TW201531370A - Sealing structure and sealing method of a vapor chamber - Google Patents
Sealing structure and sealing method of a vapor chamber Download PDFInfo
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- TW201531370A TW201531370A TW103104839A TW103104839A TW201531370A TW 201531370 A TW201531370 A TW 201531370A TW 103104839 A TW103104839 A TW 103104839A TW 103104839 A TW103104839 A TW 103104839A TW 201531370 A TW201531370 A TW 201531370A
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- melting point
- working hole
- open
- upper cover
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- 238000007789 sealing Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000002844 melting Methods 0.000 claims abstract description 64
- 230000008018 melting Effects 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims description 25
- 238000007731 hot pressing Methods 0.000 claims description 10
- 238000004080 punching Methods 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 239000012943 hotmelt Substances 0.000 claims description 2
- 238000004049 embossing Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 5
- 238000002347 injection Methods 0.000 abstract description 4
- 239000007924 injection Substances 0.000 abstract description 4
- 238000011109 contamination Methods 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Pressure Vessels And Lids Thereof (AREA)
Abstract
Description
本發明係涉及一種均溫板；特別是指所述均溫板的封口結構及封口方法創新技術揭示者。 The present invention relates to a temperature equalizing plate; in particular, to the inventor of the sealing structure and sealing method of the temperature equalizing plate.
按，習知均溫板的結構型態，通常係由一上蓋板以及一下蓋板相疊靠且通過二者周邊施以結合固定手段所構成；且其中，所述上蓋板與下蓋板的周邊於完成結合固定步驟之後，尚必須預留一缺口，以利用該缺口進行後續均溫板內部的抽真空及注液等步驟，然後再將該缺口藉由焊料焊接封閉。 According to the conventional structure of the uniform temperature plate, usually, an upper cover plate and a lower cover plate are stacked and are combined by the fixing means; and wherein the upper cover and the lower cover are After the completion of the bonding and fixing step of the periphery of the board, a gap must be reserved to perform the steps of vacuuming and injecting the inside of the subsequent temperature equalizing plate, and then the notch is closed by soldering.
惟查，前段所揭習知均溫板的結構型態與成型方式，於實際應用經驗中發現仍舊存在一些問題與缺弊，概因所述缺口通常係利用該上蓋板於沖壓出立體罩殼形狀時於其周邊一併沖壓出一半管形狀所構成，待與下蓋板疊靠結合後形成一開口朝側向的缺口，然而此種缺口的形成，除了其側向開口型態並不符合相關加工設備的機構較佳動線之缺點外，所述缺口的設置會造成上蓋板與下蓋板周邊原本能夠呈環狀結合封閉的理想型態受到影響，造成其內部真空狀態容易破損喪失而難以長久保持，且因為該缺口於完成抽真空及注液等步驟之後必須再藉由焊料加以焊接封閉，造成其製造工序稍嫌複雜的問題點，且所述焊料的使用更存在污染不環保的問題。 However, the structure and formation method of the uniform temperature plate disclosed in the previous paragraph have been found in the practical application experience. There are still some problems and shortcomings in the application. The gap is usually caused by the upper cover to punch out the three-dimensional cover. The shape of the shell is formed by punching a half of the tube shape at the periphery thereof, and is combined with the lower cover to form an opening with a lateral opening, but the formation of the notch is not except for the lateral opening type. In addition to the shortcomings of the preferred moving line of the mechanism of the relevant processing equipment, the setting of the notch may cause the ideal shape of the upper cover and the lower cover to be annularly closed and closed, thereby causing the internal vacuum state to be easily damaged. It is difficult to maintain for a long time, and because the gap must be welded and sealed by solder after the steps of vacuuming and liquid filling, the manufacturing process is slightly complicated, and the use of the solder is more polluted. Environmental issues.
是以，針對上述習知均溫板封口結構及封口方法所存在之問題點，如何研發出一種能夠更具理想實用性之創新發明，實有待相關業界再加以思索突破之目標及 方向者。 Therefore, in view of the problems existing in the above-mentioned conventional uniform temperature plate sealing structure and sealing method, how to develop an innovative invention that can be more ideal and practical, and the relevant industry should further consider the breakthrough goal and Direction.
