CN211425160U

CN211425160U - Temperature equalizing plate

Info

Publication number: CN211425160U
Application number: CN201922080903.6U
Authority: CN
Inventors: 张天曜; 郭哲玮
Original assignee: Auras Electronic Science And Technology Industrial Kunshan Co ltd
Current assignee: Auras Electronic Science And Technology Industrial Kunshan Co ltd
Priority date: 2019-01-25
Filing date: 2019-11-27
Publication date: 2020-09-04
Anticipated expiration: 2029-11-27
Also published as: CN111486727A; TWI763967B; TW202028673A

Abstract

The utility model provides a temperature-uniforming plate, which comprises an upper plate, a lower plate, a through hole, a liquid injection pipe, a first welding flux and a second welding flux. The upper plate has a first joint surface, and the lower plate has a second joint surface. The through hole is formed by jointly defining a partial structure of the upper plate and a partial structure of the lower plate, and is formed by clamping a first channel formed on the upper plate and a second channel formed on the lower plate, or formed by clamping the lower plate and the first channel formed on the upper plate. The liquid injection pipe is arranged in the through hole. The first welding flux is formed between the first joint surface and the second joint surface, and the second welding flux is formed between the through hole and the liquid injection pipe. The utility model discloses the temperature equalization board easily banding and maintain inside gas tightness stable in structure simultaneously.

Description

Temperature equalizing plate

Technical Field

The utility model relates to a heat abstractor especially relates to a temperature-uniforming plate.

Background

The heat dissipation device of the temperature equalization plate has a large bonding range between the upper plate and the lower plate, and needs a liquid injection pipe for injecting water and vacuuming during the manufacturing process, so how to successfully seal the edge to maintain the air tightness inside the temperature equalization plate, and meanwhile, the temperature equalization plate maintains the structural stability, which has been regarded as an important issue in the industry.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to the above-mentioned not enough that prior art exists, provide an easy banding and keep inside gas tightness while stable in structure's samming board.

The technical scheme that its technical problem was adopted is solved in the utility model and a temperature-uniforming plate is provided, including an upper plate, a hypoplastron, a through hole, one annotate liquid pipe, a first solder and a second solder. The upper plate has a first joint surface, and the lower plate has a second joint surface. The through hole is formed by jointly defining a partial structure of the upper plate and a partial structure of the lower plate, and is formed by clamping a first channel formed on the upper plate and a second channel formed on the lower plate, or formed by clamping the lower plate and the first channel formed on the upper plate. The liquid injection pipe is arranged in the through hole. The first welding flux is formed between the first joint surface and the second joint surface, and the second welding flux is formed between the through hole and the liquid injection pipe.

Preferably, the first solder and the second solder are structurally connected to each other.

Preferably, the first solder and the second solder form a complete and non-broken circuit in structure.

Preferably, the first solder and the second solder have the same composition.

Preferably, the first solder has the same metal composition as that contained in the upper plate or the lower plate.

Preferably, the second solder has the same metal composition as that contained in the upper plate, the lower plate or the liquid pouring spout.

Preferably, the heat transfer coefficient of the upper plate is lower than that of the lower plate.

Preferably, the tube body of the partial liquid injection tube is positioned in the through hole, and the tube body of the liquid injection tube positioned in the through hole is pressed and closed.

The utility model also provides a temperature-uniforming plate, which comprises an upper plate, a lower plate, a through hole, a liquid injection pipe and a welding flux. The upper plate has a first joint surface, and the lower plate has a second joint surface. The through hole is formed by jointly defining a partial structure of the upper plate and a partial structure of the lower plate, and is formed by clamping a first channel formed on the upper plate and a second channel formed on the lower plate, or formed by clamping the lower plate and the first channel formed on the upper plate. The liquid injection pipe is arranged in the through hole. The solder is formed between the first joint surface and the second joint surface and between the through hole and the liquid injection pipe.

Preferably, the upper plate has a first space, the lower plate has a second space, the first space and the second space define an action space together, and the action space is provided with a capillary structure therein.

Preferably, the upper plate has a space, the lower plate and the space together define an action space, and the action space is provided with a capillary structure.

Preferably, the lower plate has a space, the upper plate and the space together define an action space, and the action space is provided with a capillary structure.

Preferably, the solder formed between the first joint surface and the second joint surface and the solder formed between the through hole and the liquid filling pipe are structurally connected with each other.

Preferably, the solder forms a complete and non-broken loop in structure between the first joint surface and the second joint surface and between the through hole and the liquid injection pipe.

