US20090178784A1 - Manufacturing Method of Isothermal Vapor Chamber And Product Thereof - Google Patents

Manufacturing Method of Isothermal Vapor Chamber And Product Thereof Download PDF

Info

Publication number
US20090178784A1
US20090178784A1 US12/014,145 US1414508A US2009178784A1 US 20090178784 A1 US20090178784 A1 US 20090178784A1 US 1414508 A US1414508 A US 1414508A US 2009178784 A1 US2009178784 A1 US 2009178784A1
Authority
US
United States
Prior art keywords
orifice
vapor chamber
plates
plate body
isothermal vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/014,145
Inventor
Chin-Wen Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HYPER-GREEN INDUSTRIAL Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US12/014,145 priority Critical patent/US20090178784A1/en
Assigned to WANG, CHIN-WEN, HYPER-GREEN INDUSTRIAL CO., LTD. reassignment WANG, CHIN-WEN ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WANG, CHIN-WEN
Publication of US20090178784A1 publication Critical patent/US20090178784A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09Heat pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sealing Using Fluids, Sealing Without Contact, And Removal Of Oil (AREA)

Abstract

A manufacturing method of a isothermal vapor chamber and a product thereof are to use an integrated manner to form an orifice directly on a plate body of a isothermal vapor chamber. Through the orifice, the operations of injecting working fluid and degassing or vacuating can be proceeded. The orifice is functionally similar to a degassing tube or a vacuating tube of the prior arts. However, since the orifice is integrated on the plate body of the isothermal vapor chamber body, it can be pressed to seal the isothermal vapor chamber after an operation of degassing. Therefore, the vacuity in the isothermal vapor chamber and the stored amount of the working fluid, and it is easier for manufacture.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention generally relates to a cooling technique, in particular, to a heat pipe.
  • 2. Description of Prior Art
  • An isothermal vapor chamber is a kind of heat pipes formed as a flat plate, which has a similar working principle as a common heat pipe. Namely, through an internal environment of vacuum, a working fluid contained therein can generate a phase change from liquid to vapor for transferring heat from a heated end to a cooling end. The working fluid condenses into liquid phase at the cooling end, flows back to the heated end and repeats the cycle.
  • However, an isothermal vapor chamber is different from a heat pipe in terms of manufacture process. The tube body of a heat pipe is usually formed as a tube configuration, one end of which can be sealed first, then another side of which can be processed with the operations of injecting working fluid and degassing. Immediately after the degassing is finished, the tube body is sealed so as to complete a manufacturing process of a heat pipe. Nonetheless, the plate body of an isothermal vapor chamber is form as a flat plate, which is constructed by closing two plates that are closed up. Not only do the circumferential edges of the closing two plates have to be sealed, but also an injection port has to be pre-made as well, such that it may process aforementioned operations, such as: an injection of working fluid, a de-aeration, or an evacuation, etc. During the manufacturing process of an isothermal vapor chamber according to the prior arts, a de-aerating tube or an evacuating tube has to be inserted into the injection port first, such that it is possible to process the operations of an injection of working fluid, a de-aeration, and an evacuation. After aforementioned operations are finished, the de-aerating tube or the evacuating tube has to be removed, so that it is possible to seal the injection port subsequently. Under such circumstance, the vacuity in the isothermal vapor chamber and the stored amount of the working fluid will be influenced and out of accurate control. In the meantime, the manufacturing process is more difficult.
  • Accordingly, aiming to solve aforementioned shortcomings, after a substantially devoted study, in cooperation with the application of relatively academic principles, the inventor has at last proposed the present invention that is designed reasonably to possess the capability to improve the prior arts significantly.
  • SUMMARY OF THE INVENTION
