CN103629961A - Uniform temperature plate and manufacturing method thereof - Google Patents

Uniform temperature plate and manufacturing method thereof Download PDF

Info

Publication number
CN103629961A
CN103629961A CN201210298182.6A CN201210298182A CN103629961A CN 103629961 A CN103629961 A CN 103629961A CN 201210298182 A CN201210298182 A CN 201210298182A CN 103629961 A CN103629961 A CN 103629961A
Authority
CN
China
Prior art keywords
upper shell
scolder
plate
temperature
lower house
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210298182.6A
Other languages
Chinese (zh)
Inventor
王勤文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201210298182.6A priority Critical patent/CN103629961A/en
Publication of CN103629961A publication Critical patent/CN103629961A/en
Pending legal-status Critical Current

Links

Images

Abstract

The invention discloses a uniform temperature plate and a manufacturing method of the uniform temperature plate. The uniform temperature plate comprises a lower shell body, an upper shell body, a capillary structure and work fluid, wherein the lower shell body is provided with a bottom plate and a lower side plate extending to the periphery of the bottom plate, the upper shell body is provided with a top plate, an annular groove formed in the outer edge of the top plate and an upper side plate extending to the periphery of the annular groove, the upper shell body covers the lower shell body so that the upper side plate can abut against the lower side plate, and a solder containing area is arranged between the annular groove and the lower side plate in a surrounding mode. Through the structure, solder will not drip to the periphery of the uniform temperature plate in the welding process, and the solder is not stripped off easily after welding is finished.