Preferably, the metal composition contained in the solder is the same as the metal composition contained in the upper plate, the lower plate or the liquid pouring spout.

Preferably, the action space of the temperature equalization plate is communicated with the outside through the liquid injection pipe.

Preferably, the tube body of the partial liquid injection tube is positioned in the through hole, and the tube body of the liquid injection tube positioned in the through hole is pressed and sealed, so that the action space is isolated from the outside.

Preferably, the tube body of the partial liquid injection tube is positioned in the through hole, the tube body of the liquid injection tube positioned in the through hole is pressed and closed, and the tube body of the partial liquid injection tube is positioned outside the through hole.

The utility model also provides a temperature-uniforming plate, including an upper plate, a hypoplastron, a through-hole, one annotate liquid pipe and a first solder. The through hole is formed by jointly defining a partial structure of the upper plate and a partial structure of the lower plate, and is formed by clamping a first channel formed on the upper plate and a second channel formed on the lower plate, or formed by clamping the lower plate and the first channel formed on the upper plate. The liquid injection pipe is arranged in the through hole. The first solder is formed between the through hole and the liquid injection pipe, and the solder is heated and then diffused to a gap between the through hole and the liquid injection pipe.

Preferably, the upper plate has a first joint surface, the lower plate has a second joint surface, and the temperature-uniforming plate further includes a second solder formed between the first joint surface and the second joint surface.

Preferably, the first solder has the same metal composition as that contained in the upper plate, the lower plate or the liquid pouring spout.

Preferably, the second solder has the same metal composition as that contained in the upper plate or the lower plate.

Preferably, the first solder is heated and then diffused to the gap between the through hole and the liquid filling pipe, and overflows to the liquid filling pipe body outside the through hole, and the amount of the first solder between the through hole and the liquid filling pipe is larger than that of the first solder overflowing to the liquid filling pipe body outside the through hole.

The utility model discloses a temperature-uniforming plate is through the hole and annotate between the liquid pipe and/or form the solder between first composition surface and the second composition surface for thereby the easy banding of temperature-uniforming plate maintains inside gas tightness, and ensures temperature-uniforming plate stable in structure.

Drawings

Fig. 1A to fig. 1B are schematic structural views of a semi-finished product of a temperature equalizing plate before being pressed according to a first embodiment of the present invention.

Fig. 1C is a schematic structural view of the vapor chamber according to the first embodiment of the present invention, after the liquid injection and vacuum-pumping steps are completed, a pressing step is performed to seal the liquid injection tube.

Fig. 1D is a schematic diagram of the relative distribution of the solder and the solder ring in the vapor chamber after the vapor chamber provided by the first embodiment of the present invention is filled with liquid and vacuumized, and then pressed to seal the liquid filling tube.

Fig. 2A to fig. 2C are schematic structural views of a semi-finished product of a temperature equalizing plate before being pressed according to a second embodiment of the present invention.

Fig. 2D is a schematic view of the three-dimensional structure of the temperature-uniforming plate after the liquid-injecting and vacuum-pumping steps are completed and the liquid-injecting pipe is sealed by performing a pressing step according to the second embodiment of the present invention.

FIG. 2E is a schematic cross-sectional view of the vapor chamber at the bonding location along line 2E-2E in FIG. 2D.

Fig. 2F is a schematic view of the solder distribution within the thermal equalization plate of fig. 2D.

Fig. 3A to 3C are schematic structural views of a semi-finished product of a temperature equalizing plate before being pressed according to a third embodiment of the present invention.

Fig. 3D is a schematic view of the three-dimensional structure of the vapor chamber after the liquid injection and vacuum-pumping steps are completed and the liquid injection tube is sealed by a pressing step according to the third embodiment of the present invention.

FIG. 3E is a schematic cross-sectional view of the vapor chamber at the bonding location along line 3E-3E in FIG. 3D.

Fig. 3F is a schematic view of the solder distribution within the vapor chamber of fig. 3D.

Fig. 4A to 4C are schematic structural views of a semi-finished product of a temperature equalizing plate before being pressed according to a fourth embodiment of the present invention.

Fig. 4D is a schematic view of the three-dimensional structure of the temperature-uniforming plate after the liquid injection and vacuum-pumping steps are completed and the liquid injection pipe is sealed by performing a pressing step according to the fourth embodiment of the present invention.

FIG. 4E is a cross-sectional view of the vapor chamber at the bonding location along line 4E-4E in FIG. 4D.

Fig. 4F is a schematic view of the solder distribution within the thermal equalization plate of fig. 4D.