  • The invention is mainly to provide a manufacturing method of an isothermal vapor chamber and a product thereof. According to the invention, an integrating manner is applied to form an orifice directly on a plate body of an isothermal vapor chamber for being able to process the operations of an injection of working fluid, a de-aeration, and an evacuation. The orifice is functionally similar to a degassing tube or a vacuating tube in the prior arts but, since the orifice is integrated on the plate body of the isothermal vapor chamber, as soon as aforementioned operations have been processed, an immediate pressing and sealing operation can be subsequently processed, so it is possible to accurately control the vacuity in the isothermal vapor chamber and the stored amount of the working fluid. Furthermore, its manufacturing method is much easier.
  • To achieve the above-mentioned objects, the invention is to provide an isothermal vapor chamber, which includes a hollow plate body and a capillary structure attached on inner walls thereof. According to the invention, the plate body is constructed by closing two plates. There are sealing sides formed around the circumferences of the closing two plates. Particularly, a welding part is arranged at the outer edges between the sealing sides of the closing two plates, and a projected orifice is integrated on any one of the sealing sides.
  • BRIEF DESCRIPTION OF DRAWING
  • The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes a number of exemplary embodiments of the invention, taken in conjunction with the accompanying drawings, in which:
  • FIG. 1 is a step flowchart of a method according to the present invention;
  • FIG. 2 is a perspective explosive view of the isothermal vapor chamber according to the present invention;
  • FIG. 3 is a perspective assembled view of the isothermal vapor chamber according to the present invention;
  • FIG. 4 is a partially enlarging view of the “A” part in FIG. 3;
  • FIG. 5 is an illustration of the isothermal vapor chamber in FIG. 4, in which the circumferential edges have been sealed;
  • FIG. 6 is a cross-sectional view of the isothermal vapor chamber in FIG. 5 sectioned along a “6-6” sectional line;
  • FIG. 7 is an illustration of the isothermal vapor chamber in FIG. 5, in which the orifice has been pressed to be sealed;
  • FIG. 8 is an illustration of the isothermal vapor chamber in FIG. 7, in which the orifice has been melted to be sealed;
  • FIG. 9 is an explosively perspective view of the isothermal vapor chamber according to another preferable embodiment of the present invention;
  • FIG. 10 is a partially enlarging view of a pressed and sealed orifice of the isothermal vapor chamber according to a further preferable embodiment of the present invention; and,
  • FIG. 11 is an illustration of the isothermal vapor chamber in FIG. 10, in which some parts of the orifice have been cut off.
  • DETAILED DESCRIPTION OF THE INVENTION
  • In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, being not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.
  • Please refer to FIG. 1, which is a step flowchart of a method according to the present invention. The invention is to provide a manufacturing method of an isothermal vapor chamber and a product thereof, its method including following steps:
  • First, the method combines two plates to form a hollow plate body having an accommodating space in step S1. Secondly, the method forms a projected orifice on one of the plates in step S2. After step S2, the method seals circumferential edges of the plate body except the orifice in step S3. Next, the method vacuates the accommodating space via the orifice in step S4. Finally, the method press the orifice to close up in step S5.
  • As shown in FIG. 2, the two plates 10, 11 forming the plate body 1 of the isothermal vapor chamber are illustrated. The two plates 10, 11 are closed up to constitute the plate body 1, in which the accommodating space 12 is formed therein, as shown in FIG. 6. The closing two plates 10, 11 respectively shown as a substantially flat plate are all made of materials with good heat conductivity, such as: aluminum, copper, etc. According to the preferable embodiments of the present invention, the accommodating space 12 is formed by flatly projecting one plate 10 outwardly. Additionally, a capillary structure 2 is attached on inner walls of the accommodating space 12.
  • As shown in FIG. 3, there are sealing sides 100, 110 formed around the all circumferential edges of the closing two plates 10, 11. The sealing sides 100, 110 are to seal the accommodating space 12 in the plate body 1 after the two plates 10, 11 have been closed up. In this case, each contour of the closing two plates 10, 11 is all shown as a rectangular shape. At any intersection of two adjacent sealing sides 100, 110 of the closing two plates 10, 11, at least a beveled corner 101, 111 is reserved. Thereby, the projected orifice 13 is integrated at the comers 101, 111 of any one of the closing two plates 10, 11. In the meantime, the orifice 13 is communicated to the aforementioned accommodating space 12. The orifice 13 is located at the corner 101 of the upper closing plate 10. More specifically, as shown in FIG. 4, the orifice 13 includes: a shrunk tube 130 communicated to the accommodating space 12, an expanded tube 131 communicated to an end of the shrunk tube 130, and a through hole 132 sequentially penetrating the expanded tube 131 and the shrunk tube 130 from an outer edge of the corner 101 for being communicated to the accommodating space 12.
