JP2008181702A - Battery pack, battery protection module, and manufacturing method of base board for battery protection module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a battery pack, a battery protection module, and a base plate for a battery protection module, protecting a terminal with weak static resistance from static electricity, and with strong resistance against influence from outside such as corrosive gas. <P>SOLUTION: In the battery protection module 70, electricity is passed to a plurality of pads 11, 12, 13, 14, provided on the surface of a base board w, by an electrolytic plating wire 20, and they are electrolytically plated to form terminals 31, 32, 33, 34. At least one terminal 33 out of the plurality of terminals 31, 32, 33, 34, after the electrolytic plating, has its connection 50, 51, 52, 53, 54 with the electrolytic plating wire 20 cut off by a hole 40 inside the base board. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a battery pack, a battery protection module housed in the battery pack, and a method for manufacturing a battery protection module substrate.

  Conventionally, a battery protection module of a lithium battery pack used for a mobile phone or the like is known (see, for example, Patent Document 1).

  Such a battery protection module generally has a COB (Chip On Board) structure, and an output terminal of a lithium battery and a test terminal are provided on the surface of the circuit board. The terminal provided on the surface of such a circuit board is often made of a corrosive metal such as copper, and is gold-plated to protect the terminal from a corrosive gas such as sulfurous acid gas or hydrogen sulfide. There are many cases.

  Such gold plating is generally performed by electrolytic plating. FIG. 10 is a diagram showing a general electrolytic plating apparatus 60 and a substrate w to be plated. FIG. 10A shows individual substrates w to be plated. In FIG. 10A, the substrate w is provided with a pad 10 on the surface thereof, and further provided with an electroplating wire 20 for connecting the pads 10 of adjacent individual substrates w.

FIG. 10B shows a state where the collective substrate W of the substrates w is gold-plated by the electrolytic plating apparatus 60. The electrolytic plating apparatus 60 includes a plating tank 61, a cathode electrode 62, an anode electrode 63, and a substrate holding jig 64, and a gold plating solution 66 is accommodated in the plating tank 61. The substrate w is held by the substrate holding jig 64 and immersed in the gold plating solution 66 in the state of the collective substrate W electrically connected to the adjacent substrate w by the electrolytic plating wire 20. A negative voltage is applied from the cathode electrode 62 connected to the power source 65, and a positive voltage is applied from the anode electrode 63. Then, gold ions Au ⁺ in the gold plating solution 66 are attracted and moved toward the substrate W to which a negative voltage is applied, and a protective metal film is formed on the pad 10 by gold plating.

  FIG. 11 is a diagram showing a substrate for a battery protection module of the prior art. FIG. 11A is a diagram showing individual substrates w. A positive output terminal pad 11, a negative output terminal pad 12, a VDD test terminal pad 13, and a VSS test terminal pad 14 are provided on the substrate w. The positive output terminal pad 11 includes an electrolytic plating wire 21, the negative output terminal pad 12 includes an electrolytic plating wire 22, the VDD test terminal pad 13 includes an electrolytic plating wire 23, and the VSS test terminal pad 14 includes an electrolytic plating wire 24. .

  The positive output terminal pad 11 and the negative output terminal pad 12 are respectively connected to corresponding output terminals of the lithium battery pack, and serve as connection terminals with the outside. On the other hand, although not shown, the VDD test terminal pad 13 and the VSS test terminal pad 14 are normally tested by a battery pack manufacturer or the like for the operation of a battery protection IC (Integrated Circuit) integrated on the back surface of the substrate w. This is a terminal for performing the above and the like, and is covered with a seal or the like when the protection module is shipped. The electroplating wires 21, 22, 23, and 24 are connection wires for supplying current to the connected terminal pads 11, 12, 13, and 14, respectively. For example, a negative voltage is applied from the cathode electrode 62 shown in FIG. 10B to the terminal pads 11, 12, 13, and 14 through the electrolytic plating wires 21, 22, 23, and 24.

FIG. 11B is a diagram showing a state in which the adjacent substrates w are connected by the electrolytic plating wires 21, 22, 23, 24 to form the collective substrate W. In FIG. 11B, only two adjacent substrates w1 and w2 are shown, but the substrates w may be connected adjacently in the same manner to form a collective substrate W. In this way, each substrate w is connected to the adjacent substrates w by the respective electroplating wires 21, 22, 23, and 24 so as to be energized, batch-processed in the state of the collective substrate W, and gold-plated. Is given. Then, after the aggregate substrate W is subjected to gold plating, the base material of the substrate W and the electrolytic plating wires 21, 22, 23, and 24 are cut along the scribe line 25 to be divided into individual substrates w. Thus, by performing the gold plating process once on the collective substrate W, a plurality of substrates w on which gold-plated terminals are formed can be obtained, and the overall throughput can be improved.
JP 2005-339966 A

  However, in the configuration of the above-described prior art, since the aggregate substrate W is gold-plated and then divided into individual substrates w, a large number of metals such as copper that are not gold-plated are exposed on the side surfaces of the end portions of the substrate w. Therefore, there are many paths through which static electricity enters the terminals of the substrate w and portions that are easily affected by corrosive gas.