Detailed Description

Please refer to fig. 1A to fig. 1B, which are schematic structural diagrams of the vapor chamber according to the first embodiment of the present invention when the vapor chamber is still a semi-finished product before being pressed. The temperature equalizing plate comprises an upper plate 11, a lower plate 12, a solder 13, a liquid injection pipe 16 and a welding ring 17. The upper plate 11 has a first channel 111, a first joint surface 112 and a first space 113, and the lower plate 12 has a second channel 121, a second joint surface 122 and a second space 123, wherein the first channel 111 and the second channel 121 together form a through hole 14, and the first space 113 and the second space 123 together form an acting space 15. The solder 13 is provided on the first bonding surface 112 of the upper plate 11 and the second bonding surface 122 of the lower plate 12. The liquid filling pipe 16 has an inner opening 161 and an outer opening 162, and is inserted into the through hole 14 after the upper plate 11 and the lower plate 12 are fixed, at this time, the outer edge of the liquid filling pipe 16 is respectively attached to the first channel 111 and the second channel 121 from top to bottom, the inner opening 161 is connected to the operation space 15, and the outer opening 162 is connected to the outside. In addition, the welding ring 17 is sleeved on the outer edge of the liquid injection pipe 16, and the joint of the liquid injection pipe 16 and the through hole 14 can be closed after being heated by high frequency. The design of the first embodiment for sealing the joint between the pouring spout 16 and the through hole 14 by means of the welding ring 17 has a structural feature that the welding ring 17 after being heated is mostly concentrated on the spout body of the pouring spout 16 located outside the through hole 14, so that it must be precisely controlled to smoothly penetrate into the gap between the through hole 14 and the pouring spout 16, otherwise the welding ring 17 and the solder 13 are not structurally connected.

Please refer to fig. 1C to 1D, which are schematic diagrams of a structure of the uniform temperature plate according to the first embodiment of the present invention, which is obtained by performing a pressing step to seal the liquid injection pipe after the liquid injection and the vacuum pumping step are completed, and schematic diagrams of relative distribution of the solder and the solder rings in the uniform temperature plate. Because the welding ring 17 sleeved on the tube body of the liquid injection tube 16 can directly bear the pressing of external force, the situation of cracking or deformation after pressing is not eliminated, and once the welding ring 17 and the liquid injection tube 16 cannot be tightly attached to form a gap, and the welding ring 17 and the welding flux 13 cannot be connected together structurally, the sealing degree of the uniform temperature plate 1 is influenced. Therefore, the present invention tries to provide other feasible processes and structures of the vapor chamber.

According to the utility model discloses a second embodiment provides a samming board semi-manufactured goods and a samming board. Please refer to fig. 2A to 2C, which are schematic structural diagrams of the vapor chamber before lamination when the vapor chamber is still a semi-finished product, wherein fig. 2C is a schematic cross-sectional view along the line 2C-2C in fig. 2B.

The semi-finished product of the temperature equalization plate comprises an upper plate 21, a lower plate 22, a first welding flux 23A, a second welding flux 23B and a liquid injection pipe 26. The upper plate 21 has a first slot channel 211, a first joint surface 212 and a first space 213, and the lower plate 22 has a second slot channel 221, a second joint surface 222 and a second space 223, wherein the first slot channel 211 and the second slot channel 221 together form a through hole 24, the first space 213 and the second space 223 together form an active space 25, and a capillary structure (not shown) may be disposed in the first space 213, the second space 223 or the active space 25. The liquid injection tube 26 has an inner opening 261 and an outer opening 262, and the tube body can be fixed with the first slot channel 211 of the upper plate 21 and then fixed with the second slot channel 221 of the lower plate 22, or vice versa, the tube body of the liquid injection tube 26 can be fixed with the second slot channel 221 of the lower plate 22 and then fixed with the first slot channel 211 of the upper plate 21, and finally the tube body can be vertically attached by the first slot channel 211 and the second slot channel 221, and part of the tube body is placed in the through hole 24, and the other part of the tube body is exposed out of the through hole 24. At this time, the inner opening 261 of the pouring spout 26 communicates with the working space 25, and the outer opening 262 communicates with the outside. The material of the upper plate 21 and the lower plate 22 may be a metal plate, and the liquid injection pipe 26 may be a metal pipe, but the material of the upper plate 21 and the material of the lower plate 22 are not limited to be the same, for example, the heat transfer coefficient of the upper plate 21 may be lower than that of the lower plate 22, so as to avoid the temperature of the condensation surface from being too high, and at this time, the material of the upper plate 21 and the material of the lower plate 22 may be different.