Description

Temperature-uniforming plate and manufacture method thereof
Technical field
The present invention relates to a kind of temperature-uniforming plate and manufacture method thereof, especially refer to a kind of temperature-uniforming plate and manufacture method thereof with scolder accommodating area.
Background technology
Along with making rapid progress and the slimming day by day of electronic product of development in science and technology, people develop and are permitted eurypalynous temperature-uniforming plate electronic heating element is led to heat radiation.
The manufacture method of current temperature-uniforming plate be the docking of a lower house and a upper shell is covered after, then pressing that the periphery of lower house is alignd with the periphery of upper shell, finally seals the edge of this pressing again with scolder.
Yet the temperature-uniforming plate of such manufacture method manufacture has following shortcoming: the first, the periphery of temperature-uniforming plate can form a flange, this flange is the product after docking pressing and welding, so just makes the periphery of temperature-uniforming plate in formation state, diminish its outward appearance.The second, scolder is to be coated with the boxing of weldering mode on two edges, boundary of lower house and upper shell, so in the process of welding, scolder is easy to drop onto on working top and makes the working environment of whole production line become dirty and messy.Three, complete welding scolder afterwards, because in the unsettled state welding, so scolder is easy to peel off, reduce its sealing effectiveness.
Summary of the invention
In order to address the above problem, the invention provides a kind of temperature-uniforming plate, its scolder when welding can not drop onto around temperature-uniforming plate, and the scolder after having welded is incrust.
A kind of temperature-uniforming plate provided by the invention, comprising:
One lower house, has a base plate and a lower side panel that extends base plate periphery;
One upper shell, has a top board, takes shape in an annular groove of top board outer rim and extends an epipleural of annular groove periphery, and upper shell cover cap pastes lower side panel in lower house so that epipleural supports, and makes to surround between annular groove and lower side panel a scolder accommodating area;
One capillary structure, is laid on the inwall of base plate and upper shell; And
One working fluid, fills between lower house and upper shell.
Preferably, the upper limb of described lower side panel surpasses the level height of annular groove, is firmly positioned at a scolder of scolder accommodating area with bracketing.
Preferably, the upper limb of described lower side panel bends to envelope a scolder that is positioned at scolder accommodating area towards annular groove.
Preferably, described lower side panel offers one except pore is for a gas removing pipe cross-under, described epipleural in correspondence except the position of the pore corresponding through hole being provided with for gas removing pipe cross-under also.
Preferably, described capillary structure comprises capillary portion on one on the inwall that is laid in the portion of capillary of base plate and is laid in upper shell.
Preferably, also comprise the supporting construction being arranged between described base plate and top board.
Preferably, described supporting construction comprises a plate body and protrudes from the lip-deep a plurality of support protrusion of plate body two, and support protrusion is respectively against base plate and top board.
The present invention also provides a kind of method of manufacturing temperature-uniforming plate, and its made temperature-uniforming plate scolder when welding can not drop onto around temperature-uniforming plate, and the scolder after having welded is incrust.
A kind of method of manufacturing temperature-uniforming plate provided by the invention, comprises following steps:
(a) moulding one lower house, lower house has a base plate and extends a lower side panel of base plate periphery, and a base plate surperficial sintering upward has a capillary structure;
(b) moulding one upper shell, upper shell has a top board, take shape in an annular groove of top board outer rim and extend an epipleural of annular groove periphery, and the inwall sintering of upper shell has another capillary structure;
(c) working fluid is injected to lower house inner;
(d) by upper shell cover cap in lower house so that epipleural support to paste lower side panel, and make to surround between annular groove and lower side panel a scolder accommodating area;
(e) scolder is coated with and is welded in scolder accommodating area, with soldering and sealing, live in housing and lower house;
(f) by a gas removing pipe, the space between lower house and upper shell is evacuated; And
(g) sealing gas removing pipe.
Preferably, between described step (b) and step (c), a step (b') is set: a supporting construction is arranged between lower house and upper shell.
Preferably, described supporting construction comprises a plate body and protrudes from the lip-deep a plurality of support protrusion of this plate body two, and support protrusion is respectively against base plate and top board.
Compared with prior art, the present invention has following beneficial effect:
Because temperature-uniforming plate of the present invention has a lower house and a upper shell, and the top board periphery of upper shell forms an annular groove, when upper shell cover cap is during in lower house, is enclosed to form a scolder accommodating area between the annular groove of upper shell and the lower side panel of lower house.By this structure, when upper shell and lower house are welded together, scolder is splash in scolder accommodating area and be undertaken in scolder accommodating area from the top of upper shell, so scolder can not drop onto on temperature-uniforming plate working top around, makes the working environment of production line keep clean.
In addition, because scolder is undertaken in scolder accommodating area, so the scolder after hardening by cooling can firmly be undertaken in scolder accommodating area, and be subject to the lower side panel bracketing of lower house and incrust, contribute to maintain the sealing effectiveness of weld strength and temperature-uniforming plate.
Accompanying drawing explanation
Fig. 1 is the exploded perspective view of temperature-uniforming plate of the present invention;
Fig. 2 is the combination stereogram of temperature-uniforming plate of the present invention;
Fig. 3 is the combination section of temperature-uniforming plate of the present invention;
Fig. 4 is the partial enlarged drawing of the position A of Fig. 3, and wherein scolder is not yet inserted in scolder accommodating area;
Fig. 5 is another partial enlarged drawing of the position A of Fig. 3, and wherein scolder has been inserted in scolder accommodating area;
Fig. 6 is the combination stereogram of temperature-uniforming plate of the present invention, has wherein completed degasification and encapsulation step;
Fig. 7 is the combination stereogram of the temperature-uniforming plate of another embodiment of the present invention.
Main element symbol description:
1,1'. temperature-uniforming plate; 10. lower house;
11. base plates; 12. lower side panels;
121. except pore; 13,13'. gas removing pipe;
20. upper shells; 21. top boards;
22. annular grooves; 23. epipleurals;
231. through hole; 30. capillary structures;
31. times capillary portions; Capillary portion on 32.;
40. working fluids; 50. supporting constructions;
51. plate bodys; 52,53. support protrusion;
100. scolder; Z. scolder accommodating area.
The specific embodiment
Relevant detailed description of the present invention and technology contents, be described as follows cooperation accompanying drawing, yet accompanying drawing is only as illustrative purposes, not for limiting to the present invention.
Please refer to Fig. 1 to Fig. 5, the invention provides a kind of temperature-uniforming plate and manufacture method thereof.Temperature-uniforming plate 1 of the present invention comprises: a lower house 10, a upper shell 20, a capillary structure 30, a working fluid 40 and a supporting construction 50.
Lower house 10 is roughly in the form of annular discs and can be metal or ceramic material is made, and lower house 10 is made into a lower side panel 12 that has a base plate 11 and extend these base plate 11 peripheries, and lower side panel 12 offers one except pore 121 and for gas removing pipe 13 cross-under.In addition, a base plate 11 surperficial sintering upward has capillary portion 31.
Similarly, upper shell 20 is roughly in the form of annular discs and can be metal or ceramic material is made, lower house 20 is made into be had a top board 21, take shape in an annular groove 22 of these top board 21 outer rims and extends an epipleural 23 of these annular groove 22 peripheries, and epipleural 23 also offers a through hole 231 and for these gas removing pipe 13 cross-under.
Comparison diagram 4 and Fig. 5, the external diameter of upper shell 20 is slightly less than the internal diameter of lower house 10, causes when upper shell 20 cover caps are during in lower house 10, and epipleural 23 supports and pastes lower side panel 12, and makes to surround between annular groove 22 and lower side panel 12 a scolder accommodating area Z.In addition, the upper limb of lower side panel 12 surpasses the level height of annular groove 22 and roughly flushes in top board 21, and thus, scolder 100 can be undertaken in the Z of scolder accommodating area as shown in Figure 5, and lower side panel 12 can block scolder 100 and avoid scolder 100 leak outside or peel off simultaneously.Certainly, from Fig. 5, can imagine and draw, the upper limb of lower side panel 12 can bend to envelope scolder 100 towards annular groove 22, makes again the periphery of temperature-uniforming plate 1 produce a lead angle simultaneously.
In addition, the inwall of upper shell 20 is integral sintered goes out capillary portion 32 on, and therefore, the upper capillary portion 32 of the lower capillary portion 31 of lower house 10 and upper shell 20 is common forms capillary structure 30 of the present invention.Working fluid 40 (for example: water) fill between lower house 10 and upper shell 20, liquid phase by working fluid 40 changes and the circulation between lower capillary portion 31 and upper capillary portion 32, and the heat that the base plate of lower house 10 11 can be absorbed conducts to the top board 21 of upper shell 20.About the operation principle of temperature-uniforming plate 1, owing to belonging to prior art and not being technical characterictic of the present invention, so omit related description in order to avoid repeat at this.
