CN216958587U - Terminal with stacked platinum electroplated layers - Google Patents

Abstract

The utility model discloses a terminal with stacked platinum electroplated layers, and a multi-layer plated terminal structure can better prevent corrosion. The utility model comprises a substrate, wherein a composite plating layer with a stacked structure is formed on the surface of the substrate, the substrate is made of Cu copper, and the composite plating layer outside the surface of the substrate comprises a first plating layer, a second plating layer, a third plating layer, a fourth plating layer, a fifth plating layer and a sixth plating layer; the first electroplated layer is a Cu copper electroplated layer; the second electroplated layer is a Ni-Ni electroplated layer; the third electroplated layer is a Pt platinum electroplated layer; the fourth electroplated layer is a Cr-Cr electroplated layer; the fifth electroplated layer is a Pt platinum electroplated layer; the sixth electroplated layer is an Au gold electroplated layer. The conductive terminal of the utility model is mainly used for high-speed connector products, such as mobile phones, notebook computers and the like. The utility model can better prevent corrosion and keep the stability and safety of electrical connection.

Description

Terminal with stacked platinum electroplated layers

Technical Field

The utility model relates to the field of electroplating processing, in particular to a platinum electroplating layer stacking technology which is applied to the electroplating production of a conductive terminal and ensures the safe use of the conductive terminal on products such as connectors and the like.

Background

With the continuous development of electronic products, connectors are widely used, and the connectors are input and output interfaces for data transmission, connection with external equipment and power supply of the equipment, and are adapted to performance trends of being faster, more compatible, more durable and the like. The interface of the connector needs to be pulled out and inserted for many times, and after the conductive terminals are assembled into a finished product, the conductive terminals of the connector need to be reliable and more durable and safe; however, after the conductive terminals are assembled into finished products, the products have a plug-pull wear plating layer in the using process, and the anti-electrolytic capability is reduced, so the wear resistance of the products needs to be solved, and therefore, the conductive terminals of the connector need to be electroplated. The common method is to electroplate a "palladium-nickel alloy" layer with good wear resistance, but the corrosion resistance is poor and the production cost is high.

The existing terminal passes an electrolytic corrosion test, a rhodium alloy layer is mostly electroplated on the terminal, and a rhodium plating layer is electroplated for protection, so that the rhodium is an inert substance, is rare and very expensive, and has a market price of more than 4000 yuan/g. The purpose of electroplating the conductive terminal is to solve the problem of electrolytic corrosion, and the commonly used electroplating species is rhodium or rhodium alloy, but the production cost is too high. In order to reduce the cost, a new electroplating process which is low in cost and can pass an electrolytic test is urgently needed to be developed, and a replaceable plating seed is searched for to replace the new electroplating process.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model discloses a terminal with stacked platinum electroplated layers, wherein a multi-layer plated terminal structure can better prevent corrosion and keep the stability and safety of electrical connection.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a terminal with a stacked platinum electroplated layer comprises a base material, wherein a composite electroplated layer with a stacked structure is formed on the surface of the base material, the base material is Cu copper, and the composite electroplated layer outside the surface of the base material comprises a first electroplated layer, a second electroplated layer, a third electroplated layer, a fourth electroplated layer, a fifth electroplated layer and a sixth electroplated layer;

the first electroplated layer is a Cu copper electroplated layer;

the second electroplated layer is a Ni-Ni electroplated layer;

the third electroplated layer is a Pt platinum electroplated layer;

the fourth electroplated layer is a Cr-Cr electroplated layer;

the fifth electroplated layer is a Pt platinum electroplated layer;

the sixth electroplated layer is an Au gold electroplated layer.

Further, the composite plating layer outside the surface of the base material sequentially comprises a first plating layer, a second plating layer, a third plating layer, a fourth plating layer, a fifth plating layer and a sixth plating layer outwards in sequence;

thickness of the first plating layer: 0.125-2 μm;

thickness of the second plating layer: 1-7 μm;

thickness of the third plating layer: 0.5 to 1.5 μm;

thickness of the fourth plating layer: 0.25 to 1 μm;

thickness of the fifth plating layer: 0.5 to 1.5 μm;

thickness of the sixth plating layer: 0.075 to 1.5 μm.