It should be noted that the embodiment provides the first solder 23A and arranges it between the first joint surface 212 of the upper plate 21 and the second joint surface 222 of the lower plate 22, and also provides the second solder 23B and arranges it between the through hole 24 and the liquid injection pipe 26, for example, the second solder 23B is arranged between the first channel 211 of the upper plate 21 and the liquid injection pipe 26, or the second solder 23B is arranged between the second channel 221 of the lower plate 22 and the liquid injection pipe 26. The solder 23B formed between the first channel 211 and the pour spout 26 or between the second channel 221 and the pour spout 26 is protected by the upper and

lower plates

21 and 22, and will not be severely deformed or broken by direct pressure of external force when pressed together in the future.

In addition, the solder 23B and the solder 23A can be structurally connected to each other after being heated and diffused, and the two can form a complete and non-broken circuit together. The

solder

23A and 23B may be selected to have the same composition, and may be made of copper paste, stainless steel paste, aluminum alloy paste, titanium alloy paste, copper-silver paste, or other suitable solder paste, depending on the materials of the upper plate 21, the lower plate 22, and the liquid pouring tube 26. For example, the solder 23A may contain a metal composition that is the same as the metal composition contained in the upper plate 21 or the metal composition contained in the lower plate 22. The solder 23B may contain a metal composition that is the same as a metal composition contained in the upper plate 21, the lower plate 22, or the pour spout 26. Of course, if the materials of the upper plate 21, the lower plate 22 and the pouring spout 26 are different, the solder 23A that can be smoothly joined to both the materials of the upper plate 21 and the lower plate 22, the solder 23B that can be smoothly joined to both the materials of the upper plate 21 and the pouring spout 26, and the solder 23B that can be smoothly joined to both the materials of the lower plate 22 and the pouring spout 26 can be selected. In this case, it is possible to use different compositions for the

solders

23A and 23B, and still be embodied according to the present invention.

In addition, the cross-sections of the first channel 211 of the upper plate 21 and the second channel 221 of the lower plate 22 are approximately semicircular before being pressed, and the liquid injection pipe 26 is a circular pipe or other arc pipe body, so as to correspond to the outlines of the first channel 211 and the second channel 221 (or the outline of the through hole 24).

In addition, the solder 23B formed between the through hole 24 and the liquid filling pipe 26 will spread to the gap between the through hole 24 and the liquid filling pipe 26 after being heated, and the gap will be filled up as much as possible by capillary force, and the amount of the solder 23B can be controlled to make the solder 23B overflow slightly to the pipe body of the liquid filling pipe 26 located outside the through hole 24, and further to ensure that no gap will be generated after the two, at this time, the amount of the solder 23B located between the through hole 24 and the liquid filling pipe 26 will be controlled to be larger than the amount of the solder 23B overflowing to the pipe body of the liquid filling pipe 26 located outside the through hole 24, so as to avoid the problem that the solder 23B overflowing too much after the pressing procedure in the future will break.

Please refer to fig. 2D to fig. 2F, wherein fig. 2D is a schematic perspective view of the temperature-uniforming plate after the liquid injection and vacuum pumping steps are completed and a pressing step is performed to seal the liquid injection tube, fig. 2E is a schematic cross-sectional view of the temperature-uniforming plate at the pressing portion along the line 2E-2E in fig. 2D, and fig. 2F is a schematic view of solder distribution in the temperature-uniforming plate in fig. 2D. It can be seen from the above drawings that the liquid pouring spout 26 is sealed, the gaps between the upper plate 21, the lower plate 22 and the liquid pouring spout 26 are firmly filled with the diffused

solder

23A and 23B, the body of the liquid pouring spout 26 in the through hole 24 is pressed and sealed, so that the air tightness of the vapor chamber 2 is ensured, and the solder 23A between the first joint surface 212 of the upper plate 21 and the second joint surface 222 of the lower plate 22 and the solder 23B formed between the first groove channel 211 and the liquid pouring spout 26 or between the second groove channel 221 and the liquid pouring spout 26 are protected by the upper plate 21 and the lower plate 22, so that they are not damaged structurally when pressed.

In addition, structurally, the solder 23B and the solder 23A are closely pressed, so that the two can be connected to each other after being pressed, and the hermetic property of the sealed vapor chamber 2 can be maintained.

