US20110192576A1 - Vapor chamber and edge-sealing structure thereof - Google Patents
Vapor chamber and edge-sealing structure thereof Download PDFInfo
- Publication number
- US20110192576A1 US20110192576A1 US12/981,392 US98139210A US2011192576A1 US 20110192576 A1 US20110192576 A1 US 20110192576A1 US 98139210 A US98139210 A US 98139210A US 2011192576 A1 US2011192576 A1 US 2011192576A1
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- US
- United States
- Prior art keywords
- folded edge
- cover
- vapor chamber
- edge
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 30
- 239000012530 fluid Substances 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 9
- 238000003825 pressing Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D1/00—Evaporating
- B01D1/22—Evaporating by bringing a thin layer of the liquid into contact with a heated surface
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/04—Fastening; Joining by brazing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/12—Fastening; Joining by methods involving deformation of the elements
Definitions
- the present invention relates to a vapor chamber, and in particular to an edge-sealing structure of a vapor chamber.
- the conventional vapor chamber includes a hollow plate, a wick structure provided in the hollow plate, and a sealing pipe in communication with the interior of the hollow plate.
- the hollow plate is constituted of two separate covers. The periphery of each of the two covers is a sealing edge. The two covers cover to each other and the wick structure is provided on inner walls of the two covers. Then, the sealing edges are sealed by a sealing process.
- a pipe is inserted into a filling port formed between the two cover plates. Through the filling port, a working fluid is filled into the vapor chamber and air inside the vapor chamber is drawn to the outside.
- the sealing edges on the peripheries of the two covers are aligned with each other and then a connecting portion between the two covers is soldered together to thereby seal the edges of the vapor chamber.
- the working fluid is filled into the vapor chamber.
- the working fluid circulates in the vapor chamber for transferring the heat by means of the phase change thereof. Since the interior of the vapor chamber is often subjected to thermal expansion and contraction, the tightness of the sealing edges of the vapor chamber becomes very critical. In order to enhance the tightness of the vapor chamber, the soldering process has to be performed more precisely, which inevitably increases the working hours and cost for manufacturing the vapor chamber.
- the present Inventor proposes a novel and reasonable structure based on his experience and researches.
- the present invention is to provide a vapor chamber, in which the tightness of its sealing edges is enhanced.
- the present invention is to provide a vapor chamber, whereby the production yield is increased and the production cost is reduced.
- the present invention provides a vapor chamber including a first cover, a second cover, a wick structure and a working fluid.
- the periphery of the first cover is bent to form a first folded edge.
- the second cover covers on the first cover.
- the periphery of the second cover is bent to form a second folded edge.
- the second folded edge is superposed on the first folded edge with the first folded edge being bent to cover on the second folded edge.
- the wick structure is arranged inside the first cover and the second cover.
- the working fluid is filled between the first cover and a second cover.
- the present invention is to provide an edge-sealing structure of a vapor chamber, whereby the tightness of the vapor chamber can be enhanced.
- the present invention provides an edge-sealing structure of a vapor chamber, which includes a first cover and a second cover.
- the periphery of the first cover is bent to form a first folded edge.
- the second cover covers on the first cover.
- the periphery of the second cover is bent to form a second folded edge.
- the second folded edge is superposed on the first folded edge with the first folded edge being bent to cover on the second folded edge.
- the present invention has the following advantageous features.
- the length of the first folded edge of the first cover is larger than that of the second folded edge of the second cover.
- the first folded edge is bent to cover atop the second folded edge.
- a pressing die is used to press the first folded edge and the second folded edge, whereby the first folded edge and the second edge can be connected to each other tightly.
- the connecting portion between the first cover and the second cover has an excellent tightness, the air or fluid received in the vapor chamber can be prevented from leaking to the outside through the connecting portion between the first folded edge and the second folded edge.
- the production yield of the present invention is increased while the production cost is reduced. Therefore, the present invention is practicable and cost-effective.
