CN111041544A - Continuous electroplating process for BTB connector terminal - Google Patents
Continuous electroplating process for BTB connector terminal Download PDFInfo
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- CN111041544A CN111041544A CN201911391366.5A CN201911391366A CN111041544A CN 111041544 A CN111041544 A CN 111041544A CN 201911391366 A CN201911391366 A CN 201911391366A CN 111041544 A CN111041544 A CN 111041544A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
- C25F1/04—Pickling; Descaling in solution
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- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the field of continuous electroplating, and discloses a continuous electroplating process for BTB connector terminals. Wherein, the semi-gloss nickel plating solution comprises the following components: 550-650 ml/l of nickel sulfamate, 6-14 g/l of nickel chloride, 35-45 g/l of boric acid and 10-20 ml/l of additive of Dow chemical MP 200; the high-temperature nickel plating solution comprises the following steps: 400-500 ml/l of nickel sulfamate, 6-14 g/l of nickel chloride, 35-45 g/l of boric acid, TS additive of hong Kong Delile company, and FB7000 of Meitaile company as gold plating solution. The tin climbing of the terminal welding plate of the BTB plated connector is full and the appearance is bright; the salt spray test can pass 48 hours; can realize stable nickel exposure area and prevent solder paste from climbing to the functional area during board welding.
Description
Technical Field
The invention relates to the field of continuous electroplating, in particular to a continuous electroplating process for a BTB connector terminal.
Background
BTB is board to board connector, widely used in consumer electronic products, because the connector size is small (0.4 mm pin pitch, 0.8mm high, 0.35mm pin pitch BTB is used for 5G product), the electrogilding area is small (0.2-0.75 mm) and needs to expose nickel 0.19mm between the welding area and the contact area, and expose nickel to prevent tin from climbing to the functional area to cause function failure problem during SMT process; in addition, the tin is required to be full and bright on the whole tin pin when the plate is welded, and the salt spray test is passed for 48 hours. Therefore, the tin-plating and salt spray tests on exposed nickel and a welding plate are technical bottlenecks in the continuous electroplating of the terminal of the BTB connector.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the problems in the prior art, the invention provides a continuous electroplating process of a BTB connector terminal, which is used for obtaining a stable nickel exposed area after electroplating, and the tin foot is full and bright after welding and can stably pass a salt spray test for 48 hours.
The technical scheme is as follows: the invention provides a continuous electroplating process of a BTB connector terminal, which comprises the following steps: degreasing; copper polishing: under the conditions of normal temperature and constant voltage of 5-8V of a rectifier, after 6-10S of anode electrolysis, leaching by using a water jet cutter at normal temperature; acid washing; plating semi-gloss nickel: electroplating for 60-90 seconds in a semi-gloss nickel plating solution with the pH value of 3.0-4.2 under the conditions of the temperature of 55-60 ℃ and the current density of 8-12 ASD, and then spraying water for washing at normal temperature; the semi-gloss plating solution comprises the following components in percentage by weight: 550-650 ml/l of nickel sulfamate, 6-14 g/l of nickel chloride, 35-45 g/l of boric acid and 10-20 ml/l of Dow chemical MP200 additive; plating high-temperature nickel: electroplating for 6-10 seconds in a high-temperature nickel plating solution with the pH of 2.0-3.0 under the conditions of the temperature of 55-60 ℃ and the current density of 4-6 ASD, and then sequentially washing with normal warm spray water and 40-45 ℃ ultrasonic hot water; the high-temperature nickel plating solution comprises the following components in percentage by weight: 400-500 ml/l of nickel sulfamate, 6-14 g/l of nickel chloride, 35-45 g/l of boric acid and 8-20 ml/l of TS additive of hong Kong Deli company; gold plating: electroplating for 3-10S in a gold plating solution with the pH of 4.2-4.6 at the temperature of 55-65 ℃ and the current density of 15-30 ASD, recovering gold, washing with water, and spraying water at normal temperature; the gold plating solution is a gold liquid medicine which is produced by the metilex company, has the model of FB7000 and the cobalt content of 0.25 g/l; and (5) water-based hole sealing.
