CN216087117U - Cost-reduced nickel alloy multilayer gold-plating for printed circuit board - Google Patents
Cost-reduced nickel alloy multilayer gold-plating for printed circuit board Download PDFInfo
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- CN216087117U CN216087117U CN202122180778.3U CN202122180778U CN216087117U CN 216087117 U CN216087117 U CN 216087117U CN 202122180778 U CN202122180778 U CN 202122180778U CN 216087117 U CN216087117 U CN 216087117U
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Abstract
The utility model discloses a printed circuit board nickel alloy multilayer gold plating with reduced cost, which comprises a substrate and a plurality of superposed layers arranged on the substrate, wherein the superposed layers sequentially comprise from inside to outside: the metal layer is arranged on the substrate and is electrically connected with external equipment; a nickel-tungsten gold plating layer disposed on the metal layer, the nickel-tungsten gold plating layer protecting the metal layer; a nickel plating layer disposed on the nickel-tungsten gold plating layer, the nickel plating layer protecting the nickel-tungsten gold plating layer; a gold plating layer disposed on the nickel plating layer, the gold plating layer protecting the nickel plating layer; the nickel-tungsten gold plating layer is prepared from the nickel-tungsten gold plating solution, and the nickel-tungsten gold plating solution comprises a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent and a soft enhancer. The nickel alloy multilayer gold plating of the printed circuit board with the reduced cost has the advantages of low cost and the like.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a cost-reduced nickel alloy multilayer gold plating method for a printed circuit board.
Background
Printed circuit boards used for memory modules and battery terminals have a characteristic of repeated detachment, and physical properties such as abrasion resistance, scratch resistance, and corrosion resistance are required. In order to improve the above properties, a terminal portion or a connection portion is formed on a chassis forming a printed circuit board, and a gold plating layer is formed by an electrolytic hard plating layer of a mixture of a nickel gold plating layer, gold, cobalt, nickel, or the like. The gold plating layer is formed on the nickel layer to ensure the wear resistance, scratch resistance, corrosion resistance, etc. of the printed wiring board, but a thick gold plating layer is required to ensure the above physical properties, so that the consumption of expensive gold increases and the manufacturing cost of the printed wiring board also increases. Although various studies have been made to reduce the thickness of the gold-plating layer and to improve the physical properties (such as abrasion resistance, scratch resistance, corrosion resistance) required for the printed circuit board, they have not been able to achieve a satisfactory level.
SUMMERY OF THE UTILITY MODEL
The utility model provides a printed circuit board nickel alloy multilayer gold plating with reduced cost, and aims to solve the problems.
According to the printed circuit board nickel alloy multilayer gold plating that this application embodiment provided of light reduce cost, including the base plate and set up a plurality of stack layers on the base plate, stack layer from inside to outside includes in proper order:
the metal layer is arranged on the substrate and is electrically connected with external equipment;
a nickel-tungsten gold plating layer disposed on the metal layer, the nickel-tungsten gold plating layer protecting the metal layer;
a nickel plating layer disposed on the nickel-tungsten gold plating layer, the nickel plating layer protecting the nickel-tungsten gold plating layer;
a gold plating layer disposed on the nickel plating layer, the gold plating layer protecting the nickel plating layer;
the nickel-tungsten gold plating layer is prepared from the nickel-tungsten gold plating solution, and the nickel-tungsten gold plating solution comprises a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent and a soft enhancer;
the thickness of the nickel-tungsten gold plating layer is 2.5-4.0 microns, and the plating layer negative electrode current density of the nickel plating layer is 1-5A/dm2And 2, the thickness of the gold plating layer is 0.1-10 um, the gold plating layer is any one of a hard gold plating layer and a gold-copper gold plating layer, and the gold plating layer forms a hard gold plating solution with a small amount of cobalt or nickel added in potassium gold cyanide, a complexing agent, a buffering agent, a gloss agent and a surfactant, or a gold-copper gold plating solution containing copper cyanide.
Preferably, the water-soluble nickel compound comprises any one or more of nickel sulfate salt, nickel sulfate and nickel ammonium sulfate, and the content of the water-soluble nickel compound is 2.0-4.0% of the weight of the nickel-tungsten gold plating solution.
Preferably, the water-soluble tungsten compound comprises sodium tungstate, and the content of the water-soluble tungsten compound is 9.0-11.0% of the weight of the nickel-tungsten gold plating solution.
Preferably, the complexing agent comprises any one or more of citric acid, sodium citrate, citric acid compounds, glycine, triethanolamine and hexapropylamine, and the content of the complexing agent is 7.0-11.0% of the weight of the nickel-tungsten gold plating solution.
