CN111370894A - Conductive terminal coating, electric connector, conductive terminal and manufacturing method thereof - Google Patents
Conductive terminal coating, electric connector, conductive terminal and manufacturing method thereof Download PDFInfo
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- CN111370894A CN111370894A CN202010297952.XA CN202010297952A CN111370894A CN 111370894 A CN111370894 A CN 111370894A CN 202010297952 A CN202010297952 A CN 202010297952A CN 111370894 A CN111370894 A CN 111370894A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000011248 coating agent Substances 0.000 title claims abstract description 8
- 238000000576 coating method Methods 0.000 title claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 95
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 88
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 49
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 44
- 229910001260 Pt alloy Inorganic materials 0.000 claims abstract description 43
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 32
- 210000001503 joint Anatomy 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 37
- 239000010949 copper Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 34
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 21
- 229910052737 gold Inorganic materials 0.000 claims description 21
- 239000010931 gold Substances 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- 229910000929 Ru alloy Inorganic materials 0.000 claims description 13
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 claims description 13
- 229910052703 rhodium Inorganic materials 0.000 claims description 13
- 239000010948 rhodium Substances 0.000 claims description 13
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 13
- 230000007797 corrosion Effects 0.000 abstract description 13
- UQMRAFJOBWOFNS-UHFFFAOYSA-N butyl 2-(2,4-dichlorophenoxy)acetate Chemical compound CCCCOC(=O)COC1=CC=C(Cl)C=C1Cl UQMRAFJOBWOFNS-UHFFFAOYSA-N 0.000 description 10
- 230000013011 mating Effects 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003032 molecular docking Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a conductive terminal coating, an electric connector, a conductive terminal and a manufacturing method thereof, wherein the electric connector comprises an insulating body, the conductive terminal fixed on the insulating body and a shielding shell fixed on the outer side of the insulating body, the shielding shell surrounds the outer side of the insulating body to form a butt joint cavity, and the conductive terminal is provided with a fixing part fixed on the insulating body, a contact part extending forwards from the fixing part and protruding into the butt joint cavity and a welding part extending backwards out of the insulating body. The conductive terminal plating layer at least comprises a platinum or platinum alloy layer and a palladium or palladium-nickel alloy layer plated on the surface of the platinum or platinum alloy layer, and the corrosion resistance of the conductive terminal can be improved.
Description
Technical Field
The present invention relates to a conductive terminal plating layer, an electrical connector, a conductive terminal and a method for manufacturing the same, and more particularly, to a conductive terminal plating layer, an electrical connector, a conductive terminal and a method for manufacturing the same for fast data transmission.
Background
The electric connector plays a role in lifting weight in the existing electronic equipment and has the functions of charging the electronic equipment and transmitting data; however, when water or other substances enter the electronic device, the electronic device may be damaged, and in severe cases, the electronic device may not be used normally. With the change and innovation of science and technology, the existing electronic equipment can achieve a certain waterproof effect, the waterproof property becomes a new trend, and the development of the waterproof electric connector also tends to be standardized. Although the electric connector can be designed into a waterproof structure in the prior art and can prevent the electronic equipment from contacting with the outside, when corrosive media are adhered to the electric connector, the electric connector can corrode the conductive terminals of the electric connector, so that the electric connector generates a condition of function attenuation or failure after being used for a period of time, and the use of the electric connector is influenced.
Therefore, it is necessary to provide a new conductive terminal plating, an electrical connector, a conductive terminal and a method for manufacturing the same to overcome the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide a conductive terminal plating layer with better corrosion resistance and an electric connector thereof.
In order to achieve the purpose, the invention adopts the following technical scheme: a conductive terminal plating layer at least comprises a platinum or platinum alloy layer and a palladium or palladium-nickel alloy layer plated on the surface of the platinum or platinum alloy layer.
In a preferred embodiment, the plating thickness of the platinum or platinum alloy layer is 15 to 50u ″, and the plating thickness of the palladium or palladium-nickel alloy layer is 10 to 80u ″.
In a preferred embodiment, the conductive terminal plating layer includes a rhodium or rhodium-ruthenium alloy layer plated on an outer side of the palladium or palladium-nickel alloy layer.
