CN206850073U - A kind of electroplating coating for terminal and terminal, electronic interface, electronic equipment - Google Patents
A kind of electroplating coating for terminal and terminal, electronic interface, electronic equipment Download PDFInfo
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- CN206850073U CN206850073U CN201720784631.6U CN201720784631U CN206850073U CN 206850073 U CN206850073 U CN 206850073U CN 201720784631 U CN201720784631 U CN 201720784631U CN 206850073 U CN206850073 U CN 206850073U
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Abstract
本实用新型涉及一种用于端子的电镀镀层以及端子、电子接口、电子设备。电镀镀层,其包括电镀于端子表面的铜镀层,铜镀层表面依次电镀有内镍钨镀层、内金镀层、钯镀层、外金镀层以及铑钌镀层;内金镀层和钯镀层之间还设有外镍钨镀层、中间金镀层,内金镀层和钯镀层之间还设有外镍钨镀层、中间金镀层。本实用新型通过设置镍钨镀层、钯镀层以及铑钌镀层可以有效提高端子的耐磨性、防腐蚀性以及硬度和电接触性能,使得端子使用寿命长。
The utility model relates to an electroplating coating for terminals, terminals, electronic interfaces, and electronic devices. The electroplating coating comprises a copper coating electroplated on the surface of the terminal, and the surface of the copper coating is electroplated with an inner nickel-tungsten coating, an inner gold coating, a palladium coating, an outer gold coating, and a rhodium-ruthenium coating in sequence; an outer nickel-tungsten coating and an intermediate gold coating are provided between the inner gold coating and the palladium coating, and an outer nickel-tungsten coating and an intermediate gold coating are provided between the inner gold coating and the palladium coating. The utility model can effectively improve the wear resistance, corrosion resistance, hardness, and electrical contact performance of the terminal by providing the nickel-tungsten coating, the palladium coating, and the rhodium-ruthenium coating, so that the terminal has a long service life.
Description
技术领域technical field
本实用新型涉及电镀技术领域,尤其涉及一种用于端子的电镀镀层以及端子、电子接口、电子设备。The utility model relates to the technical field of electroplating, in particular to an electroplating layer used for a terminal, a terminal, an electronic interface and electronic equipment.
背景技术Background technique
随着智能设备对不断普及,其使用频率越来越高;智能设备如手机、平板等在使用过程中,其接口既可以作为充电接口也可以作为数据传输接口,接口经常与数据线之间进行插拔,且接口经常会被手触摸到,长时间使用后,容易造成接口的端子腐蚀或磨损,影响智能设备的使用寿命。With the continuous popularization of smart devices, their use frequency is getting higher and higher; when smart devices such as mobile phones and tablets are in use, their interfaces can be used as charging interfaces or data transmission interfaces, and the interfaces are often connected with data lines. Plugging and unplugging, and the interface is often touched by hands. After a long time of use, it is easy to cause corrosion or wear of the terminal of the interface, which will affect the service life of the smart device.
发明内容Contents of the invention
本实用新型的目的在于针对现有技术的不足提供一种用于端子的电镀镀层,该电镀镀层可有效防止端子被磨损或腐蚀。The purpose of the utility model is to provide an electroplating coating for terminals, which can effectively prevent the terminals from being worn or corroded.
本实用新型的另一目的在于:提供一种端子,该端子具有耐磨损、腐蚀的性能,使用寿命长。Another object of the present utility model is to provide a terminal, which is resistant to wear and corrosion and has a long service life.
本实用新型的第三目的在于:提供一种电子接口,该电子接口的端子使用寿命长。The third purpose of the present utility model is to provide an electronic interface whose terminals have a long service life.
本实用新型的第四目的在于:提供一种电子设备,该电子设备的电子接口的端子使用寿命长。The fourth objective of the present utility model is to provide an electronic device, the terminal of the electronic interface of which has a long service life.
