CN106091769A - Slimming heat conducting device - Google Patents
Slimming heat conducting device Download PDFInfo
- Publication number
- CN106091769A CN106091769A CN201610610027.1A CN201610610027A CN106091769A CN 106091769 A CN106091769 A CN 106091769A CN 201610610027 A CN201610610027 A CN 201610610027A CN 106091769 A CN106091769 A CN 106091769A
- Authority
- CN
- China
- Prior art keywords
- pressing
- liquid injection
- base plate
- pumping liquid
- vacuum pumping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
Abstract
A kind of slimming heat conducting device, described device includes a base plate and a cover plate of the overlapped combination of shape and state in planar, this base plate has a smooth radiating surface, between base plate and cover plate, periphery has a pressing limit, this pressing side ring forms a vacuum chamber in the range of enclosing, then being provided with a vacuum pumping liquid injection mouth at pressing limit one, this vacuum pumping liquid injection mouth is closed by pressing edge, and outer end, pressing edge is sealed in closely sealed shape by welding procedure again；This position, pressing limit corresponding to vacuum pumping liquid injection mouth is further provided with a upwards inner concave, for by the smooth radiating surface of base plate towards cover plate direction planar indent form；Whereby, constitute the outer end, pressing edge of vacuum pumping liquid injection mouth relative to the smooth radiating surface of base plate in upwards inside contracting state, the solder making sealing has space that can be downwardly projecting, prevent solder from protruding from outside the smooth radiating surface of base plate, to guarantee that the smooth radiating surface of base plate assembles flatness and optimal heat dissipation.
Description
Technical field
The present invention relates to a kind of heat conducting device；Particularly relate to the innovation of the configuration of a kind of slimming heat conducting device
Technology.
Background technology
Heat conducting device application on, its base plate generally lock group on a heat radiating fin bar, the cover plate plate face of heat conducting device
Then for assembling a pyrotoxin (such as CPU), the base plate of heat conducting device and side, cover plate pressing limit are generally of a vacuum pumping liquid injection
Mouthful, this vacuum pumping liquid injection mouth is in processing procedure, after its work completing evacuation and injecting working solution, it is necessary to pass through further
Sheet Metal Forming Technology is formed closes edge form, and the end of this vacuum pumping liquid injection mouth would generally be welded shape by solder further
Become firm and closely sealed ora terminalis.
But above-mentioned existing heat conducting device structure and manufacture method still find that in extensive application experience there are some asks
Topic and scarce fraud: for example, when designing according to slimming due to base plate and the cover plate pressing limit of heat conducting device, its gross thickness
The most meagre, typically not greater than 0.5mm, at this under meagre thickness condition, the solder limit that this vacuum pumping liquid injection mouth end is welded
Edge would generally protrude from the upper and lower surface of vacuum pumping liquid injection mouth end, even if the situation amplitude of this kind of solder edge evagination is little,
Negative effect and consequence are the most serious, because the lower surface of the base plate of heat conducting device must present a formation state, and can
Guaranteeing to reach between this base plate and heat radiating fin bar smooth closely sealed, conduction of heat, smooth and easy nothing serious that perfect condition assembles matter with component
Amount, but, the vacuum pumping liquid injection mouth end solder edge evagination phenomenon of aforementioned existing heat conducting device, if its solder edge is
Evagination, is i.e. equal to towards cover plate pressing direction evagination downwards, under this state, even if this solder edge evagination amplitude is the trickleest, also
It is to cause by local support height between base plate and heat radiating fin bar, and causes to be unable to reach complete smooth closely sealed flaw state, from
And causing averagely leading in heat conducting device structure scattered heat, it is impossible to efficiency conduction carries out hot type to heat radiating fin bar as expected
Dissipate, be necessary to be thought again breakthrough in fact.
Therefore, for the problem existing for above-mentioned existing heat conducting device technology, how to develop one and can more manage
Thinking the innovative structure of practicality, actually relevant industry must be thought target and the direction of breakthrough again.
In view of this, inventor this in being engaged in manufacturing development and the design experiences of Related product for many years, for above-mentioned target,
Design in detail and after scrupulous assessment, obtain true this creation having practicality eventually.
Summary of the invention
The present invention provides a kind of slimming heat conducting device, and its purpose is more preferable real mainly for how developing one
New-type heat conducting device and manufacture method by property are target strategic structural in addition.
