CN105665864A - Welding method for FPCB and metal bonding pad - Google Patents
Welding method for FPCB and metal bonding pad Download PDFInfo
- Publication number
- CN105665864A CN105665864A CN201610237131.0A CN201610237131A CN105665864A CN 105665864 A CN105665864 A CN 105665864A CN 201610237131 A CN201610237131 A CN 201610237131A CN 105665864 A CN105665864 A CN 105665864A
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- CN
- China
- Prior art keywords
- fpcb
- pad
- metal pad
- tin
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of welding and provides a welding method for an FPCB and a metal bonding pad. The method comprises the following steps that the two sides of a bonding pad of the FPCB are plated with tin, tin layers are formed on the two sides of the bonding pad of the FPCB respectively, and meanwhile, a welding area of the metal bonding pad is plated with tin to form a tin layer; the FPCB is fixed to the metal bonding pad, and the bonding pad of the FPCB is attached to the welding area of the metal bonding pad; a welding head of hot-press equipment is arranged on the welding pad of the FPCB in a hot-press mode, the tin layers of the FPCB and the tin layer of the metal bonding pad are fused, the FPCB and the metal bonding pad are conducted, and thus conduction of the FPCB and the metal bonding pad is achieved. The welding technology is simplified, tin does not need to be additionally arranged, the appearance is attractive, and the risk of short circuiting caused by scattering of tin beads due to additional tin is avoided.
Description
Technical field
The invention belongs to technical field of electronic products, particularly relate to the welding method of a kind of FPCB and metal pad.
Background technology
On the electronic product including motor, needing to weld conducting between FPCB with metal pad, thus realizing the circulation of the corresponding signal of telecommunication, therefore, being welded and fixed of FPCB and metal pad is exactly a required process in electronic product assembling process.
FPCB needs to use solder ball as medium with welding of metal pad, first melts solder ball, utilizes the stannum conducting FPCB and metal pad that solidify. Wherein, in welding process, it is necessary to additionally add stannum, tin cream can overflow stannum ball etc. when melting, thus affecting weld appearance, and is likely to cause other positions of pad because stannum ball is near the risk being short-circuited.
Summary of the invention
It is an object of the invention to provide the welding method of a kind of FPCB and metal pad, aim to solve the problem that in prior art in the welding process of FPCB and metal pad, need additionally to add stannum, tin cream can overflow stannum ball etc. when melting, thus affecting weld appearance, and it is likely to cause other positions of pad because stannum ball is near the problem of the risk being short-circuited.
The present invention is achieved in that the welding method of a kind of FPCB and metal pad, and described method comprises the steps:
On the pad of FPCB is two-sided, difference is tin plating, tin layers is formed respectively on the pad of FPCB is two-sided, simultaneously, tin plating formation tin layers on the welding region of metal pad, wherein, the welding region of described metal pad is positioned at the side welding described FPCB and the region corresponding with the pad of described FPCB;
Described FPCB is fixed on described metal pad, makes the pad of described FPCB and the welding region of described metal pad be affixed;
By the plumb joint hot pressing of hot-press equipment on the pad of described FPCB, the tin layers of the tin layers of FPCB and metal pad is melted, make described FPCB and metal pad conducting.
As a kind of improved plan, the thickness of the pad tin layers of described FPCB is be more than or equal to 0.5 micron.
As a kind of improved plan, the tin thickness of described metal pad is be more than or equal to 0.5 micron.
As a kind of improved plan, described the step that described FPCB is fixed on described metal pad is specifically included following step:
Location borehole jack on FPCB is contained in the locating dowel of described metal pad.
As a kind of improved plan, described method also comprises the steps:
Arranging several locating dowels on described metal pad, described locating dowel is positioned close to the position of described welding region;
At described FPCB, several location holes corresponding with described locating dowel are set near the position of pad.
In embodiments of the present invention, tin plating respectively on the pad of FPCB is two-sided, on the pad of FPCB is two-sided, form tin layers respectively, meanwhile, tin plating formation stannum layer on the welding region of metal pad; FPCB is fixed on described metal pad, makes the pad of described FPCB and the welding region of described metal pad be affixed; By the plumb joint hot pressing of hot-press equipment on the pad of described FPCB, the tin layers of the tin layers of FPCB and metal pad is melted, make FPCB and metal pad conducting, thus realizing the conducting of FPCB and metal pad, simplify welding procedure, it is not necessary to additionally add stannum, appearance looks elegant, avoiding and additionally add stannum, tin sweat(ing) is scattered the risk being short-circuited.
Accompanying drawing explanation
Fig. 1 is the flowchart of FPCB provided by the invention and the welding method of metal pad;
Fig. 2 is the Welding Structure schematic diagram of FPCB provided by the invention and metal pad.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated. Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
Fig. 1 illustrates the flowchart of FPCB provided by the invention and the welding method of metal pad, specifically includes following step:
In step S101, on the pad of FPCB is two-sided, difference is tin plating, tin layers is formed respectively on the pad of FPCB is two-sided, simultaneously, tin plating formation tin layers on the welding region of metal pad, wherein, the welding region of metal pad is positioned at the side of welding FPCB and the region corresponding with the pad of FPCB.
In step s 102, FPCB is fixed on metal pad, makes the pad of FPCB and the welding region of metal pad be affixed.
In step s 103, by the plumb joint hot pressing of hot-press equipment on the pad of FPCB, the tin layers of the tin layers of FPCB and metal pad is melted, make FPCB and metal pad conducting.
In this embodiment, the step being fixed on metal pad by FPCB specifically includes following step:
Location borehole jack on FPCB is contained in the locating dowel of metal pad.