一种用于端子的电镀镀层,其包括电镀于端子表面的铜镀层,铜镀层表面依次电镀有内镍钨镀层、内金镀层、钯镀层、外金镀层以及铑钌镀层。优选地,内金镀层和钯镀层之间还设有外镍钨镀层、中间金镀层。An electroplating coating for a terminal, which includes a copper coating electroplated on the surface of the terminal, and the surface of the copper coating is sequentially electroplated with an inner nickel-tungsten coating, an inner gold coating, a palladium coating, an outer gold coating and a rhodium-ruthenium coating. Preferably, an outer nickel-tungsten plating layer and an intermediate gold plating layer are also provided between the inner gold plating layer and the palladium plating layer.
优选地,铜镀层的厚度a为:1-3μm。Preferably, the thickness a of the copper plating layer is 1-3 μm.
优选地,内镍钨镀层的厚度b为0.75-3μm;Preferably, the thickness b of the inner nickel-tungsten coating is 0.75-3 μm;
优选地,内镀金层的厚度c为0.05-0.3μm;Preferably, the thickness c of the inner gold plating layer is 0.05-0.3 μm;
优选地,外镍钨镀层的厚度d为0.75-3μm;Preferably, the thickness d of the outer nickel-tungsten coating is 0.75-3 μm;
优选地,中间镀金层的厚度e为0.05-0.3μm;Preferably, the thickness e of the middle gold-plated layer is 0.05-0.3 μm;
优选地,钯镀层的厚度f为0.5-2μm;Preferably, the thickness f of the palladium coating is 0.5-2 μm;
优选地,外镀金层的厚度g为0.05-0.5μm;Preferably, the thickness g of the outer gold-plated layer is 0.05-0.5 μm;
优选地,铑钌镀层的厚度h为0.25-2μm。Preferably, the thickness h of the rhodium-ruthenium coating is 0.25-2 μm.
进一步地,g+h<3μm;b+d>2um;Further, g+h<3μm; b+d>2um;
一种端子,其表面镀有上述的电镀镀层。A terminal, the surface of which is plated with the above electroplating layer.
一种电子接口包括上述端子。An electronic interface includes the above terminal.
一种电子设备包括上述电子接口。An electronic device includes the above-mentioned electronic interface.
本实用新型的有益效果:本实用新型通过设置镍钨镀层、钯镀层以及铑钌镀层可以有效提高端子的耐磨性、防腐蚀性以及硬度和电接触性能,使得端子使用寿命长。Beneficial effects of the utility model: the utility model can effectively improve the wear resistance, corrosion resistance, hardness and electrical contact performance of the terminal by setting nickel-tungsten coating, palladium coating and rhodium-ruthenium coating, so that the service life of the terminal is long.
附图说明Description of drawings
图1为本实施例电镀镀层的一种结构示意图。FIG. 1 is a schematic structural view of the electroplating coating in this embodiment.
1-铑钌镀层;2-外镀金层;3-钯镀层;4-中间镀金层;5-外镍钨镀层;6-内镀金层;7-内镍钨镀层;8-铜镀层;9-端子。1-rhodium ruthenium coating; 2-outer gold coating; 3-palladium coating; 4-intermediate gold coating; 5-outer nickel-tungsten coating; 6-inner gold coating; 7-inner nickel-tungsten coating; 8-copper coating; 9- terminals.
具体实施方式detailed description
以下结合附图对本实用新型进行详细的描述。如图1所示。Below in conjunction with accompanying drawing, the utility model is described in detail. As shown in Figure 1.
实施例1:参见图1,一种用于端子9的电镀镀层,其包括电镀于端子9表面的铜镀层8,铜镀层8表面依次电镀有内镍钨镀层7、内金镀层、钯镀层3、外金镀层以及铑钌镀层1。Embodiment 1: Referring to FIG. 1 , an electroplating coating for a terminal 9, which includes a copper coating 8 electroplated on the surface of the terminal 9, the surface of the copper coating 8 is sequentially electroplated with an inner nickel-tungsten coating 7, an inner gold coating, and a palladium coating 3 , outer gold coating and rhodium ruthenium coating 1.
优选地,内金镀层和钯镀层3之间还设有外镍钨镀层5、中间金镀层。Preferably, an outer nickel-tungsten plating layer 5 and an intermediate gold plating layer are also provided between the inner gold plating layer and the palladium plating layer 3 .