Further, in the degreasing step, the following operations are specifically included: ultrasonic degreasing is carried out for 6-10S at the bath solution temperature of 60 ℃; the temperature of the bath solution is 60 ℃, the cathode electrolysis current density is 8-15 ASD, and the alkaline degreasing powder aqueous solution is used for carrying out electrolytic degreasing for 18-30S; washing with water at normal temperature.
Further, the pickling step specifically includes the following operations: soaking the mixture for 8 to 20 seconds in a 15 to 25 percent sulfuric acid aqueous solution; spraying water and washing at normal temperature; and (3) ultrasonic hot water washing at 40-45 ℃.
Further, the concrete operations in the aqueous sealing step are as follows: and (3) placing the gold-plated BTB connector terminal in an aqueous hole sealing agent with the concentration of 6-10% and the temperature of 50-60 ℃ for soaking for 8-20 seconds, and then sequentially carrying out normal warm spray washing and 40-50 ℃ ultrasonic hot water washing and air drying.
Has the advantages that: according to the continuous electroplating process of the BTB connector terminal, due to the fact that the copper polishing step is added before electroplating, flaws such as scratches, indentations, small holes and serious oxidation of the copper surface are removed, the copper alloy surface of the base material is more flat and smooth, the microcosmic combination between the base material and the nickel coating is tighter, and finally the effects of full solder foot tin climbing and corrosion resistance during salt spray testing are easily achieved during soldering tin; when the semi-gloss nickel is plated, a Dow chemical MP200 additive is used, and the additive does not contain sulfur and uses alcohols with low carbon chains of 4 carbons, so that a nickel plating layer does not contain sulfur elements and has extremely low carbon content, and tin climbing and salt spray testing are facilitated; when high-temperature nickel is plated, TS additive of Hongkong Delivery company is used, phosphorus element is contained in the additive, and the crystal face of nickel, phosphorus and tin formed when welding the plate does not change color after soldering; during gold plating, a gold liquid medicine which is manufactured by the metilex corporation and has the model FB7000 and the cobalt content of 0.25g/l is used, and the cobalt content is 0.25g/l, so that the excellent low-region inhibiting function and the excellent replacement preventing capability are realized, and a nickel-exposed gold plating layer with high precision (the nickel-exposed precision between gold regions reaches 0.18 mm) is obtained, and the function of preventing tin paste from climbing to a functional region during final board welding is achieved.
Therefore, the four synergistic effects can ensure that after the electroplating process disclosed by the invention is used for electroplating, a stable nickel exposed area can be obtained on the surface of the BTB connector, and tin on tin pins after the board is welded is full and bright and can stably pass a salt spray test for 48 hours.
Drawings
FIG. 1 is a flow chart of a BTB connector terminal plating process;
fig. 2 and 3 are photographs of BTB connector terminals plated by the plating process of embodiments 1 to 3;
fig. 4 is a photograph of a BTB connector terminal plated by the plating process of the present invention after passing a salt spray test for 48 hours.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
Embodiment 1:
the present embodiment provides a continuous plating process for a terminal of a BTB connector (the process flow is shown in fig. 1):
degreasing: the bath solution temperature is 60 ℃, the ultrasonic degreasing is 10S (1 groove) → the bath solution temperature is 60 ℃, the cathode electrolytic current density is 10ASD, and the alkaline degreasing powder aqueous solution is 25S (3 grooves) → the normal temperature water washing.
Copper polishing: and (5) electrolyzing the anode for 10s → leaching by a water jet at the normal temperature under the condition of constant voltage of 6V of a rectifier at the normal temperature.
Acid washing: soaking the fabric in 15-25% sulfuric acid water solution for 15S → normal temperature water spraying (3 lanes) → 40 ℃ ultrasonic hot water washing.
Plating semi-gloss nickel: electroplating 80S (10 slots) → normal-temperature water spraying washing (3 lanes) in a semi-gloss nickel plating solution with the pH value of 4.0 under the conditions of the temperature of 60 ℃ and the current density of 10 ASD;
the plating semi-gloss solution comprises the following components in percentage by weight: 600ml/l of nickel sulfamate, 10g/l of nickel chloride, 40g/l of boric acid and 15ml/l of MP200 additive in the Dow chemical industry.
