CN113073367A - Manufacturing process of conductive terminal - Google Patents
Manufacturing process of conductive terminal Download PDFInfo
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- CN113073367A CN113073367A CN202110281081.7A CN202110281081A CN113073367A CN 113073367 A CN113073367 A CN 113073367A CN 202110281081 A CN202110281081 A CN 202110281081A CN 113073367 A CN113073367 A CN 113073367A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
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- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a manufacturing process of a conductive terminal, belonging to the technical field of electronic product manufacturing, comprising the steps of firstly carrying out oil removal treatment on terminal raw materials to obtain a first conductive piece; putting the first conductive piece into the copper plating solution to obtain a second conductive piece; putting the second conductive piece into the nickel plating solution to electroplate nickel on the surface of the second conductive piece to obtain a third conductive piece; sequentially putting the first end of the third conductive piece and the second end of the third conductive piece into the gold-plating solution to plate gold on the surfaces of the first end and the second end; placing the gold-plated second end into a platinum plating group solution or a platinum alloy plating group solution to plate platinum or a platinum alloy on the surface of the second end; and putting the second end plated with platinum or platinum alloy into the palladium-nickel plating solution to electroplate palladium-nickel on the surface of the second end, wherein the second end plated with palladium-nickel forms a contact zone, and then the conductive terminal comprising the contact zone and the solder leg zone is obtained. The conductive terminal obtained by the manufacturing process of the conductive terminal is low in cost.
Description
Technical Field
The invention relates to the technical field of electronic product manufacturing, in particular to a manufacturing process of a conductive terminal.
Background
The conductive terminal is mainly used for data transmission of a high-speed connector and can be applied to electronic equipment such as mobile phones and computers, and the corrosion resistance of the conductive terminal is one of important indexes for evaluating the performance of the conductive terminal.
In the prior art, in order to ensure the performance of a conductive terminal, a ruthenium rhodium alloy layer is required to be electroplated on the terminal. For example, the manufacturing process of the conductive terminal is as follows: the whole conductive terminal is sequentially subjected to copper immersion plating and nickel immersion plating, then the contact area of the conductive terminal is subjected to gold immersion plating, then the contact area is subjected to ruthenium-rhodium immersion plating, and finally the leg area of the conductive terminal is subjected to gold immersion plating to obtain the conductive terminal with high corrosion resistance.
However, the cost of rhodium is high, about five thousand yuan per gram, resulting in high cost of conductive terminals with space for optimization.
Disclosure of Invention
The invention aims to provide a manufacturing process of a conductive terminal, which has lower cost.
As the conception, the technical scheme adopted by the invention is as follows:
a manufacturing process of a conductive terminal comprises the following steps:
s1, carrying out oil removal treatment on the terminal raw material to obtain a first conductive piece;
s2, putting the whole first conductive piece into a copper plating solution to plate copper on the surface of the first conductive piece to obtain a second conductive piece;
s3, putting the whole second conductive member into a nickel plating solution to electroplate nickel on the surface of the second conductive member to obtain a third conductive member;
s4, sequentially putting the first end of the third conductive piece and the second end of the third conductive piece into a gold plating solution to plate gold on the surfaces of the first end and the second end, wherein the first end after gold plating forms a pin area;
s5, putting the second end plated with gold into a platinum plating group solution or a platinum alloy plating group solution to plate platinum or a platinum alloy on the surface of the second end;
s6, putting the second end plated with platinum or platinum alloy into the palladium-nickel plating solution to electroplate palladium-nickel on the surface of the second end, and forming a contact area on the second end plated with palladium-nickel to obtain the conductive terminal comprising the contact area and the solder leg area.
Optionally, in step S5, the current during electroplating is 1 to 8 amperes, the electroplating time is 5 to 10 seconds, the PH of the platinum group plating solution or the platinum alloy group plating solution is less than 1.0, and the solution concentration of the platinum group plating solution or the platinum alloy group plating solution is 10 to 20 baume.
Optionally, the thickness of the platinum layer or platinum alloy layer of the second end is 0.125-1.5 microns.
Optionally, in step S6, the concentration of palladium ions in the palladium-nickel plating composition liquid is 200-300 ml/l, the concentration of nickel ions is 10-30 g/l, the concentration of palladium concentrated liquid is 80-120 g/l, the concentration of palladium brightener is 30-50 ml/l, and the concentration of palladium additive is 20-40 ml/l.