由于端子9一般采用铜材料,以提供端子9的信号传输性能和导电性能;在端子9表面电镀一层铜镀层8,与端子9可以紧密结合,同时在端子9表面形成较为平整的电镀层,避免尖端效应。镍钨镀层具有较好耐磨性能和防腐蚀,尤其是耐酸性能,钯镀层3的硬度较大,可以提高端子9的硬度,防止其弯曲延伸,耐插拔,其次具有一定防腐蚀性和防氧化性;铑钌镀层1可以提高端子9的电接触性能,其接触电阻小;同时还具有较高的硬度和良好的抗腐蚀,耐插拔以及耐手汗电解;镍钨镀层、钯镀层3以及铑钌镀层1可以有效提高端子9的耐磨性、防腐蚀性以及硬度和电接触性能;但由于这三种镀层自身具有一定的内应力,不易相互结合,需要寻找过渡层,经过长时间的选料尝试,这里采用金镀层作为过渡层,金具有较好延展性,可以缓冲或消减上述三种镀层的内应力,防止镀层出现裂缝。从而使得电镀镀层具有较好的性能。Since the terminal 9 is generally made of copper material to provide the signal transmission performance and electrical conductivity of the terminal 9; a layer of copper plating 8 is electroplated on the surface of the terminal 9, which can be closely combined with the terminal 9, and at the same time a relatively flat electroplating layer is formed on the surface of the terminal 9. Avoid tip effects. The nickel-tungsten coating has good wear resistance and corrosion resistance, especially acid resistance. The hardness of the palladium coating 3 is relatively high, which can increase the hardness of the terminal 9, prevent it from bending and extending, and is resistant to plugging. Secondly, it has certain corrosion resistance and anti-corrosion Oxidation; rhodium ruthenium coating 1 can improve the electrical contact performance of terminal 9, and its contact resistance is small; it also has high hardness and good corrosion resistance, resistance to plugging and electrolysis of hand sweat; nickel tungsten coating, palladium coating 3 And the rhodium-ruthenium coating 1 can effectively improve the wear resistance, corrosion resistance, hardness and electrical contact performance of the terminal 9; but because these three coatings themselves have certain internal stresses, they are not easy to combine with each other. The selection of materials is made here. Gold plating is used as the transition layer. Gold has good ductility, which can buffer or reduce the internal stress of the above three coatings and prevent cracks in the coating. So that the electroplating coating has better performance.
其次,这里采用双层镍钨镀层后,可有效降低钯镀层3、铑钌镀层1的厚度,降低成本。双层镍钨镀层后,其镍钨镀层的厚度得到增加,电镀层的耐磨性和耐腐蚀得到增加;从而可以减少镀层、铑钌镀层1的厚度。其次,双层镍钨镀层使得其中的单层镍钨镀层的厚度减少,进而减少金属其内部的电镀内应力,可有效防止镍钨镀层厚度过厚导致其结构不稳定。Secondly, after the double-layer nickel-tungsten coating is adopted here, the thickness of the palladium coating 3 and the rhodium-ruthenium coating 1 can be effectively reduced, and the cost can be reduced. After the double-layer nickel-tungsten coating, the thickness of the nickel-tungsten coating is increased, and the wear resistance and corrosion resistance of the electroplating layer are increased; thereby the thickness of the coating and the rhodium-ruthenium coating 1 can be reduced. Secondly, the double-layer nickel-tungsten coating reduces the thickness of the single-layer nickel-tungsten coating, thereby reducing the internal stress of the metal plating, which can effectively prevent the structure of the nickel-tungsten coating from being too thick and unstable.
优选地,铜镀层8的厚度a为:1-3μm。Preferably, the thickness a of the copper plating layer 8 is 1-3 μm.