For reaching above-mentioned purpose, the technical solution used in the present invention is: a kind of slimming heat conducting device, including:
One base plate, is a plane plate form, has a smooth radiating surface；
One cover plate, in planar, overlapped combination of shape and state is in described base plate, and this cover plate has a pyrotoxin installment surface；
One pressing limit, is located between base plate and cover plate the closing form in ring shape pressing；
One vacuum chamber, is formed between base plate and cover plate and in the range of described pressing side ring encloses in flat-shaped interior spatial shape,
This vacuum chamber is vacuum state and is equipped with capillary structure and working solution；
One vacuum pumping liquid injection mouth, is located at the one of described pressing limit, and this vacuum pumping liquid injection mouth is in order to the evacuation as vacuum chamber
With working solution perfusion channel, this vacuum pumping liquid injection mouth is closed by a pressing edge, and this outer end, pressing edge is passed through again
Welding procedure is sealed in closely sealed shape；
One upwards inner concave, is located at the position, pressing limit corresponding to described vacuum pumping liquid injection mouth, this upwards inner concave be the end of by
The smooth radiating surface of plate is towards the form of cover plate direction planar indent；
The pressing edge of described vacuum pumping liquid injection mouth includes a curved section nip portion；
The pressing edge of described vacuum pumping liquid injection mouth further includes the ㄇ shape nip portion laterally blocking vacuum pumping liquid injection mouth；
Described slimming heat conducting device is a soaking plate.
Operation principle and the advantage of the present invention are as follows:
One slimming heat conducting device of the present invention, the main vacuum pumping liquid injection mouth correspondence pressing by slimming heat conducting device
Position, limit be further provided with described in upwards the innovation unique texture form of inner concave and technical characteristic, make the present invention compare background technology
For carried existing structure, due to this upwards inner concave be towards the shape of cover plate direction planar indent by the smooth radiating surface of base plate
State, therefore constitute the outer end, pressing edge of vacuum pumping liquid injection mouth relative to the smooth radiating surface of base plate in upwards inside contracting state, whereby,
Make the solder of end closure outside pressing edge have space that can be downwardly projecting, prevent solder from protruding from the smooth heat radiation of base plate
Outside face, and then reach effectively to guarantee that the smooth radiating surface of base plate assembles flatness and the practical improvement of optimal heat dissipation.
Accompanying drawing explanation
Accompanying drawing 1 is the axonometric chart of slimming heat conducting device preferred embodiment of the present invention；
Accompanying drawing 2 is the plane graph of slimming heat conducting device preferred embodiment of the present invention；
Accompanying drawing 3 is that the partial structurtes of the present invention look up angle axonometric chart；
Accompanying drawing 4 is the partial structurtes sectional view one of the present invention；
Accompanying drawing 5 is the partial structurtes sectional view two of the present invention；
Accompanying drawing 6 is the forming method schematic diagram one of the present invention；
Accompanying drawing 7 is the forming method schematic diagram two of the present invention；
Accompanying drawing 8 is the forming method schematic diagram three of the present invention.
In the figures above: A. slimming heat conducting device；10. base plate；11. smooth radiating surfaces；20. cover plates；21. pyrotoxins
Installment surface；30. pressing limits；40. vacuum chambers；41. capillary structures；42. working solutions；50. vacuum pumping liquid injection mouths；51. pressing edges；
512. curved section nip portion；514. ㄇ shape nip portion；52. solders；53. welding procedures；60. upwards inner concaves；70. heat radiating fins
Bar；80. pyrotoxins；90. diels.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment the invention will be further described:
Embodiment: refer to shown in Fig. 1 ~ 5, for the preferred embodiment of slimming heat conducting device of the present invention, only these embodiments
It is intended for purposes of discussion, patent application is not limited by this structure；
Described slimming heat conducting device A includes following composition: a base plate 10, is a plane plate form, has one smooth scattered
Hot side 11；One cover plate 20, in planar, overlapped combination of shape and state is in this base plate 10, and this cover plate 20 has a pyrotoxin installment surface 21；One
Pressing limit 30, is located between base plate 10 and cover plate 20 the closing form in ring shape pressing；One vacuum chamber 40, in flat-shaped interior space shape
State is formed between base plate 10 and cover plate 20 and in the range of this pressing limit 30 collar, and this vacuum chamber 40 in vacuum state and
It is equipped with capillary structure 41 and working solution 42 (being only shown in Fig. 5) and in vacuum state；One vacuum pumping liquid injection mouth 50, is located at this
At the one of pressing limit 30, this vacuum pumping liquid injection mouth 50, should in order to evacuation and working solution 41 perfusion channel as vacuum chamber 40
Vacuum pumping liquid injection mouth 50 is for be closed by a pressing edge 51, and this outer end, pressing edge 51 is again by welding procedure in addition
Sealing in closely sealed shape (note: this example is the embodiment with solder 52, but is not limited to this, also can be solderless welding procedure,
As stirred weldering)；One upwards inner concave 60, are located at this position, pressing limit 30 corresponding to vacuum pumping liquid injection mouth 50, this upwards in
Concave surface is towards the form of cover plate 20 direction planar indent by the smooth radiating surface 11 of base plate 10.
