TW201538258A - Joining structure of thin board and joining method thereof - Google Patents

Abstract

This invention is a joining structure of thin board and its joining method of a thin boar, wherein the joining structure comprises a lower thin board and an upper thin board mutually pasted. At least one solder tank is recessed at the top surface of the lower thin board. Hence, a space capable of containing solder between the two thin boards is provided. This molten solder will move inside the solder tank to prevent it from overflowing from the edge between the two thin boards. In addition, the solder does not only touch the inner wall surface of the solder tank but also touches the upper thin board upwardly. Therefore, this invention could achieve the effect of connecting the two thin boards and accordingly achieves the purpose of preventing solder from overflowing the edge of two thin boards.

Description

Bonding structure of thin plate and bonding method thereof

The present invention relates to a combined structure of a thin plate and a bonding method thereof, and more particularly to a structure and a method for joining thin plates by welding.

There are many ways to weld two sheets in the prior art, one of which is that one layer of solder is applied to the top surface of one of the sheets, and then the other sheet is pressed against the sheet and the solder, and then the two sheets are heated to The melting point of the solder melts the solder. After the solder is cooled and solidified, the two sheets are bonded and fixed by the solder.

However, the soldering method has a disadvantage in that when the two sheets are heated and the solder is melted, since the surfaces of the two sheets abutting each other are flat, the solder sandwiched between the two sheets is pressed and then moved to both sides. It may overflow from the edge of the two sheets, and the overflowed solder is not only unsightly, but may also affect the combination of the two sheets with other components due to the increase in volume; in addition, the solder is generally applied to the edge of the sheet to the edge It is avoided that the joint of the two sheets is too far from the edge, so that the edges of the two sheets can be opened at an excessive angle, but this further causes the solder to easily escape from the edge.

In view of the above disadvantages and deficiencies of the prior art, the present invention provides a bonding structure of a thin plate and a bonding method thereof, so as to effectively avoid solder overflow edges.

In order to achieve the above-mentioned creative purpose, the technical means adopted in the present invention is to design a bonding structure of a thin plate, which comprises: a lower sheet having at least one solder groove recessed on a top surface thereof; and an upper thin plate which abuts against the lower sheet Top surface; solder, which is disposed in a corresponding solder bath of the lower sheet and contacts the upper sheet.

In order to achieve the above-mentioned creative purpose, the present invention further provides a method for bonding a combined structure of thin plates, comprising: preparing a thin plate: preparing an upper thin plate and a lower thin plate, wherein a top surface of the lower thin plate is recessed with at least one solder groove; Coating the solder in each solder bath of the lower sheet; pressing the sheet: pressing the upper sheet against the top surface of the lower sheet and contacting the upper sheet with the solder in each solder bath; heating the solder: heating at least one sheet until the solder melts; Solder cooling: The solder cools and solidifies and joins the two sheets.

The advantage of this creation is that by providing a solder bath on the top surface of the lower sheet, so that there is space between the two sheets to accommodate the solder, the solder will melt in the solder bath and avoid the edges from the two sheets. In addition, in addition to contacting the inner wall surface of the solder bath, the solder also contacts the upper sheet, so that the effect of connecting the two sheets can also be achieved; this creation aims to avoid the solder from overflowing the edges of the two sheets.

Further, in the combined structure of the thin plate, the peripheral edge of the upper thin plate extends with a reversed portion, and the reverse folded portion surrounds the periphery of the lower thin plate and is pressed against the bottom surface of the lower thin plate. Thereby, the combination of the two sheets can be further strengthened.

The technical means adopted by the present invention for achieving the intended purpose of creation are further explained below in conjunction with the drawings and the preferred embodiment of the present invention.

Referring to FIG. 1 , the method for combining the combined structure of the thin plate of the present invention comprises the following steps:

Referring to FIG. 2 and FIG. 3, first, a thin plate 10 and an upper thin plate 20 (S1) are prepared; the lower thin plate 10 is rectangular, and a solder groove 11 is recessed on the top surface thereof, and the solder groove 11 is along a ring groove surrounded by the periphery of the lower sheet 10 and adjacent to the periphery of the lower sheet 10, the bottom surface of the solder groove 11 protrudes from the bottom surface of the lower sheet 10; the upper sheet 20 is also rectangular, but a folded portion 22 extends from the periphery of the upper sheet 20, so The upper surface of the upper plate 20 is larger than the area of the lower plate 10; a convex portion 21 is protruded from the bottom surface of the upper thin plate 20, and the convex portion 21 is a ring convex portion surrounding the periphery of the upper thin plate 20; in the embodiment, the solder groove 11 and The convex portions 21 are all formed by punching, but are not limited thereto.

Next, the solder 30 is applied to the solder bath 11 of the lower sheet 10 (S2), and the solder 30 may be tin or other material; then the upper sheet 20 is pressed against the top surface of the lower sheet 10 (S3), and the convexity of the upper sheet 20 is made. The portion 21 is passed through the solder groove 11 of the lower sheet 10, and the convex portion 21 contacts the solder 30 in the solder bath 11.

Then, the lower thin plate 10 is corresponding to the position of the solder 30, or where the upper thin plate 20 corresponds to the position of the solder 30, or where the two thin plates 10, 20 correspond to the position of the solder 30, respectively, until the temperature rises to the solder 30. The melting point is such that the solder 30 is melted (S4); the solder 30 is cooled and solidified within a few seconds, and thus the two sheets 10, 20 (S5) are joined; please refer to FIG. 4, and then the two sheets 10, 20 are turned over. The bottom surface of the lower sheet 10 is faced upward, and the solder groove 11 on the bottom surface of the lower sheet 10 is rolled and leveled (S6); then the rolling portion is ground to make it smoother (S7); please refer to FIG. 5 As shown, the folded-back portion 22 of the upper sheet 20 is finally folded back (S8) so that the folded-back portion 22 surrounds the periphery of the lower sheet 10 and is pressed against the bottom surface of the lower sheet 10; thus, the joining operation is completed.

As can be seen from the above process, when the upper sheet 20 is pressed against the lower sheet 10, since the solder groove 11 creates a space for accommodating the solder 30, the solder 30 is melted and then moved in the solder bath 11, avoiding from two The edges of the thin plates 10, 20 overflow; and the solder 30 contacts the convex portion 21 of the upper thin plate 20 in addition to the inner wall surface of the solder bath 11, so that the two thin plates 10, 20 can still be effectively connected and fixed. The purpose of avoiding the solder 30 overflowing the edges of the two sheets 10, 20 is achieved.

The refraction portion 22 of the upper thin plate 20 surrounds the periphery of the lower thin plate 10 and is pressed against the bottom surface of the lower thin plate 10, so that the combination of the two thin plates 10, 20 is more stable; The periphery of the lower sheet is folded back upwards to surround the periphery of the upper sheet, and finally pressed to the top surface of the upper sheet, so that the purpose of strengthening the joining of the two sheets can be achieved.

In addition, the present invention can be applied to various types and types of thin plates, for example, in the present embodiment, a temperature equalizing plate for conducting heat to prevent heat from being concentrated in one place, and further provided with a channel groove 40, the channel groove 40 being sandwiched and formed Between the lower sheet 10 and the upper sheet 20, the channel groove 40 is a ring groove parallel to the solder groove 11 and located inside the solder bath 11; in use, a working fluid such as water or a refrigerant is disposed in the channel groove 40 to work. After the fluid is evaporated by heat in the channel groove 40, it flows along the channel groove 40 and transfers heat and cools into a liquid, and finally returns to the original position to be evaporated again by heat, whereby the working fluid can quickly transfer the heat evenly; The volume and shape of the channel groove 40 are precisely calculated and designed in order to achieve the best thermal conductivity. Therefore, the solder groove 11 of the lower plate 10 can also effectively prevent the solder 30 from flowing into the channel groove 40, so as to prevent the solder 30 from affecting the channel groove. 40 volume and shape.

Referring to FIG. 6, when used as a temperature equalizing plate, the center of the lower thin plate 10A and the upper thin plate 20A can further penetrate through a through hole 12A, 23A, and the two thin plates 10A, 20A are both annular, and the two through holes 12A, 23A The shape and size are the same, and the positions of the two through holes 12A and 23A are also corresponding; the use of the same can also achieve the effect of rapidly transferring the heat evenly, and the same can be passed through the solder tank to prevent the solder from flowing into the channel groove 40A. Or overflow the edges of the two sheets 10A, 20A.

In other embodiments, please refer to FIG. 7 , the upper plate 20B of the present invention may also have no convex portion, and the upper thin plate 20B corresponds to the solder groove 11B as a plane, so that more solder 30B can be accommodated, or The distance at which the solder groove 11B protrudes from the bottom surface of the lower sheet 10B is lowered.

In other embodiments, the solder bath may not be a ring groove, and the lower sheet may instead include a plurality of solder slots that are not connected, and each solder slot may be a long slot or other shape, and the solder is also applied only to the solder bath. In this way, the purpose of avoiding the overflow of the solder outside the edges of the two sheets can also be achieved.

In other embodiments, as shown in FIG. 8 , after the solder is cooled and solidified (S5), the reverse folding portion may be reversely folded (S8), and finally rolled and leveled (S6). And sanding (S7); and in order to avoid interference with the end of the folding portion during rolling, the folding portion can be formed on the lower sheet and folded back upward, so that the end of the folding portion will be located The top surface of the sheet.

In other embodiments, the manufacturing method of the present invention may also omit the reflexing of the reflexing portion as the case may be, that is, the two sheets have no reflexing portions; the grinding of the rolling place may be omitted as the case may be, or even the solder groove may be The rolling flattening is omitted together, for example, when the depth of the solder groove is shallow and does not protrude from the bottom surface of the lower sheet, or the solder groove protrudes from the bottom surface of the lower sheet to be light and negligible, roll flattening is not required.

The above description is only a preferred embodiment of the present invention, and does not impose any form limitation on the present invention. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present creation, and has any technical field. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The technical essence of the creation Any simple modification, equivalent change and modification of the above embodiments are still within the scope of the technical solution of the present invention.

10‧‧‧low sheet
11‧‧‧ solder bath
20‧‧‧Upper sheet
21‧‧‧ convex
22‧‧‧Reflexion
30‧‧‧ solder
40‧‧‧channel slot
10A‧‧‧low sheet
12A‧‧‧Perforation
20A‧‧‧Upper sheet
23A‧‧‧Perforation
40A‧‧‧ channel slot
10B‧‧‧low sheet
11B‧‧‧ solder bath
20B‧‧‧Upper sheet
30B‧‧‧ solder

Figure 1 is a flow chart of the method of combining the creations. Figure 2 is a perspective view of the two sheets of the present creation when the combination is completed. Figure 3 is a side cross-sectional view of the solder of the present invention after melting. Figure 4 is a side cross-sectional view of the thin plate after it has been rolled. Fig. 5 is a side cross-sectional view showing the reverse of the reflexed portion of the sheet above the creation. Fig. 6 is a perspective view showing the completion of the joining of two sheets of another embodiment of the present invention. Figure 7 is a side cross-sectional view showing another embodiment of the present invention after the solder has been melted. Figure 8 is a flow chart of still another embodiment of the method of combining the creations.

10‧‧‧low sheet

11‧‧‧ solder bath

20‧‧‧Upper sheet

21‧‧‧ convex

22‧‧‧Reflexion

30‧‧‧ solder

40‧‧‧channel slot

Claims (14)

A bonding structure of a thin plate, comprising: a lower thin plate having at least one solder groove recessed on a top surface thereof; an upper thin plate abutting against a top surface of the lower thin plate; and a solder disposed in a corresponding solder groove of the lower thin plate And contact the thin plate. The bonding structure of the thin plate according to claim 1, wherein the bottom surface of the upper thin plate protrudes from at least one convex portion, and each convex portion penetrates into a corresponding solder groove of the lower thin plate and contacts the solder. The bonding structure of the thin plate according to claim 1, wherein the lower thin plate has a single solder groove, and the solder groove is a ring groove. The bonding structure of the thin plate according to claim 2, wherein the lower thin plate has a single solder groove, and the solder groove is a ring groove; the upper thin plate has a single convex portion, and the convex portion is a ring convex portion. The bonding structure of the thin plate according to any one of claims 1 to 4, wherein the solder groove of the lower sheet abuts the circumference of the lower sheet. The bonding structure of the thin plate according to any one of claims 1 to 4, wherein the periphery of the upper sheet extends with a reversed portion which surrounds the periphery of the lower sheet and is pressed against the bottom surface of the lower sheet. The bonding structure of the thin plate according to any one of claims 1 to 4, wherein the periphery of the lower sheet extends with a reversed portion which surrounds the periphery of the upper sheet and is pressed against the top surface of the upper sheet. The bonding structure of the thin plate according to any one of claims 1 to 4, wherein the upper thin plate and the lower thin plate are sandwiched by a channel groove which is a ring groove and is located inside the solder groove. The bonding structure of the thin plate according to any one of claims 1 to 4, wherein a center of the upper and lower sheets has a perforation therethrough. A bonding method for a bonding structure of a thin plate, comprising: preparing a thin plate: preparing an upper thin plate and a lower thin plate, wherein a top surface of the lower thin plate is recessed with at least one solder groove; coating solder: coating solder in each solder slot of the lower thin plate Pressing the sheet: pressing the upper sheet against the top surface of the lower sheet and contacting the upper sheet with the solder in each solder bath; heating the solder: heating at least one sheet until the solder melts; solder cooling: the solder cools and solidifies and joins the two sheets. The bonding method of the bonding structure of the thin plate according to claim 10, wherein: in the step of preparing the thin plate, the bottom surface of the solder groove of the lower thin plate protrudes from the bottom surface of the lower thin plate; after the solder cooling step, further comprising a step: the thin plate Flat: Roll the flat surface of the solder groove on the bottom of the lower plate to be flattened. The bonding method of the bonding structure of the thin plate according to claim 11, wherein: after the thinning step, the method further comprises a step of: sanding the thin plate: grinding the rolling portion of the bottom surface of the lower plate. The bonding method of the bonding structure of the thin plate according to claim 10, wherein: in the step of preparing the thin plate, the peripheral edge of the upper thin plate extends with a reversed portion; after the solder cooling step, further comprising a step of: folding the peripheral edge: The folded portion of the sheet is folded back and wrapped around the periphery of the lower sheet and pressed against the bottom surface of the lower sheet. The bonding method of the bonding structure of the thin plate according to claim 10, wherein: in the step of preparing the thin plate, the periphery of the lower thin plate extends with a reversed portion; after the solder cooling step, further comprising a step of: reversing the peripheral edge: the lower portion The folded portion of the sheet is folded back and wrapped around the periphery of the upper sheet and pressed against the top surface of the upper sheet.