As shown in Figure 1, between lower house 10 and upper shell 20, be also provided with a supporting construction 50, in order to be supported between the base plate 11 of lower house 10 and the top board 21 of upper shell 20, to prevent that base plate 11 from making whole temperature-uniforming plate 1 depression go down because of ambient pressure or external force with top board 21.Supporting construction 50 comprises a plate body 51 and protrudes from the lip-deep a plurality of support protrusion 52 of this plate body 51 2 and 53, these support protrusion 52,53 against the base plate 11 of lower house 10 and the top board 21 of upper shell 20, increase the structural strength of whole temperature-uniforming plate 1 with this respectively.
With reference to figure 6, after temperature-uniforming plate 1 of the present invention completes assembling and welding, by gas removing pipe 13, temperature-uniforming plate 1 inside can be evacuated, last the more exposed one section of mode with welding or pressing of gas removing pipe 13 is sealed.
With reference to figure 7, it shows another embodiment of the present invention, the difference of the present embodiment and previous embodiment is: the temperature-uniforming plate 1 of previous embodiment is in the form of annular discs, and the temperature-uniforming plate 1' of the present embodiment is square, and gas removing pipe 13' is arranged on a wherein corner of this square structure.Although the lower house 10 of temperature-uniforming plate 1' and upper shell 20 make into squarely in this embodiment, the periphery of upper shell 20 is still provided with an annular groove 22, and jointly surrounds a scolder accommodating area Z with the lower side panel 12 of lower house 10, uses for scolder 100 and is undertaken in wherein.
The present invention also provides a kind of method of manufacturing temperature-uniforming plate, comprises following steps:
(a) moulding one lower house 10, this lower house 10 has a base plate 11 and extends a lower side panel 12 of these base plate 11 peripheries, and this base plate 11 surperficial sintering upward has a capillary structure (that is: lower capillary portion 31);
(b) moulding one upper shell 20, this upper shell 20 has a top board 21, take shape in an annular groove 22 of these top board 21 outer rims and extend an epipleural 23 of these annular groove 22 peripheries, and the inwall sintering of this upper shell 20 has another capillary structure (that is: upper capillary portion 32);
(c) by a working fluid 40 (for example: water) inject this lower house 10 inside;
(d) by these upper shell 20 cover caps in this lower house 10 so that this epipleural 23 supports, paste this lower side panel 12, and make to surround between this annular groove 22 and this lower side panel 12 a scolder accommodating area Z;
(e) scolder 100 is coated with and is welded in the Z of this scolder accommodating area, with soldering and sealing, live this upper shell 20 and this lower house 10;
(f) by a gas removing pipe 13, the space between this lower house 10 and this upper shell 20 is evacuated; And
(g) seal this gas removing pipe 13.
In addition, between step (b) and step (c), can optionally set up a step (b'): a supporting construction 50 is arranged between this lower house 10 and this upper shell 20.As shown in Figure 1, this supporting construction 50 is in order to be supported between the base plate 11 of lower house 10 and the top board 21 of upper shell 20, to prevent that base plate 11 from making whole temperature-uniforming plate 1 depression go down because of ambient pressure or external force with top board 21.Supporting construction 50 comprises a plate body 51 and protrudes from the lip-deep a plurality of support protrusion 52 of this plate body 51 2 and 53, these support protrusion 52 and 53 against the base plate 11 of lower house 10 and the top board 21 of upper shell 20, increase the structural strength of whole temperature-uniforming plate 1 with this respectively.
Compared to prior art, the present invention has following beneficial effect: because temperature-uniforming plate 1 of the present invention has a lower house 10 and a upper shell 20, and top board 21 peripheries of upper shell 20 form an annular groove 22, when upper shell 20 cover caps are during in lower house 10, between the annular groove 22 of upper shell 20 and the lower side panel 12 of lower house 10, be enclosed to form a scolder accommodating area Z.By this structure, when upper shell 20 and lower house 10 are welded together, scolder 100 splashes in the Z of scolder accommodating area and is undertaken in the Z of scolder accommodating area from the top of upper shell 20, so scolder 100 can not drop onto on temperature-uniforming plate 1 working top around, make the working environment of production line keep clean.
In addition, because scolder 100 is undertaken in the Z of scolder accommodating area, so the scolder 100 after hardening by cooling can firmly be undertaken in the Z of scolder accommodating area, and be subject to lower side panel 121 bracketings of lower house 10 and incrust, contribute to maintain the sealing effectiveness of weld strength and temperature-uniforming plate 1.
The above embodiment is only the preferred embodiment for absolutely proving that the present invention lifts, and protection scope of the present invention is not limited to this.Being equal to that those skilled in the art do on basis of the present invention substitutes or conversion, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.