Optionally, in step S6, the PH of the pd-ni plating solution is greater than or equal to 3 and less than or equal to 5, the voltage during electroplating is greater than 2 volts, the electroplating time is 5-10 seconds, and the thickness of the pd-ni layer at the second end is 0.125-1.5 μm.
Optionally, after step S6, the manufacturing process of the conductive terminal further includes: and carrying out oily hole sealing or water-based hole sealing on the conductive terminals, and then drying the conductive terminals.
Optionally, step S3 includes:
s31, putting the second conductive piece into a first nickel plating solution to electroplate a first nickel layer on the surface of the second conductive piece, wherein the temperature of the first nickel plating solution is 15-25 ℃;
s32, putting the second conductive piece plated with the first nickel layer into a second nickel plating group liquid integrally to electroplate a second nickel layer on the surface of the second conductive piece plated with the first nickel layer to obtain a third conductive piece, wherein the temperature of the second nickel plating group liquid is 50-65 ℃.
Optionally, the concentration of nickel ions in the second nickel plating solution is 40-70 grams per liter, the concentration of nickel chloride is 5-15 grams per liter, and the concentration of boric acid is 35-55 grams per liter.
Optionally, in step S4, the gold ion concentration in the gold plating solution is 3-6 g/l, the conductive salt concentration is 80-120 g/l, the balance salt concentration is 80-120 g/l, the anti-displacement agent concentration is 1-1.5 mg/l, the gold layer thickness of the second end is 0.075-1.5 μm, and the gold layer thickness of the foot pad area is 0.025-0.375 μm.
Optionally, step S1 includes: carrying out electrolytic degreasing on the terminal raw material, and then carrying out acid cleaning and polishing on the electrolytically degreased terminal raw material.
The invention has at least the following beneficial effects:
the conductive terminal manufacturing process provided by this embodiment includes performing an oil removal process on a terminal raw material to obtain a first conductive member, sequentially electroplating copper and nickel on the entire first conductive member to obtain a third conductive member, plating gold on a first end and a second end of the third conductive member to form a solder foot region on the first end, plating platinum or a platinum alloy on the surface of the gold-plated second end to improve the corrosion resistance and rigidity of the second end, and plating palladium-nickel on the surface of the platinum or platinum alloy on the second end to form a contact region on the second end, where the contact region manufactured by the conductive terminal manufacturing process provided by this embodiment has strong corrosion resistance, can pass an electrolytic corrosion test for 5-30 minutes, and the corrosion resistance of the contact region is improved by using platinum or a platinum alloy, which reduces the cost by about 90% compared with a rhodium alloy method in the prior art, so that the cost of the conductive terminal is lower.
Drawings
Fig. 1 is a flow chart of a process for manufacturing a conductive terminal according to an embodiment of the present invention;
FIG. 2 is a schematic view of a conductive terminal provided in an embodiment of the present invention before an electrolytic corrosion test is performed;
FIG. 3 is a schematic view of a conductive terminal provided in an embodiment of the present invention after 10 minutes of electrolysis in 5% saline;
fig. 4 is a schematic view of the conductive terminal provided in the embodiment of the present invention after being electrolyzed in 5% saline for 30 minutes.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The embodiment provides a manufacturing process of a conductive terminal, which is used for manufacturing the conductive terminal, and the conductive terminal can be applied to a connector for data transmission.
As shown in fig. 1, the manufacturing process of the conductive terminal includes the following steps:
s1, carrying out oil removal treatment on the terminal raw material to obtain the first conductive piece.
The terminal raw material is made of conductive metal, and the first conductive piece is of a structure obtained by deoiling the terminal raw material. After the terminal raw materials are subjected to oil removal treatment, subsequent electroplating can be facilitated, so that the electroplating effect is improved.
Alternatively, step S1 may include: carrying out electrolytic degreasing on the terminal raw material, and then carrying out acid cleaning and polishing on the electrolytically degreased terminal raw material.
Specifically, the terminal raw material may be placed in an oil removing tank, then oil removing powder is added in the oil removing tank to form an oil removing solution, and then electrolytic oil removal is performed. Wherein the solution concentration of the deoiling solution is 10-20 Baume, the temperature of the deoiling solution is 5-65 ℃, the deoiling time is 5-10 seconds, and the voltage during electrolysis is more than 2 volts. By way of example, the oil removal powder may be copper powder,
the step of acid cleaning and polishing is to put the deoiled terminal raw material into a polishing tank, then add sulfuric acid into the polishing tank to form a polishing solution, and control the terminal raw material to stay in the polishing tank for 5-10 seconds, and control the temperature of the solution in the polishing tank to be normal temperature. Wherein the solution concentration of the polishing solution is 8-15 Baume.