  FIG. 12 is a diagram of the surface on the terminal side of the substrate w of the prior art. As shown in FIG. 12, when each of the positive output terminal 31, the negative output terminal 32, the test terminal VDD 33 and the test terminal VSS 34 of the substrate w includes the electrolytic plating wires 21, 22, 23 and 24, the electrolytic plating wire is 1 Since there are two upper and lower terminals for one terminal pad, there are a total of eight exposed at the edge of the substrate w. Therefore, a large number of paths through which the static electricity enters the output terminals 31 and 32 and the test terminals 33 and 34 provided on the substrate w are constituted by the plated wires 21, 22, 23, and 24. There is a problem that the terminal is easily affected by external influences such as static electricity and corrosive gas.

  FIG. 13 is a view showing a state in which the conventional substrate w is applied to the battery protection module 70 and accommodated in the battery pack 80. In FIG. 13, a negative output terminal 32 and a test terminal VDD 33 are formed on the surface of the battery protection module 70. Other terminals are omitted for ease of explanation.

  In FIG. 13, there are four electroplated wires 22, 22 a, 23, and 23 a that serve as a path of entry of static electricity into the terminal, but when static electricity enters the negative output terminal 32, the static electricity enters the negative output terminal 32. In some cases, the space moves between the battery pack 80 and the battery protection module 70 without staying, and enters the test terminal VDD33 through, for example, the electrolytic plating wire 23a. Such a phenomenon has been confirmed by ESD (Electro-Static Discharge) evaluation, and a phenomenon may occur in which static electricity jumps into a place different from the place where the static electricity is applied. In many cases, static electricity is considered to move in the space between the battery pack 80 and the battery protection module 70. Therefore, in the configuration of the prior art shown in FIG. 13, static electricity jumping into the negative output terminal 32 moves from the electrolytic plating wire 22a to the space between the battery pack 80 and the battery protection module 70, and the electrolytic plating wire 23a. Through the test terminal VDD33.

  Next, a problem caused by such intrusion of static electricity will be described with reference to FIG. FIG. 14 is a circuit diagram of a general battery protection module 70. The battery protection module 70 includes a positive output terminal 31 and a negative output terminal 32, and is connected to a positive electrode 81 and a negative electrode 82 of a lithium storage battery (not shown). As described so far, the positive output terminal 31 and the negative output terminal 32 are provided on the surface of the battery protection module 70 and contact an external charger (not shown) to charge the lithium storage battery. Further, the battery protection module 70 includes a battery protection IC 71, in which a battery protection circuit is accommodated. A test terminal VDD33 and a test terminal VSS34 provided on the surface of the battery protection module 70 are connected to the VDD terminal and the VSS terminal of the battery protection IC 71 so that an operation test of the battery protection IC 71 can be performed from the outside. ing. A resistor R1 is connected between the positive output terminal 31 of the battery protection module 70 or the positive electrode 81 of the lithium storage battery and the test terminal VDD33, and a capacitor C1 is connected between the test terminal VDD33 and the test terminal VSS34. It is connected. Further, MOS transistors M1 and D1 are connected between the DO terminal of the battery protection IC 71 and the negative electrode 82 of the lithium storage battery, and between the CO terminal of the battery protection IC 71 and the negative output terminal 32 of the battery protection module 70. Are connected to the MOS transistor M2 and the diode D2. Further, a resistor R <b> 2 is connected between the V− terminal of the battery protection IC 71 and the negative output terminal 32 of the battery protection module 70.

  Consider a case where static electricity enters each terminal in such a configuration. Since the negative electrode 82 of the lithium storage battery is connected to the GND terminal (ground terminal) of the battery, even if static electricity is applied, the negative electrode 82 is pulled out to the ground terminal, so that no problem occurs. Similarly, since the negative output terminal 32 of the battery protection module 70 is connected to the set GND terminal (ground terminal) of the battery protection module 70, no problem occurs even if static electricity is applied thereto. Further, since the test terminal VSS34 is also connected to the battery GND terminal of the lithium storage battery, no problem occurs even when static electricity is applied thereto. Further, when static electricity is applied to the positive output terminal 31 of the battery protection module 70 and the positive electrode 81 of the lithium storage battery, the static electricity is attenuated by the resistor R1 before being input to the VDD terminal of the battery protection IC 71. The tolerance is relatively high and the risk of problems is relatively small.