有鑑於此，發明人本於多年從事相關產品之製造開發與設計經驗，針對上述之目標，詳加設計與審慎評估後，終得一確具實用性之本發明。 In view of this, the inventor has been engaged in the manufacturing development and design experience of related products for many years. After detailed design and careful evaluation, the inventor has finally obtained the practical invention.
本創作之主要目的，係在提供一種均溫板之封口結構及封口方法，其所欲解決之技術問題，係針對如何研發出一種更具理想實用性之新式均溫板封口結構及封口方法為目標加以思索創新突破。所述均溫板係包括一上蓋板及下蓋板相疊靠構成，上、下蓋板之間內部形成中空腔室，且上、下蓋板周邊係藉一環狀壓合邊相結合固定以令中空腔室呈封閉狀態。 The main purpose of this creation is to provide a sealing structure and sealing method for a uniform temperature plate. The technical problem to be solved is to develop a new type of uniform temperature plate sealing structure and sealing method which is more ideal and practical. The goal is to think about innovative breakthroughs. The temperature equalizing plate comprises an upper cover plate and a lower cover plate which are stacked on each other, and a hollow cavity is formed inside the upper and lower cover plates, and the upper and lower cover plates are combined by a ring-shaped pressing edge. Fixed so that the hollow chamber is closed.
本發明解決問題之技術特點之一，係提供一種均溫板之封口結構，所述封口結構係包括：一面向開設式作業孔，開設於上蓋板的板面一臨近環狀壓合邊位置處呈連通中空腔室之型態，以供對該中空腔室進行抽真空、注液作業之用；一延伸管部，一體式形成於面向開設式作業孔內呈朝中空腔室內凸伸的型態；一低熔點壓合部，呈限位狀態設於下蓋板內面，且令該低熔點壓合部位於上蓋板所設面向開設式作業孔相對位處，低熔點壓合部的上端向上穿伸過延伸管部，令低熔點壓合部與延伸管部之間形成有間隔空間，且低熔點壓合部的上端具有一熔融受壓部，該熔融受壓部須向上凸伸至面向開設式作業孔的上端處；且該低熔點壓合部的材質熔點須相對低於上蓋板的材質熔點。 One of the technical features of the present invention is to provide a sealing structure for a temperature equalizing plate, the sealing structure comprising: an open-faced working hole, and a plate surface opened on the upper cover plate adjacent to the annular pressing edge position The portion is connected to the hollow chamber for vacuuming and injecting the hollow chamber; an extension tube portion is integrally formed in the open working hole to protrude into the hollow chamber a low melting point nip portion, which is disposed in a limit state on the inner surface of the lower cover plate, and the low melting point nip portion is located at an opposite position of the upper cover plate facing the open working hole, and the low melting point nip portion The upper end of the low-melting-point nip has a space between the low-melting-point nip and the extension tube, and the upper end of the low-melting nip has a molten pressure-receiving portion. Extending to the upper end of the open working hole; and the melting point of the low melting point nip must be relatively lower than the melting point of the material of the upper cover.
本發明之另一主要目的，並提供一種均溫板之封口方法，係包括：製備一上蓋板及下蓋板；通過沖孔手段於上蓋板一處成型一面向開設式作業孔，且面向開設式作業孔內一體式形成有一延伸管部；通過環狀壓合手段 將上、下蓋板周邊壓合固定，使上、下蓋板之間內部形成有封閉狀態之一中空腔室，且上、下蓋板係藉一環狀壓合邊相結合固定；通過抽真空注液手段，由面向開設式作業孔對中空腔室內進行抽吸成真空狀態及注入工作液之作業；由面向開設式作業孔中置入一實心金屬柱體，且令實心金屬柱體的材質熔點低於上蓋板的材質熔點而構成一低熔點壓合部，該低熔點壓合部與面向開設式作業孔內的延伸管部之間形成有間隔空間，且令低熔點壓合部上端之熔融受壓部向上凸伸至面向開設式作業孔的上端處；通過一熱壓手段令該熔融受壓部熱壓熔融擴大並硬化，以將該面向開設式作業孔加以封閉密合。 Another main object of the present invention is to provide a method for sealing a temperature equalizing plate, comprising: preparing an upper cover plate and a lower cover plate; forming an open working hole at a position on the upper cover plate by punching, and Forming an extension pipe portion integrally formed in the open working hole; and adopting annular pressing means Pressing and fixing the periphery of the upper and lower cover plates to form a hollow chamber in a closed state between the upper and lower cover plates, and the upper and lower cover plates are combined and fixed by a ring-shaped pressing edge; The vacuum liquid injection means, the vacuum chamber is injected into the hollow chamber facing the open working hole, and the working fluid is injected; the solid metal cylinder is placed in the open working hole, and the solid metal cylinder is placed The melting point of the material is lower than the melting point of the material of the upper cover plate to form a low melting point nip, and the low melting point nip portion forms a space between the nip portion facing the open working hole and the low melting point nip portion. The molten pressure receiving portion of the upper end protrudes upward to the upper end facing the open working hole; the molten pressure receiving portion is expanded and hardened by a hot pressing means to close and close the open working hole.
