CN105318756A - Ultrathin uniform temperature plate and manufacturing method thereof - Google Patents
Ultrathin uniform temperature plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN105318756A CN105318756A CN201410418065.8A CN201410418065A CN105318756A CN 105318756 A CN105318756 A CN 105318756A CN 201410418065 A CN201410418065 A CN 201410418065A CN 105318756 A CN105318756 A CN 105318756A
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- viscose
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 61
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 238000005245 sintering Methods 0.000 claims abstract description 23
- 238000010521 absorption reaction Methods 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 7
- 239000000428 dust Substances 0.000 claims description 60
- 229920000297 Rayon Polymers 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 13
- 238000004080 punching Methods 0.000 claims description 10
- 238000004026 adhesive bonding Methods 0.000 claims description 9
- 239000011800 void material Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000007872 degassing Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000009833 condensation Methods 0.000 abstract description 2
- 230000005494 condensation Effects 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 4
- 239000012071 phase Substances 0.000 description 3
- 239000013589 supplement Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Abstract
An ultra-thin vapor chamber, comprising: a first plate and a second plate, a chamber being formed between the first plate and the second plate; wherein one of the first plate or the second plate defines a heat absorption region and a condensation region; at least one capillary tissue positioned in the cavity and sintered on a part of the surface of at least one of the first plate or the second plate, wherein at least one space part is formed at the part where the at least one capillary tissue is not sintered; and an actuating fluid filled in the chamber. The manufacturing method of the ultrathin uniform temperature plate mainly comprises the steps of arranging adhesive on a first plate or a second plate by matching with a jig, further adhering metal powder, combining the first plate and the second plate after sintering, welding, injecting working fluid, vacuumizing, sealing and the like, and then finishing the ultrathin uniform temperature plate.
Description
Technical field
The present invention is relevant with heat abstractor, refers to a kind of ultra-thin temperature-uniforming plate and manufacture method thereof especially.
Background technology
U.S. US2013/0022312 patent, discloses a kind of temperature-uniforming plate manufacturing process (vaporchambercapillaryformationmethod), comprises step (a) to step (e).Step (a) provides a substrate (baseplate) (figure number 10) and a corresponding cover plate (coverplate) (figure number 20).Step (b) forms several support convex (apluralityofsupportprotrusions) (figure number 30) at this substrate or at the inwall of this cover plate.Capillary structure (capillarystructure) (figure number 40) is coated on the inwall of the surface of this several support convex, the inwall of this substrate and this cover plate by step (c).Stacked and the hermetic sealing substrate of step (d) and cover plate are each other to form a chamber (cavity) (figure number 100).Step (e) filling is made hydrodynamic (workingfluid) (figure number 50) and is entered in chamber, and in the chamber vacuumizing and seal.In addition, this capillary structure can directly be formed at the inwall of housing of temperature-uniforming plate, and the productive rate of support strength and temperature-uniforming plate is improved.
This capillary structure aforementioned is coated on the surface of this several support convex.Because namely the thickness itself of these several support convex thickness and this capillary structure have suitable thickness, under such basis, namely the thickness of this temperature-uniforming plate cannot more reduce again, that is aforementioned prior art there is no method and is made into ultra-thin temperature-uniforming plate.
Summary of the invention
Main purpose of the present invention is to provide a kind of ultra-thin temperature-uniforming plate, structurally not there is the protuberance structure that conventional prior art uses, and only have the spatial portion formed between capillary structure and metal dust be made up of metal dust, namely form ultra-thin temperature-uniforming plate by this.
Edge is, according to the ultra-thin temperature-uniforming plate of one provided by the present invention, includes: one first plate; One second plate, corresponding in conjunction with this first plate, and a commissura is formed in around, form a socket again in this commissura, and this commissura and the soldered sealing of this socket, form a chamber between this first plate and this second plate; Wherein, this first plate or one of them definition of this both the second plate have a heat absorption district and a condensing zone; At least one capillary structure, be positioned at this chamber, and being sintered in the local on this first plate or this both the second plate at least surface of one of them, namely the position not sintering this at least one capillary structure is formed with at least one spatial portion, and this at least one spatial portion is positioned at this condensing zone; And one makes hydrodynamic, insert in this chamber.