Furthermore, a first transition layer is introduced between the second electroplated layer and the third electroplated layer in a dip plating manner, a second transition layer is introduced between the third electroplated layer and the fourth electroplated layer in a dip plating manner, and a third transition layer is introduced between the fourth electroplated layer and the fifth electroplated layer in a dip plating manner;

the first transition layer is an Au gold electroplated layer;

the second transition layer is an Au gold electroplated layer;

the third transition layer is an Au gold electroplated layer;

thickness of the first transition layer: 0.025 to 0.375 μm;

thickness of the second transition layer: 0.025 to 0.375 μm;

thickness of the third transition layer: 0.025 to 0.375 μm.

Further, the thickness of the first plating layer is: 0.125 μm, thickness of the second plating layer: 1 μm, first transition layer thickness: 0.025 μm, thickness of the third plating layer: 0.5 μm, thickness of the second transition layer: 0.025 μm, thickness of the fourth plating layer: 0.5 μm, thickness of the third transition layer: 0.025 μm, thickness of the fifth plating layer: 0.5 μm, thickness of the sixth plating layer: 0.075 μm.

A connector terminal with a stacked platinum electroplating layer comprises a base material, wherein the base material is a Cu-Cu conductive terminal, the conductive terminal is divided into a contact part A area (a plug-in area), an extension bending part C area and a welding part B area (a welding leg), and the contact part A area (the plug-in area), the extension bending part C area and the welding part B area are sequentially connected into a whole; the composite plating layer with the stacking structure outside the surface of the contact part A area (plug-in area) of the conductive terminal sequentially comprises a first plating layer, a second plating layer, a first transition layer, a third plating layer, a second transition layer, a fourth plating layer, a third transition layer, a fifth plating layer and a sixth plating layer outwards in sequence;

the first electroplated layer is a Cu copper electroplated layer, and the thickness is as follows: 0.125-2 μm;

the second electroplated layer is a Ni-Ni electroplated layer, and the thickness is as follows: 1-7 μm;

the first transition layer is an Au gold electroplated layer, and the thickness is as follows: 0.025 to 0.375 μm;

the third electroplated layer is a Pt platinum electroplated layer, and the thickness is as follows: 0.5 to 1.5 μm;

the second transition layer is an Au gold electroplated layer, and the thickness is as follows: 0.025 to 0.375 μm;

the fourth electroplated layer is a Cr-Cr electroplated layer, and the thickness is as follows: 0.25 to 1 μm;

the third transition layer is an Au gold electroplated layer, and the thickness is as follows: 0.025 to 0.375 μm;

the fifth electroplated layer is a Pt platinum electroplated layer, and the thickness is as follows: 0.5 to 1.5 μm;

the sixth electroplated layer is an Au gold electroplated layer, and the thickness is as follows: 0.075 to 1.5 μm.

Further, the composite plating layer with the stacking structure outside the extending and bending part C area surface of the conductive terminal is sequentially a Cu copper plating layer according to immersion plating, and the thickness is as follows: 0.125-2 μm; and then dip-plating a Ni-Ni electroplated layer, wherein the thickness is as follows: 1 to 7 μm.

The composite plating layer with the stacking structure outside the surface of the welding part B area (welding leg) of the conductive terminal is sequentially a Cu copper electroplating layer outwards and sequentially according to immersion plating, and the thickness is as follows: 0.125-2 μm; and then dip-plating a Ni-Ni electroplated layer, wherein the thickness is as follows: 1-7 μm; and finally, plating an Au gold electroplated layer by immersion, wherein the thickness is as follows: 0.025 to 0.2 μm.

The conductive terminal of the utility model is mainly used for high-speed connector products, such as mobile phones, notebook computers and the like. The conductive terminal surface of the utility model is electroplated with multiple plating stacks and platinum alloy plating layers, and through the adjustment of the electroplating process, the utility model discovers that platinum can overcome the electrolytic corrosion test, rhodium can be replaced, the storage capacity of platinum on the earth is more than that of rhodium, the price is only about 240 yuan/gram, and the price only accounts for 5% of the cost of rhodium. The conductive terminal electroplated layer can pass the 'electrolytic corrosion' test, has obvious cost advantage and achieves the effect of greatly reducing the electroplating cost.

The production process of the utility model comprises the following steps: the conductive terminal is processed by a production process of a composite coating (copper plating, nickel plating, gold plating, platinum plating, gold plating, chromium plating, gold plating, platinum plating and gold plating), so that a multi-plating-type stacked coating is obtained, and the problem of electrolytic corrosion of a product is solved. According to the utility model, the platinum electroplated layer is stacked to replace a rhodium alloy electroplated layer, and the product can pass an electrolytic corrosion test in 5-30 minutes, so that the electroplating cost can be saved by 60%. After the brine electrolysis test, no corrosion occurred for 30 minutes. Therefore, the conductive terminal with the stacked platinum electroplating layers can better prevent corrosion and keep the stability and the safety of electrical connection.