  However, when static electricity is applied to the test terminal VDD33, the resistor R1 is provided above the connection point, and the capacitor C1 is provided below the connection point. ing. In addition, since the VDD terminal of the battery protection IC is directly connected to the test terminal VDD33, the applied static electricity flows there, adversely affects the battery protection IC 71, and sometimes destroys the battery protection IC 71. Arise. Thus, the battery protection IC 71 of the general battery protection module 70 is in an unprotected state against static electricity applied to the test terminal VDD33.

  Accordingly, the present invention protects a terminal having weak electrostatic resistance, such as the above-described test terminal VDD, from static electricity, and also has a battery pack, a battery protection module, and a battery that are resistant to external influences such as corrosive gas. An object is to provide a substrate for a protection module.

In order to achieve the above object, the battery protection module (70) according to the first invention is provided with a plurality of pads (11, 12, 13, 14) on the surface of the substrate (w), and the plurality of pads are electrolyzed. A battery protection module (70) for forming terminals (31, 32, 33, 34) by being energized by plating wires (20, 22, 24) and electrolytically plating,
Among the plurality of terminals (31, 32, 33, 34), at least one terminal (33) has a connection (50, 51, 53, 54) with the electrolytic plating wire (20) after the electrolytic plating. It is cut and insulated by a hole (40) in the substrate. Thereby, about the terminal which wants to protect from static electricity, the application of the static electricity from the electrolytic plating wire provided in the edge part of a board | substrate can be prevented, and it can be set as a battery protection module with strong static electricity tolerance.

According to a second invention, in the battery protection module (70) according to the first invention,
The hole (40) is provided at a connection point (57) of the connection between the plurality of terminals (31, 33, 34) and the electrolytic plating wire (20). Thereby, even in the case of a wiring structure in which a plurality of terminals are connected to the electrolytic plating wire in the substrate, it is possible to provide a configuration in which the electrostatic resistance of many terminals is increased with a small number of holes by providing holes at the gathering points. .

3rd invention is the module for battery protection (70a) based on 1st or 2nd invention,
The hole (40) is filled with a resin (41). As a result, the electrostatic resistance can be further increased, and the corrosion of the metal portion exposed in the cross section of the hole due to the corrosive gas can be prevented.

A fourth invention provides the battery protection module (70b) according to the first to third inventions,
A ground wiring (42) is provided around the hole (40). As a result, even if the static electricity moves around the terminals that are to be protected from static electricity, the static electricity can be guided to the ground wiring and escaped, and adverse effects from static electricity can be prevented more effectively.

  A fifth invention is a battery pack including the battery protection module according to any of the first to fourth inventions, wherein the terminals of the battery protection module serving as the terminals of the battery pack are affected by static electricity or corrosive gas. It can be set as the battery pack which can be protected from.

In the method for manufacturing a substrate (w) according to the sixth aspect of the invention, an individual substrate (w) having a plurality of pads (11, 12, 13, 14) provided on the surface thereof is electroplated (20, 22, 24). A manufacturing method for manufacturing individual substrates (w) from the aggregate substrate (W) connected by
Among the plurality of pads (11, 12, 13, 14), at least one pad (31, 32, 34) is directly connected to the electrolytic plating wire (20, 22, 24), and the other pads ( 33) preparing the collective substrate connected to the electrolytic plating wire (20) by connection wiring (50, 51, 53, 54) provided in the individual substrate (w);
The collective substrate (W) is immersed in a plating solution (66), a voltage is applied to the electrolytic plating wires (20, 21, 22, 24) to perform electrolytic plating, and the plurality of pads (11, 12, 13). 14) forming a protective metal film to form terminals (31, 32, 33, 34);
Dividing the electrolytic plating wires (20, 22, 24) of the aggregate substrate into individual substrates (w); and
A step of insulating the electrical connection by opening a hole in the connection wiring (50, 51, 53, 54) provided in the substrate and cutting the connection wiring. This makes it possible to manufacture a substrate having terminals in which electrolytic plating wires are not provided at the end portions of the substrate even when the aggregate substrate is divided, and to be protected from the effects of static electricity and corrosive gas The substrate can be manufactured.

7th invention is the manufacturing method of the board | substrate (w) based on 6th invention,
The connection wiring (50, 51, 53, 54) is a collection point of the connection wiring (50, 51, 53, 54) of the plurality of pads (11, 12, 13, 14) in the substrate (w) ( 57), and the step of insulating the electrical connection is performed by making a hole (40) at the assembly point and cutting. As a result, it is possible to manufacture a substrate having a wiring structure in which a plurality of terminals can be formed into terminals having extremely strong electrostatic resistance.

