WO2020042974A1

WO2020042974A1 - Thin-type vacuum heat insulating sheet and manufacturing method therefor

Info

Publication number: WO2020042974A1
Application number: PCT/CN2019/101696
Authority: WO
Inventors: 陈振贤
Original assignee: 广州力及热管理科技有限公司
Priority date: 2018-08-27
Filing date: 2019-08-21
Publication date: 2020-03-05
Also published as: CN110864193B; CN110864193A

Abstract

A thin-type vacuum heat insulating sheet and a manufacturing method therefor. The thin-type vacuum heat insulating sheet comprises a first sheet-shaped structure (11), a second sheet-shaped structure (12), and a soldering material (10); the first sheet-shaped structure comprises a first surface (110) having solderability; the second sheet-shaped structure comprises a second surface (120) having solderability; the soldering material is annularly soldered to the first surface and the second surface; the first sheet-shaped structure and the second sheet-shaped structure are airtightly joined by means of the soldering material and form a clearance space (15); the air pressure in the clearance space is in an negative pressure state of being smaller than one atmosphere. The thin-type vacuum heat insulating sheet can effectively reduce heat conduction and heat convection between the two surfaces of the heat insulating sheet, thereby achieving the function of effectively insulating heat. By precisely controlling the first sheet-shaped structure, the second sheet-shaped structure, and the thickness of an annular soldering material, and performing sealed soldering in an vacuum environment, the thin-type vacuum heat insulating sheet with the thickness smaller than 1mm may be formed and is suitable for various heat insulation requirements of thin electronic and communication products.

Description

Thin vacuum insulation sheet and manufacturing method thereof

Technical field

The invention provides a vacuum heat insulation sheet and a manufacturing method thereof, particularly a thin vacuum heat insulation sheet and a manufacturing method thereof.

Background technique

The development trend of electronic and handheld communication devices continues to be thin and highly functional, and people have increasingly demanded the computing speed and functions of microprocessors in the devices. The microprocessor is the core component of electronic and communication products. It is easy to generate heat and become the main heating element of electronic devices under high-speed computing. If the heat is not dissipated immediately, local hotspots will occur. Without a good thermal management solution and heat dissipation system, the microprocessor will often overheat and fail to perform its due functions, and even affect the life and reliability of the entire electronic device system. Therefore, electronic products need excellent heat dissipation design, and especially ultra-thin electronic devices such as smartphones and tablet PCs need to have excellent heat dissipation capabilities. At present, the effective solution for hot and hot spot (Hot Spot) heat removal and heat dissipation is to contact the graphite sheet (Graphitte sheet) or Flatten Micro Heat Pipe or Vapor Chamber to generate heat. The source and the other side are in contact with the casing of the electronic device. It is hoped that the high-density heat generated by the microprocessor can be quickly conducted and distributed to the casing in a more effective manner, thereby radiating the heat to the air.

However, since some electronic or communication products, such as smart phones, are designed to be very thin and light, the thickness space between the microprocessor and the case that allows the heat dissipation component to be placed is often less than 1mm. Therefore, the other side of the heat dissipation element in the heat source area will directly contact the case, and the high temperature generated by the hot spot will be easily directly transmitted to the case, causing the hot spot temperature on the case to be too high. Therefore, in order to avoid the case temperature being too high, it is necessary to place a layer of heat insulation sheet between the case in the hotspot area and a part of the heat dissipation element to prevent the conduction of heat flow. At the same time, it is necessary to use a layer of heat insulation sheet for proper isolation between the heating element on the circuit board and other heat-sensitive electronic or optoelectronic components. Therefore, in addition to an effective heat dissipation design for light, thin and short electronic and communication devices, how to achieve high-efficiency heat insulation in the limited thickness and space of the local part of the device has also become an urgent problem to be solved.

Summary of the Invention

An object of the present invention is to provide a thin vacuum insulation sheet and a manufacturing method thereof. The structure and manufacturing method of the thin vacuum insulation sheet can effectively solve the problem that it is difficult for general insulation materials to have a heat insulation effect in a space with a limited thickness, especially in an application scene where the insulation thickness space is required to be less than 1mm.