本發明之另一主要目的，係更提供另一種均溫板之封口方法，係包括：製備一上蓋板以及一下蓋板，且令下蓋板的材質熔點低於上蓋板的材質熔點；通過沖孔手段於上蓋板一處成型一面向開設式作業孔，且面向開設式作業孔內一體式形成有一延伸管部；通過沖壓手段於下蓋板一處成型一中空凸部而構成一低熔點壓合部，該低熔點壓合部上端具熔融受壓部；通過環狀壓合手段將上、下蓋板周邊壓合固定，使上、下蓋板之間內部形成有封閉狀態之中空腔室，上、下蓋板係藉一環狀壓合邊結合固定；且令低熔點壓合部上端之熔融受壓部向上凸伸至面向開設式作業孔上端處，低熔點壓合部與面向開設式作業孔內的延伸管部之間形成有間隔空間；通過一抽真空注液手段，由面向開設式作業孔對中空腔室內進行抽吸成真空狀態及注入工作液之作業；通過熱壓手段令熔融受壓部熱壓熔融擴大並硬化，以將面向開設式作業孔封閉密合。 Another main object of the present invention is to provide another method for sealing a temperature equalizing plate, comprising: preparing an upper cover plate and a lower cover plate, and making the material of the lower cover plate have a melting point lower than a melting point of the material of the upper cover plate; Forming an open-faced working hole in the upper cover by punching, and forming an extended pipe portion integrally formed in the open working hole; forming a hollow convex portion at a position on the lower cover by pressing means to form a a low-melting-point nip portion having a molten pressure-receiving portion at an upper end of the low-melting-point nip portion; the periphery of the upper and lower cover plates is press-fitted and fixed by a ring-shaped pressing means, and a closed state is formed between the upper and lower cover plates In the hollow chamber, the upper and lower cover plates are combined and fixed by a ring-shaped pressing edge; and the molten pressure-receiving portion at the upper end of the low-melting-point nip portion is protruded upward to the upper end of the open working hole, and the low melting point nip portion is Forming a space between the extending pipe portion facing the open working hole; and vacuuming the liquid to open the hollow chamber to open the vacuum chamber and inject the working fluid; Hot pressing hand So that the molten hot melt pressure-receiving portion to expand and harden, to operation hole blocking face defines formula adhesion.
本發明之主要效果與優點大致包括：上、下蓋板周邊不必形成缺口，故可製成環狀結合封閉之理想型態；其面向開設式作業孔型態相對於習知側向缺口之開口型態而言，更加符合相關加工設備的機構較佳動線；藉由 該低熔點壓合部的設置，於完成抽真空及注液等步驟後，通過熱壓手段將該低熔點壓合部熔融即可封閉面向開設式作業孔，故無須使用焊料焊接封閉，製造工序更簡化，且無焊料污染問題而更符合環保訴求。 The main effects and advantages of the present invention generally include: no need to form a gap around the upper and lower cover plates, so that the ideal shape of the annular joint closure can be made; the opening facing the open working hole type relative to the conventional lateral notch opening In terms of type, it is more suitable for the mechanism of the relevant processing equipment; The low-melting-point nip portion is provided after the steps of vacuuming and liquid-filling, and the low-melting-point nip is melted by a hot pressing means to close the open-faced working hole, so that it is not necessary to use solder welding to seal the manufacturing process. It is more simplified and has no solder contamination problems and is more environmentally friendly.