  Note that the reference numerals in the parentheses are given for easy understanding, are merely examples, and are not limited to the illustrated modes.

  According to the present invention, it is possible to protect terminals with low electrostatic resistance of the battery pack and the battery protection module.

  The best mode for carrying out the present invention will be described below with reference to the drawings. Note that the same reference numerals are given to the same components as those described above.

  FIG. 1 is a perspective view showing a substrate w used as a terminal of the battery protection module 70 according to the present embodiment. FIG. 1A is a diagram showing the configuration of each substrate w before the electrolytic plating process.

  In FIG. 1, a positive output terminal pad 11, a negative output terminal pad 12, a VDD test terminal pad 13, and a VSS test terminal pad 14 are provided on the surface of the substrate w. Further, an electrolytic plating wire 20 is provided connected to the negative output terminal pad 12, and a metal cross section is exposed on the side surface of the end portion of the substrate w. The in-substrate connection wiring 50 is connected to the electrolytic plating wire 20, and the in-substrate connection wiring 50 is connected to the in-substrate connection wiring 53 through the aggregation point 57 to form a connection wiring. The test terminal VDD 13 and the electrolytic plating wire 20 are electrically connected by this connection wiring. Further, the in-board connection wiring 50 is connected to the in-board wirings 51 and 54 through the aggregation point 57 and is electrically connected to the positive output terminal 11 and the VSS test terminal 14 through each of them. Note that the terminal pads 11, 12, 13, and 14, the electrolytic plating wire 20 and the in-substrate wirings 50, 51, 53, and 54, which are metal portions on the substrate w, are made of copper or aluminum that is preferably used as a wiring material. A metal wiring material may be used.

  The substrate w according to the present embodiment shown in FIG. 1 (a) is directly connected to the electrolytic plating wire 20 or via all the in-substrate wirings 50, 51, 53, 54. Since 12, 13, and 14 are connected, the current supplied to the electrolytic plating wire 20 is supplied to all the terminal pads 11, 12, 13, and 14, and electrolytic plating can be performed. That is, the substrate w is provided with only one electrolytic plating wire 20, but all the terminal pads 11, 12, 13, and 14 on the substrate w can be subjected to electrolytic plating. Yes.

  FIG. 1B is a perspective view of the collective substrate W according to the present embodiment. As described above, each substrate w shown in FIG. 1A constitutes a collective substrate W if adjacent substrates are connected by one electrolytic plating wire 20, 20a, 20b before the electrolytic plating process. be able to. Then, by performing the electrolytic plating process, for example, the gold plating process using a gold plating solution on the collective substrate W, the plurality of substrates w can be subjected to the gold plating process at one time.

  FIG. 2 is a view showing a state in which the collective substrate W according to the present embodiment is gold-plated on the substrate W using the electrolytic plating apparatus 60. FIG. 2A is a schematic diagram of each substrate w. In FIG. 2A, the number of electrodes is two for simplicity.

  The substrate w according to the present embodiment shown in FIG. 2A has, for example, a negative output terminal pad 12 and a VDD test terminal pad 13 provided on the surface, and an electrolytic plating wire 20 provided only on the negative output terminal pad 12. ing. The VDD test terminal pad 13 is not provided with an electrolytic plating wire, but is provided with an in-substrate connection wiring 50, connected to the negative output terminal pad 12, and configured to allow energization from the electrolytic plating wire 20. Yes.

  FIG. 2B shows a diagram in which the individual substrates w shown in FIG. 2A are connected by the electrolytic plating wire 20 to form a collective substrate W, and the collective substrate W is gold-plated. Yes. The configuration of the electrolytic plating apparatus 60 is the same as that of the conventional electrolytic plating apparatus 60 described with reference to FIG.

In FIG. 2B, the collective substrate W is provided in each substrate w by energizing the negative output terminal 12 of each substrate w by one electrolytic plating wire 20 connecting the individual substrates w. Further, the power supply to the VDD test terminal 13 of each substrate w is secured by the in-substrate connection wiring 50. As a result, a negative voltage is applied from the cathode 62 of the electroplating apparatus 60, a positive voltage is applied to the anode 63, and gold ions Au ⁺ in the plating solution stored in the plating tank 61 are transferred to each terminal of each substrate w. 12 and 13 move and adhere to form a protective metal film. The metal on the substrate surface including the terminal pads 12 and 13 can be protected from corrosive gases such as human sweat, hydrogen sulfide, and sulfurous acid gas by the protective metal film formed by gold plating.