Plating high-temperature nickel: in a high-temperature nickel plating solution with the pH value of 2.5, the electroplating is carried out for 10S (2 grooves) → normal-temperature water spraying washing (3 channels) → 45 ℃ ultrasonic hot water washing under the conditions of the temperature of 60 ℃ and the current density of 5 ASD.
The high-temperature nickel plating solution comprises the following components in percentage by weight: 450ml/l of nickel sulfamate, 10g/l of nickel chloride, 40g/l of boric acid and 15ml/l of TS additive of hong Kong Delivery company;
gold plating: electroplating in a gold plating solution at pH 4.4 at 60 ℃ and a current density of 20ASD for 10S → washing with gold recovery water → washing with water at room temperature by spraying (lane 3).
The gold plating solution is FB7000 type gold liquid produced by Meitaile corporation, the stock solution is opened, and the cobalt content is 0.25 g/l.
Water-based hole sealing: the gold-plated BTB connector terminal is placed in an aqueous sealant with the concentration of 8% and the temperature of 55 ℃ to be soaked for 15S, the length of the terminal groove is 1m → the normal temperature water spraying washing (1 channel) → 45 ℃ ultrasonic hot water washing → air drying.
Embodiment 2:
this embodiment provides a continuous plating process for a BTB connector terminal, and is substantially the same as embodiment 1 except that:
(1) in the copper polishing step, the anode was electrolyzed for 15s under a constant voltage of 8V by a rectifier.
(2) In the step of plating the semi-gloss nickel, the concentration of the Dow chemical MP200 additive in the semi-gloss solution was 10 ml/l.
(3) In the step of plating high temperature nickel, the concentration of TS additive of hong Kong Delivery Co in the high temperature nickel plating solution is 20 ml/l.
Otherwise, this embodiment is identical to embodiment 1, and will not be described herein.
Embodiment 3:
this embodiment provides a continuous plating process for a BTB connector terminal, and is substantially the same as embodiment 1 except that:
(1) in the copper polishing step, the anode was electrolyzed for 8s under a constant voltage of 5V by a rectifier.
(2) In the step of plating the semi-gloss nickel, the concentration of the Dow chemical MP200 additive in the semi-gloss solution was 20 ml/l.
(3) In the step of plating high temperature nickel, the concentration of TS additive of hong Kong Delivery Co in the high temperature nickel plating solution was 8 ml/l.
Otherwise, this embodiment is identical to embodiment 1, and will not be described herein.
Fig. 2 and 3 show that tin on tin feet of the BTB connector plated by the electroplating process of the above embodiments 1 to 3 is fully and brightly plated after the board is welded, and fig. 3 shows that a stable nickel exposed area can be obtained; fig. 4 is a photograph of a BTB connector terminal plated by the present plating process after passing a salt spray test for 48 hours. Therefore, the BTB connector terminal subjected to the electroplating process can stably pass the salt spray test for 48 hours.
The above embodiments are merely illustrative of the technical concepts and features of the present invention, and the purpose of the embodiments is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (4)
1. A continuous electroplating process of a BTB connector terminal is characterized by comprising the following steps:
degreasing;
copper polishing: electrolyzing the anode for 8-15 s under the condition of constant voltage of 5-8V of a rectifier at normal temperature, and leaching by using a water jet cutter at normal temperature;
acid washing;
plating semi-gloss nickel: electroplating for 60-90 seconds in a semi-gloss nickel plating solution with the pH value of 3.0-4.2 under the conditions of the temperature of 55-60 ℃ and the current density of 8-12 ASD, and then spraying water for washing at normal temperature;
the semi-gloss plating solution comprises the following components in percentage by weight: 550-650 ml/l of nickel sulfamate, 6-14 g/l of nickel chloride, 35-45 g/l of boric acid and 10-20 ml/l of Dow chemical MP200 additive;
plating high-temperature nickel: electroplating for 6-10 seconds in a high-temperature nickel plating solution with the pH of 2.0-3.0 under the conditions of the temperature of 55-60 ℃ and the current density of 4-6 ASD, and then sequentially washing with normal warm spray water and 40-45 ℃ ultrasonic hot water;
the high-temperature nickel plating solution comprises the following components in percentage by weight: 400-500 ml/l of nickel sulfamate, 6-14 g/l of nickel chloride, 35-45 g/l of boric acid and 8-20 ml/l of TS additive of hong Kong Deli company;
gold plating: electroplating for 3-10S in a gold plating solution with the pH of 4.2-4.6 at the temperature of 55-65 ℃ and the current density of 15-30 ASD, recovering gold, washing with water, and spraying water at normal temperature;
the gold plating solution is a gold liquid medicine which is produced by the metilex company, has the model of FB7000 and the cobalt content of 0.25 g/l;
and (5) water-based hole sealing.