In a preferred embodiment, the conductive terminal plating layer further includes a copper material located at a bottom layer and a bottom plating layer plated on an outer layer of the copper material, and the bottom plating layer is a metal material or an alloy and is plated between the copper material and the platinum or platinum alloy layer.
In a preferred embodiment, the metallic material or alloy comprises a gold plating layer and the platinum or platinum alloy layer is plated on the gold plating layer.
In a preferred embodiment, the metal material or alloy comprises a nickel or nickel alloy layer plated on the outer side of the copper material, and the gold plating layer is plated on the nickel or nickel alloy layer.
In order to achieve the purpose, the invention adopts the following technical scheme: an electric connector comprises an insulating body, a conductive terminal fixed on the insulating body and a shielding shell fixed on the outer side of the insulating body, wherein the shielding shell surrounds the outer side of the insulating body to form a butt joint cavity, and the conductive terminal is provided with a fixing part fixed on the insulating body, a contact part extending forwards from the fixing part and protruding into the butt joint cavity and a welding part extending backwards out of the insulating body. The conductive terminal is provided with the conductive terminal plating layer.
In order to achieve the purpose, the invention adopts the following technical scheme: a conductive terminal includes a copper material on a bottom layer and a plating layer formed on the copper material. The plating layer at least comprises a first layer and a second layer which are mutually laminated, the first layer is provided with platinum or platinum alloy, and the second layer is provided with palladium or palladium-nickel alloy.
In a preferred embodiment, the first layer has a coating thickness of 15-50u "and the second layer has a coating thickness of 10-80 u".
In a preferred embodiment, the conductive terminal includes an undercoat layer between the copper material and the first layer, the undercoat layer includes a first undercoat layer formed on the copper material and a second undercoat layer formed on the first undercoat layer, the second undercoat layer has nickel or a nickel alloy, and the second undercoat layer has gold.
In a preferred embodiment, the conductive terminal further comprises a third layer formed on the second layer, the third layer having rhodium or a rhodium ruthenium alloy.
In order to achieve the purpose, the invention also adopts the following technical scheme:
a method for manufacturing a conductive terminal comprises the following steps:
firstly, providing a conductive terminal substrate made of copper;
secondly, plating a plating layer on the outer side of the copper base material, wherein the plating layer at least comprises a platinum or platinum alloy layer;
thirdly, the plating layer also comprises a palladium or palladium-nickel alloy layer which is directly plated on the outer side of the platinum or platinum alloy layer to form the conductive terminal.
In a preferred embodiment, the plating thickness of the platinum or platinum alloy layer is 15 to 50u "and the plating thickness of the palladium or palladium nickel alloy layer is 10 to 80 u".
In a preferred embodiment, first, a nickel or nickel alloy layer and a gold plating layer plated on the outer side of the nickel or nickel alloy layer are sequentially plated on the outer side of the copper base material, and the platinum or platinum alloy layer is plated on the outer side of the gold plating layer.
In a preferred embodiment, the palladium or palladium-nickel alloy layer is finally plated on the outside with a rhodium or rhodium-ruthenium alloy layer.
Compared with the prior art, the invention has the following beneficial effects: the conductive terminal plating layer at least comprises a platinum or platinum alloy layer and a palladium or palladium-nickel alloy layer positioned on the surface of the platinum or platinum alloy layer, and the corrosion resistance of the conductive terminal can be improved under the consideration of low cost.
Drawings
Fig. 1 is a perspective view of an electrical connector of the present invention.
Fig. 2 is a schematic perspective view of another angle of the electrical connector shown in fig. 1.
Fig. 3 is an exploded view of the electrical connector shown in fig. 1.
Fig. 4 is a cross-sectional view of the electrical connector shown in fig. 1 taken along the direction a-a.
Fig. 5 is a cross-sectional view of the electrical connector shown in fig. 1 taken along the direction B-B.
Fig. 6 is a schematic structural diagram of a conductive terminal plating layer in the electrical connector of the present invention.
Detailed Description
Referring to fig. 1 to 5, an electrical connector 100 for mounting on a circuit board (not shown) is disclosed. The electrical connector 100 includes an insulative housing 10, a plurality of conductive terminals 20 held on the insulative housing 10, a pair of middle shielding plates 30 held in the insulative housing 10, and a shielding shell 40 covering the insulative housing 10, wherein the shielding shell 40 and the insulative housing 10 enclose a mating cavity 101 for inserting a mating connector (not shown).
Referring to fig. 3, the insulating housing 10 includes a base 11 and a tongue portion 12 extending forward from the base 11. The base 11 is fixed in the shielding shell 40 and has a holding groove 111 at the front end and a fixing groove 112 at the rear end, and the holding groove 111 and the fixing groove 112 are respectively disposed at the front and rear sides of the base 11. The tongue portion 12 includes a flat plate portion 13 at a front end and a stepped portion 14 at a rear end, the stepped portion 14 is formed by extending forward from the base portion 11, and the flat plate portion 13 is formed by extending forward from the stepped portion 14. The two sides of the rear end of the flat plate part 13 are both concavely provided with retaining grooves 131, and the two sides of the front end of the flat plate part 13 are provided with a pair of convex parts 132, and the convex parts 132 are positioned in front of the retaining grooves 131. The thickness of the step portion 14 in both the width direction and the height direction is larger than that of the flat plate portion 13, so as to enhance the strength of the insulating body 10.
Referring to fig. 3 to 5, the conductive terminals 20 are integrally formed in the insulating body 10, and the conductive terminals 20 are arranged in two rows on the upper and lower surfaces of the insulating body 10, and the two rows of conductive terminals 20 are divided into an upper row terminal 21 and a lower row terminal 22. The number of the upper row terminals 21 and the lower row terminals 22 is the same, and the arrangement sequence of the upper row terminals 21 and the lower row terminals 22 from left to right is opposite, so that the electrical connector 100 can realize the function of being plugged into the mating connector 200 in a positive and negative manner. Each of the upper row terminal 21 and the lower row terminal 22 at least includes a pair of ground terminals, a pair of power terminals, a pair of signal terminals, and a detection terminal. The pair of ground terminals of the upper row of terminals 21 and the lower row of terminals 22 are held at both sides of the outermost end of the insulative housing 10. The pair of power terminals, the pair of signal terminals and the detecting terminal are located between the pair of ground terminals, i.e. located at the middle position of the insulating body 10 in the transverse direction.
The upper row of terminals 21 and the lower row of terminals 22 are held in parallel in the up-down direction in the insulative housing 10. Each of the upper row terminal 21 and the lower row terminal 22 includes a holding portion 201 held on the base portion 11, a contact portion 202 extending forward from the holding portion 201 and protruding into the mating cavity 101, a soldering portion 203 extending backward from the holding portion 201 to the base portion 11, and an embedded portion 204 bent forward from the contact portion 202.
The holding portions 201 of the upper and lower rows of terminals 21 and 22 are held in the step portion 14 and the base portion 11. The contact portion 202 of the upper row terminal 21 is exposed to the upper surface of the flat plate portion 13, and the embedded portion 204 of the upper row terminal 21 extends downward and is embedded in the flat plate portion 13 to be fixed with the second tongue plate portion 12. The contact portion 202 of the lower row terminal 22 is exposed to the lower surface of the flat plate portion 13, and the embedded portion 204 of the lower row terminal 22 extends forward and is embedded in the flat plate portion 13 to be held with the tongue plate portion 12. Meanwhile, the soldering portions 203 of the upper and lower rows of terminals 21 and 22 extend rearward out of the base 11 and are arranged in a row.
The pair of middle shield pieces 30 are two symmetrical independent parts and no connecting structure is provided between the middle shield pieces 30. The pair of middle shielding plates 30 are separately disposed at two sides of the insulating body 10, and the pair of middle shielding plates 30 are respectively located between two pairs of ground terminals of the upper row terminal 21 and the lower row terminal 22 in the vertical direction and avoid other conductive terminals except the ground terminals in the width direction. Each of the middle shielding plates 30 includes a fixing portion 31 fixed in the insulating housing 10, an abutting portion 32 extending outward from the fixing portion 31, and a grounding pin 33 extending backward from the fixing portion 31 to the insulating housing 10. The interference portion 32 is formed to extend laterally outward from the fixing portion 31.
The fixing portion 31 of the middle shielding plate 30 is held in the tongue portion 12 and the base portion 11. The interference portion 32 is exposed out of the protrusion 132 and the retaining groove 131. In the using process, the butting connector is clamped in the buckling groove 131 and electrically connected with the abutting portion 32, so as to realize the grounding function. In addition, when the mating connector is mated with the electrical connector 100, the interference portion 32 can protect the protrusion 132 and the latching groove 131 from being scratched by the mating connector, thereby prolonging the service life. Meanwhile, the grounding pin 33 of the middle shielding plate 30 and the soldering portion 203 of the conductive terminal 20 both extend out of the insulating body 10 and are arranged in a row in the transverse direction.
The shielding shell 40 is made of metal material and has a substantially cylindrical structure. The inner wall 41 of the shielding shell 40 and the insulating body 10 enclose to form a docking cavity 101, and the tongue plate portion 12 protrudes into the docking cavity 101. The shielding shell 40 includes a rear stop 43 at the rear of a plurality of projections 42 extending from the inner wall 41 into the docking cavity 101. When the insulative housing 10 is assembled into the mating cavity 101 of the shielding shell 40 from the rear to the front, the rear end surface of the protrusion 42 abuts against the abutting groove 111, thereby preventing the insulative housing 10 from moving forward during use. In addition, the front end surface of the protrusion 42 is protruded forward beyond the front end surface of the base 11, and when an over-pushing phenomenon occurs during the mating process with the mating connector, the mating connector is preferentially pushed against the protrusion 42 to protect the insulation body 10 from being damaged. The rear stop portion 43 of the shielding shell 40 abuts against the retaining groove 112 to prevent the insulating housing 10 from moving backward. The shielding shell 40 further includes a holding pin 44 at least held on a circuit board (not shown), so that the shielding shell 40 has functions of grounding and shielding.
Referring to fig. 6, a cross-sectional view of a portion of a conductive terminal plating layer is shown, where the conductive terminal 20 includes a copper base a1 located at a bottom layer and a plating layer formed on the copper base a1, the plating layer includes a first layer and a second layer stacked on top of each other and a third layer formed on the second layer, the first layer has platinum or a platinum alloy (also referred to as a platinum or platinum alloy layer a4), the second layer has palladium or a palladium-nickel alloy (also referred to as a palladium or palladium-nickel alloy layer a5), and the third layer has rhodium or a rhodium-ruthenium alloy (also referred to as a rhodium or rhodium-ruthenium alloy layer a 6). Of course, the conductive terminal 20 further includes an undercoat layer between the copper material a1 and the first layer, the undercoat layer includes a first undercoat layer formed on the copper material a1 and a second undercoat layer formed on the first undercoat layer, the second undercoat layer has nickel or a nickel alloy (also referred to as nickel or a nickel alloy layer a2), and the second undercoat layer has gold (also referred to as gold layer A3), which improves the bondability of the terminal structure plating layer and further increases the corrosion resistance time. That is, the conductive terminal 20 has six plating layer structures from inside to outside, which are a copper base material a1, a nickel or nickel alloy layer a2 plated on the outer side of the copper base material a1, a gold plating layer A3 plated on the nickel or nickel alloy layer a2, a platinum or platinum alloy layer a4 plated on the gold plating layer A3, a palladium or palladium-nickel alloy layer a5 plated on the surface of the platinum or platinum alloy layer a4, and a rhodium or rhodium-ruthenium alloy layer a6 plated on the outer side of the palladium or palladium-nickel alloy layer a 5.
In the normal use state of the electrical connector 100, the conductive terminal 20 in the electrical connector 100 usually has weak current, and the plating layer on the surface of the conductive terminal 20 generates an electrolytic reaction when a loop is formed, because the potential of platinum is more positive than that of palladium, palladium or palladium-nickel alloy as an anode protects the platinum or platinum alloy and the bottom layer below, thereby ensuring the corrosion resistance of the conductive terminal 20, and the combination of the platinum or platinum alloy layer a4 and the palladium or palladium-nickel alloy layer a5 can effectively improve the anodic electrolytic corrosion resistance, and meet the design requirement of low cost.
The invention can improve the corrosion resistance of the conductive terminal 20 and reduce the manufacturing cost of the electric connector 100 by plating the outer layer of the conductive terminal 20 with at least the platinum or platinum alloy layer A4 and the palladium or palladium-nickel alloy layer A5 on the surface of the platinum or platinum alloy layer A4. Meanwhile, in order to improve the compactness of the plating layer and further reduce the manufacturing cost, a base plating layer can be plated on the outer layer of the copper base material A1, and the base plating layer is a metal material or an alloy, such as a nickel or nickel alloy layer A2 and a gold plating layer A3. The bottom plating layer is plated between the copper base material A1 and the platinum or platinum alloy layer A4, namely the gold plating layer A3 of the second bottom plating layer is beneficial to increasing the bonding force between the platinum or platinum alloy layer A4 and other metal materials, preventing the platinum or platinum alloy layer A4 from falling off and improving the corrosion resistance.
The thickness of the platinum or platinum alloy plating layer of the first layer is 15-50u ', the thickness of the palladium or palladium-nickel alloy plating layer of the second layer is 10-80 u', in order to prevent the conductive terminal 20 of the electrical connector 100 from being too thick, experiments show that the increase of the thickness of the plating layer, namely the increase of the thickness of the plating layer, is beneficial to improving the gap of the plating layer material and solving the problem of sealing performance of the plating layer, but the excessive thickness can increase the thickness of the electrical connector 100, is not beneficial to the thinning development of the electrical connector 100, and increases the manufacturing cost, so the thickness of the plating layer can better ensure the sealing effect and prevent corrosion without affecting the thickness of the electrical connector 100. Meanwhile, the outer side surface of the copper material A1 can be polished, so that the copper layer gap is reduced, the sealing effect is improved, and the corrosion resistance is improved.
The invention relates to a method for manufacturing a conductive terminal 20, which comprises the following steps:
firstly, providing a conductive terminal substrate made of a copper material A1;
secondly, plating a plating layer on the outer side of the copper base material, wherein the plating layer at least comprises a platinum or platinum alloy layer; the plating thickness of the platinum or platinum alloy layer A4 is 15-50 u';
thirdly, the plating layer also comprises a palladium or palladium-nickel alloy layer directly plated on the outer side of the platinum or platinum alloy layer; and forming the conductive terminal with the plating thickness of 10-80 u' prior to the palladium or palladium-nickel alloy layer A5.
The outside of the copper base material a1 can be sequentially plated with a nickel or nickel alloy layer a2 and a gold plating layer A3 plated on the outside of the nickel or nickel alloy layer a2, then the platinum or platinum alloy layer a4 is plated on the outside of the gold plating layer A3, and finally the outside of the palladium or palladium-nickel alloy layer a5 is plated with a rhodium or rhodium-ruthenium alloy layer a 6. The nickel or nickel alloy layer a2 and the gold plating layer A3 plated on the outer side of the nickel or nickel alloy layer a2 are collectively referred to as a metal material or an alloy. The conductive terminal structure formed by the method is made of materials such as a copper base material A1, a metal material or alloy plated on the outer side of the copper base material A1, a platinum or platinum alloy layer A4 positioned on the outer side of the metal material or alloy, a palladium or palladium-nickel alloy layer A5, a rhodium or rhodium-ruthenium alloy layer A6 positioned on the outermost layer and the like.
Through a lot of experiments, if the thickness of the conductive terminal plating layer is set to 5-10 u "of the platinum or platinum alloy layer a4 and 10 u" of the palladium or palladium-nickel alloy layer a5, the corrosion resistance of the conductive terminal is improved to 2 minutes, and if the conductive terminal plating layer is changed to 10-20 u "of the platinum or platinum alloy layer a4 and 50 u" of the palladium or palladium-nickel alloy layer a5, the corrosion resistance of the conductive terminal is improved to 10 minutes; if the rhodium or rhodium-ruthenium alloy layer A6 is continuously plated on the basis of the above steps to be 5-10 u', the corrosion resistance of the conductive terminal reaches 40 minutes, and compared with the existing pure rhodium or rhodium-ruthenium alloy layer with the same thickness, the plating layer design of the invention can save 20% of cost; data alignment please refer to the following:
in summary, the above is only a preferred embodiment of the present invention, and should not be limited to the scope of the present invention, and all the equivalent changes and modifications made by the claims and the specification of the present invention should still fall within the scope of the present invention.
Claims (15)
1. A conductive terminal plating, comprising: the conductive terminal plating layer at least comprises a platinum or platinum alloy layer and a palladium or palladium-nickel alloy layer plated on the surface of the platinum or platinum alloy layer.
2. An electrically conductive terminal plating as claimed in claim 1, wherein: the plating thickness of the platinum or platinum alloy layer is 15-50u ', and the plating thickness of the palladium or palladium-nickel alloy layer is 10-80 u'.
3. An electrically conductive terminal plating as claimed in claim 1, wherein: the conductive terminal plating layer comprises a rhodium or rhodium-ruthenium alloy layer plated on the outer side of the palladium or palladium-nickel alloy layer.
4. An electrically conductive terminal plating as claimed in claim 1, wherein: the conductive terminal coating further comprises a copper material positioned on the bottom layer and a bottom coating plated on the outer layer of the copper material, wherein the bottom coating is a metal material or alloy and is plated between the copper material and the platinum or platinum alloy layer.
5. An electrically conductive terminal plating as claimed in claim 4, wherein: the metal material or alloy includes a gold plating layer, and the platinum or platinum alloy layer is plated on the gold plating layer.
6. An electrically conductive terminal plating as claimed in claim 5, wherein: the metal material or alloy comprises a nickel or nickel alloy layer plated on the outer side of the copper material, and the gold plating layer is plated on the nickel or nickel alloy layer.
7. An electrical connector, comprising: the shielding shell surrounds the outer side of the insulating body to form a butt joint cavity, and the conductive terminal is provided with a fixing part fixed on the insulating body, a contact part extending forwards from the fixing part and protruding into the butt joint cavity, and a welding part extending backwards out of the insulating body; the method is characterized in that: the conductive terminal has the conductive terminal plating layer of any one of the above claims 1 to 6.
8. A conductive terminal comprises a copper material positioned on a bottom layer and a plating layer formed on the copper material; the method is characterized in that: the plating layer at least comprises a first layer and a second layer which are mutually laminated, the first layer is provided with platinum or platinum alloy, and the second layer is provided with palladium or palladium-nickel alloy.
9. An electrically conductive terminal as claimed in claim 8, wherein: the thickness of the first layer is 15-50u 'and the thickness of the second layer is 10-80 u'.
10. An electrically conductive terminal as claimed in claim 8, wherein: the conductive terminal comprises a bottom plating layer positioned between the copper material and the first layer, the bottom plating layer comprises a first bottom plating layer formed on the copper material and a second bottom plating layer formed on the first bottom plating layer, the second bottom plating layer is provided with nickel or nickel alloy, and the second bottom plating layer is provided with gold.
11. An electrically conductive terminal as claimed in claim 8, wherein: the conductive terminal also includes a third layer formed on the second layer, the third layer having rhodium or a rhodium ruthenium alloy.
12. A method for manufacturing a conductive terminal comprises the following steps:
firstly, providing a conductive terminal substrate made of copper;
secondly, plating a plating layer on the outer side of the copper base material, wherein the plating layer at least comprises a platinum or platinum alloy layer;
thirdly, the plating layer also comprises a palladium or palladium-nickel alloy layer which is directly plated on the outer side of the platinum or platinum alloy layer to form the conductive terminal.
13. The method of manufacturing an electrically conductive terminal as claimed in claim 12, wherein: the plating thickness of the platinum or platinum alloy layer is 15-50u ', and the plating thickness of the palladium or palladium-nickel alloy layer is 10-80 u'.
14. The method of manufacturing an electrically conductive terminal as claimed in claim 12, wherein: firstly, the outer side of the copper base material is sequentially plated with a nickel or nickel alloy layer and a gold plating layer plated on the outer side of the nickel or nickel alloy layer, and the platinum or platinum alloy layer is plated on the outer side of the gold plating layer.
15. The method of manufacturing an electrically conductive terminal as claimed in claim 14, wherein: and finally plating a rhodium or rhodium-ruthenium alloy layer on the outer side of the palladium or palladium-nickel alloy layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010263988 | 2020-04-03 | ||
| CN2020102639886 | 2020-04-03 |
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| CN111370894A true CN111370894A (en) | 2020-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010297952.XA Pending CN111370894A (en) | 2020-04-03 | 2020-04-15 | Conductive terminal coating, electric connector, conductive terminal and manufacturing method thereof |
| CN202020563232.9U Active CN211789656U (en) | 2020-04-03 | 2020-04-15 | Conductive terminal coating, electric connector and conductive terminal |
| CN202021495765.4U Active CN213304418U (en) | 2020-04-03 | 2020-04-15 | Conductive terminal coating and electric connector |
| CN202021495694.8U Active CN213304417U (en) | 2020-04-03 | 2020-04-15 | Conductive terminal coating and electric connector |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020563232.9U Active CN211789656U (en) | 2020-04-03 | 2020-04-15 | Conductive terminal coating, electric connector and conductive terminal |
| CN202021495765.4U Active CN213304418U (en) | 2020-04-03 | 2020-04-15 | Conductive terminal coating and electric connector |
| CN202021495694.8U Active CN213304417U (en) | 2020-04-03 | 2020-04-15 | Conductive terminal coating and electric connector |
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| CN (4) | CN111370894A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073367A (en) * | 2021-03-16 | 2021-07-06 | 东莞立德精密工业有限公司 | Manufacturing process of conductive terminal |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111370894A (en) * | 2020-04-03 | 2020-07-03 | 启东乾朔电子有限公司 | Conductive terminal coating, electric connector, conductive terminal and manufacturing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428335A (en) * | 2015-12-09 | 2016-03-23 | 北京达博有色金属焊料有限责任公司 | Bonding wire |
| CN106337197A (en) * | 2016-09-27 | 2017-01-18 | 东莞中探探针有限公司 | Electroplating technique for electric connector |
| CN108400463A (en) * | 2017-07-05 | 2018-08-14 | 启东乾朔电子有限公司 | Conducting terminal coating and its electric connector |
| CN109440091A (en) * | 2018-12-29 | 2019-03-08 | 大连大学 | The preparation process of tri- layers of anode composite plating layer of chemical Ni-P plating/Ni-Zn-P |
| CN109913917A (en) * | 2019-04-10 | 2019-06-21 | 东莞市合航精密科技有限公司 | A kind of corrosion resistant coating of mobile phone fast charge interface energization |
| CN110739569A (en) * | 2019-10-31 | 2020-01-31 | 广东东硕科技有限公司 | Electric contact terminal and preparation method and application thereof |
| CN211789656U (en) * | 2020-04-03 | 2020-10-27 | 启东乾朔电子有限公司 | Conductive terminal coating, electric connector and conductive terminal |
-
2020
- 2020-04-15 CN CN202010297952.XA patent/CN111370894A/en active Pending
- 2020-04-15 CN CN202020563232.9U patent/CN211789656U/en active Active
- 2020-04-15 CN CN202021495765.4U patent/CN213304418U/en active Active
- 2020-04-15 CN CN202021495694.8U patent/CN213304417U/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428335A (en) * | 2015-12-09 | 2016-03-23 | 北京达博有色金属焊料有限责任公司 | Bonding wire |
| CN106337197A (en) * | 2016-09-27 | 2017-01-18 | 东莞中探探针有限公司 | Electroplating technique for electric connector |
| CN108400463A (en) * | 2017-07-05 | 2018-08-14 | 启东乾朔电子有限公司 | Conducting terminal coating and its electric connector |
| CN109440091A (en) * | 2018-12-29 | 2019-03-08 | 大连大学 | The preparation process of tri- layers of anode composite plating layer of chemical Ni-P plating/Ni-Zn-P |
| CN109913917A (en) * | 2019-04-10 | 2019-06-21 | 东莞市合航精密科技有限公司 | A kind of corrosion resistant coating of mobile phone fast charge interface energization |
| CN110739569A (en) * | 2019-10-31 | 2020-01-31 | 广东东硕科技有限公司 | Electric contact terminal and preparation method and application thereof |
| CN211789656U (en) * | 2020-04-03 | 2020-10-27 | 启东乾朔电子有限公司 | Conductive terminal coating, electric connector and conductive terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073367A (en) * | 2021-03-16 | 2021-07-06 | 东莞立德精密工业有限公司 | Manufacturing process of conductive terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN213304418U (en) | 2021-05-28 |
| CN211789656U (en) | 2020-10-27 |
| CN213304417U (en) | 2021-05-28 |
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