Drawings

FIG. 1 is a schematic view of a substrate portion of an embodiment of the present invention;

FIG. 2 is a block diagram of an embodiment of the present invention;

FIG. 3 is a schematic diagram of an embodiment of the present invention;

FIG. 4 is a graphical representation of the results of a brine electrolysis test in accordance with an embodiment of the present invention.

The following are marked in the figure:

first electroplated layer 11, second electroplated layer 12, first transition layer 13, third electroplated layer 14, second transition layer 15, fourth electroplated layer 16, third transition layer 17, fifth electroplated layer 18, sixth electroplated layer 19 and base material 20.

Detailed Description

For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

The utility model comprises a base material 20, wherein a composite plating layer with a stacked structure is formed on the surface of the base material 20, the base material 20 is Cu copper, and the composite plating layer outside the surface of the base material 20 comprises a first plating layer 11, a second plating layer 12, a third plating layer 14, a fourth plating layer 16, a fifth plating layer 18 and a sixth plating layer 19;

the first plating layer 11 is a Cu copper plating layer;

the second electroplated layer 12 is a Ni-Ni electroplated layer;

the third electroplated layer 14 is a Pt platinum electroplated layer;

fourth electroplated layer 16 is a Cr-Cr electroplated layer;

the fifth electroplated layer 18 is a Pt platinum electroplated layer;

the sixth plating layer 19 is an Au gold plating layer.

Further, the composite plating layer outside the surface of the base material 20 sequentially comprises a first plating layer 11, a second plating layer 12, a third plating layer 14, a fourth plating layer 16, a fifth plating layer 18 and a sixth plating layer 19 in sequence;

thickness of first plating layer 11: 0.125-2 μm;

thickness of second plating layer 12: 1-7 μm;

thickness of third plating layer 14: 0.5 to 1.5 μm;

thickness of fourth plating layer 16: 0.25 to 1 μm;

thickness of fifth plating layer 18: 0.5 to 1.5 μm;

thickness of sixth plating layer 19: 0.075-1.5 μm.

Further, a first transition layer 13 is introduced between the second electroplated layer 12 and the third electroplated layer 14 in a dip plating manner, a second transition layer 15 is introduced between the third electroplated layer 14 and the fourth electroplated layer 16 in a dip plating manner, and a third transition layer 17 is introduced between the fourth electroplated layer 16 and the fifth electroplated layer 18 in a dip plating manner;

the first transition layer 13 is an Au gold plating layer;

the second transition layer 15 is an Au gold plating layer;

the third transition layer 17 is an Au gold plating layer;

thickness of the first transition layer 13: 0.025 to 0.375 μm;

thickness of the second transition layer 15: 0.025 to 0.375 μm;

thickness of the third transition layer 17: 0.025 to 0.375 μm.

Further, the thickness of the first plating layer 11: 0.125 μm, thickness of second plating layer 12: 2 μm, first transition layer 13 thickness: 0.025 μm, thickness of third plating layer 14: 0.5 μm, thickness of the second transition layer 15: 0.025 μm, thickness of fourth plating layer 16: 0.5 μm, thickness of the third transition layer 17: 0.025 μm, thickness of the fifth plating layer 18: 0.5 μm, thickness of sixth plating layer 19: 0.076 μm.

Platinum electroplating layer stacking: the second electroplated layer 12, the third electroplated layer 14, the fourth electroplated layer 16 and the fifth electroplated layer 18 of the first stage are wear-resistant and corrosion-resistant to Pt;

the first plating layer 11, the first transition layer 13, the second transition layer 15, and the third transition layer 17 of the second step are used to level the surface roughness of the base 20, and the sixth plating layer 19 is used to determine the appearance color of the terminal, in order to improve the layer-to-layer bonding (adhesion) and prevent layer-to-layer separation.

Further, the connector terminal with the stacked platinum plating layers of the present embodiment includes a substrate 20, the substrate 20 is a Cu copper conductive terminal, the conductive terminal is divided into a contact portion a area (plug-in area), an extending and bending portion C area, and a welding portion B area (leg), and the contact portion a area, the extending and bending portion C area, and the welding portion B area are connected in sequence into a whole, as shown in fig. 1. The conductive terminals are plated with dry film; the composite plating layer with the stacking structure outside the contact part A area (plug-in area) surface of the conductive terminal sequentially comprises a first plating layer 11, a second plating layer 12, a first transition layer 13, a third plating layer 14, a second transition layer 15, a fourth plating layer 16, a third transition layer 17, a fifth plating layer 18 and a sixth plating layer 19 in sequence.