Claims (10)

1. a temperature-uniforming plate, is characterized in that, comprising:
One lower house, has a base plate and extends a lower side panel of base plate periphery;
One upper shell, has a top board, takes shape in an annular groove of top board outer rim and extends an epipleural of annular groove periphery, and upper shell cover cap makes epipleural support subsides lower side panel in lower house, and makes to surround between annular groove and lower side panel a scolder accommodating area;
One capillary structure, is laid on the inwall of base plate and upper shell; And
One working fluid, fills between lower house and upper shell.
2. temperature-uniforming plate as claimed in claim 1, is characterized in that, the upper limb of described lower side panel surpasses the level height of annular groove, is firmly positioned at a scolder of scolder accommodating area with bracketing.
3. temperature-uniforming plate as claimed in claim 1, is characterized in that, the upper limb of described lower side panel bends to envelope a scolder that is positioned at scolder accommodating area towards annular groove.
4. temperature-uniforming plate as claimed in claim 2 or claim 3, is characterized in that, described lower side panel offers one except pore is for a gas removing pipe cross-under, described epipleural in correspondence except the position of the pore corresponding through hole being provided with for gas removing pipe cross-under also.
5. temperature-uniforming plate as claimed in claim 2 or claim 3, is characterized in that, described capillary structure comprises capillary portion on one on the inwall that is laid in the portion of capillary of base plate and is laid in upper shell.
6. temperature-uniforming plate as claimed in claim 5, is characterized in that, also comprises the supporting construction being arranged between described base plate and top board.
7. temperature-uniforming plate as claimed in claim 6, is characterized in that, described supporting construction comprises a plate body and protrude from the lip-deep a plurality of support protrusion of plate body two, and support protrusion is respectively against base plate and top board.
8. a method of manufacturing the temperature-uniforming plate described in claim 1, is characterized in that, comprises following steps:
(a) moulding one lower house, lower house has a base plate and extends a lower side panel of base plate periphery, and a base plate surperficial sintering upward has a capillary structure;
(b) moulding one upper shell, upper shell has a top board, take shape in an annular groove of top board outer rim and extend an epipleural of annular groove periphery, and the inwall sintering of upper shell has another capillary structure;
(c) working fluid is injected to lower house inner;
(d) by upper shell cover cap in lower house so that epipleural support to paste lower side panel, and make to surround between annular groove and lower side panel a scolder accommodating area;
(e) scolder is coated with and is welded in scolder accommodating area, with soldering and sealing, live in housing and lower house;
(f) by a gas removing pipe, the space between lower house and upper shell is evacuated; And
(g) sealing gas removing pipe.
9. the method for manufacture temperature-uniforming plate as claimed in claim 8, is characterized in that, between described step (b) and step (c), a step (b') is set: a supporting construction is arranged between lower house and upper shell.
10. the method for manufacture temperature-uniforming plate as claimed in claim 9, is characterized in that, described supporting construction comprises a plate body and protrude from the lip-deep a plurality of support protrusion of this plate body two, and support protrusion is respectively against base plate and top board.
CN201210298182.6A 2012-08-21 2012-08-21 Uniform temperature plate and manufacturing method thereof Pending CN103629961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210298182.6A CN103629961A (en) 2012-08-21 2012-08-21 Uniform temperature plate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210298182.6A CN103629961A (en) 2012-08-21 2012-08-21 Uniform temperature plate and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN103629961A true CN103629961A (en) 2014-03-12

Family

ID=50211255

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210298182.6A Pending CN103629961A (en) 2012-08-21 2012-08-21 Uniform temperature plate and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN103629961A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105222627A (en) * 2014-06-13 2016-01-06 昆山巨仲电子有限公司 Thermal conduction plate sealing method and structure thereof
CN113465428A (en) * 2020-03-30 2021-10-01 超众科技股份有限公司 Heat conduction member and method for manufacturing heat conduction member
CN114739220A (en) * 2022-04-25 2022-07-12 恒为科技(上海)股份有限公司 Temperature equalizing plate

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137491A (en) * 1979-04-13 1980-10-27 Furukawa Electric Co Ltd:The Heat pipe type heat exchanger
CN2655424Y (en) * 2003-10-15 2004-11-10 王勤文 Plate-heat pipe
CN2692616Y (en) * 2004-01-09 2005-04-13 泰硕电子股份有限公司 Liquid-gas phase heat radiator with sealed structure
CN2739690Y (en) * 2004-11-12 2005-11-09 珍通科技股份有限公司 Uniform temperature board
CN1849049A (en) * 2006-04-20 2006-10-18 嘉善华昇电子热传科技有限公司 Flat column shape thermal tube
CN1917753A (en) * 2005-08-17 2007-02-21 台达电子工业股份有限公司 Module of heat elimination, and method for connecting between sub-assembles
CN200952669Y (en) * 2006-07-11 2007-09-26 奥古斯丁科技股份有限公司 LED lamp and radiating module fast assembling structure
CN201196545Y (en) * 2008-02-28 2009-02-18 索士亚科技股份有限公司 Average-temperature plate and its support structure
CN102149266A (en) * 2010-02-04 2011-08-10 台烨科技股份有限公司 Temperature equalizing plate
CN202014433U (en) * 2011-03-18 2011-10-19 索士亚科技股份有限公司 Isothermal vapor chamber with seal
CN102620453A (en) * 2012-04-09 2012-08-01 中国科学院工程热物理研究所 Unit heat pipe heat absorber and manufacturing method thereof