A‧‧‧均溫板 A‧‧‧Wall plate
10‧‧‧上蓋板 10‧‧‧Upper cover
11‧‧‧面向開設式作業孔 11‧‧‧ facing open working holes
12‧‧‧延伸管部 12‧‧‧Extension tube
20‧‧‧下蓋板 20‧‧‧Under cover
21‧‧‧低熔點壓合部 21‧‧‧Low melting point nip
22‧‧‧熔融受壓部 22‧‧‧melting pressure department
30‧‧‧中空腔室 30‧‧‧ hollow room
40‧‧‧環狀壓合邊 40‧‧‧ annular pressing edge
B‧‧‧封口結構 B‧‧‧Seal structure
C‧‧‧封口方法 C‧‧‧ sealing method
50‧‧‧沖孔手段 50‧‧‧punching means
60‧‧‧環狀壓合手段 60‧‧‧Circular compression
70‧‧‧抽真空注液手段 70‧‧‧ Vacuum injection method
71‧‧‧工作液 71‧‧‧Working fluid
80‧‧‧熱壓手段 80‧‧‧Hot pressure means
90‧‧‧沖壓手段 90‧‧‧Pressing means
91‧‧‧中空凸部 91‧‧‧ hollow convex
第1圖係本發明結構較佳實施例之分解立體圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a preferred embodiment of the structure of the present invention.
第2圖係本發明結構較佳實施例之組合立體圖。 Figure 2 is a perspective view of a combination of preferred embodiments of the structure of the present invention.
第3圖係本發明結構較佳實施例之局部剖視圖。 Figure 3 is a partial cross-sectional view showing a preferred embodiment of the structure of the present invention.
第4圖係本發明之低熔點壓合部上端熔融受壓部熔融硬化將面向開設式作業孔封閉密合狀態剖視圖。 Fig. 4 is a cross-sectional view showing the state in which the upper end portion of the low-melting-point nip portion of the present invention is melt-hardened and is closed to the open working hole.
第5圖係本發明之低熔點壓合部藉由下蓋板結構本身一體式沖壓成型的中空凸部所構成之實施例剖視圖。 Fig. 5 is a cross-sectional view showing an embodiment in which the low-melting-point nip of the present invention is formed by integrally forming a hollow convex portion of the lower cover structure itself.
第6圖係承第5圖所揭實施例之熔融受壓部熱壓熔融擴大硬化將面向開設式作業孔封閉密合狀態圖。 Fig. 6 is a view showing a state in which the molten pressure-receiving portion of the embodiment shown in Fig. 5 is subjected to hot-pressure melting and expansion hardening to face the open working hole.
第7圖係本發明均溫板之封口方法較佳實施例步驟簡示圖。 Figure 7 is a schematic view showing the steps of a preferred embodiment of the sealing method of the temperature equalizing plate of the present invention.
第8圖係本發明均溫板之封口方法另一較佳實施例步驟簡示圖。 Figure 8 is a schematic view showing the steps of another preferred embodiment of the sealing method of the temperature equalizing plate of the present invention.