优选地,内镍钨镀层7的厚度b为0.75-3μm;Preferably, the thickness b of the inner nickel-tungsten coating 7 is 0.75-3 μm;
优选地,内镀金层6的厚度c为0.05-0.3μm;Preferably, the thickness c of the inner gold-plated layer 6 is 0.05-0.3 μm;
优选地,外镍钨镀层5的厚度d为0.75-3μm;Preferably, the thickness d of the outer nickel-tungsten coating 5 is 0.75-3 μm;
优选地,中间镀金层4的厚度e为0.05-0.3μm;Preferably, the thickness e of the middle gold-plated layer 4 is 0.05-0.3 μm;
优选地,钯镀层3的厚度f为0.5-2μm;Preferably, the thickness f of the palladium coating 3 is 0.5-2 μm;
优选地,外镀金层2的厚度g为0.05-0.5μm;Preferably, the thickness g of the outer gold-plated layer 2 is 0.05-0.5 μm;
优选地,铑钌镀层1的厚度h为0.25-2μm。Preferably, the thickness h of the rhodium-ruthenium coating 1 is 0.25-2 μm.
进一步地,g+h<3μm;b+d>2um;Further, g+h<3μm; b+d>2um;
为减少成本,以及控制镀层的质量,防止镀层厚度过小,性能达到不到要求,镀层厚度过大,镀层结构不稳定。经过实验,上述的厚度组合可以获得一个性能良好的电镀镀层。In order to reduce the cost and control the quality of the coating, prevent the thickness of the coating from being too small, the performance cannot meet the requirements, and the thickness of the coating is too large, and the structure of the coating is unstable. Through experiments, the above combination of thicknesses can obtain an electroplating coating with good performance.
实施例2:一种端子9,其表面镀有实施例1的电镀镀层。Embodiment 2: A terminal 9, the surface of which is plated with the electroplating layer of Embodiment 1.
端子9 可以为目前电子接口中的端子。Terminal 9 may be a terminal in the current electronic interface.
实施例3:一种电子接口包括实施例2的端子9。Embodiment 3: An electronic interface includes the terminal 9 of Embodiment 2.
电子接口,可以为各种数据连接线接口,如USB接口;也可以为电连接器的电子接口,其他用于信号传输或导电的接口。The electronic interface may be various data connection line interfaces, such as a USB interface; it may also be an electronic interface of an electrical connector, or other interfaces for signal transmission or conduction.
实施例4:一种电子设备包括实施例3的电子接口。Embodiment 4: An electronic device includes the electronic interface of Embodiment 3.
电子设备,可以为手机、笔记本、IPAD、相机、电脑等具有数据处理或/和存储功能的设备。Electronic equipment can be mobile phones, notebooks, IPADs, cameras, computers and other equipment with data processing and/or storage functions.
以上内容仅为本实用新型的较佳实施例,对于本领域的普通技术人员,依据本实用新型的思想,在具体实施方式及应用范围上均会有改变之处,本说明书内容不应理解为对本实用新型的限制。The above content is only a preferred embodiment of the present utility model. For those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation and scope of application. The content of this specification should not be understood as Limitations on the Invention.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107146964A (en) * | 2017-07-01 | 2017-09-08 | 东莞普瑞得五金塑胶制品有限公司 | A kind of galvanization coating and terminal, electrical interface, electronic equipment for terminal |
| CN109149317A (en) * | 2018-08-10 | 2019-01-04 | 北京小米移动软件有限公司 | The production method and Micro USB plug of Micro USB plug |
| CN110820024A (en) * | 2019-12-25 | 2020-02-21 | 无锡华晶利达电子有限公司 | A coating structure for enhancing corrosion resistance of mobile phone connectors |
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2017
- 2017-07-01 CN CN201720784631.6U patent/CN206850073U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107146964A (en) * | 2017-07-01 | 2017-09-08 | 东莞普瑞得五金塑胶制品有限公司 | A kind of galvanization coating and terminal, electrical interface, electronic equipment for terminal |
| CN109149317A (en) * | 2018-08-10 | 2019-01-04 | 北京小米移动软件有限公司 | The production method and Micro USB plug of Micro USB plug |
| CN110820024A (en) * | 2019-12-25 | 2020-02-21 | 无锡华晶利达电子有限公司 | A coating structure for enhancing corrosion resistance of mobile phone connectors |
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