Wherein, before performing above-mentioned steps, it is necessary to do following setting:
Arranging several locating dowels 1 on metal pad, locating dowel 1 is positioned close to the position of welding region;
At FPCB, several location holes 2 corresponding with locating dowel are set near the position of pad.
The quantity in this locating dowel 1 and hole 2, location can be two, as shown in Figure 2, naturally it is also possible to be set to other quantity, at this not in order to limit the present invention.
As shown in Figure 2, in thermal compression welding process, the plumb joint hot pressing of hot-press equipment is on the tin layers face of the pad upper side of FPCB, then transfer heat in the tin layers of downside of the pad of FPCB, then conduct to the tin layers of metal pad, although increasing of temperature, the tin layers that FPCB contacts with metal pad melts fixed line, thus realizing the conducting of FPCB and metal pad.
In embodiments of the present invention, on the pad of above-mentioned FPCB the thickness of tin layers be more than or equal to 0.5 micron; Equally, the tin thickness of metal pad is be more than or equal to 0.5 micron.
In embodiments of the present invention, tin plating respectively on the pad of FPCB is two-sided, on the pad of FPCB is two-sided, form tin layers respectively, meanwhile, tin plating formation stannum layer on the welding region of metal pad; FPCB is fixed on metal pad, makes the pad of FPCB and the welding region of metal pad be affixed; By the plumb joint hot pressing of hot-press equipment on the pad of FPCB, the tin layers of the tin layers of FPCB and metal pad is melted, make FPCB and metal pad conducting, thus realizing the conducting of FPCB and metal pad, simplify welding procedure, it is not necessary to additionally add stannum, appearance looks elegant, avoiding and additionally add stannum, tin sweat(ing) is scattered the risk being short-circuited.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent replacement and improvement etc. made within the spirit and principles in the present invention, should be included within protection scope of the present invention.
Claims (5)
1. the welding method of a FPCB and metal pad, it is characterised in that described method comprises the steps:
On the pad of FPCB is two-sided, difference is tin plating, tin layers is formed respectively on the pad of FPCB is two-sided, simultaneously, tin plating formation tin layers on the welding region of metal pad, wherein, the welding region of described metal pad is positioned at the side welding described FPCB and the region corresponding with the pad of described FPCB;
Described FPCB is fixed on described metal pad, makes the pad of described FPCB and the welding region of described metal pad be affixed;
By the plumb joint hot pressing of hot-press equipment on the pad of described FPCB, the tin layers of the tin layers of FPCB and metal pad is melted, make described FPCB and metal pad conducting.
2. the welding method of FPCB according to claim 1 and metal pad, it is characterised in that the thickness of the pad tin layers of described FPCB is be more than or equal to 0.5 micron.
3. the welding method of FPCB according to claim 1 and metal pad, it is characterised in that the tin thickness of described metal pad is be more than or equal to 0.5 micron.
4. the welding method of FPCB according to claim 1 and metal pad, it is characterised in that described the step that described FPCB is fixed on described metal pad is specifically included following step:
Location borehole jack on FPCB is contained in the locating dowel of described metal pad.
5. the welding method of FPCB according to claim 4 and metal pad, it is characterised in that described method also comprises the steps:
Arranging several locating dowels on described metal pad, described locating dowel is positioned close to the position of described welding region;
At described FPCB, several location holes corresponding with described locating dowel are set near the position of pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610237131.0A CN105665864A (en) | 2016-04-15 | 2016-04-15 | Welding method for FPCB and metal bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610237131.0A CN105665864A (en) | 2016-04-15 | 2016-04-15 | Welding method for FPCB and metal bonding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105665864A true CN105665864A (en) | 2016-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610237131.0A Pending CN105665864A (en) | 2016-04-15 | 2016-04-15 | Welding method for FPCB and metal bonding pad |
Country Status (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110303213A (en) * | 2019-07-05 | 2019-10-08 | 深圳市集银科技有限公司 | A kind of backlight module FPC welding wire pressing plate technology |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121064A (en) * | 1983-12-06 | 1985-06-28 | Matsushita Electric Ind Co Ltd | Terminal soldering method of metallic base circuit board |
| CN1360465A (en) * | 2000-12-19 | 2002-07-24 | 株式会社东芝 | Parts mounting baseplate and making method therefor |
| CN101125396A (en) * | 2006-08-17 | 2008-02-20 | 黄柏山 | Tin paste and its use in thermal press welding method |
| CN202679796U (en) * | 2012-06-13 | 2013-01-16 | 田茂福 | FPC with tin-coating solder joints and LED lamp strip |
| CN105407636A (en) * | 2014-08-18 | 2016-03-16 | 台达电子工业股份有限公司 | Golden finger device for flexible printed circuit board |
-
2016
- 2016-04-15 CN CN201610237131.0A patent/CN105665864A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121064A (en) * | 1983-12-06 | 1985-06-28 | Matsushita Electric Ind Co Ltd | Terminal soldering method of metallic base circuit board |
| CN1360465A (en) * | 2000-12-19 | 2002-07-24 | 株式会社东芝 | Parts mounting baseplate and making method therefor |
| CN101125396A (en) * | 2006-08-17 | 2008-02-20 | 黄柏山 | Tin paste and its use in thermal press welding method |
| CN202679796U (en) * | 2012-06-13 | 2013-01-16 | 田茂福 | FPC with tin-coating solder joints and LED lamp strip |
| CN105407636A (en) * | 2014-08-18 | 2016-03-16 | 台达电子工业股份有限公司 | Golden finger device for flexible printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110303213A (en) * | 2019-07-05 | 2019-10-08 | 深圳市集银科技有限公司 | A kind of backlight module FPC welding wire pressing plate technology |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160615 |
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| RJ01 | Rejection of invention patent application after publication |