As Fig. 1 is to shown in 5, and wherein the pressing edge 51 of this vacuum pumping liquid injection mouth 50 can include a curved section nip portion
512.By the morphological characteristic of section nip portion 512 curved described in this example, therefore the structural strength that can strengthen this pressing edge 51 (is produced
The strengthening action of raw similar rib), the welding contact area of enlarged ends solder 52, obtains preferable welding effect simultaneously.
As shown in Fig. 2,4,5, wherein the pressing edge 51 of this vacuum pumping liquid injection mouth 50 more can include laterally blocking evacuation
One ㄇ shape nip portion 514 of liquid injection port 50.
Wherein said slimming heat conducting device A can be a soaking plate.
By said structure composition form and technical characteristic, described slimming heat conducting device A specifically applies such as Fig. 1 institute
Showing, the smooth radiating surface 11 bottom its base plate 10 is available for assembling and is posted by heat radiating fin bar 70 end face, the heating of cover plate 20
Source installment surface 21 is then with reclining on it for pyrotoxin 80 (such as a CPU) assembling, whereby, when pyrotoxin 80 running produces heat temperature
Time, heat temperature can be imported and uniformly guide and diffuse to overall slimming heat conducting device A, then via this by pyrotoxin installment surface 21
The smooth radiating surface 11 of base plate 10 is directed to this heat radiating fin bar 70 and carries out end heat radiation.
Then please join Fig. 2 to shown in 8, for the manufacture method of slimming heat conducting device of the present invention, comprise the steps:
A), preparing base plate 10 and a cover plate 20, wherein this base plate 10 has a smooth radiating surface 11, and cover plate 20 then has one
Pyrotoxin installment surface 21, forms again capillary structure 41 between base plate 10 and cover plate 20；
B), by a pressing and forming step, between this base plate 10 and cover plate 20, form ring shape pressing close a pressure of form
Conjunction limit 30, and in the range of this pressing limit 30 collar, form a vacuum chamber 40 of flat-shaped interior spatial shape, and in pressing limit 30 1
Place is installed with a vacuum pumping liquid injection mouth 50；(refering to Fig. 3)
C), by a vacuum pumping liquid injection step, evacuation is carried out (such as Fig. 6 with this vacuum pumping liquid injection mouth 50 to vacuum chamber 40 is internal
Arrow L1 shown in) and working solution 41 perfusion operation (as shown in the arrow L2 of Fig. 6)；
D), by a pressing sealing step (as shown in the arrow L3 of Fig. 7), this vacuum pumping liquid injection mouth 50 is closed；
E), by upwards punch steps (as shown in an arrow L4 of Fig. 7), with in the pressing limit of vacuum pumping liquid injection mouth 50 correspondence
30 position molding one upwards inner concave 60, this upwards inner concave 60 be towards cover plate 20 direction by the smooth radiating surface 11 of base plate 10
The form of planar indent；
F), join shown in Fig. 8, by a welding step, make vacuum pumping liquid injection mouth 50 outer end of aforementioned closing by welding procedure 53
Sealed in closely sealed shape.
As it is shown in fig. 7, wherein said upwards punch steps and pressing sealing step, can be synchronized by same diel 90
Complete.
Wherein, described pressing and forming step can use Hot pressing diffusion joint, hard solder filler high temperature hard solder, TIG weldering
(Tungsten Inert Gas Welding), electron beam welding etc., being can specific embodiment.
Advantages of the present invention illustrates:
One slimming heat conducting device of the present invention, the main vacuum pumping liquid injection mouth correspondence pressing by slimming heat conducting device
Position, limit be further provided with described in upwards the innovation unique texture form of inner concave and technical characteristic, make the present invention compare background technology
For carried existing structure, due to this upwards inner concave be towards the shape of cover plate direction planar indent by the smooth radiating surface of base plate
State, therefore constitute the outer end, pressing edge of vacuum pumping liquid injection mouth relative to the smooth radiating surface of base plate in upwards inside contracting state, whereby,
Make the solder of end closure outside pressing edge have space that can be downwardly projecting, prevent solder from protruding from the smooth heat radiation of base plate
Outside face, and then reach effectively to guarantee that the smooth radiating surface of base plate assembles flatness and the practical improvement of optimal heat dissipation.
Above-described embodiment, only for technology design and the feature of the explanation present invention, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and implements according to this, can not limit the scope of the invention with this.All according to the present invention
The equivalence that spirit is made changes or modifies, and all should contain within protection scope of the present invention.
