03-25 | 2011-12-21 | 淳华科技(昆山)有限公司 | Method for manufacturing gold finger |
| CN102036506B (en) * | 2010-11-12 | 2012-11-28 | 北大方正集团有限公司 | Manufacturing method of golden fingers |
| CN102762040A (en) * | 2012-07-20 | 2012-10-31 | 杭州华三通信技术有限公司 | Method for forming golden fingers on PCB (printed circuit board) and processing method of PCB |
| CN104684277A (en) * | 2015-02-14 | 2015-06-03 | 深圳市五株科技股份有限公司 | Method for manufacturing gold fingers of printed circuit board |
| CN110518387A (en) * | 2019-08-30 | 2019-11-29 | Oppo（重庆）智能科技有限公司 | Plug connector and preparation method thereof, electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1360465A (en) * | 2000-12-19 | 2002-07-24 | 株式会社东芝 | Parts mounting baseplate and making method therefor |
| US6426879B1 (en) * | 2000-10-20 | 2002-07-30 | Mitsubishi Denki Kabushiki Kaisha | Load adjustment board and data processing apparatus |
| JP2002343466A (en) * | 2001-05-07 | 2002-11-29 | Three M Innovative Properties Co | Connector for connecting between printed wiring boards |
| JP2003258035A (en) * | 2002-03-06 | 2003-09-12 | Seiko Epson Corp | Circuit board, electronic device and its manufacturing method and electronic equipment |
-
2003
- 2003-09-25 CN CNB03143326XA patent/CN100391319C/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6426879B1 (en) * | 2000-10-20 | 2002-07-30 | Mitsubishi Denki Kabushiki Kaisha | Load adjustment board and data processing apparatus |
| CN1360465A (en) * | 2000-12-19 | 2002-07-24 | 株式会社东芝 | Parts mounting baseplate and making method therefor |
| JP2002343466A (en) * | 2001-05-07 | 2002-11-29 | Three M Innovative Properties Co | Connector for connecting between printed wiring boards |
| JP2003258035A (en) * | 2002-03-06 | 2003-09-12 | Seiko Epson Corp | Circuit board, electronic device and its manufacturing method and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1602141A (en) | 2005-03-30 |
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Granted publication date: 20080528 |