2. The continuous plating process of a BTB connector terminal as claimed in claim 1, wherein in the degreasing step, the following operations are specifically included:
ultrasonic degreasing is carried out for 6-10S at the bath solution temperature of 60 ℃;
the temperature of the bath solution is 60 ℃, the cathode electrolysis current density is 8-15 ASD, and the alkaline degreasing powder aqueous solution is used for carrying out electrolytic degreasing for 18-30S;
washing with water at normal temperature.
3. The continuous plating process for a BTB connector terminal as recited in claim 1, further comprising the following steps:
soaking the mixture for 8 to 20 seconds in a 15 to 25 percent sulfuric acid aqueous solution;
spraying water and washing at normal temperature;
and (3) ultrasonic hot water washing at 40-45 ℃.
4. The continuous plating process for a BTB connector terminal according to any one of claims 1 to 3, wherein the specific operations in the aqueous sealing step are:
and (3) placing the gold-plated BTB connector terminal in an aqueous hole sealing agent with the concentration of 6-10% and the temperature of 50-60 ℃ for soaking for 8-20 seconds, and then sequentially carrying out normal warm spray washing and 40-50 ℃ ultrasonic hot water washing and air drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911391366.5A CN111041544A (en) | 2019-12-30 | 2019-12-30 | Continuous electroplating process for BTB connector terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911391366.5A CN111041544A (en) | 2019-12-30 | 2019-12-30 | Continuous electroplating process for BTB connector terminal |
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| CN111041544A true CN111041544A (en) | 2020-04-21 |
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| CN201911391366.5A Pending CN111041544A (en) | 2019-12-30 | 2019-12-30 | Continuous electroplating process for BTB connector terminal |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073367A (en) * | 2021-03-16 | 2021-07-06 | 东莞立德精密工业有限公司 | Manufacturing process of conductive terminal |
| CN113186573A (en) * | 2021-04-30 | 2021-07-30 | 东莞市环侨金属制品有限公司 | Manufacturing process of electroplated communication terminal |
| CN113279032A (en) * | 2021-04-30 | 2021-08-20 | 东莞市环侨金属制品有限公司 | Continuous electroplating process for metal product |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103668369A (en) * | 2014-01-08 | 2014-03-26 | 苏州道蒙恩电子科技有限公司 | Electric plating method capable of improving anti-corrosion performance of metal element |
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2019
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103668369A (en) * | 2014-01-08 | 2014-03-26 | 苏州道蒙恩电子科技有限公司 | Electric plating method capable of improving anti-corrosion performance of metal element |
Non-Patent Citations (2)
| Title |
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| 张荣光等: "接插件端子连续选择性镀金工艺的发展趋势", 《电镀与精饰》 * |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073367A (en) * | 2021-03-16 | 2021-07-06 | 东莞立德精密工业有限公司 | Manufacturing process of conductive terminal |
| CN113186573A (en) * | 2021-04-30 | 2021-07-30 | 东莞市环侨金属制品有限公司 | Manufacturing process of electroplated communication terminal |
| CN113279032A (en) * | 2021-04-30 | 2021-08-20 | 东莞市环侨金属制品有限公司 | Continuous electroplating process for metal product |
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Application publication date: 20200421 |