And S2, putting the whole first conductive member into the copper plating solution to plate copper on the surface of the first conductive member to obtain a second conductive member.
And electroplating copper on the whole outer surface of the first conductive member to improve the conductive capability of the first conductive member. In the copper plating solution: the concentration of the copper sulfate ion is 250-300 g/L, the concentration of the nickel chloride is 100-150 g/L, and the concentration of the pure sulfuric acid is 30-60 ml/L. And the concentration of the solution of the platinizing group solution is 1-2 Baume, the temperature is 40-60 ℃, and the PH value is 3.8-4.4. The duration of the electroplating is 5-10 seconds, the current of the electroplating is 10-50 amperes, and the thickness of the copper layer electroplated on the second conductive piece is 0.5-4 micrometers. The copper layer can be more uniform and the conductivity is better through the parameters.
And S3, putting the whole second conductive member into the nickel plating solution to electroplate nickel on the surface of the second conductive member to obtain a third conductive member.
The nickel has higher corrosion resistance, and the nickel plating on the second conductive member can improve the corrosion resistance of the formed conductive terminal.
And S4, sequentially putting the first end of the third conductive piece and the second end of the third conductive piece into the gold plating solution to plate gold on the surfaces of the first end and the second end, wherein the gold plated first end forms a pin area.
After the third conductive member is obtained, gold may be plated on both ends of the third conductive member, specifically, the third conductive member has a first end and a second end opposite to each other, wherein the first end and the second end have a certain length. In step S4, the first end may be controlled to enter the gold plating solution to plate a gold layer on the surface of the first end, and then the second end may be controlled to enter the gold plating solution to plate a gold layer on the surface of the second end. It should be noted that the first end can be directly formed with the solder foot region of the conductive terminal after the gold layer is plated.
Alternatively, in step S4, the gold plating solution is composed of gold ions, a conductive salt, a balance salt, and an anti-displacement agent. Wherein the concentration of gold ion is 3-6 g/L, the concentration of conductive salt is 80-120 g/L, the conductive salt is a substance containing conductive ion and is used for improving the conductivity of gold plating solution, reducing the voltage at the end of the plating bath and improving the process current density, and the conductive salt can be Na for example2SO4It does not participate in the electrode reaction. The concentration of the balance salt is 80-120 g/L, and the balance salt is used for balancing the pH value of the gold plating solution, and the balance salt can be gold potassium cyanide. The concentration of the anti-displacement agent is 1 to 1.5 mg per liter, and the anti-displacement agent is used for forming a thin protective film on the first end or the second end to inhibit gold displacement reaction when no current flows in the gold plating solution, and exemplarily comprises at least 1 compound of 2-mercapto-1-methylimidazole, triazole compound having mercapto group, and 2-hydroxy-3-mercapto-1-propanesulfonic acid. And the thickness of the gold layer at the second end is 0.075-1.5 microns, and the thickness of the gold layer at the first end is 0.025-0.375 microns, namely, the thickness of the gold layer at the welding foot area is 0.025-0.375 microns.
And S5, putting the gold-plated second end into the platinum plating group solution or the platinum alloy plating group solution to plate platinum or platinum alloy on the surface of the second end.
In step S5, only the second end of the third conductive member is placed in the platinum plating bath, and the first end and the middle portion of the third conductive member are not required to be placed in the platinum plating bath. The platinum alloy is an alloy in which platinum is mixed with other metals, such as palladium, rhodium, yttrium, and ruthenium.
S6, putting the second end plated with platinum or platinum alloy into the palladium-nickel plating solution to electroplate palladium-nickel on the surface of the second end, and forming a contact area on the second end plated with palladium-nickel to obtain the conductive terminal comprising the contact area and the solder leg area.
The conductive terminal manufacturing process provided by this embodiment includes performing an oil removal process on a terminal raw material to obtain a first conductive member, sequentially electroplating copper and nickel on the entire first conductive member to obtain a third conductive member, plating gold on a first end and a second end of the third conductive member to form a solder foot region on the first end, plating platinum or a platinum alloy on the surface of the gold-plated second end to improve the corrosion resistance and rigidity of the second end, and plating palladium-nickel on the surface of the platinum or platinum alloy on the second end to form a contact region on the second end, where the contact region manufactured by the conductive terminal manufacturing process provided by this embodiment has strong corrosion resistance, can pass an electrolytic corrosion test for 5-30 minutes, and the corrosion resistance of the contact region is improved by using platinum or a platinum alloy, which reduces the cost by about 90% compared with a rhodium alloy method in the prior art, so that the cost of the conductive terminal is lower.