  As described above, the collective substrate W according to the present embodiment can perform the gold plating process using the same electroplating apparatus 60 as the conventional one. The substrate W that has been subjected to gold plating by the electroplating apparatus 60 is pulled up from the plating solution after the electroplating and washed, and then the electroplating wire 20 is cut and divided into individual substrates w.

  In FIG. 2B, the terminals have been described by taking the negative output terminal pad 12 and the VDD test terminal pad 13 as an example, but it goes without saying that any arbitrary terminals of the substrate w may be targeted. In this embodiment, the gold plating process is described as an example. However, as long as it is a stable metal capable of protecting the metal wiring, the protective metal film may be formed by performing a plating process with another metal. The electroplating process according to the present embodiment can be suitably performed using various terminals or metals.

  FIG. 3 is a view showing individual substrates w divided after electrolytic plating according to the present embodiment. In FIG. 3, a hole 40 is formed at the position of the gathering point 57. After the collective substrate W is subjected to the electrolytic plating process, the position of the collective point 57 is cut by the hole 40 to insulate the respective terminals 31, 32, 33 and 34. If the set point 57 is left connected, the positive output terminal 31, the negative output terminal 32, the test terminal VDD33, and the test terminal VSS34 are all electrically connected and have no meaning as terminals. Therefore, after electrolytic plating, a hole 40 is formed at the position of the gathering point 57, the in-substrate connection wirings 50, 51, 53, and 54 are cut, and the terminals 31, 32, 33, and 34 are insulated. Since it takes a labor and time for processing to form the hole 40, it is preferable that the gathering point 57 is concentrated at one point and the cutting and insulation process is completed by one drilling as shown in FIG. Depending on the layout design of the substrate w, the number of terminals, and the like, a plurality of collection points 57 may be provided, and holes 40 may be formed in all of them to be cut and insulated.

  The processing of the substrate hole 40 may be performed with a drill, or the hole 40 may be formed using a mold or a router. Further, the hole 40 only needs to be able to cut the in-substrate connection wirings 50, 51, 53, 54. Therefore, when the in-substrate connection wirings 50, 51, 53, 54 are formed only on the surface of the substrate w, the substrate The hole 40 may not be the hole 40 penetrating w, and may be cut so as to form a hollow hole 40.

  Conversely, the in-substrate connection wirings 50, 51, 53, 54 including the gathering points 57 may be formed not inside the surface of the substrate w but inside the substrate w. For example, when the substrate w has a multilayer wiring structure, the in-substrate connection wirings 50, 51, 53, and 54 may be formed in a number of layers of the substrate w. Thus, by cutting and insulating the in-substrate connection wirings 50, 51, 53, 54 after electrolytic plating, electrolysis can be performed without providing the electrolytic plating wire 20 on all the terminals 31, 32, 33, 34. Each terminal 31, 32, 33, 34 can be formed as a terminal of the battery protection module 70 while plating.

  FIG. 4 is a plan view of the surface of the substrate w according to the present embodiment. In FIG. 4, a positive output terminal 31, a negative output terminal 32, a test terminal VDD33, and a test terminal VSS34 are formed on the surface of the substrate w. Each terminal 31, 32, 33, 34 is connected to the in-board connection wiring 51, 50, 53, 54, but the connection is cut by the hole 40 provided in the board w, and each terminal 31, 32, The wiring structure 33 and 34 are all insulated. Moreover, the number of the electrolytic plating wires 20 is one, and the upper and lower two portions are exposed on the side surface of the end portion of the substrate w. Accordingly, the entrance of static electricity can be stopped only at the exposed portion of the substrate end portion of the electroplated wire 20, and the entry of static electricity into the positive output terminal 31, the test terminal VDD33 and the test terminal VSS34 can be prevented. The effect is particularly great for the test terminal VDD33 that is weak against static electricity. Further, by reducing the exposed metal portion where the protective film such as gold plating is not formed, the influence of the corrosive gas such as hydrogen sulfide or sulfurous acid gas on the metal can be minimized.

  FIG. 5 is a diagram showing an aspect in which the substrate w described so far is applied to the battery pack 80 according to the present embodiment. The battery pack 80 according to this embodiment includes a battery protection module 70 and includes a positive output terminal 31, a negative output terminal 32, a test terminal VDD33, a test terminal VSS34, and a thermistor terminal 35 on the surface. In the conventional substrate w, the thermistor terminal 35 is not provided for ease of explanation, but the thermistor terminal 35 may be further provided in this way. Each of the terminals 31, 32, 33, 34, and 35 is connected to the in-substrate connection wiring 51, 50, 53, 54, and 55, but is provided with a substrate hole 40 and cut and insulated.