The invention provides a thin vacuum insulation sheet, which includes a first sheet-like structure, a second sheet-like structure, and a solder material. The first sheet structure has a first surface with solderability. The second sheet structure has a second surface with solderability. The solder material is circularly welded to the first surface and the second surface, and the first sheet structure and the second sheet structure are hermetically joined by the solder material to form a gap space. The air pressure in the gap space is a negative pressure state less than one atmosphere.

The first sheet structure and the second sheet structure are made of metal. Further, the material of the first sheet structure and the second sheet structure is copper.

In addition, the thickness of the thin vacuum insulation sheet is less than 1 mm, and the height of the clearance space is less than 0.5 mm.

The first surface of the first sheet structure has a solder resist layer, and a solder material is welded to the edge of the solder resist layer on the first surface.

The thin vacuum insulation sheet further includes a support post formed in the gap space, and two ends of the support post are respectively connected to the first sheet structure and the second sheet structure.

The present invention also provides a method for manufacturing a thin vacuum insulation sheet, which includes the following steps: providing a first jig platform having a first groove and a second jig platform having a second groove. A first sheet structure is adsorbed in the first groove, and a second sheet structure is adsorbed in the second groove. A ring of solder material is laid on a first surface of the first sheet structure. The second jig platform and the first jig platform are overlapped, so that the position of the first sheet structure is spaced to a height corresponding to the position of the second sheet structure, and there is a gap between the first sheet structure and the second sheet structure. Solder material. The stacked second jig platform and the first jig platform are placed in a cavity. Evacuate and heat the first and second mold platforms and the first sheet structure and the second sheet structure in the cavity, melt the solder material and hermetically weld the first sheet structure and the second sheet in a vacuum state. To form a vacuum space between the first sheet structure, the second sheet structure, and the annular solder material.

In a specific embodiment, in the step of providing a first jig platform with a first groove and a second jig platform with a second groove, the second jig platform further has a positioning post; In the steps of the second jig platform and the first jig platform, the height between the first sheet structure and the second sheet structure is determined by the height of the positioning column.

In another embodiment, in the step of providing a first jig platform with the first groove and the second jig platform with a second groove, it is further to provide a first jig platform with a first groove and a plurality of A first jig platform with three third grooves, and the second jig platform with a second groove and a positioning post.

Next, the method for manufacturing a thin vacuum insulation sheet further includes a step: placing at least three solder balls in the third groove, the material and melting point of the solder ball are the same as the solder material, and the height of the solder ball is higher than the positioning post.

Moreover, in the step of superimposing the second jig platform and the first jig platform, before the solder material and the solder ball have been dissolved, the height between the first sheet structure and the second sheet structure is determined by the solder balls. The height of the support; and in the step of heating the first and second mold platforms and the first sheet structure and the second sheet structure in the heating chamber and vacuuming, the solder material and the solder ball are melted, because With the action of gravity, the second jig platform with the second sheet structure sinks and approaches the first jig platform with the first sheet structure. At this time, the first sheet structure and the second sheet structure are melted in the interval. The height of the ring solder material is determined by the height of the positioning post.

The method for manufacturing a thin vacuum insulation sheet further includes a step of cooling the first jig platform and the second jig platform to solidify the solder material. At this time, welding between the first sheet structure and the second sheet structure is performed. The separation height is determined by the height of the positioning post.

Furthermore, in the step of laying the solder material in a ring shape on the first surface of the first sheet structure, placing a solder wire on the first surface in a ring shape, extruding a solder paste on the first surface in a ring shape, or A circular solder paste is printed on the first surface.

In summary, the thin vacuum insulation sheet of the present invention can effectively reduce thermal resistance and isolate heat conduction and heat convection between two sides of the insulation sheet. At the same time, due to the thin sheet structure and the hollow characteristics, it has the advantage of extremely light weight, which is suitable for light and thin electronic products and various thin insulation requirements. In addition, since a sheet-like vacuum structure is not easy to manufacture, conventional techniques cannot produce a vacuum insulation sheet having a thickness of less than 1 mm. The present invention also provides a method for manufacturing a thin vacuum insulation sheet. In this manufacturing method, a jig platform with an adsorption capacity is used to stabilize the thin two-piece structure, which is beneficial to the placement of solder material and the welding of the two-piece structure. When the sheet structure and the solder material are heated in a vacuum environment, the solder material is melted and the sheet structure is hermetically welded to form a vacuum gap space naturally. As a result, an ultra-thin vacuum insulation sheet having a thickness of less than 1 mm can be manufactured, and is suitable for being applied to light and thin electronic devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic diagram showing a thin vacuum insulation sheet according to the present invention.

FIG. 1B is a schematic cross-sectional view of the thin vacuum insulation sheet corresponding to FIG. 1A.

FIG. 1C is a cross-sectional view of the thin vacuum insulation sheet corresponding to FIG. 1B along the line C-C.

FIG. 1D is a cross-sectional view of the thin vacuum insulation sheet corresponding to FIG. 1B along D-D.

FIG. 2A is a cross-sectional view illustrating a thin vacuum insulation sheet in another embodiment of the present invention.

FIG. 2B is a cross-sectional view of the thin vacuum insulation sheet corresponding to FIG. 2A.

FIG. 3A to FIG. 3F are top views illustrating thin vacuum insulation sheets according to various embodiments of the present invention.

FIG. 4A is a top view illustrating a first sheet structure in another embodiment of the present invention.

FIG. 4B is a cross-sectional view of the first sheet structure corresponding to FIG. 4A.

FIG. 4C is a cross-sectional view illustrating a thin vacuum insulation sheet formed by using the first sheet structure of FIG. 4A.

FIG. 5 is a flowchart showing steps of a method for manufacturing a thin vacuum insulation sheet according to the present invention.

FIG. 6A is a plan view illustrating a first jig platform and a second jig platform of the present invention.

FIG. 6B is a schematic cross-sectional view of the first jig platform of FIG. 6A.

FIG. 6C is a schematic cross-sectional view illustrating that the first jig platform of FIG. 6B adsorbs the first sheet structure.

FIG. 6D is a schematic diagram showing the superposition of the first jig platform and the second jig platform.

FIG. 6E is a schematic diagram of placing the first jig platform and the second jig platform in the cavity.

FIG. 7 is a schematic diagram showing a superposition of a first jig platform and a second jig platform in another embodiment.

FIG. 8A is a schematic diagram showing a superposition of a first jig platform and a second jig platform in another embodiment.

FIG. 8B is a schematic diagram illustrating the first jig platform and the second jig platform superposed and heated in FIG. 8A.

detailed description

In order to make the advantages, spirits and features of the present invention easier and clearer, it will be detailed and discussed in the following with reference to the embodiments and the accompanying drawings. It is worth noting that these embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. illustrated therein are not intended to limit the present invention or corresponding embodiments.

In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "vertical, horizontal, top, bottom, front, back, left, right, top, bottom, inside, outside" and the like is based on the drawings. The orientations or positional relationships shown are merely for the convenience of describing the present invention and simplifying the description, and do not indicate that the device or element must have a specific orientation, structure and operation in a specific orientation, so it cannot be understood as a limitation on the present invention.

In addition, the indefinite articles "a", "an", and "an" before the device or element of the present invention do not limit the number of devices or elements (ie, the number of occurrences). Thus, "a" should be read as including one or at least one, and a device or element in the singular also includes the plural unless the number clearly refers to the singular.

Please refer to FIGS. 1A to 1D. FIG. 1A is a schematic view showing a thin vacuum insulation sheet according to the present invention. FIG. 1B is a schematic cross-sectional view of the thin vacuum insulation sheet corresponding to FIG. 1A. FIG. 1C is a cross-sectional view of the thin vacuum insulation sheet corresponding to FIG. 1B along C-C. FIG. 1D is a cross-sectional view of the thin vacuum insulation sheet corresponding to FIG. 1B along D-D. The present invention provides a thin vacuum insulation sheet 1 including a first sheet-like structure 11, a second sheet-like structure 12 and a solder material 10. The first sheet structure 11 has a first surface 110 having solderability. The second sheet structure 12 has a second surface 120 having solderability. The solder material 10 is circularly welded to the first surface 110 and the second surface 120. The first sheet-like structure 11 and the second sheet-like structure 12 are hermetically joined by the solder material 10 to form a gap space 15. The air pressure in the gap space 15 is a negative pressure state less than one atmosphere. It should be noted that there is no absolute vertical relationship between the first sheet-like structure 11 and the second sheet-like structure after forming.

In the conventional technology, a material with a lower thermal conductivity is generally used as the material of the heat insulation layer, thereby achieving the effect of heat insulation. However, under the application requirements of thickness less than 1mm, the effect of the thermal insulation material is not ideal. The material of the heat-insulating layer in the conventional technology is difficult to meet the requirements of thin and light electronic products. The thermal conductivity of solder material 10 is about 60W / mk. Depending on the alloy mixing ratio, a material with a lower thermal conductivity can be formed, which is much lower than other types of metals, such as copper (401W / mk), aluminum (237W / nk), etc. Commonly used thermal metal materials. In the present invention, the first sheet structure 11 and the second sheet structure 12 are joined by only a small area of the solder material 10 to reduce heat conduction, and the temperature between the first sheet structure 11 and the second sheet structure 12 is reduced. The vacuum also reduces thermal convection. Therefore, the hollow and vacuum thin vacuum insulation sheet 1 can effectively reduce the thermal energy from the first sheet structure 11 to the second sheet structure 12. At the same time, due to the thin sheet-like structure and hollow characteristics, the present invention has the advantage of extremely light weight, and is suitable for light and thin electronic products and various thin heat insulation requirements.

The first sheet structure 11 and the second sheet structure 12 are made of metal. Further, the material of the first sheet structure 11 and the second sheet structure 12 is copper. At this time, the heat conduction efficiency in the first sheet structure 11 is excellent, and the heat conduction efficiency in the second sheet structure 12 is also excellent. As a result, thermal energy is preferentially conducted along the first end of the X or Y axis of the first sheet structure 11 or the second sheet structure 12 to the X or Y axis of the first sheet structure 11 or the second sheet structure 12. The two ends can be used to contact the heat source at the first end and the heat dissipation area can be designed at the second end. The hollow vacuum zone formed between the Z-axis of the first sheet-like structure 11 and the second sheet-like structure 12 has extremely high thermal resistance and effectively blocks heat conduction.

Please refer to FIGS. 3A to 3F. FIG. 3A to FIG. 3F are top views of thin vacuum insulation sheets according to various embodiments of the present invention. In different embodiments, the shape of the thin vacuum insulation sheet 1 may be designed as the images shown in FIGS. 3A to 3F. However, since the present invention is formed by butting two sheet-like structures corresponding to each other, the shape can be changed very elastically, so it is not limited to the shapes shown in FIGS. 3A to 3F. Different types of thin vacuum insulation sheets 1 can be designed in different electronic devices.

Please refer to FIGS. 1A to 1D again. Due to the thinner and thinner body of current smart phones, some models are even less than 5mm thick. Excluding the display panel, battery, circuit board, case, etc., the thickness of the space left for the heat dissipation element has been less than 1mm. Since the heating element of the CPU of the mobile phone is almost close to the back cover of the case, the temperature of the back cover increases as the temperature of the CPU rises. The user feels discomfort while holding the back cover of the mobile phone. Once the back cover temperature exceeds a certain value, the CPU is forced to reduce the frequency to achieve the purpose of cooling down, and therefore sacrifices the functions that the mobile phone should have. In order to solve this problem, in addition to using a heat pipe or a temperature equalizing plate to dissipate heat in the design of the mobile phone, the application of a vacuum insulation sheet can solve the problem of overheating of the mobile phone back cover at a hot spot. However, the vacuum insulation sheet must be very thin to meet the design requirements of smart phones. In one embodiment of the present invention, the thickness H of the thin vacuum insulation sheet 1 is less than 1 mm, the thicknesses of the first sheet structure 11 and the second sheet structure 12 are less than 0.3 mm, and the height h of the gap space 15 is less than 0.5. mm. In another preferred embodiment, based on the structure and manufacturing method of the thin vacuum insulation sheet of the present invention, the thickness H of the thin vacuum insulation sheet 1 may be less than 0.1 mm, and the first sheet structure 11 and the second sheet shape The thickness of the structure 12 may be less than 0.03 mm, and the height h of the clearance space 15 may be less than 0.05 mm.

Please refer to FIG. 2A and FIG. 2B. FIG. 2A is a cross-sectional view of a thin vacuum insulation sheet according to another embodiment of the present invention, and the viewing angle is the same as that of FIG. 1C. FIG. 2B is a cross-sectional view of the thin vacuum insulation sheet corresponding to FIG. 2A, and the viewing angle is the same as that of FIG. 1D. Since the first sheet-like structure 11 and the second sheet-like structure 12 are very thin and easy to be sunken by external forces, the thin vacuum insulation sheet 1 further includes a support post 14 formed in the gap space 15, and both ends of the support post 14 The first sheet structure 11 and the second sheet structure 12 are connected respectively. At least one end of the support post 14 is fixed to the first sheet structure 11 or the second sheet structure 12. The support post 14 can be fixed to the first sheet-like structure 11 or the second sheet-like structure 12 by means of soldering or integral molding. When one end of the support post 14 is fixed to the first sheet-like structure 11, the other end may be fixed, contacted or attached to the second sheet-like structure 12, and vice versa. The material of the support pillar 14 may be a material with a low thermal conductivity, which has a thermal conductivity lower than that of the first sheet structure 11 and the second sheet structure 12, so as to reduce thermal energy in the first sheet structure 11 and the second sheet. Conduction between the structures 12. In a preferred embodiment, the material of the support post 14 is the same as that of the solder material 10. In addition, the support pillars 14 may be elongated to form a wall shape according to requirements, or a plurality of support pillars 14 may be provided in the gap space 15 to increase the structural strength of the entire thin vacuum insulation sheet.

With the design of the support post 14, the first sheet-like structure 11 and the second sheet-like structure 12 are not easily depressed, and the thin vacuum insulation sheet 1 can maintain the shape; further, the thin vacuum insulation sheet 1 is prevented from losing vacuum due to deformation. Layer effect.

Please refer to FIGS. 4A to 4C. FIG. 4A is a top view of a first sheet structure in another embodiment of the present invention. FIG. 4B is a cross-sectional view of the first sheet structure corresponding to FIG. 4A. FIG. 4C is a cross-sectional view of a thin vacuum insulation sheet formed by using the first sheet structure of FIG. 4A. In the step of manufacturing the thin vacuum insulation sheet 1, the solder material 10 is first placed on the first surface 110 of the first sheet-like structure 11. In general, it is difficult to accurately lay the solder material 10 evenly on the annular region of the first surface 110 in a molten state. In the present invention, the first surface 110 of the first sheet structure 11 has a ring-shaped solder mask 113 (Solder Mask), and solder material is placed on the ring-shaped region 116 on the edge of the ring-shaped solder mask 113. The solder resist layer 113 blocks the solder material 10 on the annular region 116 so that the solder material 10 is not easily displaced during a heating reflow process (Reflow). Then, the second sheet structure 12 is attached to the solder material 10, and the first sheet structure 11, the second sheet structure 12 and the solder material 10 are heated together. The ring-shaped area 116 on the edge of the solder layer 113 is re-soldered. The cooled solder material 10 is naturally laid accurately and welded on a predetermined annular area 116 without overflowing into the annular solder resist layer 113.

Please refer to FIG. 1C, FIG. 1D, FIG. 5 and FIGS. 6A to 6E. FIG. 5 is a flowchart showing steps of a method for manufacturing a thin vacuum insulation sheet according to the present invention. FIG. 6A is a top view of the first jig platform and the second jig platform of the present invention. FIG. 6B is a schematic cross-sectional view of the first jig platform of FIG. 6A. 6C is a schematic cross-sectional view illustrating that the first jig platform of FIG. 6B adsorbs the first sheet structure. FIG. 6D is a schematic diagram showing the superposition of the first jig platform and the second jig platform. FIG. 6E is a schematic diagram of placing the first jig platform and the second jig platform in the cavity. The present invention provides a method for manufacturing a thin vacuum insulation sheet 1 including the following steps.

A first jig platform 3 having a first groove 31 and a second jig platform 4 having a second groove 42 are provided, as shown in FIGS. 6A and 6B. In FIG. 6B, the first jig platform 3 has an air extraction channel 35 and a plurality of communication pipes 36. The suction channel 35 communicates with the outside world to draw the suction channel 35 to a negative pressure, and the communication pipe 36 communicates with the suction channel 35 and the bottom of the first groove 31. The shapes of the first groove 31 and the first sheet-like structure 11 are substantially the same in principle, but the ratio of the depth of the first groove 31 to the thickness of the first sheet-like structure 11 is different according to different embodiments. Then, a first sheet-like structure 11 is adsorbed in the first groove 31, and a second sheet-like structure 12 is adsorbed in the second groove 42. When the first sheet-like structure 11 is placed in the first groove 31 in an anastomotic manner, as shown in FIG. 6C, and the suction channel 35 is in a negative pressure state, the first sheet-like structure 11 is attracted to the first by the communication pipe 36. In the groove 31. Thereby, the first sheet-like structure 11 which is very thin and easy to be naturally bent will be flatly adsorbed on the first groove 31, which is beneficial to the subsequent manufacturing process. The structure and function of the second jig platform 4 are similar to those of the first jig platform 3, and are not repeated here.

In FIG. 6C, the solder material 10 is laid annularly on the first surface 110 of the first sheet-like structure 11. Referring to the ring-shaped solder material 10 in FIG. 1C at the same time, the laying method in this step can be understood. Next, the second jig platform 4 is superimposed on the first jig platform 3, as shown in FIG. 6D, the positions of the second sheet structure 12 are spaced at a height corresponding to the position of the first sheet structure 11. After FIG. 6D, the drawing of the suction channel 35 and the communication pipe 36 is omitted. There is a solder material 10 between the first sheet structure 11 and the second sheet structure 12. In one embodiment, the height between the first sheet structure 11 and the second sheet structure 12 is the solder material 10. the height of. Then, the stacked second jig platform 4 and the first jig platform 3 are placed in a cavity 5, as shown in FIG. 6E. The cavity 5 is evacuated, and the interior of the cavity 5 is heated. In the vacuum state, the solder material 10 is melted and the first sheet structure 11 and the second sheet structure 12 are hermetically welded, so that the first sheet structure 11, A vacuum space 15 is formed between the second sheet structure 12 and the annular solder material 10. Finally, the first jig platform 3 and the second jig platform 4 are taken out of the cavity 5, and then the first sheet structure 11, the second sheet structure 12 and the solder material 10 are removed from the first jig platform 3 and After the second jig platform 4 is taken out, a thin vacuum insulation sheet 1 as shown in FIG. 1D can be formed, which solves the problem that the conventional thin insulation sheet cannot be evacuated.

In addition, in the step of laying the solder material 10 on the first surface 110 of the first sheet structure 11 in a ring shape, placing a solder wire on the first surface 110 in a ring shape and extruding a solder paste on the first surface in a ring shape. The surface 110 or a circular solder paste is printed on the first surface 110.

Please refer to FIG. 5 and FIG. 7. FIG. 7 is a schematic diagram showing the superposition of the first jig platform 3 and the second jig platform 4 in another embodiment. When the combined thickness of the first sheet structure 11 and the second sheet structure 12 is close to the combined depth of the first groove 31 and the second groove 42, the second jig platform 4 and the first jig platform 3 are heated. The squeezed molten solder material 10 will be flattened and affect the formation of the gap space. Therefore, in a specific embodiment, in the step of providing the first jig platform 3 having the first groove 31 and the second jig platform 4 having the second groove 42, the second jig platform 4 further has A positioning column 48; in the step of overlapping the second jig platform 4 and the first jig platform 3, the height of the interval is determined by the height of the positioning column 48; the higher the positioning column height, the first sheet structure 11 and The higher the interval between the second sheet structures 12. With the positioning column 48, the first jig platform 3 and the second jig platform 4 are spaced a certain height, so that the molten solder material 10 is shaped at this height, so that the cooling material 10 forms the height of the gap space 15 after cooling. .

Please refer to FIG. 5, FIG. 8A and FIG. 8B. FIG. 8A is a schematic diagram showing a superposition of a first jig platform and a second jig platform in another embodiment. FIG. 8B is a schematic diagram of the first jig platform and the second jig platform superposed and heated in FIG. 8A. Because the solder material 10 usually contains components such as organic solvents, fluxes, or surfactants; these components will volatilize when heated, reducing the volume of the solder material 10, and further reducing the height of the gap space 15. In order to make the height of the clearance space meet the expectations, in another embodiment, the steps of providing the first jig platform 3 with the first groove 31 and the second jig platform 4 with the second groove 42 are provided. The method further includes providing a first jig platform 3 having a first groove 31 and a plurality of third grooves 33, and a second jig platform 4 having a second groove 42 and a positioning post 48.

Next, the method for manufacturing a thin vacuum insulation sheet further includes a step: placing at least three solder balls 6 in the third groove 33, and the material and melting point of the solder balls 6 are substantially the same as those of the solder material 10. The protruding height of the solder ball 6 is higher than the positioning post 48, as shown in FIG. 8A. At this time, in the step of overlapping the second jig platform 4 and the first jig platform 3, the height at which the first sheet-like structure 11 and the second sheet-like structure 12 are spaced apart is determined by the height of the solder ball 6. The higher the height of the solder ball 6, the higher the height of the distance between the first sheet structure 11 and the second sheet structure 12 is.

Then, in the step of heating the cavity and evacuating, the solder material 10 and the solder ball 6 are melted and collapsed. Due to the action of gravity, the second jig platform 4 and the second sheet structure 12 are close to the first jig. The height between the platform 3 and the first sheet structure 11 and the distance between the first sheet structure 11 and the second sheet structure 12 gradually decreases until the second jig platform 4 and the first jig platform 3 stop due to the positioning column. near. At this time, the welding height of the ring-shaped solder material 10 in the molten state is equal to the height of the positioning column, and the first sheet structure 11 and the second sheet structure 12 and the solder material 10 are re-soldered and soldered to each other. The method for manufacturing a thin vacuum insulation sheet further includes a step: cooling the first jig platform 3 and the second jig platform 4 in a vacuum state to solidify the solder material 10, and forming a weld after cooling, and a vacuum gap space 15 Also formed at the same time, at this time, the welding height of the ring-shaped solder material 10 in the molten state in the interval between the first sheet structure 11 and the second sheet structure 12 is determined by the height of the positioning post. Thereby, the height of the vacuum gap space 15 of the thin vacuum insulation sheet can be accurately controlled to a desired height.

In another embodiment, the positioning post 48 that determines the final welding height of the circular solder material 10 may be disposed on the first jig platform 3. In still another embodiment, the final soldering height of the circular solder material 10 is determined by placing at least three solder balls 6 having a higher melting point than the solder material 10. The protruding height of the solder ball 6 with a higher melting point is the height of the cavity 5 supporting the second jig platform 4 after being evacuated and heated, and also the height of the hollow gap space 15 of the thin vacuum insulation sheet 1.

In summary, the thin vacuum heat insulation sheet of the present invention can effectively isolate heat conduction and heat convection between two sides of the heat insulation sheet. At the same time, due to the thin sheet structure and the hollow characteristics, it has the advantage of extremely light weight, which is suitable for light and thin electronic products and various thin insulation requirements. In addition, since the ultra-thin sheet-like vacuum structure is not easy to manufacture and the height of the gap space of the vacuum is difficult to be accurately controlled, the present invention also provides a method for manufacturing a thin vacuum insulation sheet. In this manufacturing method, a jig platform with an adsorption capacity is used to stabilize the sheet structure. When the sheet structure and the solder material are heated in a vacuum environment, the solder material is melted and the sheet structure is hermetically welded to form a vacuum gap space naturally. Thereby, a thin vacuum insulation sheet can be manufactured, and is suitable for being applied to a thin electronic device.