Fig. 2 is a schematic view of the conductive terminal manufactured by the conductive terminal manufacturing process of the present embodiment before the electrolytic corrosion test, wherein the contact region Q1 and the middle portion Q2 of the conductive terminal are smooth and have no corrosion traces. Fig. 3 is a schematic representation of the conductive terminal after 10 minutes of electrolysis in 5% saline, and it can be seen that the contact area Q1 of the conductive terminal is still relatively smooth with no trace of corrosion, while the middle portion Q2 of the conductive terminal is more significantly corroded. Fig. 4 is a schematic representation of the conductive terminal after 30 minutes of electrolysis in 5% saline, and it can be seen that the contact area Q1 of the conductive terminal is still relatively smooth and still has no obvious trace of corrosion, while the middle portion Q2 of the conductive terminal has relatively severe corrosion. Therefore, the contact area Q1 of the conductive terminal manufactured by the manufacturing process of the conductive terminal provided by the embodiment has high corrosion resistance and is not easy to corrode.
Optionally, in step S5, the current in the electroplating process is 1 to 8 amperes, the electroplating time is 5 to 10 seconds, the temperature of the platinum plating group solution or the platinum alloy plating group solution in the electroplating process is 50 to 60 degrees celsius, the platinum ion concentration in the platinum plating group solution or the platinum alloy plating group solution is 5 to 20 grams per liter, and the concentration of the additive in the platinum plating group solution or the platinum alloy plating group solution is 20 to 160 milliliters per liter, and the additive may be a chemical solution adjuvant. The pH value of the platinum plating group liquid or the platinum alloy plating group liquid is less than 1.0, and the solution concentration of the platinum plating group liquid or the platinum alloy plating group liquid is 10-20 Baume.
Further, the thickness of the platinum layer or platinum alloy layer at the second end is 0.125-1.5 micrometers to further ensure the corrosion resistance of the contact area.
Alternatively, in step S6, the palladium-nickel plating composition liquid is composed of palladium ions, nickel ions, a palladium concentrate, a palladium brightener, and a palladium additive. Wherein the concentration of palladium ions is 200-300 ml/l, the concentration of nickel ions is 10-30 g/l, the concentration of palladium concentrated solution is 80-120 g/l, the concentration of palladium brightening agent is 30-50 ml/l, and the concentration of palladium additive is 20-40 ml/l. The temperature of the palladium-nickel plating solution is 50-65 ℃, the pH value of the palladium-nickel plating solution is greater than or equal to 3 and less than or equal to 5, the voltage in the electroplating process is greater than 2 volts, the electroplating time is 5-10 seconds, and the thickness of the palladium-nickel layer at the second end is 0.125-1.5 micrometers.
In this embodiment, after the palladium-nickel layer is plated on the surface of the second end, and after step S6, the process for manufacturing the conductive terminal further includes performing post-protection on the conductive terminal, specifically, performing oil-based hole sealing or water-based hole sealing on the entire conductive terminal to improve the salt mist effect of the conductive terminal, and then performing drying treatment on the conductive terminal.
Optionally, the step S3 includes:
and S31, putting the second conductive piece into the first nickel plating solution integrally to electroplate a first nickel layer on the surface of the second conductive piece, wherein the temperature of the first nickel plating solution is 15-25 ℃.
In step S31, nickel plating is performed on the second conductive member in a normal temperature environment.
S32, putting the second conductive member plated with the first nickel layer into a second nickel plating group liquid integrally to plate a second nickel layer on the surface of the second conductive member plated with the first nickel layer to obtain a third conductive member, wherein the temperature of the second nickel plating group liquid is 50-65 ℃.
In step S32, nickel plating is performed on the second conductive member in a high temperature environment, and the firmness of the nickel layer can be improved by performing nickel plating at different temperatures in step S31 and step S32. Alternatively, the second nickel plating solution may be a solution heated by the first nickel plating solution, that is, the solute ratio of the second nickel plating solution may be the same as that of the first nickel plating solution. Wherein, the concentration of nickel ions in the first nickel plating group liquid is 40-70 g/L, the concentration of nickel chloride in the first nickel plating group liquid is 5-15 g/L, the concentration of boric acid in the first nickel plating group liquid is 35-55 g/L, the concentration of the first nickel plating group liquid is 25-35 Baume, the PH value is 3.8-4.4, the total nickel plating time in the first nickel plating group liquid and the second nickel plating group liquid is 5-10 seconds, and the voltage during electroplating is 10-50 amperes. The total thickness of the first nickel layer and the second nickel layer is 1-7 microns.