- FIG. 1 is an exploded perspective view showing the vapor chamber of the present invention
- FIG. 2 is an assembled perspective view showing the vapor chamber of the present invention
- FIG. 3 is an assembled cross-sectional view showing the vapor chamber of the present invention
- FIG. 4 is an enlarged view showing the portion A in FIG. 3 ;
- FIG. 5A is a schematic view (I) showing the edge-sealing structure of the vapor chamber of the present invention
- FIG. 5B is a schematic view (II) showing the edge-sealing structure of the vapor chamber of the present invention
- FIG. 5C is a schematic view (III) showing the edge-sealing structure of the vapor chamber of the present invention.
- FIG. 6 is a perspective view showing the external appearance of the vapor chamber of the present invention.
- FIG. 7 is a cross-sectional view taken along the line 7 - 7 in FIG. 6 ;
- FIG. 8 is a schematic view showing a method for sealing edges of a vapor chamber according to a second embodiment of the present invention.
- FIG. 9 is a schematic view showing a method for sealing edges of a vapor chamber according to a third embodiment of the present invention.
- FIG. 1 is an exploded perspective view showing the vapor chamber of the present invention.
- FIG. 2 is an assembled perspective view showing the vapor chamber of the present invention.
- FIG. 3 is an assembled cross-sectional view showing the vapor chamber of the present invention.
- the present invention provides a vapor chamber 1 including a first cover 10 , a second cover 20 , a supporting structure 30 , a wick structure 40 and a working fluid 50 .
- the periphery of the first cover 10 is bent to form a first folded edge 11 .
- the periphery of the second cover 20 is also bent to form a second folded edge 21 .
- the length of the first folded edge 11 is larger than that of the second folded edge 21 .
- the second cover 20 has a sealing pipe 22 .
- each of the first cover 10 and the second cover 20 is a square plate, but it is not limited thereto. In practice, the first cover 10 and the second cover 20 may be formed into other suitable shapes such as a circular plate.
- the supporting structure 30 and the wick structure 40 are provided between the first cover 10 and the second cover 20 .
- the wick structure 40 is arranged inside the first cover 10 and the second cover 20 .
- the supporting structure 30 is configured to support the wick structure 40 to thereby abut against inner walls of the first cover 10 and the second cover 20 .
- the supporting structure 30 is formed into a plate on which a plurality of protrusions 31 and through-holes 32 are provided.
- the through-holes 32 are formed between the protrusions 31 . A portion of the protrusions 31 protrude from one surface of the plate, and another portion of the protrusions 31 protrude from another surface of the plate.
- the second cover 20 covers on the first cover 10 to thereby form a hollow plate body.
- a sealing pipe 22 provided on the second cover 20 is in communication with the interior of the hollow plate body.
- the second folded edge 21 of the second cover 20 is superposed on the first folded edge 11 of the first cover 20 .
- a portion of the first folded edge 11 is bent to abut against the outside of the second folded edge 21 .
- FIG. 4 is an enlarged view showing the portion A in FIG. 3 .
- FIG. 5A is a schematic view (I) showing the edge-sealing structure of the vapor chamber of the present invention.
- FIG. 5B is a schematic view (II) showing the edge-sealing structure of the vapor chamber of the present invention.
- FIG. 5C is a schematic view (III) showing the edge-sealing structure of the vapor chamber of the present invention.
- the first folded edge 11 is bent to cover on the second folded edge 21 .
- a pressing die (not show) is used to press the bent first folded edge 11 , whereby the first folded edge 11 and the second folded edge 21 can be connected to each other tightly.
- a soldering material 50 is disposed in the connecting portion between the first folded edge 11 and the second folded edge 21 . After the soldering material 50 is melted by a soldering process, the molten soldering material 50 is capable of connecting the first folded edge 11 and the second folded edge 21 tightly when it is cooled and hardened.
- FIG. 6 is a perspective view showing the external appearance of the vapor chamber of the present invention.
- FIG. 7 is a cross-sectional view taken along the line 7 - 7 in FIG. 6 .
- a working fluid 60 is filled into the hollow plate body through the sealing pipe 22 . Then, a degassing processing and a pipe-sealing process are formed. In this way, the vapor chamber 1 of the present invention is formed completely.