Preferably, the soft enhancer is a water-soluble sulfo compound, the water-soluble sulfo compound comprises any one or a combination of more of acrylate, benzol alcohol triamide, sodium plastic tartrate and acrylate, and the soft enhancer accounts for 0.1-1.0% of the weight of the nickel-tungsten gold plating solution.
Preferably, the following are further arranged between the nickel-tungsten gold plating layer and the nickel plating layer in sequence: the palladium alloy layer is used for improving the electric corrosion resistance of the substrate; a rhodium alloy layer for increasing the hardness of the substrate; the inner layer or/and the outer layer of the palladium alloy layer is/are also provided with a transition layer, and the transition layer is used for bonding adjacent electroplated layers.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
the application designs a cost-reducing multilayer gold-plating of nickel alloy of a printed circuit board, through setting up a plurality of stack layers on the base plate, stack layer from interior to exterior includes in proper order: the metal layer is arranged on the substrate and is electrically connected with external equipment; a nickel-tungsten gold plating layer disposed on the metal layer, the nickel-tungsten gold plating layer protecting the metal layer; a nickel plating layer disposed on the nickel-tungsten gold plating layer, the nickel plating layer protecting the nickel-tungsten gold plating layer; a gold plating layer disposed on the nickel plating layer, the gold plating layer protecting the nickel plating layer; the nickel-tungsten gold plating layer is prepared from the nickel-tungsten gold plating solution, and the nickel-tungsten gold plating solution comprises a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent and a soft enhancer. By adopting the printed circuit board with the design, the nickel-tungsten gold plating layer can improve the physical properties of the printed circuit board such as wear resistance, scratch resistance, corrosion resistance and the like, and can reduce the thickness of the nickel-tungsten gold plating layer, so that the physical properties can be met even if the gold plating thickness is thinner. The thickness of the nickel-tungsten gold plating layer can be reduced by less than half, which is beneficial to shortening working hours, improving production efficiency and reducing cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a first embodiment of the present invention for reducing the cost of a printed circuit board with multi-layer gold plating of nickel alloy;
FIG. 2 is a schematic diagram of a first embodiment of the present invention for reducing the cost of a multilayer gold plating of a nickel alloy on a printed circuit board;
fig. 3 is a schematic flow chart of a method for plating gold on a nickel alloy of a printed wiring board according to a second embodiment of the present invention.
Description of reference numerals:
10. the nickel alloy multilayer gold plating of the printed circuit board reduces the cost; 11. a substrate; 12. an overlying layer; 13. a metal layer; 14. a nickel-tungsten gold plating layer; 15. a nickel plating layer; 16. plating a gold layer; 21. a palladium alloy layer; 22. a rhodium alloy layer; 23. and a transition layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is also to be understood that the terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1, a first embodiment of the present invention discloses a cost-reduced multilayer gold-plating 10 for a nickel alloy of a printed circuit board, including a substrate 11 and a plurality of stacked layers 12 disposed on the substrate 11, where the stacked layers 12 sequentially include, from inside to outside:
the metal layer 13 is arranged on the substrate 11, and the metal layer 13 is electrically connected with external equipment;
a nickel-tungsten gold plating layer 14 disposed on the metal layer 13, the nickel-tungsten gold plating layer 14 protecting the metal layer 13;
a nickel plating layer 15 disposed on the nickel-tungsten gold plating layer 14, the nickel plating layer 15 protecting the nickel-tungsten gold plating layer 14;
a gold plating layer 16 provided on the nickel plating layer 15, the gold plating layer 16 protecting the nickel plating layer 15;
the nickel-tungsten gold plating layer 14 is made of the nickel-tungsten gold plating solution, which includes a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent, and a soft enhancer;
the thickness of the nickel-tungsten gold-plating layer 14 is 2.5-4.0 microns, and the plating layer negative current density of the nickel plating layer 15 is 1-5A/dm2And 2, the thickness of the gold-plated layer 16 is 0.1-10 um, the gold-plated layer 16 is any one of a hard gold-plated layer and a gold-copper gold-plated layer, and the gold-plated layer 16 forms a hard gold-plating solution with a small amount of cobalt or nickel added in potassium gold cyanide, a complexing agent, a buffering agent, a gloss agent and a surfactant, or a gold-copper gold-plating solution containing copper cyanide.
By adopting the printed circuit board with the design, the nickel-tungsten gold plating layer 14 can improve the physical properties of the printed circuit board such as wear resistance, scratch resistance, corrosion resistance and the like, and can reduce the thickness of the nickel-tungsten gold plating layer 14, and the physical properties can be met even if the gold plating thickness is thinner. The thickness of the nickel-tungsten gold plating layer 14 can be reduced by less than half, which is beneficial to shortening working hours, improving production efficiency and reducing cost.