  • As shown in FIG. 5, after the two plates 10, 11 are closed up, their circumferential sides are sealed through a jointing or welding manner, for example, diffusive or plasma weld, while the orifice 13 is reserved not to seal. The accommodating space 12 can be processed with several operations via the expanded tube 131 of the orifice 13, for example, injecting working fluid and degassing or vacuating. It is easier for processing the operations, such as injecting working fluid, because the diameter of the expanded tube 131 is larger than that of the shrunk tube 130.
  • As shown in FIG. 6, immediately after a degassing or vacuating operation is finished, the shrunk tube 130 of the orifice 13 is pressed by means for die-stamping. It is easier to control the sealing quality of the isothermal vapor chamber during the sealing operation, because the diameter of the shrunk tube 130 is smaller than that of the expanded tube 131. Furthermore, as shown in FIG. 7, the pressed orifice 13 will seal the through hole 132 due to its deformation, by means of which the orifice 13 is sealed, and thus a vacuity of the accommodating space 12 may be maintained. In other words, a manufacturing process of the isothermal vapor chamber is preliminarily completed.
  • As shown in FIG. 8, in order to ensure a sealing effectiveness of the orifice 13, it is also possible to melt the expanded tube of the orifice 13 in a further step. Namely, after the expanded tube 131 of the orifice 13 is sealed through melting its own material, an outer edge of the through hole 132 of the orifice 13 may be furthermore sealed.
  • Furthermore, as shown in FIG. 9, each contour of the closing two plate 10, 11 may also be a circular shape, while the sealing sides 100, 110 of the two closing plates is correspondingly circulars surrounding the plates. More specifically, the sealing sides 100, 110 of the two closing plates 10, 11 are all a flat block 102, 112 projected outwardly, such that the orifice 13 is integrated on any one block of the two flat blocks 102, 112 of the closing two plates 10, 11. In this preferable embodiment, the orifice 13 is still located at the flat block 102 of the upper plate 10.
  • As shown in FIG. 10, the sealing process of the circumferential sides of the two closing plates 10, 11 and the pressing process of the orifice part 13 to be sealed are same as those steps described thereinbefore. However, after the shrunk tube 130 of the orifice 13 is pressed to be sealed, the flat blocks 102, 112 of the closing two plates are then cut off and, once again, the unsealed sealing sides 100, 110 of the closing two plates 10, 11 are sealed by means of jointing or welding, thus that a circular isothermal vapor chamber is obtained, just as shown in FIG. 11.
  • According to aforementioned step flowchart, it is possible to obtain a manufacturing method of the above-mentioned isothermal vapor chamber.
  • In addition, referring back to FIG. 6 and FIG. 7, the isothermal vapor chamber provided by the invention includes: a plate body 1; an accommodating space 12 formed in the plate body 1; and a capillary structure 2 attached on inner walls of the accommodating space 12. In this preferable embodiment, the plate body 1 is constructed by closing two plates 10, 11, on circumferential edges of which sealing sides 100, 110 are all formed, between which a welding portion 14 is formed due to a welding process, and a projected orifice 13 is integrated at any one of the two sealing sides 100, 110. At least one part of the orifice 13 is shown as a flat shape to be sealed. Or, as further shown in FIG. 8, an outer edge of a through hole 132 of the orifice part 13 is formed as a sealing side 133, resulting from a melting process.
  • According to aforementioned structure, an isothermal vapor chamber of the present invention is thereby obtained.
  • Summarizing aforementioned description, the invention is an indispensably novel structure for a compressor indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
  • However, the aforementioned description is only a preferable embodiment according to the present invention, being not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.