請參閱第1、2、3、4圖所示，係本發明均溫板之封口結構及封口方法之較佳實施例，惟此等實施例僅供說明之用，在專利申請上並不受此結構之限制；所述均溫板A係包括一上蓋板10以及一下蓋板20相疊靠構成，該上蓋板10與下蓋板20之間內部形成一中空腔室30，且上蓋板10與下蓋板20周邊係藉由一環狀壓合邊40相結合固定，以令中空腔室30呈封閉狀態；所述封口結構B包括下述構成： 一面向開設式作業孔11，開設於上蓋板10的板面一臨近環狀壓合邊40位置處呈連通中空腔室30之型態，以供對該中空腔室30進行抽真空、注液作業之用；一延伸管部12，一體式形成於面向開設式作業孔11內呈朝中空腔室30內凸伸的型態；一低熔點壓合部21，呈限位狀態設於下蓋板20內面，且令該低熔點壓合部21位於上蓋板10所設面向開設式作業孔11相對位處，低熔點壓合部21的上端向上穿伸過延伸管部12，令低熔點壓合部21與延伸管部12之間形成有間隔空間，且低熔點壓合部21的上端具有一熔融受壓部22，該熔融受壓部22須向上凸伸至面向開設式作業孔11的上端處；且其中，該低熔點壓合部21的材質熔點須相對低於上蓋板10的材質熔點。 Please refer to Figures 1, 2, 3 and 4, which are preferred embodiments of the sealing structure and sealing method of the temperature equalizing plate of the present invention, but the embodiments are for illustrative purposes only and are not applicable to patent applications. The structure of the temperature equalization plate A includes an upper cover plate 10 and a lower cover plate 20, and a hollow chamber 30 is formed between the upper cover plate 10 and the lower cover plate 20, and the upper portion The cover 10 and the periphery of the lower cover 20 are fixed by a ring-shaped pressing edge 40 to close the hollow chamber 30; the sealing structure B comprises the following structure: An opening-facing working hole 11 is formed in the shape of the hollow chamber 30 adjacent to the annular pressing edge 40 at the surface of the upper cover 10 for vacuuming and injecting the hollow chamber 30. For the liquid working, an extension tube portion 12 is integrally formed in a shape facing the open working hole 11 and protruding toward the hollow chamber 30; a low melting point nip portion 21 is disposed in a limit state. The inner surface of the cover plate 20 is disposed such that the low-melting-point nip portion 21 is located opposite to the open working hole 11 of the upper cover plate 10, and the upper end of the low-melting-point nip portion 21 extends upwardly through the extension tube portion 12, A space is formed between the low-melting-point nip portion 21 and the extension pipe portion 12, and the upper end of the low-melting-point nip portion 21 has a molten pressure receiving portion 22, and the molten pressure receiving portion 22 has to protrude upward to face the opening operation. The upper end of the hole 11; and wherein the low melting point nip 21 has a material melting point that is relatively lower than the material melting point of the upper cover 10.
藉此，在該中空腔室30完成抽真空、注液作業之前提下，能夠令低熔點壓合部21上端的熔融受壓部22熱壓熔融擴大並硬化(如第4圖所示)，以將該面向開設式作業孔11加以封閉密合。 Thereby, the hollow chamber 30 is lifted before the liquid filling operation and the liquid filling operation, and the molten pressure receiving portion 22 at the upper end of the low melting point nip portion 21 can be expanded and hardened (as shown in FIG. 4). The open-faced working hole 11 is closed and sealed.
如第3至6圖所示，其中該延伸管部12係可設為由上而下逐漸錐縮之型態者。此外，該延伸管部12亦可設成具有階級面之型態者(註：此例圖面省略繪示)。 As shown in Figures 3 to 6, the extension tube portion 12 can be set to be tapered from top to bottom. In addition, the extension tube portion 12 can also be set to have a class surface type (note: this example is omitted from the drawing).
如第2至4圖所示，其中該低熔點壓合部21係為置入上蓋板10所設面向開設式作業孔11中且抵靠在下蓋板20內面上的一實心金屬柱體構成型態者。 As shown in FIGS. 2 to 4 , the low melting point nip 21 is a solid metal cylinder placed in the open working hole 11 and facing the inner surface of the lower cover 20 . Form the type.
如第5圖所示，其中該低熔點壓合部21係為藉由該下蓋板20結構本身一體式沖壓成型的中空凸部91構成型態者。本例中，該低熔點壓合部21上端的熔融受壓部22熱壓熔融擴大並硬化(如第6圖所示)時，同樣能夠將該面向開設式作業孔11加以封閉密合。 As shown in Fig. 5, the low-melting-point nip portion 21 is formed by a hollow convex portion 91 integrally formed by the structure of the lower cover 20 itself. In this example, when the molten pressure-receiving portion 22 at the upper end of the low-melting-point nip portion 21 is expanded and hardened by heat pressing (as shown in Fig. 6), the open-faced working hole 11 can be closed and sealed.
再就本發明均溫板A之封口方法C而言，請參第7圖所示，其較佳實施例係包括下述步驟： 製備一上蓋板10以及一下蓋板20；(如第7圖之(a)所示) For the sealing method C of the temperature equalizing plate A of the present invention, please refer to FIG. 7, and the preferred embodiment includes the following steps: Preparing an upper cover 10 and a lower cover 20; (as shown in Figure 7 (a))
通過一沖孔手段50於上蓋板10一處成型一面向開設式作業孔11，且所述面向開設式作業孔11內為一體式形成有一延伸管部12之型態者；(如第7圖之(b)所示) Forming an open-faced working hole 11 in the upper cover 10 by a punching means 50, and forming an extended tubular portion 12 integrally formed in the open-faced working hole 11; Figure (b))
通過一環狀壓合手段60將該上蓋板10與下蓋板20的周邊加以壓合固定，使上、下蓋板10、20之間內部形成有封閉狀態之一中空腔室30，且上蓋板10與下蓋板20係藉由一環狀壓合邊40相結合固定；(如第7圖之(c)所示) The upper cover 10 and the periphery of the lower cover 20 are press-fitted and fixed by an annular pressing means 60, so that a hollow chamber 30 is formed in the closed state between the upper and lower covers 10, 20, and The upper cover 10 and the lower cover 20 are fixed by a ring-shaped pressing edge 40; (as shown in FIG. 7(c))
通過一抽真空注液手段70，由該面向開設式作業孔11對中空腔室30內進行抽吸成真空狀態以及注入工作液71之作業；(如第7圖之(d)所示，其中該抽真空、注入工作液二者之作業先後順序並無侷限。) The operation of sucking the vacuum chamber into the hollow chamber 30 and injecting the working fluid 71 from the open working hole 11 by a vacuum injecting means 70; (as shown in (d) of FIG. 7 There is no limitation on the order of operation of vacuuming and injecting working fluid.)
由該面向開設式作業孔11中置入一實心金屬柱體，且令該實心金屬柱體的材質熔點低於上蓋板10的材質熔點而構成一低熔點壓合部21，該低熔點壓合部21與面向開設式作業孔11內的延伸管部12之間形成有間隔空間，且令該低熔點壓合部21上端之一熔融受壓部22向上凸伸至面向開設式作業孔11的上端處；(如第7圖之(e)所示) A solid metal cylinder is placed in the open-faced working hole 11 and the material melting point of the solid metal cylinder is lower than the melting point of the material of the upper cover 10 to form a low melting point nip 21, which has a low melting point pressure. A space is formed between the joint portion 21 and the extension pipe portion 12 facing the open operation hole 11, and one of the upper ends of the low-melting-point nip portion 21 is convexly protruded from the pressure-receiving portion 22 to face the open working hole 11 At the upper end; (as shown in Figure 7 (e))
通過一熱壓手段80令該熔融受壓部22熱壓熔融擴大並硬化，以將該面向開設式作業孔11加以封閉密合。(如第7圖之(f)所示) The molten pressure receiving portion 22 is expanded and hardened by hot pressing and melting by a hot pressing means 80 to close and close the open-faced working hole 11. (as shown in Figure 7 (f))
又本發明均溫板A之封口方法C另一較佳實施例請參第8圖所示，係包括下述步驟：製備一上蓋板10以及一下蓋板20，且令該下蓋板20的材質熔點低於上蓋板10的材質熔點；(如第8圖之(a)所示) Another preferred embodiment of the sealing method C of the temperature equalizing plate A of the present invention, as shown in FIG. 8, includes the following steps: preparing an upper cover 10 and a lower cover 20, and making the lower cover 20 The melting point of the material is lower than the melting point of the material of the upper cover 10; (as shown in (a) of Fig. 8)
通過一沖孔手段50於上蓋板10一處成型一面向開設式作業孔11，且所述面向開設式作業孔11內為一體式形成有一延伸管部12之型態者；(如第8圖之(b)所示) Forming an open working hole 11 in the upper cover 10 by a punching means 50, and forming an extended pipe portion 12 integrally formed in the open working hole 11; Figure (b))
通過一沖壓手段90於下蓋板20一處成型一中空凸部91而構成一低熔點壓合部21，該低熔點壓合部21上端具一熔融受壓部22；(如第8圖之(c)所示) Forming a hollow convex portion 91 at a position of the lower cover 20 by a punching means 90 to form a low melting point nip portion 21 having a molten pressure receiving portion 22 at the upper end of the low melting point nip portion 21 (as shown in Fig. 8) (c) shown)
通過一環狀壓合手段60將該上蓋板10與下蓋板20的周邊加以壓合固定，使上、下蓋板10、20之間內部形成有封閉狀態之一中空腔室30，上蓋板10與下蓋板20係藉由一環狀壓合邊40相結合固定；且令該低熔點壓合部21上端之熔融受壓部22向上凸伸至面向開設式作業孔11的上端處，該低熔點壓合部21與面向開設式作業孔11內的延伸管部12之間形成有間隔空間；(如第8圖之(d)所示) The upper cover 10 and the periphery of the lower cover 20 are press-fitted and fixed by an annular pressing means 60, so that a hollow chamber 30 is formed in the closed state between the upper and lower covers 10, 20, The cover plate 10 and the lower cover 20 are fixed by a ring-shaped press-fit edge 40; and the molten pressure-receiving portion 22 at the upper end of the low-melting-point nip portion 21 is protruded upward to the upper end facing the open working hole 11. Wherein, a space is formed between the low-melting-point nip portion 21 and the extension pipe portion 12 facing the open working hole 11; (as shown in (d) of FIG. 8)
通過一抽真空注液手段70，由該面向開設式作業孔11對中空腔室30內進行抽吸成真空狀態以及注入工作液71之作業；(如第8圖之(e)所示) The operation of drawing the vacuum into the hollow chamber 30 and injecting the working fluid 71 from the open working hole 11 by a vacuum injecting means 70; (as shown in FIG. 8(e))
通過一熱壓手段80令該熔融受壓部22熱壓熔融擴大並硬化，以將該面向開設式作業孔11加以封閉密合。(如第8圖之(f)所示) The molten pressure receiving portion 22 is expanded and hardened by hot pressing and melting by a hot pressing means 80 to close and close the open-faced working hole 11. (as shown in Figure 8 (f))
本發明之優點說明：本發明所揭「均溫板之封口結構及封口方法」主要藉由前述創新獨特結構型態與方法之技術特徵，使本發明對照【先前技術】所提習知技術而言，能夠達到的優點係包括： Advantages of the Invention: The "sealing structure and sealing method of the uniform temperature plate" disclosed in the present invention mainly utilizes the technical features of the aforementioned innovative unique structural patterns and methods, so that the present invention is compared with the prior art proposed by the prior art. The advantages that can be achieved include:
1、由於本發明中用以供對中空腔室進行抽真空、注液作業用之通道係藉由設於上蓋板板面的面向開設式作業孔來達成，因此上、下蓋板周邊不必形成缺口，可製成環狀結合封閉之理想型態，藉此使得內部中空腔室的真空狀態不易破損而能夠達到長久保持、使用壽命延長之優點。 1. Since the passage for vacuuming and filling the hollow chamber in the present invention is achieved by the open-faced working hole provided on the upper cover plate surface, the periphery of the upper and lower covers is not necessary. The formation of the notch can be made into an ideal shape of the annular joint closure, whereby the vacuum state of the inner hollow chamber is not easily broken, and the advantages of long-term retention and long service life can be achieved.
2、由於其面向開設式作業孔係位於上蓋板板面的面向設置型態，如此相對於習知側向缺口之開口型態而言， 能夠達到更加符合相關加工設備的機構較佳動線之優點。 2. Because it faces the open-type working hole in the facing type of the upper cover plate surface, so compared with the open type of the conventional lateral notch, It can achieve the advantages of better moving lines that are more in line with the relevant processing equipment.
3、藉由該低熔點壓合部的設置，於完成抽真空及注液等步驟後，得以通過熱壓手段將該低熔點壓合部熔融即可封閉面向開設式作業孔，故無須使用焊料焊接封閉，藉此而能夠達到製造工序更簡化，且無焊料污染問題而更符合環保訴求之優點。 3. By the installation of the low melting point nip, after the steps of vacuuming and liquid injection, the low melting point nip can be melted by hot pressing to close the open working hole, so solder is not required. The welding is closed, thereby achieving a more simplified manufacturing process and no solder contamination problem, and is more in line with the advantages of environmental protection.
上述實施例所揭示者係藉以具體說明本發明，且文中雖透過特定的術語進行說明，當不能以此限定本發明之專利範圍；熟悉此項技術領域之人士當可在瞭解本發明之精神與原則後對其進行變更與修改而達到等效之目的，而此等變更與修改，皆應涵蓋於如后所述之申請專利範圍所界定範疇中。 The above embodiments are intended to be illustrative of the present invention, and are not to be construed as limiting the scope of the invention. The principles are changed and modified to achieve an equivalent purpose, and such changes and modifications are to be included in the scope defined by the scope of the patent application as described later.
10‧‧‧上蓋板 10‧‧‧Upper cover
11‧‧‧面向開設式作業孔 11‧‧‧ facing open working holes
12‧‧‧延伸管部 12‧‧‧Extension tube
20‧‧‧下蓋板 20‧‧‧Under cover
21‧‧‧低熔點壓合部 21‧‧‧Low melting point nip
22‧‧‧熔融受壓部 22‧‧‧melting pressure department
30‧‧‧中空腔室 30‧‧‧ hollow room
40‧‧‧環狀壓合邊 40‧‧‧ annular pressing edge
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| TW103104839A TWI517927B (en) | 2014-02-14 | 2014-02-14 | Sealing structure and sealing method of temperature plate |
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| TW103104839A TWI517927B (en) | 2014-02-14 | 2014-02-14 | Sealing structure and sealing method of temperature plate |
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| TWI517927B TWI517927B (en) | 2016-01-21 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106052440A (en) * | 2016-07-29 | 2016-10-26 | 苏州聚力电机有限公司 | Sealing structure for vapor chamber |
| CN106091769A (en) * | 2016-07-29 | 2016-11-09 | 苏州聚力电机有限公司 | Slimming heat conducting device |
| CN106091760A (en) * | 2016-07-29 | 2016-11-09 | 苏州聚力电机有限公司 | A kind of enclosuring structure of temperature-uniforming plate |
| CN106152848A (en) * | 2016-07-29 | 2016-11-23 | 苏州聚力电机有限公司 | Slimming heat conducting device manufacture method |
| CN106225533A (en) * | 2016-07-29 | 2016-12-14 | 苏州聚力电机有限公司 | The mouth-sealing method of temperature-uniforming plate |
| CN106225538A (en) * | 2016-07-29 | 2016-12-14 | 苏州聚力电机有限公司 | A kind of slimming heat conducting device manufacture method |
| CN106225532A (en) * | 2016-07-29 | 2016-12-14 | 苏州聚力电机有限公司 | A kind of mouth-sealing method of temperature-uniforming plate |
Families Citing this family (1)
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| TWI874126B (en) * | 2024-01-18 | 2025-02-21 | 高柏科技股份有限公司 | Vapor chamber sealing structure and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106052440A (en) * | 2016-07-29 | 2016-10-26 | 苏州聚力电机有限公司 | Sealing structure for vapor chamber |
| CN106091769A (en) * | 2016-07-29 | 2016-11-09 | 苏州聚力电机有限公司 | Slimming heat conducting device |
| CN106091760A (en) * | 2016-07-29 | 2016-11-09 | 苏州聚力电机有限公司 | A kind of enclosuring structure of temperature-uniforming plate |
| CN106152848A (en) * | 2016-07-29 | 2016-11-23 | 苏州聚力电机有限公司 | Slimming heat conducting device manufacture method |
| CN106225533A (en) * | 2016-07-29 | 2016-12-14 | 苏州聚力电机有限公司 | The mouth-sealing method of temperature-uniforming plate |
| CN106225538A (en) * | 2016-07-29 | 2016-12-14 | 苏州聚力电机有限公司 | A kind of slimming heat conducting device manufacture method |
| CN106225532A (en) * | 2016-07-29 | 2016-12-14 | 苏州聚力电机有限公司 | A kind of mouth-sealing method of temperature-uniforming plate |
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