The foregoing embodiments are merely illustrative of the principles and features of this invention, which is not limited to the above-described embodiments, but rather is susceptible to various changes and modifications without departing from the spirit and scope of the invention, which changes and modifications are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A manufacturing process of a conductive terminal is characterized by comprising the following steps:
s1, carrying out oil removal treatment on the terminal raw material to obtain a first conductive piece;
s2, putting the whole first conductive piece into a copper plating solution to plate copper on the surface of the first conductive piece to obtain a second conductive piece;
s3, putting the whole second conductive member into a nickel plating solution to electroplate nickel on the surface of the second conductive member to obtain a third conductive member;
s4, sequentially putting the first end of the third conductive piece and the second end of the third conductive piece into a gold plating solution to plate gold on the surfaces of the first end and the second end, wherein the first end after gold plating forms a pin area;
s5, putting the second end plated with gold into a platinum plating group solution or a platinum alloy plating group solution to plate platinum or a platinum alloy on the surface of the second end;
s6, putting the second end plated with platinum or platinum alloy into the palladium-nickel plating solution to electroplate palladium-nickel on the surface of the second end, and forming a contact area on the second end plated with palladium-nickel to obtain the conductive terminal comprising the contact area and the solder leg area.
2. The process for manufacturing an electrically conductive terminal as claimed in claim 1, wherein in step S5, the current during electroplating is 1-8 amperes, the electroplating time is 5-10 seconds, the PH of the platinizing group solution or platinizing alloy group solution is less than 1.0, and the solution concentration of the platinizing group solution or platinizing alloy group solution is 10-20 baume.
3. The process for manufacturing an electrically conductive terminal as claimed in claim 2, wherein the thickness of the platinum layer or the platinum alloy layer at the second end is 0.125-1.5 μm.
4. The process for manufacturing an electrically conductive terminal as claimed in claim 1, wherein in step S6, the concentration of palladium ions in the palladium-nickel plating solution is 200 ml/l, the concentration of nickel ions is 10-30 g/l, the concentration of palladium concentrated solution is 80-120 g/l, the concentration of palladium brightener is 30-50 ml/l, and the concentration of palladium additive is 20-40 ml/l.
5. The process for manufacturing an electrically conductive terminal as claimed in claim 4, wherein in step S6, the pH of the palladium-nickel plating solution is greater than or equal to 3 and less than or equal to 5, the voltage during electroplating is greater than 2 volts for 5-10 seconds, and the thickness of the palladium-nickel layer at the second end is 0.125-1.5 μm.
6. The process for manufacturing electrically conductive terminals of claim 1, wherein after step S6, the process further comprises: and carrying out oily hole sealing or water-based hole sealing on the conductive terminals, and then drying the conductive terminals.
7. The process for manufacturing electrically conductive terminals as claimed in claim 1, wherein step S3 includes:
s31, putting the second conductive piece into a first nickel plating solution to electroplate a first nickel layer on the surface of the second conductive piece, wherein the temperature of the first nickel plating solution is 15-25 ℃;
s32, putting the second conductive piece plated with the first nickel layer into a second nickel plating group liquid integrally to electroplate a second nickel layer on the surface of the second conductive piece plated with the first nickel layer to obtain a third conductive piece, wherein the temperature of the second nickel plating group liquid is 50-65 ℃.
8. The process for manufacturing an electrically conductive terminal as claimed in claim 7, wherein the concentration of nickel ions in the second nickel plating solution is 40-70 g/l, the concentration of nickel chloride is 5-15 g/l, and the concentration of boric acid is 35-55 g/l.
9. The process for manufacturing an electrically conductive terminal as claimed in claim 1, wherein in step S4, the gold ion concentration in the gold plating solution is 3-6 g/l, the conductive salt concentration is 80-120 g/l, the balance salt concentration is 80-120 g/l, the anti-displacement agent concentration is 1-1.5 mg/l, the gold layer thickness of the second end is 0.075-1.5 μm, and the gold layer thickness of the solder foot area is 0.025-0.375 μm.
10. The process for manufacturing electrically conductive terminals as claimed in claim 1, wherein step S1 includes: carrying out electrolytic degreasing on the terminal raw material, and then carrying out acid cleaning and polishing on the electrolytically degreased terminal raw material.
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