Claims (10)

1. A manufacturing method of an isothermal vapor chamber, including following steps:
a) combining corresponding two plates to form a hollow plate body having an accommodating space therein;
b) integratedly forming a projected orifice on one of the plates, wherein the orifice communicates to the accommodating space;
c) sealing circumferential edges of the plate body except the orifice;
d) vacuating the accommodating space in the plate body via the orifice; and
e) pressing the orifice to close up.
2. The manufacturing method according to claim 1, wherein step c) further includes sealing the two plates by means of welding.
3. The manufacturing method of according to claim 2, wherein the welding means is meant by a diffusive or plasma welding process.
4. The manufacturing method according to claim 1, wherein step d) further includes injecting a working fluid into the plate body via the orifice.
5. The manufacturing method according to claim 1, further comprising a step f after the step e:
melting the orifice.
6. An isothermal vapor chamber, comprising:
a hollow plate body composed of two plates, having an accommodating space therein, wherein circumferential edges of the plate body are all formed as sealing sides, outer edges of the sealing sides are all arranged with welding portions, a projected orifice integratedly extends from one of the sealing sides, and one portion of the orifice is of a flat shape to be sealed; and
a capillary structure attached on inner walls of the plate body.
7. The isothermal vapor chamber according to claim 6, wherein each contour of the two plates is of a rectangular shape, and at least one beveled corner is reserved at an intersection of any two adjacent sealing sides of the two plate, while the orifice is located at the corner.
8. The isothermal vapor chamber according to claim 6, wherein each contour of the two plates is of a circular shape.
9. The isothermal vapor chamber according to claim 6, wherein the orifice includes a shrunk tube and an expanded tube communicated to one end of the shrunk tube, and the flat part of the orifice is just the shrunk tube.
10. The isothermal vapor chamber according to claim 9, wherein an outer edge of the expanded tube of the orifice is further formed as a sealing side.
US12/014,145 2008-01-15 2008-01-15 Manufacturing Method of Isothermal Vapor Chamber And Product Thereof Abandoned US20090178784A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/014,145 US20090178784A1 (en) 2008-01-15 2008-01-15 Manufacturing Method of Isothermal Vapor Chamber And Product Thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/014,145 US20090178784A1 (en) 2008-01-15 2008-01-15 Manufacturing Method of Isothermal Vapor Chamber And Product Thereof

Publications (1)

Publication Number Publication Date
US20090178784A1 true US20090178784A1 (en) 2009-07-16

Family

ID=40849657

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/014,145 Abandoned US20090178784A1 (en) 2008-01-15 2008-01-15 Manufacturing Method of Isothermal Vapor Chamber And Product Thereof

Country Status (1)

Country Link
US (1) US20090178784A1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090288815A1 (en) * 2008-05-26 2009-11-26 Chi-Te Chin Heat-dissipating device without injection pipe and method of making the same
US20100243214A1 (en) * 2007-12-04 2010-09-30 Electronics and Telecommunications Research Insti tute Flat plate type micro heat transport device
US20110277955A1 (en) * 2010-05-15 2011-11-17 Zhongshan Weiqiang Technology Co., Ltd. Vapor chamber
US20120080170A1 (en) * 2010-10-04 2012-04-05 Hsiu-Wei Yang Plate-type heat pipe sealing structure and manufacturing method thereof
US20120160812A1 (en) * 2010-12-25 2012-06-28 Foxconn Technology Co., Ltd. Method for sealing vapor chamber
US20120168435A1 (en) * 2011-01-04 2012-07-05 Cooler Master Co., Ltd. Folding vapor chamber
CN103376009A (en) * 2012-04-27 2013-10-30 株式会社京滨冷暖科技 Heat exchanger with thermal storage function and method of manufacturing the same
US20140251580A1 (en) * 2011-11-17 2014-09-11 Behr Gmbh & Co. Kg Method for closing a collecting tank
US20170059254A1 (en) * 2015-08-25 2017-03-02 Champ Tech Optical (Foshan) Corporation Vapor chamber
WO2017209633A1 (en) * 2016-06-04 2017-12-07 Marek Wójcik The method of manufacturing of heat pipes for heating systems
CN108731523A (en) * 2017-04-21 2018-11-02 新光电气工业株式会社 Heat pipe and the method for manufacturing heat pipe
US20190056007A1 (en) * 2017-08-16 2019-02-21 The Legion Engineering Corporation Heat dissipating device for braking system
US20190076971A1 (en) * 2014-05-02 2019-03-14 Hyundai Motor Company Apparatus and method for manufacturing heat exchanger for vehicle
US20190113289A1 (en) * 2017-10-12 2019-04-18 Microsoft Technology Licensing, Llc Sealing a heat pipe
US20190128618A1 (en) * 2017-10-26 2019-05-02 Shinko Electric Industries Co., Ltd. Heat pipe
US20190249928A1 (en) * 2018-02-13 2019-08-15 Asia Vital Components Co., Ltd. Vapor chamber water-filling section sealing structure
CN110243216A (en) * 2018-03-09 2019-09-17 双鸿电子科技工业(昆山)有限公司 Temperature-uniforming plate and its manufacturing method
WO2020188896A1 (en) * 2019-03-15 2020-09-24 株式会社村田製作所 Vapor chamber
US10816274B2 (en) 2019-03-15 2020-10-27 Murata Manufacturing Co., Ltd. Vapor chamber
US10999952B1 (en) * 2020-01-02 2021-05-04 Taiwan Microloops Corp. Vapor chamber and manufacturing method thereof
WO2022071483A1 (en) * 2020-09-30 2022-04-07 日本電産株式会社 Thermal conductive unit and cooling device
US11747090B2 (en) 2017-02-24 2023-09-05 Dai Nippon Printing Co., Ltd. Vapor chamber, electronic device, metallic sheet for vapor chamber and manufacturing method of vapor chamber
JP7472947B2 (en) 2017-10-06 2024-04-23 大日本印刷株式会社 Vapor chambers, electronic devices and metal sheets for vapor chambers