The metal layer 13 is preferably made of a copper material having excellent conductivity and low cost, and may be a terminal portion or a connector portion to which an external device can be electrically connected.
It is understood that the water-soluble nickel compound includes any one or a combination of nickel sulfate salt, nickel sulfate and nickel ammonium sulfate, and the content is about 0.5-10.0% by weight based on the weight of the whole gold plating solution; preferably, the content of the water-soluble nickel compound is 2.0-4.0% by weight of the nickel-tungsten gold plating solution. If the weight of the nickel-tungsten gold plating solution is less than 0.5%, the gold plating speed is obviously reduced, and the production efficiency is reduced; when the amount exceeds 10.0% by weight, the optimum ratio of the alloy gold plating may be inappropriate, and the desired physical properties may not be exhibited.
It will be appreciated that the water soluble tungsten compound includes sodium tungstate in an amount of about 3.0 to about 15.0 wt%, and most preferably about 9.0 to about 11.0 wt%, based on the weight of the entire gold plating solution. If the weight is 3.0% or less, the tungsten content in the nickel-tungsten gold-plating layer 14 is insufficient and the desired physical properties cannot be exhibited; when the amount is 15.0% or more, the physical properties cannot be further improved, and the cost is high and the economical efficiency is low.
It is understood that the complexing agent comprises any one or more of citric acid, sodium citrate, citric acid compound, glycine, triethanolamine and hexapropylamine, and the content of the complexing agent is 7.0-11.0% of the weight of the nickel-tungsten gold plating solution.
The complexing agent is a metal ion complex and serves to maintain uniform gold plating properties, and may be present in an amount of about 2.0 to about 13.0 wt%, and most desirably about 7.0 to about 11.0 wt%, based on the weight of the entire gold plating solution. If the weight is less than 2.0%, the gold plating ratio may be adversely affected by the metal ions in the gold plating, and if the weight exceeds 13.0%, the gold plating efficiency may be lowered.
It is understood that the soft enhancer is a water-soluble sulfo compound, the water-soluble sulfo compound comprises any one or a combination of more of acrylate, benzol alcohol triamide, sodium plastic tartrate and acrylate, and the soft enhancer accounts for 0.1-1.0% of the weight of the nickel-tungsten gold plating solution.
The soft enhancer can relieve the stress in the nickel-tungsten gold-plating layer 14, prevent the nickel-tungsten gold-plating layer 14 from cracking in the electroplating process, and can be a water-soluble sulfo compound. The water-soluble sulfone compound may be one or more selected from the group consisting of sulfonamide, sulfonimide, bisufite, and Sulfonate. Specifically, the water-soluble sulfone compound may be acrylate, benzalkonium chloride, sodium plastic tartrate, acrylate, or the like. The amount may be about 0.01 to about 5.0 wt%, and may be about 0.1 to about 1.0 wt%, based on the weight of the entire gold plating solution. If the weight is less than 0.01%, the influence on the internal stress of the nickel-tungsten gold-plating layer 14 is small, and cracks may occur in the nickel-tungsten gold-plating layer 14; when the weight exceeds 5.0%, the physical properties cannot be further improved, and the cost is high and the economical efficiency is low.
The gold plating layer 16 may be formed of a hard gold plating solution in which a small amount of cobalt or nickel is added to gold potassium cyanide, a complexing agent, a buffer, a brightener, and a surfactant, or a gold-copper gold plating solution containing copper cyanide; the hard gold plating solution or gold-copper gold plating solution forms a gold plating layer 16 having a thickness of about 0.05 to 3 microns, preferably about 0.05 to 0.7 microns, and more preferably about 0.15 to 0.35 microns. This is a significant reduction compared to the conventional 0.76 to 3 micron thickness of the gold plating layer 16, which is caused by the above nickel-tungsten gold plating layer 14.
Referring to fig. 2, the nickel-tungsten gold-plating layer 14 and the nickel-tungsten plating layer 15 are sequentially disposed between them: a palladium alloy layer 21 for improving the corrosion resistance of the substrate 11; a rhodium alloy layer 22 for increasing the hardness of the substrate 11; the inner or/and outer layer of the palladium alloy layer 21 is further provided with a transition layer 23, the transition layer 23 serving to bond adjacent plated layers. Since the internal stress of the palladium alloy layer 21 is large, the transition layer 5 is provided between the palladium alloy layer 21 and the rhodium alloy layer 22, and the transition layer 5 is a metal layer having a good ductility.
It is understood that the thickness of the transition layer 23 is 0.025 to 2.5 micrometers, and the transition layer 23 includes a gold layer or a gold alloy layer, which has a better ductility.