In addition, after the pressing step, the first groove channel 211 of the upper plate 21 and the second groove channel 221 of the lower plate 22 have a circular arc shape in cross section because the thickness has been reduced, and the liquid injection tube 26, which is originally a circular tube or a shape close to a circular tube, has a circular arc shape with a long axis and a short axis, which is similar to an ellipse, in cross section, so as to correspond to the shapes of the first groove channel 211 and the second groove channel 221 (or the shapes of the through holes 24).

According to the utility model discloses a third embodiment provides a samming board semi-manufactured goods and a samming board. Please refer to fig. 3A to 3C, which are schematic structural diagrams of the vapor chamber before lamination when the vapor chamber is still a semi-finished product, wherein fig. 3C is a schematic cross-sectional view along the line 3C-3C in fig. 3B.

The semi-finished product of the temperature equalization plate comprises an upper plate 31, a lower plate 32, a first welding flux 33A, a second welding flux 33B and a liquid injection pipe 36. The upper plate 31 has a first channel 311, a first joint surface 312 and a first space 313, and the lower plate 32 has a second channel 321, a second joint surface 322 and a second space 323, wherein the first channel 311 and the second channel 321 form a through hole 34, the first space 313 and the second space 323 form an active space 35, and the first space 313, the second space 323 or the active space 35 may have a capillary structure (not shown). The liquid injection tube 36 has an inner opening 361 and an outer opening 362, the tube body can be fixed with the first slot 311 of the upper plate 31 and then fixed with the second slot 321 of the lower plate 32, or vice versa, the tube body of the liquid injection tube 36 can be fixed with the second slot 321 of the lower plate 32 and then fixed with the first slot 311 of the upper plate 31, and finally the tube body can be vertically attached by the first slot 311 and the second slot 321, and part of the tube body is placed in the through hole 34, and the other part of the tube body is exposed out of the through hole 34. At this time, the inner opening 361 of the pouring spout 36 communicates with the working space 35, and the outer opening 362 communicates with the outside. The material of the upper plate 31 and the lower plate 32 may be a metal plate, and the liquid injection pipe 36 may be a metal pipe, but the material of the upper plate 31 and the material of the lower plate 32 are not limited to be the same, for example, the heat transfer coefficient of the upper plate 31 may be lower than that of the lower plate 32, so as to avoid the temperature of the condensation surface from being too high, and at this time, the material of the upper plate 31 and the material of the lower plate 32 may be different.

It should be noted that the present embodiment provides the first solder 33A and places it between the first joint surface 312 of the upper plate 31 and the second joint surface 322 of the lower plate 32, and also provides the second solder 33B and places it between the through hole 34 and the liquid injection pipe 36, including placing the second solder 33B between the first channel 311 of the upper plate 31 and the liquid injection pipe 36, and placing the second solder 33B between the second channel 321 of the lower plate 32 and the liquid injection pipe 36. The solder 33B formed between the first channel 311 and the pour spout 36 or between the second channel 321 and the pour spout 36 is protected by the upper and

lower plates

31 and 32, and will not be severely deformed or broken by direct pressure of external force when pressed together in the future.

In addition, the solder 33B and the solder 33A can be structurally connected to each other after being heated and diffused, and the two can form a complete and non-broken circuit together. The

solder

33A and 33B may be selected to have the same composition, and may be made of copper paste, stainless steel paste, aluminum alloy paste, titanium alloy paste, copper-silver paste, or other suitable solder paste, depending on the materials of the upper plate 31, the lower plate 32, and the liquid pouring tube 36. For example, the solder 33A may contain a metal composition that is the same as the metal composition contained in the upper plate 31 or the metal composition contained in the lower plate 32. The solder 33B may contain a metal composition that is the same as a metal composition contained in the upper plate 31, the lower plate 32, or the pour spout 36. Of course, if the material of the upper plate 31, the lower plate 32, or the pouring spout 36 is different, the solder 33A that can be smoothly joined to both the material of the upper plate 31 and the material of the lower plate 32, the solder 33B that can be smoothly joined to both the material of the upper plate 31 and the material of the pouring spout 36, or the solder 33B that can be smoothly joined to both the material of the lower plate 32 and the material of the pouring spout 36 can be selected. In this case, it is possible to use different compositions for the

solders

33A and 33B, and still be embodied according to the present invention.

In addition, the cross-sections of the first slot 311 of the upper plate 31 and the second slot 321 of the lower plate 32 are similar to the shape of a rectangular groove before being pressed, and the liquid injection pipe 36 is a square pipe or a rectangular pipe corresponding to the shapes of the first slot 311 and the second slot 321 (or the shape of the through hole 34).

In addition, the solder 33B formed between the through hole 34 and the liquid injection tube 36 will spread to the gap between the through hole 34 and the liquid injection tube 36 after being heated, and the gap will be filled up as much as possible by capillary force, and the amount of the solder 33B can be controlled to make the solder 33B overflow slightly to the tube body of the liquid injection tube 36 outside the through hole 34, and further to ensure that no gap will be generated after the two, at this time, the amount of the solder 33B between the through hole 34 and the liquid injection tube 36 will be controlled to be larger than the amount of the solder 33B overflowing to the tube body of the liquid injection tube 36 outside the through hole 34, so as to avoid the problem that the solder 33B overflowing too much after the pressing procedure in the future will break.

Please refer to fig. 3D to fig. 3F, wherein fig. 3D is a schematic perspective view of the temperature-uniforming plate after the liquid injection and vacuum pumping steps are completed and a pressing step is performed to seal the liquid injection tube, fig. 3E is a schematic cross-sectional view of the temperature-uniforming plate at the pressing portion along the line 3E-3E in fig. 3D, and fig. 3F is a schematic view of solder distribution in the temperature-uniforming plate in fig. 3D. As can be seen from the above drawings, the pouring spout 36 is sealed, the gaps between the upper plate 31, the lower plate 32 and the pouring spout 36 are firmly sealed by the diffused

solder

33A and 33B, and the pouring spout 36 in the through hole 34 is also sealed by pressing, so that the air tightness of the isothermal plate 3 is ensured, because the solder 33A between the first joint surface 312 of the upper plate 31 and the second joint surface 322 of the lower plate 32 and the solder 33B between the first groove 311 and the pouring spout 36 or between the second groove 321 and the pouring spout 36 are protected by the upper plate 31 and the lower plate 32, so that the structure is not damaged when pressed.

In addition, structurally, the solder 33B and the solder 33A are closely pressed, so that the two can be connected to each other after being pressed, and the hermetic property of the sealed vapor chamber 3 can be maintained.

In addition, after the pressing step, the first slot 311 of the upper plate 31 and the second slot 321 of the lower plate 32 have reduced thickness, so the cross section of the liquid inlet tube 36, which is originally a square tube or a rectangular tube, will not be rectangular, but will be deformed together with the first slot 311 and the second slot 321, but will still be tightly attached to each other.

According to the utility model discloses a fourth embodiment provides a samming board semi-manufactured goods and a samming board. Please refer to fig. 4A to 4C, which are schematic structural diagrams illustrating the vapor chamber before lamination when the vapor chamber is still a semi-finished product, wherein fig. 4C is a schematic cross-sectional view along the line 4C-4C in fig. 4B.

The semi-finished product of the vapor chamber comprises an upper plate 41, a lower plate 42, a first solder 43A, a second solder 43B and a liquid injection tube 46. The upper plate 41 has a first joint surface 412, and the lower plate 42 has a channel 421, a second joint surface 422 and a space 423, wherein the channel 421 of the upper plate 41 and the lower plate 42 together form a through hole 44, the upper plate 41 and the space 423 also together form an active space 45, and a capillary structure (not shown) may be disposed inside the upper plate 41, in the space 423 or in the active space 45. The liquid injection tube 46 has an inner opening 461 and an outer opening 462, the tube body can be fixed with the upper plate 41 and then fixed with the channel 421 of the lower plate 42, or vice versa, the tube body of the liquid injection tube 46 is fixed with the channel 421 of the lower plate 42 and then fixed with the upper plate 41, and finally the tube body is vertically attached by the channel 421 of the upper plate 41 and the lower plate 42, and part of the tube body is placed in the through hole 44, and the other part of the tube body is exposed out of the through hole 44. At this time, the inner opening 461 of the pouring spout 46 communicates with the working space 45, and the outer opening 462 communicates with the outside. The material of the upper plate 41 and the lower plate 42 may be a metal plate, and the liquid injection pipe 46 may be a metal pipe, but the material of the upper plate 41 and the material of the lower plate 42 are not limited to be the same, for example, the heat transfer coefficient of the upper plate 41 may be lower than that of the lower plate 42, so as to avoid the temperature of the condensation surface from being too high, and at this time, the material of the upper plate 41 and the material of the lower plate 42 may be different.

It should be noted that the present embodiment provides the first solder 43A and places it between the first joint surface 412 of the upper plate 41 and the second joint surface 422 of the lower plate 42, and also provides the second solder 43B and places it between the through hole 44 and the liquid injection pipe 46, including placing the second solder 43B between the upper plate 41 and the liquid injection pipe 46, and placing the second solder 43B between the channel 421 of the lower plate 42 and the liquid injection pipe 46. The solder 43B formed between the upper plate 41 and the pour spout 46 or between the channel 421 and the pour spout 46 is protected by the upper and

lower plates

41 and 42, so that it will not be severely deformed or broken by direct pressure of external force when pressed together in the future.

In addition, the solder 43B and the solder 43A can be structurally connected to each other after being heated and diffused, and the two can form a complete and non-broken circuit together. The

solder materials

43A and 43B may be selected to have the same composition, and copper paste, stainless steel paste, aluminum alloy paste, titanium alloy paste, copper-silver paste, or other suitable solder paste may be used depending on the materials of the upper plate 41, the lower plate 42, and the liquid pouring tube 46. For example, the solder 43A may have a metal composition that is the same as the metal composition contained in the upper plate 41 or the metal composition contained in the lower plate 42. The metal composition contained in the solder 43B may be the same as that contained in the upper plate 41, the same as that contained in the lower plate 42, or the same as that contained in the pour spout 46. Of course, if the materials of the upper plate 41, the lower plate 42, and the pouring spout 46 are different, the solder 43A that can be smoothly joined to both the materials of the upper plate 41 and the lower plate 42, the solder 43B that can be smoothly joined to both the materials of the upper plate 41 and the pouring spout 46, and the solder 43B that can be smoothly joined to both the materials of the lower plate 42 and the pouring spout 46 can be selected. In this case, it is possible to use different compositions for the

solders

43A and 43B, and still be embodied according to the present invention.

In addition, the cross section of the channel 421 of the lower plate 42 is an outline close to a rectangular groove before being pressed, and the liquid injection pipe 46 is a square pipe or a rectangular pipe to correspond to the outline of the channel 421 (or the outline of the through hole 44).

In addition, the solder 43B formed between the through hole 44 and the liquid filling pipe 46 will spread to the gap between the through hole 44 and the liquid filling pipe 46 after being heated, and the gap will be filled up as much as possible by capillary force, and the amount of the solder 43B can be controlled to make the solder 43B overflow slightly to the pipe body of the liquid filling pipe 46 located outside the through hole 44, and further to ensure that no gap will be generated after the two, at this time, the amount of the solder 23B located between the through hole 44 and the liquid filling pipe 46 will be controlled to be larger than the amount of the solder 43B overflowing to the pipe body of the liquid filling pipe 46 located outside the through hole 44, so as to avoid the problem that the solder 43B overflowing too much after the pressing procedure in the future will break.

Referring to fig. 4D to 4F, fig. 4D is a schematic perspective view of the temperature-uniforming plate after the liquid injection and vacuum-pumping steps are completed and a pressing step is performed to close the liquid injection tube, fig. 4E is a schematic cross-sectional view of the temperature-uniforming plate at the pressing portion along the line 4E-4E in fig. 4D, and fig. 4F is a schematic view of solder distribution in the temperature-uniforming plate in fig. 4D. As can be seen from the above drawings, the pouring spout 46 is closed, the gaps between the upper plate 41, the lower plate 42 and the pouring spout 46 are firmly sealed by the spread solders 43A and 43B, and the pouring spout 46 inside the through hole 44 is pressed and sealed, so that the air tightness of the isothermal plate 4 is ensured, because the solders 43A between the first joint surface 412 of the upper plate 41 and the second joint surface 422 of the lower plate 42 and the solders 43B between the upper plate 41 and the pouring spout 46 or between the channel 421 and the pouring spout 46 are protected by the upper plate 41 and the lower plate 42, so that the structure is not damaged when pressed.

In addition, structurally, the solder 43B and the solder 43A are closely pressed, so that the two can be connected together after being pressed, and the airtight performance of the sealed vapor chamber 4 can be maintained.

In addition, after the pressing step, the grooves 421 of the upper plate 41 and the lower plate 42 have reduced thickness, so the cross section of the grooves is not rectangular, but has a slightly arc-shaped or even irregular shape, and the cross section of the liquid injection pipe 46, which is originally a square pipe or a rectangular pipe, is deformed together with the grooves 421 of the upper plate 41 and the grooves, but is still tightly attached to each other.

The foregoing outlines features of several embodiments so that those skilled in the art may understand the principles and techniques disclosed herein. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein.