In the present embodiment, the thickness of the first plating layer 11(Cu copper plating layer): 0.125-2 μm;

thickness of second plating layer 12(Ni nickel plating layer): 1-7 μm;

thickness of first transition layer 13(Au gold plating layer): 0.025 to 0.375 μm;

thickness of third plating layer 14(Pt platinum plating layer): 0.5 to 1.5 μm;

thickness of second transition layer 15(Au gold plating layer): 0.025 to 0.375 μm;

thickness of fourth plating layer 16(Cr chromium plating layer): 0.25 to 1 μm;

thickness of third transition layer 17(Au gold plating layer): 0.025 to 0.375 μm;

thickness of the fifth plating layer 18(Pt platinum plating layer): 0.5 to 1.5 μm;

thickness of sixth plating layer 19(Au gold plating layer): 0.075 to 1.5 μm.

Contact a area (plug area) 2.8mm long;

contact a region (interposer region) four sides: and plating Cu + Ni + Au + Pt + Au + Cr + Au + Pt + Au.

Description of plating layer Stacking:

on the copper substrate of the contact part A area of the conductive terminal (substrate 20): electroplating Cu + Ni + Au + Pt + Au + (Cr)⁺³)+Au+Pt+Au。

Further, the composite plating layer with the stacking structure outside the surface of the extending bending part C area of the conductive terminal is sequentially a Cu copper plating layer outwards and sequentially according to immersion plating, and the thickness is as follows: 0.125-2 μm; and then dip-plating a Ni-Ni electroplated layer, wherein the thickness is as follows: 1-7 μm;

the composite plating layer with the stacking structure outside the surface of the welding part B area (welding leg) of the conductive terminal is sequentially a Cu copper electroplating layer outwards and sequentially according to immersion plating, and the thickness is as follows: 0.125-2 μm; and then dip-plating a Ni-Ni electroplated layer, wherein the thickness is as follows: 1-7 μm; and finally, plating an Au gold electroplated layer in a dipping way, wherein the thickness is as follows: 0.025 to 0.2 μm.

Extended bent part C region (extended part): and (3) immersion plating of Cu: 0.125-2 μm + immersion plating Ni: 1-7 μm;

the length of the welding part B area (welding leg) is 2.0 mm: immersion plating of Cu, thickness: 0.125-2 μm; + immersion plating of Ni, thickness: 1-7 μm; + immersion plating of Au: 0.025 to 0.2 μm.

When the base material 20 terminal is electroplated, firstly cleaning, then integrally dip-plating Cu + and integrally dip-plating Ni + and partially dip-plating Au + and partially dip-plating Pt + and partially dip-plating Au + and partially dip-plating Cr + and partially dip-plating Au + and partially dip-plating Pt + and partially dip-plating Au, and finally carrying out hole sealing (oil hole sealing) treatment.

Carrying out electrolytic degreasing and acid washing polishing on the base material 20 terminal:

adding oil removing powder (copper material) into the oil removing groove, wherein the specific gravity (Baume) is as follows: 10-20 Be, temperature: 50-65 ℃, the oil removing time is as follows: 5-10 seconds, voltage: 2V or more;

sulfuric acid was added to the polishing tank, and the specific gravity (baume): 8-15 Be, temperature: normal temperature, time: 5-10 seconds;

plating a Cu copper electroplating layer:

copper plating solution, copper sulfate ion: 250-300 g/L, nickel chloride: 100-150 g/L, pure sulfuric acid: 30-60 ml/L, specific gravity (Baume): 1-2 g/cc, temperature: 40-60 ℃, pH: 3.8-4.4, the time is as follows: 5-10 seconds, current: 10-50A;

ni-plated nickel plating layer:

nickel plating solution, nickel ion: 40-70 g/L, nickel chloride: 5-15 g/L, boric acid 35-55 g/L, specific gravity (Baume): 25-35 Be, temperature: 50-65 ℃, pH: 3.8-4.4, wherein the time is as follows: 5-10 seconds, voltage: 10-50A; the high temperature is selected and can be used or not used;

au-plated gold transition layer:

gold plating solution, gold ions: 3-6 g/L, conductive salt: 80-120 g/L, balance salt: 80-120 g/L, anti-displacement agent: 1-1.5 mg/L, specific gravity (Baume): 8-15 Be, temperature: 50-60 ℃, pH: 3.8-4.8, the time is as follows: 5-10 seconds, current: 1A or more; transition gold, which may or may not be used;

plating a Pt platinum electroplating layer:

platinum plating group liquid, platinum ion: 5-20 g/L, additive: 20-160 ml/L, temperature: 50-60 ℃, pH: 1.0 below, specific gravity (baume): 10-20 Be, the time is: 5-10 seconds, current: 1-8A;

plating a Cr chromium plating layer:

chromium plating liquid, chromium ion: 50-100 ml/L, chromium salt: 1.0-2.0 g/L, specific gravity (Baume): 28-35 Be, temperature: 20-30 ℃, pH: 3.8-5.4, time: 10-100 seconds, current: more than 10A;

plating an Au gold plating layer:

gold plating solution, gold ions: 3-6 g/L, conductive salt: 80-120 g/L, balance salt: 80-120 g/L, anti-displacement agent: 1-1.5 mg/L, specific gravity (Baume): 8-15 Be, temperature: 50-60 ℃, pH: 3.8-4.8, the time is as follows: 5-10 seconds, current: 1A, thickness of contact part A area (plug-in area) of conductive terminal: 0.075-1.5 μm, thickness of the welding part B area (welding leg) of the conductive terminal: 0.051 to 0.152 mu m;

post-protection: (aqueous sealing)

Pore sealing agent, water solubility: 2-5%, temperature: the salt spray effect is improved at 40-60 ℃.

The same metal immersion plating method is the same for different laminated layers.

After the conductive terminal of the base material 20 (hardware material) is electroplated, assembling a finished product by Molding, performing plugging and unplugging 1500 times, and finally performing an electrolytic test according to the following electrolytic test standard.

The brine electrolysis test is a simulated accelerated test for the surface corrosion resistance of a tested workpiece sample, and the test requirements are as follows:

1. concentration of brine: a 5% solution containing sodium chloride (NaCl);

2. the testing temperature is 40 ℃, the magnetic stirring is carried out, and the rotating speed is 200 +/-20;

3. the voltage applied to the terminal is 5.0V, the distance between the cathode and the anode is 20CM, and the contact area of the terminal is opposite to the electrode;

4. requiring more than 5 minutes.

Note: after testing for 5 minutes, data was recorded every 1 minute until Fail.

Referring to fig. 4, E1: for the pre-experimental state, E2: state at 10 minutes of electrolysis of 5% brine, E3: 5% brine was electrolyzed for 30 minutes. It can be seen that the electrolytic contact area of the product is discolored, but no corrosion points occur.

The purpose of the platinum (Pt) plating of the utility model is to solveSolving the problem of electrolytic corrosion, and proving that the electrolytic problem can be solved by platinum plating; plating of trivalent chromium (Cr)⁺³) The corrosion resistance is strong, the chromium plating is more corrosion resistant than palladium-nickel plating, and the palladium-nickel plating can not resist the nitric acid corrosion; the hardness of the chromium plating layer is higher than that of the palladium nickel plating layer (the hardness of the chromium plating layer is 750-1000 HV, and the hardness of the palladium nickel plating layer is 600 HV); the production cost of chromium plating is much lower than that of palladium nickel plating (chromium plating: 0.2 yuan/g, palladium nickel plating: 450 yuan/g).

The product coating can successfully pass a nitric acid corrosion test of porosity, the coating structure is improved in the aspects of product wear resistance, corrosion resistance, electrolytic corrosion resistance and the like, and the electroplating production cost of the product is obviously reduced.

The above-mentioned embodiments only express one embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent should be subject to the appended claims.

Claims (6)

1. A terminal with stacked platinum plating layers, which comprises a base material (20), and is characterized in that a composite plating layer with a stacked structure is formed on the surface of the base material (20), the material of the base material (20) is Cu copper, and the composite plating layer outside the surface of the base material (20) comprises a first plating layer (11), a second plating layer (12), a third plating layer (14), a fourth plating layer (16), a fifth plating layer (18) and a sixth plating layer (19);

the first electroplated layer (11) is a Cu electroplated layer;

the second electroplated layer (12) is a Ni-Ni electroplated layer;

the third electroplated layer (14) is a Pt platinum electroplated layer;

the fourth electroplated layer (16) is a Cr-Cr electroplated layer;

the fifth electroplated layer (18) is a Pt platinum electroplated layer;

the sixth electroplated layer (19) is an Au gold electroplated layer.