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137491A (en) * 1979-04-13 1980-10-27 Furukawa Electric Co Ltd:The Heat pipe type heat exchanger
CN2655424Y (en) * 2003-10-15 2004-11-10 王勤文 Plate-heat pipe
CN2692616Y (en) * 2004-01-09 2005-04-13 泰硕电子股份有限公司 Liquid-gas phase heat radiator with sealed structure
CN2739690Y (en) * 2004-11-12 2005-11-09 珍通科技股份有限公司 Uniform temperature board
CN1917753A (en) * 2005-08-17 2007-02-21 台达电子工业股份有限公司 Module of heat elimination, and method for connecting between sub-assembles
CN1849049A (en) * 2006-04-20 2006-10-18 嘉善华昇电子热传科技有限公司 Flat column shape thermal tube
CN200952669Y (en) * 2006-07-11 2007-09-26 奥古斯丁科技股份有限公司 LED lamp and radiating module fast assembling structure
CN201196545Y (en) * 2008-02-28 2009-02-18 索士亚科技股份有限公司 Average-temperature plate and its support structure
CN102149266A (en) * 2010-02-04 2011-08-10 台烨科技股份有限公司 Temperature equalizing plate
CN202014433U (en) * 2011-03-18 2011-10-19 索士亚科技股份有限公司 Isothermal vapor chamber with seal
CN102620453A (en) * 2012-04-09 2012-08-01 中国科学院工程热物理研究所 Unit heat pipe heat absorber and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105222627A (en) * 2014-06-13 2016-01-06 昆山巨仲电子有限公司 Thermal conduction plate sealing method and structure thereof
CN105222627B (en) * 2014-06-13 2017-06-27 昆山巨仲电子有限公司 Thermal conduction plate sealing method and its structure
CN113465428A (en) * 2020-03-30 2021-10-01 超众科技股份有限公司 Heat conduction member and method for manufacturing heat conduction member
CN114739220A (en) * 2022-04-25 2022-07-12 恒为科技(上海)股份有限公司 Temperature equalizing plate

Similar Documents

Publication Publication Date Title
CN202885617U (en) Temperature evenness plate provided with sealing structure
TWI592623B (en) Vapor chamber and manufacturing method thereof
JP5782102B2 (en) Vacuum glass suction hole sealing device
CN101614499B (en) Uniform temperature plate and manufacturing method thereof
US20140076995A1 (en) Vapor chamber and method of manufacturing the same
TWI529364B (en) Ultra - thin temperature plate and its manufacturing method
KR20060051143A (en) Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same
CN103629961A (en) Uniform temperature plate and manufacturing method thereof
TWM513988U (en) Structure of temperature equilibration plate
TW201544783A (en) Structure of a vapor chamber and the manufacturing method thereof
CN110567304A (en) Thin capillary structure supporting temperature equalizing plate
KR100688728B1 (en) Method for case's bonding of flat plate heat spreader and Apparatus manufactured using the same
CN107588672A (en) A kind of equalizing plate structure and its manufacture method
CN104748597A (en) Flat plate heating tube and manufacturing method thereof
US20110192576A1 (en) Vapor chamber and edge-sealing structure thereof
CN211425160U (en) Temperature equalizing plate
US20110192004A1 (en) Method for sealing edges of vapor chamber
JP2014109401A (en) Heat pipe and its manufacturing method
CN1316535C (en) Method for producing discharge lamp
CN211202867U (en) Vacuum furnace sealing structure of reflow soldering machine
TWI754124B (en) Manufacturing method of vaper chamber
CN201352500Y (en) Chip capacitor packaging structure
CN111739848A (en) Novel ceramic packaging structure
CN205303440U (en) Built -in many racks electrode ceramic encapsulation shell of IGBT
TWM443154U (en) Sealing structure of heat spreader

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140312