Claims

1. A vapor chamber, comprising:

an upper plate having a first joint surface;

a lower plate having a second joint surface;

the through hole is formed by jointly defining a part of structure of the upper plate and a part of structure of the lower plate, and comprises a first channel formed on the upper plate and a second channel formed on the lower plate, or is formed by clamping the upper plate and the second channel formed on the lower plate, or is formed by clamping the lower plate and the first channel formed on the upper plate;

a liquid injection pipe disposed in the through hole;

a first solder formed between the first joint surface and the second joint surface; and

a second solder formed between the through hole and the liquid injection tube.

2. The vapor chamber of claim 1, wherein the first and second solders are structurally bonded to each other.

3. The vapor chamber of claim 1, wherein the first solder and the second solder form a complete and non-breaking circuit in structure.

4. The vapor chamber of claim 1, wherein the first solder and the second solder have the same composition.

5. The temperature-uniforming plate according to claim 1, wherein the first solder has a metal composition identical to that of the upper plate or the lower plate.

6. The temperature-uniforming plate according to claim 1, wherein the second solder has a metal composition identical to that of the upper plate, the lower plate or the liquid inlet pipe.

7. The vapor chamber of claim 1, wherein the upper plate has a thermal conductivity coefficient lower than that of the lower plate.

8. The temperature equalization plate as claimed in claim 1, wherein a part of the liquid injection tube body is located in the through hole, and the liquid injection tube body located in the through hole is press-sealed.

9. A vapor chamber, comprising:

an upper plate having a first joint surface;

a lower plate having a second joint surface;

a liquid injection pipe disposed in the through hole; and

a solder formed between the first joint surface and the second joint surface and between the through hole and the liquid injection pipe.

10. The temperature-uniforming plate according to claim 9, wherein the upper plate has a first space, the lower plate has a second space, the first space and the second space together define an active space, and the active space has a capillary structure therein.

11. The temperature-uniforming plate according to claim 9, wherein the upper plate has a space, the lower plate and the space together define an active space, and the active space has a capillary structure disposed therein.

12. The vapor chamber of claim 9, wherein the lower plate has a space, the upper plate and the space together define an active space, and the active space has a capillary structure disposed therein.

13. The vapor chamber of claim 9, wherein the solder material formed between the first bonding surface and the second bonding surface and the solder material formed between the through hole and the liquid injection pipe are structurally connected to each other.

14. The vapor chamber of claim 9, wherein the solder is between the first bonding surface and the second bonding surface and between the through hole and the liquid injection tube, thereby forming a complete and non-broken loop in structure.

15. The vapor chamber of claim 9, wherein the solder has the same metal composition as the upper plate, the lower plate, or the pour spout.

16. The vapor chamber of claim 9, wherein the upper plate has a thermal conductivity coefficient lower than that of the lower plate.

17. The temperature-uniforming plate according to claim 10, 11 or 12, wherein the action space is communicated with the outside through the liquid injection pipe.

18. The temperature equalizing plate of claim 10, 11 or 12, wherein a portion of the liquid filling pipe is located in the through hole, and the liquid filling pipe is pressed and sealed in the through hole, so that the operation space is isolated from the outside.

19. The temperature equalization plate as claimed in claim 9, wherein a portion of the liquid injection tube is located inside the through hole, and the liquid injection tube is press-fit-sealed inside the through hole, and a portion of the liquid injection tube is located outside the through hole.

20. A vapor chamber, comprising:

an upper plate;

a lower plate;

a liquid injection pipe disposed in the through hole; and

and the first welding flux is formed between the through hole and the liquid injection pipe, and is heated and then diffused to a gap between the through hole and the liquid injection pipe.

21. The vapor chamber of claim 20, wherein the upper plate has a first bonding surface and the lower plate has a second bonding surface, the vapor chamber further comprising a second solder formed between the first bonding surface and the second bonding surface.

22. The vapor chamber of claim 21, wherein the first and second solders are structurally bonded to each other.

23. The vapor chamber of claim 21, wherein the first solder and the second solder form a complete and non-breaking circuit in structure.

24. The vapor chamber of claim 20, wherein the first solder material has a metal composition that is the same as the metal composition of the upper plate, the lower plate, or the pour spout.

25. The temperature-uniforming plate according to claim 21, wherein the second solder has a metal composition identical to that of the upper plate or the lower plate.

26. The vapor chamber of claim 20, wherein the upper plate has a thermal conductivity that is lower than the thermal conductivity of the lower plate.

27. The temperature-uniforming plate according to claim 20, wherein the first solder is heated to diffuse into a gap between the through hole and the liquid injection tube and overflow onto the liquid injection tube body outside the through hole, and an amount of the first solder between the through hole and the liquid injection tube is larger than an amount of the first solder overflowing onto the liquid injection tube body outside the through hole.