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8490683B2 (en) * 2007-12-04 2013-07-23 Electronics And Telecommunications Research Institute Flat plate type micro heat transport device
US20100243214A1 (en) * 2007-12-04 2010-09-30 Electronics and Telecommunications Research Insti tute Flat plate type micro heat transport device
US20090288815A1 (en) * 2008-05-26 2009-11-26 Chi-Te Chin Heat-dissipating device without injection pipe and method of making the same
US20110277955A1 (en) * 2010-05-15 2011-11-17 Zhongshan Weiqiang Technology Co., Ltd. Vapor chamber
US20130118011A1 (en) * 2010-10-04 2013-05-16 Asia Vital Components Co., Ltd. Plate-Type Heat Pipe Sealing Structure and Manufacturing Method Thereof
US9032624B2 (en) * 2010-10-04 2015-05-19 Asia Vital Components Co., Ltd. Plate-type heat pipe sealing structure and manufacturing method thereof
US20120080170A1 (en) * 2010-10-04 2012-04-05 Hsiu-Wei Yang Plate-type heat pipe sealing structure and manufacturing method thereof
US20120160812A1 (en) * 2010-12-25 2012-06-28 Foxconn Technology Co., Ltd. Method for sealing vapor chamber
US20120168435A1 (en) * 2011-01-04 2012-07-05 Cooler Master Co., Ltd. Folding vapor chamber
US9919818B2 (en) * 2011-11-17 2018-03-20 Mahle International Gmbh Method for closing a collecting tank
US20140251580A1 (en) * 2011-11-17 2014-09-11 Behr Gmbh & Co. Kg Method for closing a collecting tank
CN103376009A (en) * 2012-04-27 2013-10-30 株式会社京滨冷暖科技 Heat exchanger with thermal storage function and method of manufacturing the same
US20130284395A1 (en) * 2012-04-27 2013-10-31 Keihin Thermal Technology Corporation Heat exchanger with thermal storage function and method of manufacturing the same
US9511458B2 (en) * 2012-04-27 2016-12-06 Keihin Thermal Technology Corporation Heat exchanger with thermal storage function and method of manufacturing the same
US20190076971A1 (en) * 2014-05-02 2019-03-14 Hyundai Motor Company Apparatus and method for manufacturing heat exchanger for vehicle
US11701743B2 (en) * 2014-05-02 2023-07-18 Hyundai Motor Company Apparatus and method for manufacturing heat exchanger for vehicle
US20170059254A1 (en) * 2015-08-25 2017-03-02 Champ Tech Optical (Foshan) Corporation Vapor chamber
WO2017209633A1 (en) * 2016-06-04 2017-12-07 Marek Wójcik The method of manufacturing of heat pipes for heating systems
US11747090B2 (en) 2017-02-24 2023-09-05 Dai Nippon Printing Co., Ltd. Vapor chamber, electronic device, metallic sheet for vapor chamber and manufacturing method of vapor chamber
CN108731523A (en) * 2017-04-21 2018-11-02 新光电气工业株式会社 Heat pipe and the method for manufacturing heat pipe
US10495167B2 (en) * 2017-08-16 2019-12-03 The Legion Engineering Corporation Heat dissipating device for braking system
US20190056007A1 (en) * 2017-08-16 2019-02-21 The Legion Engineering Corporation Heat dissipating device for braking system
JP7472947B2 (en) 2017-10-06 2024-04-23 大日本印刷株式会社 Vapor chambers, electronic devices and metal sheets for vapor chambers
US20190113289A1 (en) * 2017-10-12 2019-04-18 Microsoft Technology Licensing, Llc Sealing a heat pipe
US10859321B2 (en) * 2017-10-26 2020-12-08 Shinko Electric Industries Co., Ltd. Heat pipe
US20190128618A1 (en) * 2017-10-26 2019-05-02 Shinko Electric Industries Co., Ltd. Heat pipe
US10591222B2 (en) * 2018-02-13 2020-03-17 Asia Vital Components Co., Ltd. Vapor chamber water-filling section sealing structure
US10739081B2 (en) * 2018-02-13 2020-08-11 Asia Vital Components Co., Ltd. Manufacturing method of vapor chamber water-filling section sealing structure
US11525635B2 (en) * 2018-02-13 2022-12-13 Asia Vital Components Co., Ltd. Vapor chamber water-filling section sealing structure
US20190247964A1 (en) * 2018-02-13 2019-08-15 Asia Vital Components Co., Ltd. Manufacturing method of vapor chamber water-filling section sealing structure
US20190249928A1 (en) * 2018-02-13 2019-08-15 Asia Vital Components Co., Ltd. Vapor chamber water-filling section sealing structure
CN110243216A (en) * 2018-03-09 2019-09-17 双鸿电子科技工业(昆山)有限公司 Temperature-uniforming plate and its manufacturing method
WO2020188896A1 (en) * 2019-03-15 2020-09-24 株式会社村田製作所 Vapor chamber
US10816274B2 (en) 2019-03-15 2020-10-27 Murata Manufacturing Co., Ltd. Vapor chamber
CN111954789A (en) * 2019-03-15 2020-11-17 株式会社村田制作所 Vapor chamber
US10999952B1 (en) * 2020-01-02 2021-05-04 Taiwan Microloops Corp. Vapor chamber and manufacturing method thereof
WO2022071483A1 (en) * 2020-09-30 2022-04-07 日本電産株式会社 Thermal conductive unit and cooling device