The ultra-thin temperature-uniforming plate of above structure, it only has the spatial portion that formed between capillary structure and metal dust that metal dust forms, and therefore can form ultra-thin temperature-uniforming plate.
Of the present invention time an object is the manufacture method providing a kind of ultra-thin temperature-uniforming plate, and it can produce the thinner ultra-thin temperature-uniforming plate of more existing prior art.
Edge is, according to the manufacture method of a kind of ultra-thin temperature-uniforming plate provided by the present invention, includes the following step: purchase: purchase one first plate and one second plate; Place tool: this first plate or this both the second plate at least one of them one a tool is set on the surface, this tool is formed with at least one void region; Gluing: viscose is applied to this first plate or this second plate of being placed with this tool, makes viscose be coated on the local of this first plate or this second plate via this at least one void region; Take off tool: take off this tool in this first plate or this second plate, and namely the position scribbling this viscose on this first plate or this second plate is defined as at least one viscose region, namely the position not scribbling this viscose is defined as at least one without viscose region; Stick metal dust: metal dust is spilt this first plate or this second plate in being provided with this viscose, namely this metal dust is attached to this at least one viscose region by this viscose, and namely this at least one metal dust without viscose region is not sticked; Remove metal dust: do not removed on this first plate or this second plate by the metal dust sticked; First sintering: will this first plate of having this metal dust be sticked or this second plate sinters, this viscose evaporates loss after sintering, namely this metal dust after sintering forms at least one capillary structure on this first plate or this second plate, and this is because form at least one spatial portion without metal dust relative to this at least one capillary structure without viscose region; Combination: this first plate and this second plate are combined and form a composition, the periphery of said composition forms a commissura, and forms a socket again in this commissura; Welding: the commissura of said composition is applied solder, and gives welded seal; Hydrodynamic is made in injection: inject and make hydrodynamic; Vacuumize: degasification vacuumizes; And sealing: close this socket.。
Above step, after the present invention mainly sticks metal dust by viscose, is directly sintered and is formed ultra-thin capillary structure, and do not use conventional prior art to use the technological means of protuberance, therefore can produce ultra-thin temperature-uniforming plate, its thickness can be very thin.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of the present invention first preferred embodiment.
Fig. 2 is the combination schematic diagram of the present invention first preferred embodiment.
Fig. 3 is another visual angle combination schematic diagram of the present invention first preferred embodiment.
Fig. 4 is the profile along 4-4 hatching line in Fig. 2, the internal state of display finished product.
Fig. 5 is the flow chart of steps of the present invention second preferred embodiment.
Fig. 6 is the action schematic diagram of the present invention second preferred embodiment, and display tool places the state before the first plate.
Fig. 7 is the action schematic diagram of the present invention second preferred embodiment, and display tool places the state on the first plate.
Fig. 8 is the action schematic diagram of the present invention second preferred embodiment, and display tool is positioned at the state the first plate completing gluing.
Fig. 9 is the action schematic diagram of the present invention second preferred embodiment, shows by the state of the first plate taking off tool.
Figure 10 is the action schematic diagram of the present invention second preferred embodiment, and display spills metal dust in the state of the first plate.
Figure 11 is the action schematic diagram of the present invention second preferred embodiment, and the state of the metal dust do not sticked on the first plate is removed in display.
Figure 12 is the action schematic diagram of the present invention second preferred embodiment, and display capillary structure is sintered in the state of the first plate.
Figure 13 is the action schematic diagram of the present invention second preferred embodiment, shows the state after the first plate punching press.
Figure 14 is the action schematic diagram of the present invention second preferred embodiment, shows the first plate and the second plate assembled state.
Figure 15 is another visual angle combination schematic diagram of the present invention second preferred embodiment, shows the first plate and the second plate assembled state.
Figure 16 is the combination schematic diagram of the present invention second preferred embodiment, and the state of gas removing pipe is put in display.
Figure 17 is the profile along 17-17 hatching line in Figure 16, the internal state of display finished product.
Figure 18 is the action schematic diagram of the present invention second preferred embodiment, and display spills metal dust in the state of the first plate of not taking off tool
Detailed description of the invention
In order to describe technical characterstic place of the present invention in detail, hereby lift following preferred embodiment and coordinate graphic explanation as after, wherein:
Refer to Fig. 1 to 4, the present invention first preferred embodiment provides a kind of ultra-thin temperature-uniforming plate 200, makes hydrodynamic (not shown) formed primarily of one first plate 20,1 second plate 30, capillary structure 50, gas removing pipe 80 and one, wherein:
This first plate 20 is corresponding in conjunction with this second plate 30, and form a commissura 71 around, to stretch out again formation one socket 60 in this commissura 71, and the soldered sealing of this commissura 71, form a chamber A (being shown in Fig. 4) between this first plate 20 and this second plate 30.
Wherein, this first plate 20 or one of them definition of this both the second plate 30 have heat absorption district 21 and a condensing zone 22, are located at this first plate 20 in the present embodiment for this heat absorption district 21 and this condensing zone 22.
This capillary structure 50 is positioned at this chamber A, and is sintered in the local on this first plate 20 surface, and namely the position not sintering this capillary structure 50 is formed with at least one spatial portion 51, and this at least one spatial portion 51 is several in the present embodiment, and is positioned at this condensing zone 22.Some spatial portions 51 are had spatially to be connected in those spatial portions 51.In this first embodiment, this at least one capillary structure 50 is extended with several first extension 52 to district 21 of should absorbing heat to this condensing zone 22, and has this spatial portion 51 between the first extension 52 between two.In addition, outwards extend in parallel several second extension 53 by each this first extension 52, have this spatial portion 51 between the second extension 53 or between this second extension 53 and this first extension 52 between two.Surrounding's bending of this second plate 30 and form a kink 33, and clamp the periphery of this first plate 20 and form sandwich relationship.As for aforementioned first extension 52 and the second extension 53 possible variation pattern quantitatively and on arranging, take off in the first embodiment before being illustrated in, hold not give again in this repeating.
This gas removing pipe 80 is inserted in this socket 60 and outer end is exposed, and communicates with this chamber A, and the outer end of this gas removing pipe 80 is closed.Should be noted that, this gas removing pipe 80 non-essential element, in the occasion of not this gas removing pipe 80, directly seal this socket 60.
This inserts in this chamber A as hydrodynamic, because this is the known element of art person as hydrodynamic, and is difficult to, in graphic middle display, therefore, not represent in the drawings.
Aforementioned structure is only with this two plate 20, and it is example explanation that the plate in 30 is provided with the state that another plate of capillary structure 50 then contacts with this capillary structure 50.On the implementation, also can be that another plate does not contact and a preset distance of being separated by with capillary structure 50, or two plates 20,30 are all provided with capillary structure 50 and contact or a preset distance of being separated by with its capillary structure 50, because foregoing structure can be understood by this first embodiment, therefore, no longer with graphic representation it.
Be explained above the structure of the present invention first preferred embodiment, next the using state of the present invention first preferred embodiment is described.
Refer to Fig. 1 and Fig. 4, when non-duty, make hydrodynamic (not shown) and excused by absorbing in this capillary structure 50.Operationally, after a heating source (not shown) heating corresponds to the capillary structure 50 in the heat absorption district 21 of this first plate 20, this is made hydrodynamic and can evaporate and be vapour phase, and in vapour phase do hydrodynamic via this at least one spatial portion 51 be spread in should the first plate 20 condensing zone 22 this several spatial portion 51 in, through supercooling, condensation forms liquid phase, and again absorb by this capillary structure 50, and be back to the capillary structure 50 being arranged in this thermal treatment zone again.By this, this is made hydrodynamic and by the change between liquid phase and vapour phase to conduct heat energy, and can reach the effect of samming heat conduction.
As from the foregoing, the attainable effect of first embodiment of the invention is: its thickness ultrathin, solves the problem that the temperature-uniforming plate thickness of prior art is thicker, and then has higher application.
Referring again to Fig. 5 to Figure 18, the manufacture method of the ultra-thin temperature-uniforming plate that the present invention second preferred embodiment provides, includes the following step:
A) purchase: purchase one first plate 20 and one second plate 30.Wherein, Fig. 6 only shows the first plate 20, second plate 30 and refers to Figure 15.
B) place tool: as shown in FIG. 6 and 7, this first plate 20 or this both the second plate 30 at least one of them one a tool 10 is set on the surface, this tool 10 is formed with at least one void region 11.In the present embodiment, this at least one void region 11 is for one, but this at least one void region 11 optionally can also change most into.In addition, this first plate 20 is arranged at for this tool 10 in the present embodiment.But also can all put this tool 10 on this first plate 20 and this second plate 30, be not arranged on this first plate 20 or this second plate 30 only there to be a tool 10 and be limited, because aforementioned manner can be understood by this second embodiment, therefore, no longer with graphic representation it.
C) gluing: as shown in Figure 8, is applied to this first plate 20 being placed with this tool 10 by viscose 40, make this viscose 40 be coated on the local surfaces of this first plate 20 via the void region 11 of this tool 10.When this first plate 20 and this second plate 30 are equipped with this tool 10, namely representative need carry out gluing to this two plate 20,30, and wherein, the mode of gluing can be coating or sprays or other known gluing modes.
D) take off tool: as shown in Figure 9, take off this tool 10 from this first plate 20, and namely the position scribbling this viscose 40 on this first plate 20 is defined as at least one viscose region 41, namely the position not scribbling this viscose 40 is defined as at least one without viscose region 42.In the present embodiment, quantitatively define a viscose region 41 and several without viscose region 42.When this two plate 20,30 all has this tool 10, namely need this two plate 20, the tool 10 on 30 takes off.
E) sticking metal dust: as shown in Figure 10, metal dust 43 being spilt this first plate 20 in being provided with this viscose 40, namely this metal dust 43 be positioned on this viscose region 41 is sticked, and namely these are several is not sticked without the metal dust 43 on viscose region 42.Must remark additionally, this metal dust 43 compacting can also flatten with a top pressure tool (not shown) by the metal dust 43 sticked, and makes to be formed between metal dust 43 to arrange stack states more closely.When this two plate 20,30 all has viscose 40, namely this step of sticking metal dust needs to implement this two plate 20,30.In the present embodiment, this metal dust 43 is for copper powder.
F) metal dust is removed: as shown in figure 11, removed by the metal dust 43 that this first plate 20 does not stick.On the implementation, this first plate 20 can be overturn the metal dust 43 making not stick down to drop.When this two plate 20,30 all sticks metal dust 43, namely this step removing metal dust needs to implement this two plate 20,30.
G) first sintering: as shown in Figure 10 and Figure 12, this first plate 20 of this metal dust 43 is had to sinter by sticking, this viscose 40 evaporates loss after sintering, namely this metal dust 43 after sintering forms at least one capillary structure 50 on this first plate 20, this namely because form at least one spatial portion 51 without metal dust relative to this at least one capillary structure 50, has some spatial portions 51 to be spatially connected in this at least one spatial portion 51 without viscose region 42.In this second embodiment, this at least one spatial portion 51 is for several, but this at least one spatial portion 51 quantity also can be one, is not restriction with several.This first plate 20 or one of them definition of this both the second plate 30 have heat absorption district 21 and a condensing zone 22 (being shown in Fig. 6), and this at least one spatial portion 51 is positioned at this condensing zone 22.In the present embodiment, this at least one capillary structure 50 extends several first extension 52 by this heat absorption district 21 to this condensing zone 22, and outwards extend in parallel several second extension 53 by some first extension 52 in each this first extension 52 or this several first extension 52 again, between two between the first extension 52 or between two between the second extension 53 or be have this spatial portion 51 between this second extension 53 and this first extension 52.Supplement a bit more in addition, this at least one capillary structure 50 also can extend several first extension 52 by this heat absorption district 21 to this condensing zone 22, and no longer extends the second extension 53, and still has this spatial portion 51 between two between the first extension 52; In addition, this at least one capillary structure 50 also can extend single the first extension 52 by this heat absorption district 21 to this condensing zone 22, more several or single the second extension 53 that stretch out in this first extension 52.Because foregoing structure can be understood by this second embodiment, therefore, no longer with graphic representation it.This two plate 20,30 all stick have metal dust 43 time, namely this first sintering step needs to implement this two plate 20,30, and then namely at this two plate 20, can all form this capillary structure 50 on 30.
H) punching press: as shown in figure 13, to this first plate 20 or this both the second plate 30, one of them carries out punching press.In this second embodiment, punching press is carried out to this first plate 20, makes this first plate 20 surrounding be stamped form a wall 23.
I) combine: as shown in Figure 14 to Figure 15, this first plate 20 is combined with this second plate 30, and then forms a composition 70, surrounding's formation one commissura 71 of said composition 70, and form an outward extending socket 60 again in this commissura 71.In addition, this second plate 30 contacts with the capillary structure 50 on this first plate 20.In the present embodiment, a kink 33 being formed to the bending of this second plate 30 surrounding, when combining this first plate 20 with this second plate 30, forming sandwich relationship by this kink 33 clamps the periphery of this first plate 20; In fact, this kink 33 also can be formed at this first plate 20, and clamps the periphery of this second plate 30, that is this kink 33 is not limited to be formed at this second plate 30.Must remark additionally, the punching press of this first plate 20 and this second plate 30 and the relation of bending also can be contrary, that is, bend this first plate 20 this second plate 30 punching press.Must supplement a bit, in this combination step, this second plate 30 also can be separated by with the capillary structure 50 on this first plate 20 preset distance, is not limited with contact.Supplement a bit more in addition, at this two plate 20,30 have one this capillary structure 50 when, this two plate 20,30 combined time, also can directly make this two capillary structure 50 contact or a preset distance of being separated by, because foregoing structure can be understood by this second embodiment, therefore, no longer with graphic representation it.
J) second time sintering: said composition 70 is sintered.
K) put into gas removing pipe: as shown in figure 16, insert a gas removing pipe 80 in this socket 60.
L) weld: the commissura 71 of said composition 70 is applied solder, and apply solder (not shown) between this gas removing pipe 80 and this socket 60, and give welded seal.
M) hydrodynamic is made in injection: inject and make hydrodynamic
N) vacuumize: degasification vacuumizes; And
O) seal: close this gas removing pipe 80.So far, namely complete the ultra-thin temperature-uniforming plate of the present embodiment, its internal state as shown in figure 17.
It is worth mentioning that, above-mentioned d) step of taking off tool and e) sticking metal dust also can exchange mutually.As shown in figure 18, formerly carry out this when sticking metal dust step, this metal dust 43 is spilt this first plate 20 or this second plate 30 in being provided with this viscose 40, namely this metal dust 43 is attached to this first plate 20 or this second plate 30 by this viscose 40; Then when carrying out this and taking off tool step, it takes off this tool 10 in this first plate 20 or this second plate 30, and on this first plate 20 or this second plate 30, form at least one viscose region 41 and at least one without viscose region 42, now metal dust 43 has attached on this at least one viscose region 41.Due to this kind exchange step can be understood by previous embodiment, therefore no longer with graphic representation it.
What must give explanation again is, it is aforesaid that k) to put into gas removing pipe step be can optionally by it abridged, welding manner in l) welding step then changes into and only welds this commissura 71, in o) step, then change this socket 60 closed into, this be mainly used for illustrating not have under situation k) putting into gas removing pipe step can also completing steps l) ~ o) and action.In addition, aforementioned h) punching press and j) second time sintering step, punching press is in order to the combination of two plates done, therefore, if use other modes to combine, then the technological means of punching press may can not be used, that is aforesaid punch steps is not the necessary technology means of this case.And second time sintering step, be also mainly to make the structure in said composition 70 more stable, likely optionally and by it omission on reality is implemented.
As from the foregoing, previous building methods, is, after being first painted with this viscose 40, being spilt on this viscose 40 by this metal dust 43, then carry out sintering step, can produces this capillary structure 50.This kind of use is spilt metal dust 43 on viscose 40, is sintered formation capillary structure, and on the first plate 20 or the second plate 30, do not have the position of capillary structure 50 to form the mode of spatial portion 51, very thin capillary structure 50 can be produced, therefore the temperature-uniforming plate made by the present invention, the capillary structure 50 of its inside is very thin, therefore, the ultra-thin temperature-uniforming plate of very thin thickness can be produced.
Claims (19)
1. a ultra-thin temperature-uniforming plate, is characterized in that, includes:
One first plate;
One second plate, corresponding in conjunction with this first plate, and a commissura is formed in around, form a socket again in this commissura, and this commissura and the soldered sealing of this socket, form a chamber between this first plate and this second plate;
Wherein, this first plate or one of them definition of this both the second plate have a heat absorption district and a condensing zone;
At least one capillary structure, be positioned at this chamber, and being sintered in the local on this first plate or this both the second plate at least surface of one of them, namely the position not sintering this at least one capillary structure is formed with at least one spatial portion, and this at least one spatial portion is positioned at this condensing zone; And
One makes hydrodynamic, inserts in this chamber.
2. ultra-thin temperature-uniforming plate according to claim 1, is characterized in that: this at least one capillary structure is positioned at this heat absorption district, and extends to form several first extension to this condensing zone, and has this spatial portion between the first extension between two.
3. ultra-thin temperature-uniforming plate according to claim 1, it is characterized in that: this at least one capillary structure is positioned at this heat absorption district, and extend at least one first extension to this condensing zone, this at least one first extension stretches out at least one second extension, and has this spatial portion between this second extension and this first extension; When this at least one second extension is several, have this spatial portion between the second extension between two; When this at least one first extension is several, at least some first extension among this several first extension is again respectively to this at least one second extension of extension.
4. ultra-thin temperature-uniforming plate according to claim 1, is characterized in that: this at least one capillary structure is quantitatively two, and is sintered in the local on this first plate and this second plate surface respectively, and this two capillary structure contacts or a preset distance of being separated by.
5. ultra-thin temperature-uniforming plate according to claim 1, it is characterized in that: this at least one capillary structure is quantitatively one, and be sintered in this first plate or this second plate one of them, the another one of the plate body that this capillary structure sinters with it contacts or a preset distance of being separated by.
6. ultra-thin temperature-uniforming plate according to claim 1, is characterized in that: this at least one spatial portion is several, and wherein at least some spatial portions are spatially connected.
7. ultra-thin temperature-uniforming plate according to claim 1, is characterized in that: this first plate or this second plate one of them surrounding's bending and form a kink, and clamp the periphery of this first plate or this second plate another one wherein and form sandwich relationship.
8. ultra-thin temperature-uniforming plate according to claim 1, is characterized in that: more include a gas removing pipe, is inserted in this socket and outer end is exposed, and communicates with this chamber, and the outer end of this gas removing pipe is closed.
9. a manufacture method for the ultra-thin temperature-uniforming plate described in manufacturing claims 1, is characterized in that, include the following step:
Purchase: purchase one first plate and one second plate;
Place tool: this first plate or this both the second plate at least one of them one a tool is set on the surface, this tool is formed with at least one void region;
Gluing: viscose is applied to this first plate or this second plate of being placed with this tool, makes viscose be coated on the local of this first plate or this second plate via this at least one void region;
Take off tool: take off this tool in this first plate or this second plate, and namely the position scribbling this viscose on this first plate or this second plate is defined as at least one viscose region, namely the position not scribbling this viscose is defined as at least one without viscose region;
Stick metal dust: metal dust is spilt this first plate or this second plate in being provided with this viscose, namely this metal dust is attached to this at least one viscose region by this viscose, and namely this at least one metal dust without viscose region is not sticked;
Remove metal dust: do not removed on this first plate or this second plate by the metal dust sticked;
First sintering: will this first plate of having this metal dust be sticked or this second plate sinters, this viscose evaporates loss after sintering, namely this metal dust after sintering forms at least one capillary structure on this first plate or this second plate, and this is because form at least one spatial portion without metal dust relative to this at least one capillary structure without viscose region;
Combination: this first plate and this second plate are combined and form a composition, the periphery of said composition forms a commissura, and forms a socket again in this commissura;
Welding: the commissura of said composition is applied solder, and gives welded seal;
Hydrodynamic is made in injection: inject and make hydrodynamic;
Vacuumize: degasification vacuumizes; And
Sealing: close this socket.
10. the manufacture method of ultra-thin temperature-uniforming plate according to claim 9, it is characterized in that: this takes off tool step and sticks metal dust step and can exchange mutually, and change into and first carry out this and stick metal dust and walk rapid ︰ and this metal dust is spilt this first plate or this second plate in being provided with this viscose, namely this metal dust is attached to this first plate or this second plate by this viscose; Then carry out this again and take off tool step: take off this tool in this first plate or this second plate, and on this first plate or this second plate, form at least one viscose region and at least one without viscose region, now metal dust has attached to this at least one viscose region.
The manufacture method of 11. ultra-thin temperature-uniforming plates according to claim 9, is characterized in that: this at least one spatial portion is several, and wherein at least some spatial portions are spatially connected.
The manufacture method of 12. ultra-thin temperature-uniforming plates according to claim 9, it is characterized in that: after this first sintering step, more include a punch steps, to this first plate or this both the second plate, one of them carries out punching press to this punch steps, makes surrounding's formation one wall of the person of being stamped.
The manufacture method of 13. ultra-thin temperature-uniforming plates according to claim 9, is characterized in that: surrounding's bending of this first plate or one of them person of this second plate and form a kink; In this combination step, when combining this first plate and this second plate, be form sandwich relationship by the periphery of this kink clamping another one.
The manufacture method of 14. ultra-thin temperature-uniforming plates according to claim 9, is characterized in that: after this combination step, more include a second time sintering step, this second time sintering step is sintered said composition.
The manufacture method of 15. ultra-thin temperature-uniforming plates according to claim 9, is characterized in that: this first plate or one of them definition of this both the second plate have a heat absorption district and a condensing zone, and this at least one spatial portion is positioned at this condensing zone.
The manufacture method of 16. ultra-thin temperature-uniforming plates according to claim 9, is characterized in that: this at least one capillary structure is positioned at this heat absorption district, and to this condensing zone extend several first extension, and between two between the first extension correspondence have this spatial portion.
The manufacture method of 17. ultra-thin temperature-uniforming plates according to claim 9, it is characterized in that: this at least one capillary structure is positioned at this heat absorption district, and extend at least one first extension to this condensing zone, this at least one first extension stretches out at least one second extension again, has this spatial portion between this second extension and this first extension; When this at least one second extension is several, have this spatial portion between the second extension between two; When this at least one first extension is several, at least some first extension among this several first extension is again respectively to this at least one second extension of extension.
The manufacture method of 18. ultra-thin temperature-uniforming plates according to claim 9, it is characterized in that: in this placement tool, this gluing, this takes off tool, this sticks in metal dust, this removal metal dust and this first sintering step, all this first plate and this both the second plate are carried out placing tool, gluing, the action of taking off tool, sticking metal dust, removing metal dust and first sintering.