Referring to fig. 3, a second embodiment of the present invention discloses a method 100 for plating a nickel alloy on a printed circuit board, comprising the following steps:
step S1: preparing a substrate;
step S2: immersing the substrate in an electro-deposition groove of a nickel-tungsten gold plating solution to form a nickel-tungsten gold plating layer;
step S3: forming a nickel-plated layer on the nickel-tungsten gold-plated layer;
step S4: forming a gold plating layer on the nickel plating layer.
The method for forming a nickel-tungsten gold plating layer on an electrodeposition bath in which a substrate is immersed in a nickel-tungsten gold plating solution comprises immersing a base plate in a tank for introducing a nickel-tungsten gold plating solution containing a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent and a soft enhancer, and introducing a current between two electrodes in the tank to form a nickel-tungsten gold plating layer on a metal layer.
While the utility model has been described with reference to specific embodiments, the utility model is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the utility model. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. The utility model provides a printed wiring board nickel alloy multilayer gilding of reduce cost which characterized in that includes the base plate and sets up a plurality of stack layers on the base plate, stack layer from inside to outside includes in proper order:
the metal layer is arranged on the substrate and is electrically connected with external equipment;
a nickel-tungsten gold plating layer disposed on the metal layer, the nickel-tungsten gold plating layer protecting the metal layer;
a nickel plating layer disposed on the nickel-tungsten gold plating layer, the nickel plating layer protecting the nickel-tungsten gold plating layer;
a gold plating layer disposed on the nickel plating layer, the gold plating layer protecting the nickel plating layer;
the nickel-tungsten gold plating layer is prepared from the nickel-tungsten gold plating solution, and the nickel-tungsten gold plating solution comprises a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent and a soft enhancer;
the thickness of the nickel-tungsten gold plating layer is 2.5-4.0 microns, and the plating layer negative electrode current density of the nickel plating layer is 1-5A/dm2The gold plating layer is 0.1-10 um thick, the gold plating layer is any one of a hard gold plating layer and a gold-copper gold plating layer, and the gold plating layer forms a hard gold plating solution with a small amount of cobalt or nickel added in gold potassium cyanide, a complexing agent, a buffering agent, a gloss agent and a surfactant, or a gold-copper gold plating solution containing copper cyanide.
2. The reduced cost printed wiring board nickel alloy multilayer gold plating of claim 1, wherein: the water-soluble nickel compound comprises any one or combination of nickel sulfate salt, nickel sulfate and nickel ammonium sulfate, and the content of the water-soluble nickel compound is 2.0-4.0% of the weight of the nickel-tungsten gold plating solution.
3. The cost-effective multilayer gold plating of nickel alloys for printed wiring boards of claim 2 wherein: the water-soluble tungsten compound comprises sodium tungstate, and the content of the water-soluble tungsten compound is 9.0-11.0% of the weight of the nickel-tungsten gold plating solution.
4. The reduced cost printed wiring board nickel alloy multilayer gold plating of claim 3, characterized by: the complexing agent comprises any one or more of citric acid, sodium citrate, a citric acid compound, glycine, triethanolamine and hexapropylamine, and the content of the complexing agent is 7.0-11.0% of the weight of the nickel-tungsten gold plating solution.
5. The reduced cost printed wiring board nickel alloy multilayer gold plating of claim 1, wherein: the soft enhancer is a water-soluble sulfo compound, the water-soluble sulfo compound comprises any one or combination of more of acrylic ester, benzene alcohol triamide, plastic sodium tartrate and acrylic ester, and the weight of the nickel-tungsten gold plating solution is 0.1-1.0% of the soft enhancer.
6. The cost-effective printed wiring board nickel alloy multilayer gold plating of claim 1, further comprising, disposed between the nickel tungsten gold plating and the nickel plating in this order: the palladium alloy layer is used for improving the electric corrosion resistance of the substrate; a rhodium alloy layer for increasing the hardness of the substrate; the inner layer or/and the outer layer of the palladium alloy layer is/are also provided with a transition layer, and the transition layer is used for bonding adjacent electroplated layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122180778.3U CN216087117U (en) | 2021-09-09 | 2021-09-09 | Cost-reduced nickel alloy multilayer gold-plating for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122180778.3U CN216087117U (en) | 2021-09-09 | 2021-09-09 | Cost-reduced nickel alloy multilayer gold-plating for printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN216087117U true CN216087117U (en) | 2022-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122180778.3U Active CN216087117U (en) | 2021-09-09 | 2021-09-09 | Cost-reduced nickel alloy multilayer gold-plating for printed circuit board |
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| CN (1) | CN216087117U (en) |
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