With the above detailed description of the preferred embodiments, it is hoped that the features and spirit of the present invention may be more clearly described, rather than limiting the scope of the present invention with the preferred embodiments disclosed above. On the contrary, the intention is to cover various changes and equivalent arrangements within the scope of the patent scope of the present invention. Therefore, the scope of the patent scope of the present invention should be explained in the broadest sense according to the above description, so that it covers all possible changes and equal arrangements.

Claims

A thin vacuum insulation sheet, comprising:

A first sheet-like structure having a first surface with solderability;

A second sheet structure having a second surface with solderability; and

A solder material is circularly welded to the first surface and the second surface, and the first sheet structure and the second sheet structure are hermetically joined to form a gap space by the solder material;

The air pressure in the gap space is a negative pressure state less than one atmosphere.
The thin vacuum insulation sheet according to claim 1, wherein the first sheet-like structure and the second sheet-like structure are made of metal material, and further, the first sheet-like structure and the second sheet-like structure The material of the structure is copper.
The thin vacuum insulation sheet according to claim 1, wherein the thickness of the thin vacuum insulation sheet is less than 1 mm, and the height of the gap space is less than 0.5 mm.
The thin vacuum insulation sheet according to claim 1, wherein the first surface of the first sheet structure has a solder resist layer, and the solder material is welded to the edge of the solder resist layer on the first surface. .
The thin vacuum insulation sheet according to claim 1, further comprising a support post formed in the gap space, and two ends of the support post are respectively connected to the first sheet-like structure and the second sheet-like structure. structure.
A method for manufacturing a thin vacuum insulation sheet according to claim 1, comprising the following steps:

Providing a first jig platform with a first groove and a second jig platform with a second groove;

Attracting a first sheet-like structure in the first groove, and adsorbing a second sheet-like structure in the second groove;

Laying a solder material annularly on a first surface of the first sheet structure;

The second jig platform and the first jig platform are overlapped, so that the position of the first sheet structure is spaced at a height corresponding to the position of the second sheet structure, and the first sheet structure and the second There is a ring of the solder material between the sheet structures;

Placing the overlapped second jig platform and the first jig platform in a cavity; and

Evacuate and heat the inside of the cavity, melt the solder material in a vacuum state and hermetically weld the first sheet structure and the second sheet structure, so that the first sheet structure and the second sheet structure A vacuum and a gap space are formed between the structure and the annular solder material.
The method of manufacturing a thin vacuum insulation sheet according to claim 6, wherein the steps of providing the first jig platform with the first groove and the second jig platform with the second groove are provided. In the step, the second jig platform further has a positioning column; in the step of overlapping the second jig platform and the first jig platform, the height of the interval is determined by the height of the positioning column.
The method of manufacturing a thin vacuum insulation sheet according to claim 6, wherein the steps of providing the first jig platform with the first groove and the second jig platform with the second groove are provided. Further, it is further to provide the first jig platform having the first groove and a plurality of third grooves, and the second jig platform having the second groove and a positioning post; making a thin vacuum spacer The method of hot film further includes a step:

Placing at least three solder balls in the third groove, the material and melting point of the solder balls are the same as the solder material, and the height of the solder balls protruding is higher than the positioning post;

In the step of superimposing the second jig platform and the first jig platform, the height between the first sheet structure and the second sheet structure is determined by the height supported by the solder ball; and In the step of heating the cavity and evacuating, the solder material and the solder ball are melted. Due to gravity, the second jig platform and the second sheet structure are close to the first jig platform and the first The sheet-like structure, at this time, the welding height of the ring-shaped solder material in the molten state in the interval between the first sheet-like structure and the second sheet-like structure is determined by the height of the positioning post.
The method for manufacturing a thin vacuum insulation sheet according to claim 8, further comprising a step:

The first jig platform and the second jig platform in the cavity are cooled in a vacuum state to solidify the solder material. At this time, the height of the space between the first sheet structure and the second sheet structure after welding is determined. Depends on the height of the positioning column.
The method of claim 6, wherein in the step of laying the solder material in a ring shape on the first surface of the first sheet structure, a solder wire is placed in a ring shape. A solder paste is circularly extruded on the first surface on the first surface, or the circular solder paste is printed on the first surface.