- FIG. 8 is a schematic view showing a method for sealing edges of a vapor chamber according to a second embodiment of the present invention.
- FIG. 9 is a schematic view showing a method for sealing edges of a vapor chamber according to a third embodiment of the present invention.
- the second embodiment is substantially the same as the first embodiment.
- the difference between the second embodiment and the first embodiment is as follows.
- one side of the second folded edge 21 is provided with a recess 210 and the first folded edge 11 is formed with a protrusion 110 to correspond to the recess 210 of the second folded edge 21 when the pressing die is used to press the first folded edge 11 .
- the first folded edge 11 can be engaged with the second folded edge 21 tightly.
- two opposite sides of the second folded edge 21 are respectively formed with a recess 210 , 211
- both sides of the first folded edge 11 are respectively formed with a protrusion 110 , 111 to correspond to the recess 210 , 211 of the second folded edge 11 .
- the first folded edge 11 can be engaged with the second folded edge 21 tightly.
Abstract
A vapor chamber includes a first cover and a second cover covering on the first cover. The first cover has its periphery bent to form a first folded edge, and the second cover has its periphery bent to form a second folded edge. The second folded edge is superposed on the first folded edge. The first folded edge is bent to cover the second folded edge. A wick structure is arranged inside the first cover and the second cover. A working fluid is filled between the first cover and the second cover. By this structure, the tightness of the sealing edges of the vapor chamber is enhanced. The production yield of the vapor chamber is increased and the production cost is reduced.
Description
- 1. Field of the Invention
- The present invention relates to a vapor chamber, and in particular to an edge-sealing structure of a vapor chamber.
- 2. Description of Prior Art
- The conventional vapor chamber includes a hollow plate, a wick structure provided in the hollow plate, and a sealing pipe in communication with the interior of the hollow plate. The hollow plate is constituted of two separate covers. The periphery of each of the two covers is a sealing edge. The two covers cover to each other and the wick structure is provided on inner walls of the two covers. Then, the sealing edges are sealed by a sealing process. A pipe is inserted into a filling port formed between the two cover plates. Through the filling port, a working fluid is filled into the vapor chamber and air inside the vapor chamber is drawn to the outside.
- Conventionally, the sealing edges on the peripheries of the two covers are aligned with each other and then a connecting portion between the two covers is soldered together to thereby seal the edges of the vapor chamber. Further, the working fluid is filled into the vapor chamber. The working fluid circulates in the vapor chamber for transferring the heat by means of the phase change thereof. Since the interior of the vapor chamber is often subjected to thermal expansion and contraction, the tightness of the sealing edges of the vapor chamber becomes very critical. In order to enhance the tightness of the vapor chamber, the soldering process has to be performed more precisely, which inevitably increases the working hours and cost for manufacturing the vapor chamber.
- In view of the above present, the present Inventor proposes a novel and reasonable structure based on his experience and researches.
- The present invention is to provide a vapor chamber, in which the tightness of its sealing edges is enhanced.
- The present invention is to provide a vapor chamber, whereby the production yield is increased and the production cost is reduced.
- The present invention provides a vapor chamber including a first cover, a second cover, a wick structure and a working fluid. The periphery of the first cover is bent to form a first folded edge. The second cover covers on the first cover. The periphery of the second cover is bent to form a second folded edge. The second folded edge is superposed on the first folded edge with the first folded edge being bent to cover on the second folded edge. The wick structure is arranged inside the first cover and the second cover. The working fluid is filled between the first cover and a second cover.
- The present invention is to provide an edge-sealing structure of a vapor chamber, whereby the tightness of the vapor chamber can be enhanced.
- The present invention provides an edge-sealing structure of a vapor chamber, which includes a first cover and a second cover. The periphery of the first cover is bent to form a first folded edge. The second cover covers on the first cover. The periphery of the second cover is bent to form a second folded edge. The second folded edge is superposed on the first folded edge with the first folded edge being bent to cover on the second folded edge.
- In comparison with prior art, the present invention has the following advantageous features. In the vapor chamber of the present invention, the length of the first folded edge of the first cover is larger than that of the second folded edge of the second cover. When the second cover covers on the first cover, the first folded edge is bent to cover atop the second folded edge. Then, a pressing die is used to press the first folded edge and the second folded edge, whereby the first folded edge and the second edge can be connected to each other tightly. Since the connecting portion between the first cover and the second cover has an excellent tightness, the air or fluid received in the vapor chamber can be prevented from leaking to the outside through the connecting portion between the first folded edge and the second folded edge. Thus, it is unnecessary to perform a soldering process very precisely. The production yield of the present invention is increased while the production cost is reduced. Therefore, the present invention is practicable and cost-effective.
-
FIG. 1 is an exploded perspective view showing the vapor chamber of the present invention; -
FIG. 2 is an assembled perspective view showing the vapor chamber of the present invention; -
FIG. 3 is an assembled cross-sectional view showing the vapor chamber of the present invention; -
FIG. 4 is an enlarged view showing the portion A inFIG. 3 ; -
FIG. 5A is a schematic view (I) showing the edge-sealing structure of the vapor chamber of the present invention; -
FIG. 5B is a schematic view (II) showing the edge-sealing structure of the vapor chamber of the present invention; -
FIG. 5C is a schematic view (III) showing the edge-sealing structure of the vapor chamber of the present invention; -
FIG. 6 is a perspective view showing the external appearance of the vapor chamber of the present invention; -
FIG. 7 is a cross-sectional view taken along the line 7-7 inFIG. 6 ; -
FIG. 8 is a schematic view showing a method for sealing edges of a vapor chamber according to a second embodiment of the present invention; and -
FIG. 9 is a schematic view showing a method for sealing edges of a vapor chamber according to a third embodiment of the present invention. - The detailed description and technical contents of the present invention will become apparent with the following detailed description accompanied with related drawings. It is noteworthy to point out that the drawings is provided for the illustration purpose only, but not intended for limiting the scope of the present invention.
- Please refer to
FIGS. 1 to 3 .FIG. 1 is an exploded perspective view showing the vapor chamber of the present invention.FIG. 2 is an assembled perspective view showing the vapor chamber of the present invention.FIG. 3 is an assembled cross-sectional view showing the vapor chamber of the present invention. The present invention provides avapor chamber 1 including afirst cover 10, asecond cover 20, a supportingstructure 30, awick structure 40 and a workingfluid 50. - The periphery of the
first cover 10 is bent to form a first foldededge 11. The periphery of thesecond cover 20 is also bent to form a second foldededge 21. The length of the first foldededge 11 is larger than that of the second foldededge 21. Thesecond cover 20 has a sealingpipe 22. In the present embodiment, each of thefirst cover 10 and thesecond cover 20 is a square plate, but it is not limited thereto. In practice, thefirst cover 10 and thesecond cover 20 may be formed into other suitable shapes such as a circular plate. - The supporting
structure 30 and thewick structure 40 are provided between thefirst cover 10 and thesecond cover 20. Thewick structure 40 is arranged inside thefirst cover 10 and thesecond cover 20. The supportingstructure 30 is configured to support thewick structure 40 to thereby abut against inner walls of thefirst cover 10 and thesecond cover 20. In the present embodiment, the supportingstructure 30 is formed into a plate on which a plurality ofprotrusions 31 and through-holes 32 are provided. The through-holes 32 are formed between theprotrusions 31. A portion of theprotrusions 31 protrude from one surface of the plate, and another portion of theprotrusions 31 protrude from another surface of the plate. - The
second cover 20 covers on thefirst cover 10 to thereby form a hollow plate body. A sealingpipe 22 provided on thesecond cover 20 is in communication with the interior of the hollow plate body. At the same time, the second foldededge 21 of thesecond cover 20 is superposed on the first foldededge 11 of thefirst cover 20. A portion of the first foldededge 11 is bent to abut against the outside of the second foldededge 21. - Please refer to