  In such a configuration, as described with reference to FIG. 13, for example, static electricity is applied to the negative output terminal 32, and static electricity is applied from the electrolytic plating wire 20 a exposed at the end of the substrate w to the battery pack 80 and the battery protection module 70. Even if the space between them is moved, there is no other electroplated wire that triggers the entry of static electricity, so that the static electricity cannot jump into other terminals. Therefore, each terminal 31, 33, 34, 35 is protected from static electricity. Moreover, since the exposed part of the metal in which the protective film is not formed decreases, the influence from corrosive gas can also be reduced.

  FIG. 6 is a view showing a modification of the battery protection module 70 and the battery protection module substrate w described in FIGS. 1 to 5. FIG. 6 is a perspective view of the substrate w portion of the battery protection module 70a as viewed from the back rather than from the front.

  In FIG. 6, a battery protection IC 71 is provided on the back surface of the substrate w, and a hole 40 is opened in the substrate w. However, the resin 41 is filled so as to fill the substrate hole 40 and cover the battery protection IC 71. The state sealed with is shown. By filling the substrate hole 40 with an insulating material such as a resin and filling the hole, the metal of the in-substrate connection wiring 50, 51, 52, 53, 54, 55 exposed inside the hole 40 and having no protective film formed thereon It is possible to completely protect the portion and completely shut off external static electricity and corrosive wire gas.

  Further, since the battery protection IC 71 is protected by the sealing resin 41, it is possible to use a bare chip in which a wire or the like is exposed without using an individual IC package or the like. If such a bare chip is used and an unpackaged IC is mounted on the substrate w, the size of the battery protection IC 71 can be reduced to about half, and the processing steps required for packaging of the battery protection IC 71 In addition, parts can be omitted, and the manufacturing cost of the battery protection module 70a can be reduced.

  Thus, by filling the hole 40 with an insulator such as the resin 41 and sealing it, the terminal is reliably protected from static electricity and corrosive gas, and space saving and manufacturing cost reduction are realized. be able to. In addition, resin sealing may be performed by various processes, such as molding, and the shaping | molding method is not ask | required.

  FIG. 7 is a view showing a modification of the battery protection module 70 and the battery protection module substrate w described in FIGS. 1 to 5, which are different from the modification of FIG. 6. In FIG. 7, the substrate w has a two-layer structure composed of a front surface and a back surface, FIG. 7B shows a pattern on the front surface of the substrate w, and FIG. 7A shows a guard provided on the back surface of the substrate w. FIG.

  In FIG. 7B, although the pattern structure of the in-substrate connection wirings 50, 51, 53, 54 is slightly different, a substrate w having a wiring connection structure substantially the same as that described so far is shown. That is, a positive output terminal 31, a negative output terminal 32, a test terminal VDD33, and a test terminal VSS34 are provided on the surface of the substrate w, and energization is performed from the electrolytic plating wires 20 and 20a through the in-substrate connection wires 50, 51, 53, and 54. Thus, the structure is shown in which electrolytic plating is performed and the terminals 31, 32, 33, and 34 are insulated from each other by the holes 40.

  FIG. 7A is a diagram showing a guard pattern 42 provided on the back surface of the substrate w. In FIG. 7A, an annular metal guard pattern 42 is provided around a substrate hole 40 provided in the substrate w. For example, a guard pattern 42 is provided so as to shield the surroundings even if static electricity enters through the in-board connection wirings 50, 51, 53, 54 exposed in the inner cross section of the board hole 40. It is configured to flow in the direction of. As shown in FIG. 7A, if the other guard pattern 42 is grounded and the guard pattern 42 is configured as a ground wiring, the static electricity is exposed to the inner cross section of the substrate hole 40. Even if it moves around the connection wiring 50, 51, 53, 54, it can be guided to the guard pattern 42 and escaped to the ground wiring.

  Thus, by providing the ground wiring 42 around the hole 40 that insulates each of the terminals 31, 32, 33, 34, by preventing static electricity from entering the terminals 31, 32, 33, 34, The static electricity resistance of each terminal 31, 32, 33, 34 can be improved, and the reliability of the battery protection module 70b can be increased. In FIG. 7, the substrate w may have a multilayer wiring structure of two or more layers. In that case, the ground wiring 42 may be provided in an arbitrary layer.

  FIG. 8 is a view showing a substrate w having a wiring structure different from those in FIGS. 1 to 7 and a battery protection module 70c using the substrate w.

  8 is the same as the substrate w shown in FIG. 3 in that the positive output terminal 31, the negative output terminal 32, the test terminal VDD33, and the test terminal VSS34 are provided on the surface of the substrate w. The position is different in that the position is arranged on the inner side of the substrate w from the test terminal VSS34. The electrolytic plating wire 20 is connected to the positive output terminal 31, the electrolytic plating wire 22 is connected to the negative output terminal 32, and the electrolytic plating wire 24 is connected to the test terminal VSS. There are also differences. Only the test terminal VDD33 is not connected to the electroplating wire, but instead the in-substrate connection wiring 53 is connected, and is connected to the electroplating wire 20 via the in-substrate connection wiring 50 and the positive output terminal 31. It is configured. After the electrolytic plating, the connection terminals 50 and 53 in the substrate are cut at the holes 40 so that the test terminal VDD 33 and the positive output terminal 31 can be insulated.

  As described above, the embodiment of the substrate w shown in FIG. 8 is configured so that the parts other than the test terminal VDD33 are connected to the electrolytic plating wires 31, 32, and 34, and only the test terminal VDD33 is protected from static electricity. As described with reference to FIG. 14, since the terminal particularly vulnerable to static electricity is the test terminal VDD33, the configuration of FIG. 8 is configured to protect only the terminals sensitive to static electricity. In the case where the other terminals 31, 32, and 34 have sufficient electrostatic resistance, it may be configured to protect only terminals having low electrostatic resistance in this way. In this way, the in-substrate connection wirings 50 and 53 are provided only for the terminals that need protection, and the terminals w that do not need protection are simply provided with electroplating wires to form the substrate w, thereby forming the pattern of the substrate w. It becomes easy. Moreover, it can be expected that the uniformity of the plating film thickness between the terminals is increased by increasing the number of electrolytic plating wires.

  In FIG. 8, the position of the test terminal VDD33 is moved in order to minimize the length of the in-substrate connection wirings 50 and 53. However, the arrangement shown in FIG. A wiring structure pattern may be used. Further, the sealing resin 41 and the ground wiring 42 described with reference to FIGS. 6 and 7 can be suitably applied to the present embodiment, whereby the electrostatic resistance or corrosive gas of the battery protection module 70c according to the present embodiment can be obtained. Resistance can be further increased.

  FIG. 9 is a diagram showing a substrate w having a wiring structure different from those in FIGS. 1 to 8 and a battery protection module 70d using the substrate w.

  In FIG. 9, a positive output terminal 31, a negative output terminal 32, a test terminal VDD33, and a test terminal VSS34 are provided on the surface of the substrate w in the same arrangement as that of FIG. The negative output terminal 32 is connected to the electrolytic plating wire 20, and the test terminal VSS 34 is connected to the electrolytic plating wire 24. Electrolytic plating wires are not directly connected to the positive output terminal 31 and the test terminal VDD33, but are connected to the in-substrate connection wiring 50 via the in-substrate connection wirings 51 and 53, and the in-substrate connection wiring 50 is electrolyzed. It is connected to the plated wire 20.

  In such a configuration, when the electrolytic plating process is performed using the plating solution 66, the positive output terminal 31, the negative output terminal 32, and the test terminal VDD 33 are plated through the electrolytic plating wire 20, and directly from the electrolytic plating wire 24. The test terminal VSS34 is plated. After the electrolytic plating, if the substrate hole 40 is provided at the position of the gathering point 57 to insulate the connection of the terminals 31, 32, 33, only the two electrolytic plating wires 20, 24 are not attached to the side surface of the end of the substrate w. It becomes the board | substrate w of the wiring structure which plated metal exposed.

  In FIG. 9, the electrolytic plating wires 20 and 24 are configured to be directly connected only to the negative output terminal 32 and the test terminal VSS 34 that are less affected by static electricity. As described with reference to FIG. 14, in the battery protection module 70d, the negative output terminal 32 is connected to the set GND terminal, the test VSS terminal 33 is connected to the battery GND terminal, and both are connected to the ground terminal. This is because the structure is strong against electric resistance. On the other hand, although the positive output terminal 31 is relatively strong against static electricity, it is not grounded, so it cannot be said that the positive output terminal 31 has no influence at all. In addition, since the test terminal VDD33 is a terminal that is particularly vulnerable to static electricity as described above, it is preferable to protect it reliably. From this point of view, in the embodiment according to FIG. 9, it is desired to provide electrolytic plating wires 22 and 24 only on the negative output terminal 32 and the test terminal VSS 34 which are connected to the ground terminal and are strong against static electricity, and to protect them from static electricity. The positive output terminal 31 and the test terminal VDD 33 are not provided with an electrolytic plating wire.

  As described above, according to the present embodiment, it is possible to selectively protect only a terminal that is desired to be protected from static electricity among a plurality of terminals provided on the surface of the substrate w. Further, by adopting such a configuration, the number of metals exposed on the side surface of the substrate is also reduced, so that the influence from the corrosive gas can also be reduced.

  The substrate w according to the present embodiment and the battery protection module 70d using the same can be applied with the sealing resin 41 and the ground wiring 42 described with reference to FIGS. 6 and 7, similarly to the embodiment according to FIG. is there. Thereby, the static electricity or corrosion gas tolerance of the battery protection module 70d according to the present embodiment can be enhanced.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present invention. Can be added. In particular, the type and number of terminals on the surface of the substrate w and the arrangement configuration can be variously changed. Further, the layer structure of the substrate w can be changed as appropriate, and the present invention can be applied with various changes depending on the positional relationship between the electrolytic plating wire and the terminal to be protected.

It is the perspective view which showed the board | substrate w for terminals of the battery protection module 70 which concerns on a present Example. It is the figure which showed the state which is carrying out the gold plating process of the aggregate substrate W which concerns on a present Example. It is the figure which showed each board | substrate w divided | segmented after the electrolytic plating based on a present Example. It is a top view of the surface of the board | substrate w which concerns on a present Example. It is the aspect figure which applied the board | substrate w to the battery pack 80 which concerns on a present Example. It is the figure which showed the modification of the battery protection module 70 and the board | substrate w for modules. It is a figure of the modification of the battery protection module different from the modification of FIG. 6, and the board | substrate w. It is the figure which showed the board | substrate w which has the wiring structure of the aspect different from FIGS. 1-7, and the battery protection module 70c using the same. It is the figure which showed the board | substrate w of the aspect which has a wiring structure different from FIGS. 1-8, and the battery protection module 70d using the same. It is the figure which showed the board | substrate w used as the general electrolytic plating apparatus 60 and to-be-plated object. FIG. 10A is a diagram showing individual substrates w to be plated. FIG. 10B shows a state where the collective substrate W is gold-plated. It is the figure which showed the board | substrate for battery protection modules of a prior art. It is a figure of the surface at the side of the terminal pad of the board | substrate w of the conventional treatment. FIG. 10 is a diagram showing a state in which a conventional substrate w is applied to the battery protection module 70 and accommodated in a battery pack 80. 3 is a circuit diagram of a general battery protection module 70. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Pad 11 Positive output terminal pad 12 Negative output terminal pad 13 VDD Test terminal pad 14 VSS Test terminal pad 20, 22, 24 Electroplating line 25 Scribe line 31 Positive output terminal 32 Negative output terminal 33 Test terminal VDD
34 Test terminal VSS
40 holes 41 resin 42 ground wiring (guard pattern)
50, 51, 53, 54, 55 In-substrate connection wiring 57 Assembly point 60 Electrolytic plating apparatus 61 Plating tank 62 Cathode 63 Anode 64 Substrate holding jig 65 Power supply 66 Plating solution 70, 70a, 70b, 70c, 70d Battery protection module 71 Battery protection IC
80 Battery pack 81 Positive electrode 82 Negative electrode

Claims (7)

A battery protection module in which a plurality of pads are provided on a surface of a substrate, and the plurality of pads are energized by an electrolytic plating wire and electrolytically plated to form a terminal,
The battery protection module according to claim 1, wherein at least one terminal among the plurality of terminals is insulated by being cut by a hole in the substrate after the electrolytic plating.   2. The battery protection module according to claim 1, wherein the hole is provided at a connection point between a plurality of terminals and the electrolytic plating wire.   The battery protection module according to claim 1, wherein the hole is filled with a resin.   The battery protection module according to any one of claims 1 to 3, wherein a ground wiring is provided around the hole.   A battery pack comprising the battery protection module according to any one of claims 1 to 4. A manufacturing method for manufacturing an individual substrate from an aggregate substrate obtained by connecting individual substrates provided with a plurality of pads on the surface by electrolytic plating wires,
Of the plurality of pads, at least one pad is directly connected to the electrolytic plating wire, and the other pads are connected to the electrolytic plating wire by connection wiring provided in the individual substrates. A process of preparing
Immersing the collective substrate in a plating solution, applying a voltage to the electrolytic plating wire to perform electrolytic plating, forming a protective metal film on the plurality of pads to form a terminal; and
Cutting the electrolytic plating wire of the aggregate substrate to divide the substrate into individual substrates;
A step of insulating the electrical connection by opening a hole in the connection wiring provided in the substrate and cutting the connection wiring.   The connection wiring is provided so that the connection wiring of a plurality of pads intersects at a collection point in the substrate, and the step of insulating the electrical connection is performed by making a hole in the collection point and cutting it. The method of manufacturing a substrate according to claim 6.

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