The manufacture method of 19. ultra-thin temperature-uniforming plates according to claim 9, is characterized in that: more increase between this combination step and this welding step and put into gas removing pipe step: insert a gas removing pipe to this socket; And in this welding step, be that solder is applied to the commissura of said composition, and between this gas removing pipe and this socket, apply solder, and give welded seal; In this sealing step, be then change this gas removing pipe closed into.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103125191 | 2014-07-22 | ||
| TW103125191A TWI529364B (en) | 2014-07-22 | 2014-07-22 | Ultra - thin temperature plate and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105318756A true CN105318756A (en) | 2016-02-10 |
Family
ID=55246675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410418065.8A Pending CN105318756A (en) | 2014-07-22 | 2014-08-22 | Ultrathin uniform temperature plate and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2016023923A (en) |
| CN (1) | CN105318756A (en) |
| TW (1) | TWI529364B (en) |
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| CN110088556A (en) * | 2017-04-28 | 2019-08-02 | 株式会社村田制作所 | Soaking plate |
| CN110769647A (en) * | 2019-10-22 | 2020-02-07 | 东莞领杰金属精密制造科技有限公司 | Manufacturing method of vapor chamber |
| CN110779367A (en) * | 2019-10-16 | 2020-02-11 | 东莞领杰金属精密制造科技有限公司 | A kind of manufacturing method of soaking plate without water injection port |
| CN110779362A (en) * | 2019-10-16 | 2020-02-11 | 东莞领杰金属精密制造科技有限公司 | A kind of half-shear forming method of soaking plate |
| CN111438353A (en) * | 2019-12-31 | 2020-07-24 | 苏州天脉导热科技股份有限公司 | Forming process of vapor chamber support column |
| CN112503985A (en) * | 2020-12-02 | 2021-03-16 | 深圳垒石热管理技术股份有限公司 | Manufacturing method of temperature-equalizing plate |
| CN114608365A (en) * | 2022-03-31 | 2022-06-10 | 南宁市安和机械设备有限公司 | Uniform-thickness temperature-equalizing plate and preparation method thereof |
| CN115476553A (en) * | 2021-06-16 | 2022-12-16 | 盟立自动化股份有限公司 | Adhesive vapor chamber and manufacturing method thereof |
| TWI813277B (en) * | 2022-05-06 | 2023-08-21 | 邁萪科技股份有限公司 | Vapor chamber with improved fixed structure of exhaust pipe |
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| CN110088557A (en) * | 2016-12-20 | 2019-08-02 | 株式会社藤仓 | Radiating module |
| TWI645152B (en) * | 2017-11-24 | 2018-12-21 | 泰碩電子股份有限公司 | Manufacturing method of temperature-free plate without degassing tube |
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| CN114061346A (en) * | 2020-08-04 | 2022-02-18 | 北京小米移动软件有限公司 | Soaking plate |
| TWI878479B (en) * | 2021-03-04 | 2025-04-01 | 宸寰科技有限公司 | Thin package bonding structure |
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| CN110088556A (en) * | 2017-04-28 | 2019-08-02 | 株式会社村田制作所 | Soaking plate |
| CN110088556B (en) * | 2017-04-28 | 2021-06-25 | 株式会社村田制作所 | Vapor chamber |
| CN110779367A (en) * | 2019-10-16 | 2020-02-11 | 东莞领杰金属精密制造科技有限公司 | A kind of manufacturing method of soaking plate without water injection port |
| CN110779362A (en) * | 2019-10-16 | 2020-02-11 | 东莞领杰金属精密制造科技有限公司 | A kind of half-shear forming method of soaking plate |
| CN110779362B (en) * | 2019-10-16 | 2021-04-20 | 东莞领杰金属精密制造科技有限公司 | A kind of half-shear forming method of soaking plate |
| CN110769647A (en) * | 2019-10-22 | 2020-02-07 | 东莞领杰金属精密制造科技有限公司 | Manufacturing method of vapor chamber |
| CN110769647B (en) * | 2019-10-22 | 2020-10-27 | 东莞领杰金属精密制造科技有限公司 | Manufacturing method of vapor chamber |
| CN111438353A (en) * | 2019-12-31 | 2020-07-24 | 苏州天脉导热科技股份有限公司 | Forming process of vapor chamber support column |
| CN112503985A (en) * | 2020-12-02 | 2021-03-16 | 深圳垒石热管理技术股份有限公司 | Manufacturing method of temperature-equalizing plate |
| CN115476553A (en) * | 2021-06-16 | 2022-12-16 | 盟立自动化股份有限公司 | Adhesive vapor chamber and manufacturing method thereof |
| CN114608365A (en) * | 2022-03-31 | 2022-06-10 | 南宁市安和机械设备有限公司 | Uniform-thickness temperature-equalizing plate and preparation method thereof |
| TWI813277B (en) * | 2022-05-06 | 2023-08-21 | 邁萪科技股份有限公司 | Vapor chamber with improved fixed structure of exhaust pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI529364B (en) | 2016-04-11 |
| JP2016023923A (en) | 2016-02-08 |
| TW201604512A (en) | 2016-02-01 |
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