FIGS. 4 , 5A, 5B and 5C.FIG. 4 is an enlarged view showing the portion A inFIG. 3 .FIG. 5A is a schematic view (I) showing the edge-sealing structure of the vapor chamber of the present invention.FIG. 5B is a schematic view (II) showing the edge-sealing structure of the vapor chamber of the present invention.FIG. 5C is a schematic view (III) showing the edge-sealing structure of the vapor chamber of the present invention. The first foldededge 11 is bent to cover on the second foldededge 21. A pressing die (not show) is used to press the bent first foldededge 11, whereby the first foldededge 11 and the second foldededge 21 can be connected to each other tightly. In order to enhance the tightness of a connecting portion between the first foldededge 11 and the second foldededge 21. Asoldering material 50 is disposed in the connecting portion between the first foldededge 11 and the second foldededge 21. After thesoldering material 50 is melted by a soldering process, themolten soldering material 50 is capable of connecting the first foldededge 11 and the second foldededge 21 tightly when it is cooled and hardened. - Please refer to
FIGS. 6 and 7 .FIG. 6 is a perspective view showing the external appearance of the vapor chamber of the present invention.FIG. 7 is a cross-sectional view taken along the line 7-7 inFIG. 6 . A workingfluid 60 is filled into the hollow plate body through the sealingpipe 22. Then, a degassing processing and a pipe-sealing process are formed. In this way, thevapor chamber 1 of the present invention is formed completely. - Please refer to
FIGS. 8 and 9 .FIG. 8 is a schematic view showing a method for sealing edges of a vapor chamber according to a second embodiment of the present invention.FIG. 9 is a schematic view showing a method for sealing edges of a vapor chamber according to a third embodiment of the present invention. The second embodiment is substantially the same as the first embodiment. The difference between the second embodiment and the first embodiment is as follows. As shown inFIG. 8 , one side of the second foldededge 21 is provided with arecess 210 and the first foldededge 11 is formed with aprotrusion 110 to correspond to therecess 210 of the second foldededge 21 when the pressing die is used to press the first foldededge 11. With this arrangement, the first foldededge 11 can be engaged with the second foldededge 21 tightly. Further, as shown inFIG. 9 , two opposite sides of the second foldededge 21 are respectively formed with arecess edge 11 are respectively formed with aprotrusion recess edge 11. With this arrangement, the first foldededge 11 can be engaged with the second foldededge 21 tightly. - Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
Claims (10)
1. A vapor chamber, comprising:
a first cover having its periphery bent to form a first folded edge;
a second cover covering on the first cover and having its periphery bent to form a second folded edge, the second folded edge being superposed on the first folded edge with the first folded edge being bent to cover on the second folded edge;
a wick structure arranged inside the first cover and the second cover; and
a working fluid filled between the first cover and the second cover.
2. The vapor chamber according to claim 1 , further comprising a supporting structure for supporting the wick structure to abut against inner walls of the first cover and the second cover.
3. The vapor chamber according to claim 2 , wherein the supporting structure is formed into a plate, the plate is provided thereon with a plurality of protrusions and through-holes, the through-holes are formed between the protrusions, a portion of the protrusions protrude from one surface of the plate, and the other portion of the protrusions protrude from the other surface of the plate.
4. The vapor chamber according to claim 1 , further comprising a soldering material disposed in a connecting portion between the first folded edge and a second folded edge.
5. The vapor chamber according to claim 1 , wherein one side of the second folded edge is provided with a recess, the first folded edge is provided with a protrusion to correspond to the recess of the second folded edge, whereby the first folded edge is tightly engaged with the second folded edge.
6. The vapor chamber according to claim 1 , wherein two opposite sides of the second folded edge are respectively provided with a recess, two opposite sides of the first folded edge are respectively provided with a protrusion to correspond to the recesses of the second folded edge, whereby the first folded edge is tightly engaged with the second folded edge.