Similar Documents

Publication Publication Date Title
US20090178784A1 (en) Manufacturing Method of Isothermal Vapor Chamber And Product Thereof
US7467466B2 (en) Method for sealing a heat pipe
US7665274B2 (en) Device and method for gas filling of a duct in a container
CN111366021B (en) Temperature-equalizing plate and manufacturing method thereof
TWI564096B (en) Method for manufacturing improved modified temperature plate
US20170312871A1 (en) Assembly structure of heat pipe and vapor chamber and assembly method threreof
JP2016023923A (en) Thin vapor chamber and manufacturing method thereof
JP2011242125A (en) Vapor chamber manufacturing method and vapor chamber
TWI645152B (en) Manufacturing method of temperature-free plate without degassing tube
KR20150114709A (en) Vapor chamber module manufacturing method and a vapor chamber module
TW202100938A (en) Vapor chamber and method for fabricating the same
TW201403017A (en) Thinned heat conduction device with tube-less sealing structure and forming method thereof
US7229104B2 (en) Shrinkage-free sealing structure of heat pipe
US20110192576A1 (en) Vapor chamber and edge-sealing structure thereof
TW201423017A (en) Manufacturing method of thin heat pipe
US11499787B2 (en) In-process roll-bond plate and method for manufacturing a roll-bond heat exchanger
US8505183B2 (en) Method for sealing edges of vapor chamber
CN211425160U (en) Temperature equalizing plate
US20200287198A1 (en) Liquid Injection Device
JPH1082591A (en) Plate type heat pipe and its manufacture
JP6767303B2 (en) Heat pipe and its manufacturing method
TWI754124B (en) Manufacturing method of vaper chamber
CN100384313C (en) Air-tight cavity heat radiation structure
TWI539131B (en) Vacuum thermal conductor with strengthened distal ends and the method for making the same
KR100721308B1 (en) Manufacturing Method of Accumulator for air conditioner

Legal Events

Date Code Title Description
AS Assignment

Owner name: HYPER-GREEN INDUSTRIAL CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WANG, CHIN-WEN;REEL/FRAME:020364/0164

Effective date: 20071231

Owner name: WANG, CHIN-WEN, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WANG, CHIN-WEN;REEL/FRAME:020364/0164

Effective date: 20071231

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION