CN105428335A - Bonding wire - Google Patents

Bonding wire Download PDF

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Publication number
CN105428335A
CN105428335A CN201510899336.0A CN201510899336A CN105428335A CN 105428335 A CN105428335 A CN 105428335A CN 201510899336 A CN201510899336 A CN 201510899336A CN 105428335 A CN105428335 A CN 105428335A
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China
Prior art keywords
bonding wire
gold
coating
palladium
quality
Prior art date
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Granted
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CN201510899336.0A
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Chinese (zh)
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CN105428335B (en
Inventor
梁忠
谢允昊
闫茹
向翠华
周晓光
苏宏福
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BEIJING DOUBLINK SOLDERS Co Ltd
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BEIJING DOUBLINK SOLDERS Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
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  • Engineering & Computer Science (AREA)
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  • Wire Bonding (AREA)

Abstract

The invention discloses a bonding wire. The bonding wire comprises a bonding wire base body and three plating layers, wherein the bonding wire base body is coated with the three plating layers; the bonding wire base body is gold-silver-palladium alloy; the three plating layers comprise a gold plating layer, a palladium plating layer and a platinum plating layer from interior to exterior in sequence; and the platinum plating layer is the thickest among the three plating layers. The bonding wire provided by the invention adopts the three-plating-layer structure; the bonding wire is high in antioxidant performance and sulfidation resistance, and the problem of silver migration can be solved as well; the electronically packaged bonding wire is high in subsequent performance stability; and the bonding wire is low in preparation cost, so that the bonding wire can fully replace the gold wire.

Description

A kind of bonding wire
Technical field
The present invention relates to a kind of bonding wire, be specifically related to a kind of to there is bonding wire of three layers of coating structure and preparation method thereof.
Background technology
At present, the semiconductor electronic chip in integrated circuit and the connection major part of outside lead framework all rely on bonding wire to complete, i.e. so-called wire bonding.Its process is on bonding apparatus, make bonding wire be fixed by dedicated ceramic mouth again, make it the bonding wire that afterbody reserves certain length, by outside arc discharge, bonding wire afterbody is melt into again spherical, then ceramic mouth is utilized to make spherical bonding wire squeeze flow on the electrode of electronic chip, movement finally by bonding apparatus makes the other end of bonding wire adopt the mode of friction to be connected on outside lead framework, completes after plastic resin encapsulation.Ensure carrying out smoothly of above-mentioned all process steps, para-linkage silk has the requirements such as balling-up is good, electrical and thermal conductivity is good, intensity is high, good-extensibility, non-oxidizability and good corrosion resistance.So present most bonding wire is all using the gold of purity more than 99.99% as main material, work wire diameter is within the scope of 18 ~ 50 μm, and now bonding gold wire is well positioned to meet the requirement of above-mentioned bonding, and these circumstances are verified widely and are confirmed.Such as, but involving great expense of gold, bonding gold wire cost is higher, to have released one after another the substitute of bonding gold wire for adapting to market demands, Silver alloy wire and gold-plated Silver alloy wire.Silver alloy wire manufacturing cost is lower, but its anti-oxidant cure is lower, can only substitute spun gold on low-end product.Comparatively speaking, gold-plated Silver alloy wire can better substitute spun gold, its plated surface in Silver alloy wire one deck gold, really the anti-oxidant curability of product is improve when not affecting its bonding, but due to the atomic structure of gold and silver atoms structure quite similar, so cannot solve the migration problem of silver in Silver alloy wire surface gold-plating, after Electronic Packaging, the stability in road is poor, so gold-plated Silver alloy wire still cannot substitute spun gold completely.
Summary of the invention
For solving above-mentioned problems of the prior art, the invention provides that a kind of anti-oxidant cure is strong, the bonding wire of good stability and the preparation method of bonding wire.
Above-mentioned purpose is realized by following proposal:
A kind of bonding wire, is characterized in that, this bonding wire is made up of bonding wire matrix and the three layers of coating be coated on outside bonding wire matrix, and described bonding wire matrix is gold and silver palldium alloy; Described three layers of coating are followed successively by gold plate, palladium coating, platinum coating from inside to outside, and the thickness of described platinum coating in three layers of coating is the thickest.
According to above-mentioned bonding wire, it is characterized in that, the chemical composition of described gold and silver palldium alloy is: golden 5wt%-20wt%, silver-colored 60wt%-94wt%, palladium 1wt%-20wt%.
According to above-mentioned bonding wire, it is characterized in that, the quality of described gold plate is the 1wt%-5wt% of described bonding wire substrate quality, the quality of described palladium coating is the 1wt%-5wt% of described bonding wire matrix and described gold plate quality sum, and the quality of described platinum coating is the 4wt%-10wt% of described bonding wire matrix, described gold plate and described palladium quality of coating sum.
A preparation method for above-mentioned bonding wire, is characterized in that, the step of described method is:
(1) by gold, silver and palladium in mass ratio (5-20): (60-94): after (1-20) carry out vacuum melting, cast becomes diameter to be the B alloy wire rod of 10 ~ 6mm, arrives micro-diameter that is pulled to again and is 40-80 μm, obtain bonding wire matrix through big or middle drawing;
(2) gold-plated on bonding wire matrix, wherein the quality of gold plate is the 1wt%-5wt% of bonding wire substrate quality;
(3) carry out ultrasonic cleaning to the B alloy wire of step (2), gold plate plates palladium, wherein the quality of palladium coating is the 1wt%-5wt% of bonding wire matrix and gold plate quality sum;
(4) carry out ultrasonic cleaning to the B alloy wire of step (3), platinum plating on palladium coating, wherein the quality of platinum coating is the 4wt%-10wt% of bonding wire matrix, gold plate and palladium quality of coating sum;
(5) be pulled to required wire diameter by micro-for the B alloy wire of step (4), obtain bonding wire.
According to the preparation method of above-mentioned bonding wire, it is characterized in that, mode that is gold-plated, that plate palladium and platinum plating is cyanideless electro-plating.
According to the preparation method of above-mentioned bonding wire, it is characterized in that, the purity of described gold is more than 99.999%, and the purity of described palladium is more than 99.99%, and the purity of described platinum is more than 99.99%.
Beneficial effect of the present invention:
Bonding wire of the present invention has three layers of coating structure, and its anti-oxidant cure is strong, and can solve the migration problem of silver, after Electronic Packaging, road stability is good, and preparation cost is low, can replace spun gold completely.
Accompanying drawing explanation
Fig. 1 is the structural representation of bonding gold wire of the present invention.
Embodiment
As described in Figure 1, bonding wire of the present invention possesses three layers of coating structure, and three layers of coating are coated on outside bonding wire matrix 1.The material of bonding wire matrix 1 is gold and silver palldium alloy, and three layers of coating are followed successively by gold plate 2, palladium coating 3, platinum coating 4 from inside to outside, and bonding wire of the present invention with platinum for main coating, namely in three layers of coating, the thickness of platinum coating 4 is the thickest.Chemical composition as the gold and silver palldium alloy of bonding wire matrix 1 is golden 5wt%-20wt%, silver-colored 60wt%-94wt%, palladium 1wt%-20wt%.The quality of gold plating 2 layers is the 1wt%-5wt% of bonding wire matrix 1 quality, the quality of palladium coating 3 is the 1wt%-5wt% of bonding wire matrix 1 and gold plate 2 quality sum, and the quality of platinum coating 4 is the 4wt%-10wt% of bonding wire matrix 1, gold plate 2 and palladium coating 3 quality sum.
The step of the preparation method of bonding wire of the present invention is as follows:
(1) by gold, silver and palladium in mass ratio (5-20): (60-94): (1-20) carry out vacuum melting, cast becomes diameter to be the B alloy wire rod of 10 ~ 6mm, arrives micro-diameter that is pulled to again and is 40-80 μm, obtain bonding wire matrix through big or middle drawing;
(2) gold-plated on bonding wire matrix, wherein the quality of gold plate is the 1wt%-5wt% of bonding wire substrate quality;
(3) carry out ultrasonic cleaning to the B alloy wire of step (2), gold plate plates palladium, wherein the quality of palladium coating is the 1wt%-5wt% of bonding wire matrix and gold plate quality sum;
(4) carry out ultrasonic cleaning to the B alloy wire of step (3), platinum plating on palladium coating, wherein the quality of platinum coating is the 4wt%-10wt% of bonding wire matrix, gold plate and palladium quality of coating sum;
(5) be pulled to required wire diameter by micro-for the B alloy wire of step (4), obtain bonding wire.
The mode that bonding wire matrix carries out plating is cyanideless electro-plating.
For improving the performance of bonding wire, control the purity of the present invention's metal used, wherein, the purity of gold is more than 99.999%, and the purity of palladium is more than 99.99%, and the purity of platinum is more than 99.99%.
With specific embodiment, bonding wire of the present invention and preparation method thereof is further described below.
Embodiment 1
(1) be the gold of more than 99.999% by purity, the silver of more than 99.99% and more than 99.99% palladium in mass ratio 5:94:1 carry out vacuum melting, cast become diameter be 10 ~ 6mm B alloy wire rod, draw that to arrive micro-diameter that is pulled to again be 80 μm through big or middle, obtain bonding wire matrix.
(2) on bonding wire matrix, adopt the method for cyanideless electro-plating to electroplate one deck gold, the purity of gold is more than 99.999%, and the quality of gold plate is the 1wt% of bonding wire substrate quality.
(3) carry out ultrasonic cleaning to the B alloy wire of step (2), gold plate adopts the method for cyanideless electro-plating electroplate one deck palladium, the purity of palladium is more than 99.99%, and the quality of palladium coating is the 1wt% of bonding wire matrix and gold plate quality sum.
(4) carry out ultrasonic cleaning to the B alloy wire of step (3), palladium coating adopts the method for cyanideless electro-plating electroplate one deck platinum, the purity of platinum is more than 99.99%, and the quality of platinum coating is the 4wt% of bonding wire matrix, gold plate and palladium quality of coating sum.
(5) be pulled to required wire diameter by micro-for the B alloy wire of step (4), obtain bonding wire.
Embodiment 2
(1) by gold, silver and palladium in mass ratio 20:60:20 carry out vacuum melting, cast becomes diameter to be the B alloy wire rod of 10 ~ 6mm, draws that to arrive micro-diameter that is pulled to again be 40, obtain bonding wire matrix through big or middle;
(2) gold-plated on bonding wire matrix, the purity of gold is more than 99.999%, and the quality of gold plate is the 5wt% of bonding wire substrate quality;
(3) carry out ultrasonic cleaning to the B alloy wire of step (2), gold plate plates palladium, the purity of palladium is more than 99.99%, and the quality of palladium coating is the 5wt% of bonding wire matrix and gold plate quality sum;
(4) carry out ultrasonic cleaning to the B alloy wire of step (3), platinum plating on palladium coating, the purity of platinum is more than 99.99%, and the quality of platinum coating is the 10wt% of bonding wire matrix, gold plate and palladium quality of coating sum;
(5) be pulled to required wire diameter by micro-for the B alloy wire of step (4), obtain bonding wire.

Claims (6)

1. a bonding wire, is characterized in that, this bonding wire is made up of bonding wire matrix and the three layers of coating be coated on outside bonding wire matrix; Described bonding wire matrix is gold and silver palldium alloy, and described three layers of coating are followed successively by gold plate, palladium coating, platinum coating from inside to outside, and the thickness of described platinum coating in three layers of coating is the thickest.
2. bonding wire according to claim 1, is characterized in that, the chemical composition of described gold and silver palldium alloy is: golden 5wt%-20wt%, silver-colored 60wt%-94wt%, palladium 1wt%-20wt%.
3. bonding wire according to claim 2, it is characterized in that, the quality of described gold plate is the 1wt%-5wt% of described bonding wire substrate quality, the quality of described palladium coating is the 1wt%-5wt% of described bonding wire matrix and described gold plate quality sum, and the quality of described platinum coating is the 4wt%-10wt% of described bonding wire matrix, described gold plate and described palladium quality of coating sum.
4. a preparation method for bonding wire as claimed in claim 3, is characterized in that, the step of described method is:
(1) by gold, silver and palladium in mass ratio (5-20): (60-94): after (1-20) carry out vacuum melting, cast becomes diameter to be the B alloy wire rod of 10mm, arrives micro-diameter that is pulled to again and is 40-80 μm, obtain bonding wire matrix through big or middle drawing;
(2) gold-plated on bonding wire matrix, wherein the quality of gold plate is the 1wt%-5wt% of bonding wire substrate quality;
(3) carry out ultrasonic cleaning to the B alloy wire of step (2), gold plate plates palladium, wherein the quality of palladium coating is the 1wt%-5wt% of bonding wire matrix and gold plate quality sum;
(4) carry out ultrasonic cleaning to the B alloy wire of step (3), platinum plating on palladium coating, wherein the quality of platinum coating is the 4wt%-10wt% of bonding wire matrix, gold plate and palladium quality of coating sum;
(5) be pulled to required wire diameter by micro-for the B alloy wire of step (4), obtain bonding wire.
5. the preparation method of bonding wire according to claim 4, is characterized in that, mode that is gold-plated, that plate palladium and platinum plating is cyanideless electro-plating.
6. the preparation method of bonding wire according to claim 4, is characterized in that, the purity of described gold is more than 99.999%, and the purity of described palladium is more than 99.99%, and the purity of described platinum is more than 99.99%.
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CN106337197A (en) * 2016-09-27 2017-01-18 东莞中探探针有限公司 Electroplating technique for electric connector
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CN111370894A (en) * 2020-04-03 2020-07-03 启东乾朔电子有限公司 Conductive terminal coating, electric connector, conductive terminal and manufacturing method thereof
CN112687649A (en) * 2020-12-25 2021-04-20 中国科学院宁波材料技术与工程研究所 Corrosion-resistant and oxidation-resistant coating on surface of bonding wire and preparation method and application thereof
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CN111370894A (en) * 2020-04-03 2020-07-03 启东乾朔电子有限公司 Conductive terminal coating, electric connector, conductive terminal and manufacturing method thereof
CN112687649A (en) * 2020-12-25 2021-04-20 中国科学院宁波材料技术与工程研究所 Corrosion-resistant and oxidation-resistant coating on surface of bonding wire and preparation method and application thereof
CN112687649B (en) * 2020-12-25 2024-03-12 中国科学院宁波材料技术与工程研究所 Corrosion-resistant and oxidation-resistant coating on surface of bonding wire as well as preparation method and application thereof
CN114005807A (en) * 2021-10-09 2022-02-01 江西蓝微电子科技有限公司 Gold-plated palladium-copper-based bonding wire and preparation method thereof

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