7. An edge-sealing structure of a vapor chamber, comprising:
a first cover having its periphery bent to form a first folded edge; and
a second cover covering on the first cover and having its periphery bent to form a second folded edge, the second folded edge being superposed on the first folded edge with the first folded edge being bent to cover on the second folded edge.
8. The edge-sealing structure of a vapor chamber according to claim 7 , further comprising a soldering material disposed in a connecting portion between the first folded edge and the second folded edge.
9. The edge-sealing structure of a vapor chamber according to claim 7 , wherein one side of the second folded edge is provided with a recess, the first folded edge is provided with a protrusion to correspond to the recess of the second folded edge, whereby the first folded edge is tightly engaged with the second folded edge.
10. The edge-sealing structure of a vapor chamber according to claim 7 , wherein two opposite sides of the second folded edge are respectively provided with a recess, two opposite sides of the first folded edge are respectively provided with a protrusion to correspond to the recesses of the second folded edge, whereby the first folded edge is tightly engaged with the second folded edge.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099203018U TWM385203U (en) | 2010-02-11 | 2010-02-11 | Vapor chamber and its edge-sealing structure |
TW099203018 | 2010-02-11 |
Publications (1)
Publication Number | Publication Date |
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US20110192576A1 true US20110192576A1 (en) | 2011-08-11 |
Family
ID=43927453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/981,392 Abandoned US20110192576A1 (en) | 2010-02-11 | 2010-12-29 | Vapor chamber and edge-sealing structure thereof |
Country Status (4)
Country | Link |
---|---|
US (1) | US20110192576A1 (en) |
JP (1) | JP3166803U (en) |
DE (1) | DE202011000089U1 (en) |
TW (1) | TWM385203U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130284395A1 (en) * | 2012-04-27 | 2013-10-31 | Keihin Thermal Technology Corporation | Heat exchanger with thermal storage function and method of manufacturing the same |
DE102014110459A1 (en) | 2014-07-24 | 2016-01-28 | Mahle International Gmbh | Heat exchanger |
US20200200484A1 (en) * | 2018-12-25 | 2020-06-25 | Cooler Master Co.,Ltd. | Vapor chamber and manufacturing method thereof |
US20220390184A1 (en) * | 2019-01-31 | 2022-12-08 | Auras Technology Co., Ltd. | Vapor chamber and heat dissipation device with same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3392906A1 (en) * | 2017-04-19 | 2018-10-24 | Siemens Aktiengesellschaft | Method for producing a cooling plate for a power semiconductor |
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2010
- 2010-02-11 TW TW099203018U patent/TWM385203U/en not_active IP Right Cessation
- 2010-12-29 US US12/981,392 patent/US20110192576A1/en not_active Abandoned
-
2011
- 2011-01-08 JP JP2011000070U patent/JP3166803U/en not_active Expired - Lifetime
- 2011-01-14 DE DE202011000089U patent/DE202011000089U1/en not_active Expired - Lifetime
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US20130284395A1 (en) * | 2012-04-27 | 2013-10-31 | Keihin Thermal Technology Corporation | Heat exchanger with thermal storage function and method of manufacturing the same |
US9511458B2 (en) * | 2012-04-27 | 2016-12-06 | Keihin Thermal Technology Corporation | Heat exchanger with thermal storage function and method of manufacturing the same |
DE102014110459A1 (en) | 2014-07-24 | 2016-01-28 | Mahle International Gmbh | Heat exchanger |
US20200200484A1 (en) * | 2018-12-25 | 2020-06-25 | Cooler Master Co.,Ltd. | Vapor chamber and manufacturing method thereof |
US20220390184A1 (en) * | 2019-01-31 | 2022-12-08 | Auras Technology Co., Ltd. | Vapor chamber and heat dissipation device with same |
US11747092B2 (en) * | 2019-01-31 | 2023-09-05 | Auras Technology Co., Ltd. | Vapor chamber and heat dissipation device with same |
Also Published As
Publication number | Publication date |
---|---|
DE202011000089U1 (en) | 2011-04-28 |
TWM385203U (en) | 2010-07-21 |
JP3166803U (en) | 2011-03-24 |
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