Claims (1)
1. a slimming heat conducting device, it is characterised in that: including:
One base plate, is a plane plate form, has a smooth radiating surface；
One cover plate, in planar, overlapped combination of shape and state is in described base plate, and this cover plate has a pyrotoxin installment surface；
One pressing limit, is located between base plate and cover plate the closing form in ring shape pressing；
One vacuum chamber, is formed between base plate and cover plate and in the range of described pressing side ring encloses in flat-shaped interior spatial shape,
This vacuum chamber is vacuum state and is equipped with capillary structure and working solution；
One vacuum pumping liquid injection mouth, is located at the one of described pressing limit, and this vacuum pumping liquid injection mouth is in order to the evacuation as vacuum chamber
With working solution perfusion channel, this vacuum pumping liquid injection mouth is closed by a pressing edge, and this outer end, pressing edge is passed through again
Welding procedure is sealed in closely sealed shape；
One upwards inner concave, is located at the position, pressing limit corresponding to described vacuum pumping liquid injection mouth, this upwards inner concave be the end of by
The smooth radiating surface of plate is towards the form of cover plate direction planar indent；
The pressing edge of described vacuum pumping liquid injection mouth includes a curved section nip portion；
The pressing edge of described vacuum pumping liquid injection mouth further includes the ㄇ shape nip portion laterally blocking vacuum pumping liquid injection mouth；
Described slimming heat conducting device is a soaking plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610610027.1A CN106091769A (en) | 2016-07-29 | 2016-07-29 | Slimming heat conducting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610610027.1A CN106091769A (en) | 2016-07-29 | 2016-07-29 | Slimming heat conducting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106091769A true CN106091769A (en) | 2016-11-09 |
Family
ID=57480076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610610027.1A Pending CN106091769A (en) | 2016-07-29 | 2016-07-29 | Slimming heat conducting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106091769A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI763967B (en) * | 2019-01-25 | 2022-05-11 | 雙鴻科技股份有限公司 | Vapor chamber |
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| TW200926952A (en) * | 2007-07-27 | 2009-06-16 | Amulaire Thermal Technology Inc | Vapor chamber structure with improved wick and method for manufacturing the same |
| CN202014433U (en) * | 2011-03-18 | 2011-10-19 | 索士亚科技股份有限公司 | Isothermal vapor chamber with seal |
| TW201202908A (en) * | 2010-07-14 | 2012-01-16 | Yeh Chiang Technology Corp | Vapor chamber structure |
| CN102748967A (en) * | 2012-07-19 | 2012-10-24 | 苏州聚力电机有限公司 | Thinning heat conduction device with pipeless sealing structure and forming method of thinning heat conduction device |
| DE202014005053U1 (en) * | 2014-06-17 | 2014-07-04 | Asia Vital Components Co., Ltd. | Vapor Chamber cooler |
| CN104833249A (en) * | 2014-02-12 | 2015-08-12 | 李嘉豪 | Improved edge sealing structure for temperature equalizing plate |
| TW201531370A (en) * | 2014-02-14 | 2015-08-16 | Forcecon Technology Co Ltd | Sealing structure and sealing method of a vapor chamber |
-
2016
- 2016-07-29 CN CN201610610027.1A patent/CN106091769A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200926952A (en) * | 2007-07-27 | 2009-06-16 | Amulaire Thermal Technology Inc | Vapor chamber structure with improved wick and method for manufacturing the same |
| TW201202908A (en) * | 2010-07-14 | 2012-01-16 | Yeh Chiang Technology Corp | Vapor chamber structure |
| CN202014433U (en) * | 2011-03-18 | 2011-10-19 | 索士亚科技股份有限公司 | Isothermal vapor chamber with seal |
| CN102748967A (en) * | 2012-07-19 | 2012-10-24 | 苏州聚力电机有限公司 | Thinning heat conduction device with pipeless sealing structure and forming method of thinning heat conduction device |
| CN104833249A (en) * | 2014-02-12 | 2015-08-12 | 李嘉豪 | Improved edge sealing structure for temperature equalizing plate |
| TW201531370A (en) * | 2014-02-14 | 2015-08-16 | Forcecon Technology Co Ltd | Sealing structure and sealing method of a vapor chamber |
| DE202014005053U1 (en) * | 2014-06-17 | 2014-07-04 | Asia Vital Components Co., Ltd. | Vapor Chamber cooler |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI763967B (en) * | 2019-01-25 | 2022-05-11 | 雙鴻科技股份有限公司 | Vapor chamber |
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| C06 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161109 |