2. A terminal having stacked platinum plating layers as claimed in claim 1, wherein said composite plating layer on the outside of the surface of said base material (20) is sequentially plated outwardly from said first plating layer (11), said second plating layer (12), said third plating layer (14), said fourth plating layer (16), said fifth plating layer (18) and said sixth plating layer (19);

thickness of the first plating layer (11): 0.125-2 μm;

thickness of the second plating layer (12): 1-7 μm;

thickness of the third plating layer (14): 0.5 to 1.5 μm;

thickness of the fourth plating layer (16): 0.25 to 1 μm;

thickness of the fifth plating layer (18): 0.5 to 1.5 μm;

thickness of the sixth plating layer (19): 0.075 to 1.5 μm.

3. A terminal having stacked platinum plating layers as claimed in claim 2 wherein a first transition layer (13) is dip plated between said second plating layer (12) and said third plating layer (14), a second transition layer (15) is dip plated between said third plating layer (14) and said fourth plating layer (16), and a third transition layer (17) is dip plated between said fourth plating layer (16) and said fifth plating layer (18);

the first transition layer (13) is an Au gold plating layer, and the thickness is as follows: 0.025 to 0.375 μm;

the second transition layer (15) is an Au gold electroplating layer, and the thickness is as follows: 0.025 to 0.375 μm;

the third transition layer (17) is an Au gold plating layer, and the thickness is as follows: 0.025 to 0.375 μm.

4. A terminal having a stacked platinum plating layer according to claim 3, wherein the thickness of the first plating layer (11) is: 0.125 μm, thickness of the second plating layer (12): 1 μm, the thickness of the first transition layer (13): 0.025 μm, thickness of the third plating layer (14): 0.5 μm thickness of the second transition layer (15): 0.025 μm, thickness of the fourth plating layer (16): 0.25 μm, thickness of the third transition layer (17): 0.025 μm, thickness of the fifth plating layer (18): 0.5 μm, thickness of the sixth plating layer (19): 0.076 μm.

5. The terminal with stacked platinum plating layers as claimed in claim 1, wherein said substrate (20) is a Cu copper conductive terminal, which is divided into a contact portion a region, an extended bent portion C region, and a soldering portion B region, which are connected in sequence;

the composite plating layer with a stacked structure outside the contact part A area surface of the conductive terminal sequentially comprises a first plating layer (11), a second plating layer (12), a first transition layer (13), a third plating layer (14), a second transition layer (15), a fourth plating layer (16), a third transition layer (17), a fifth plating layer (18) and a sixth plating layer (19) outwards in sequence;

the first electroplated layer (11) is a Cu electroplated layer, and the thickness: 0.125-2 μm;

the second electroplated layer (12) is a Ni-Ni electroplated layer, and the thickness: 1-7 μm;

the first transition layer (13) is an Au gold plating layer, and the thickness is as follows: 0.025 to 0.375 μm;

the third electroplated layer (14) is a Pt platinum electroplated layer, and the thickness: 0.5 to 1.5 μm;

the second transition layer (15) is an Au gold electroplating layer, and the thickness is as follows: 0.025 to 0.375 μm;

the fourth electroplated layer (16) is a Cr-Cr electroplated layer, and the thickness is as follows: 0.25 to 1 μm;

the third transition layer (17) is an Au gold plating layer, and the thickness is as follows: 0.025 to 0.375 μm;

the fifth electroplated layer (18) is a Pt platinum electroplated layer, and the thickness is as follows: 0.5 to 1.5 μm;

the sixth electroplated layer (19) is an Au gold electroplated layer, and the thickness: 0.075 to 1.5 μm.

6. The terminal of claim 5, wherein the composite plating layer with the stacked structure outside the surface of the extending and bending part C area of the conductive terminal is sequentially Cu-plated plating layers outwards and sequentially according to immersion plating, and the thickness of the composite plating layer is as follows: 0.125-2 μm; and then dip-plating a Ni-Ni electroplated layer, wherein the thickness is as follows: 1-7 μm;

the composite plating layer with the stacking structure outside the surface of the welding part B area of the conductive terminal sequentially faces outwards and is a Cu copper electroplating layer according to the immersion plating sequence, and the thickness of the composite plating layer is as follows: 0.125-2 μm; and then dip-plating a Ni-Ni electroplated layer, wherein the thickness is as follows: 1-7 μm; and finally, plating an Au gold electroplated layer by immersion, wherein the thickness is as follows: 0.025 to 0.2 μm.

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