CN103629961A - Vapor chamber and manufacturing method thereof - Google Patents
Vapor chamber and manufacturing method thereof Download PDFInfo
- Publication number
- CN103629961A CN103629961A CN201210298182.6A CN201210298182A CN103629961A CN 103629961 A CN103629961 A CN 103629961A CN 201210298182 A CN201210298182 A CN 201210298182A CN 103629961 A CN103629961 A CN 103629961A
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- China
- Prior art keywords
- plate
- side plate
- shell
- upper shell
- lower side
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000012530 fluid Substances 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract 10
- 238000000034 method Methods 0.000 claims description 9
- 238000007872 degassing Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 230000004308 accommodation Effects 0.000 claims 2
- 238000003466 welding Methods 0.000 abstract description 10
- 230000004907 flux Effects 0.000 abstract 1
- 238000010276 construction Methods 0.000 description 11
- 238000007789 sealing Methods 0.000 description 6
- 238000005245 sintering Methods 0.000 description 5
- 239000011148 porous material Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 210000001364 upper extremity Anatomy 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Filling Or Discharging Of Gas Storage Vessels (AREA)
Abstract
The invention discloses a temperature-uniforming plate and a manufacturing method thereof, wherein the temperature-uniforming plate comprises a lower shell, an upper shell, a capillary tissue and working fluid; the lower shell is provided with a bottom plate and a lower side plate extending to the periphery of the bottom plate, the upper shell is provided with a top plate, a ring groove formed in the outer edge of the top plate and an upper side plate extending to the periphery of the ring groove, the upper shell covers the lower shell so that the upper side plate abuts against the lower side plate, and a welding flux containing area is defined between the ring groove and the lower side plate; by the structure, the solder does not drop to the periphery of the temperature equalizing plate during welding, and the welded solder is not easy to peel off.
Description
Technical field
The present invention relates to a kind of temperature-uniforming plate and manufacture method thereof, especially refer to a kind of temperature-uniforming plate and manufacture method thereof with scolder accommodating area.
Background technology
Along with making rapid progress and the slimming day by day of electronic product of development in science and technology, people develop and are permitted eurypalynous temperature-uniforming plate electronic heating element is led to heat radiation.
The manufacture method of current temperature-uniforming plate be the docking of a lower house and a upper shell is covered after, then pressing that the periphery of lower house is alignd with the periphery of upper shell, finally seals the edge of this pressing again with scolder.
Yet the temperature-uniforming plate of such manufacture method manufacture has following shortcoming: the first, the periphery of temperature-uniforming plate can form a flange, this flange is the product after docking pressing and welding, so just makes the periphery of temperature-uniforming plate in formation state, diminish its outward appearance.The second, scolder is to be coated with the boxing of weldering mode on two edges, boundary of lower house and upper shell, so in the process of welding, scolder is easy to drop onto on working top and makes the working environment of whole production line become dirty and messy.Three, complete welding scolder afterwards, because in the unsettled state welding, so scolder is easy to peel off, reduce its sealing effectiveness.
Summary of the invention
In order to address the above problem, the invention provides a kind of temperature-uniforming plate, its scolder when welding can not drop onto around temperature-uniforming plate, and the scolder after having welded is incrust.
A kind of temperature-uniforming plate provided by the invention, comprising:
One lower house, has a base plate and a lower side panel that extends base plate periphery;
One upper shell, has a top board, takes shape in an annular groove of top board outer rim and extends an epipleural of annular groove periphery, and upper shell cover cap pastes lower side panel in lower house so that epipleural supports, and makes to surround between annular groove and lower side panel a scolder accommodating area;
One capillary structure, is laid on the inwall of base plate and upper shell; And
One working fluid, fills between lower house and upper shell.
Preferably, the upper limb of described lower side panel surpasses the level height of annular groove, is firmly positioned at a scolder of scolder accommodating area with bracketing.
Preferably, the upper limb of described lower side panel bends to envelope a scolder that is positioned at scolder accommodating area towards annular groove.
Preferably, described lower side panel offers one except pore is for a gas removing pipe cross-under, described epipleural in correspondence except the position of the pore corresponding through hole being provided with for gas removing pipe cross-under also.
Preferably, described capillary structure comprises capillary portion on one on the inwall that is laid in the portion of capillary of base plate and is laid in upper shell.
Preferably, also comprise the supporting construction being arranged between described base plate and top board.
Preferably, described supporting construction comprises a plate body and protrudes from the lip-deep a plurality of support protrusion of plate body two, and support protrusion is respectively against base plate and top board.
The present invention also provides a kind of method of manufacturing temperature-uniforming plate, and its made temperature-uniforming plate scolder when welding can not drop onto around temperature-uniforming plate, and the scolder after having welded is incrust.
A kind of method of manufacturing temperature-uniforming plate provided by the invention, comprises following steps:
(a) moulding one lower house, lower house has a base plate and extends a lower side panel of base plate periphery, and a base plate surperficial sintering upward has a capillary structure;
(b) moulding one upper shell, upper shell has a top board, take shape in an annular groove of top board outer rim and extend an epipleural of annular groove periphery, and the inwall sintering of upper shell has another capillary structure;
(c) working fluid is injected to lower house inner;
(d) by upper shell cover cap in lower house so that epipleural support to paste lower side panel, and make to surround between annular groove and lower side panel a scolder accommodating area;
(e) scolder is coated with and is welded in scolder accommodating area, with soldering and sealing, live in housing and lower house;
(f) by a gas removing pipe, the space between lower house and upper shell is evacuated; And
(g) sealing gas removing pipe.
Preferably, between described step (b) and step (c), a step (b') is set: a supporting construction is arranged between lower house and upper shell.
Preferably, described supporting construction comprises a plate body and protrudes from the lip-deep a plurality of support protrusion of this plate body two, and support protrusion is respectively against base plate and top board.
Compared with prior art, the present invention has following beneficial effect:
Because temperature-uniforming plate of the present invention has a lower house and a upper shell, and the top board periphery of upper shell forms an annular groove, when upper shell cover cap is during in lower house, is enclosed to form a scolder accommodating area between the annular groove of upper shell and the lower side panel of lower house.By this structure, when upper shell and lower house are welded together, scolder is splash in scolder accommodating area and be undertaken in scolder accommodating area from the top of upper shell, so scolder can not drop onto on temperature-uniforming plate working top around, makes the working environment of production line keep clean.
In addition, because scolder is undertaken in scolder accommodating area, so the scolder after hardening by cooling can firmly be undertaken in scolder accommodating area, and be subject to the lower side panel bracketing of lower house and incrust, contribute to maintain the sealing effectiveness of weld strength and temperature-uniforming plate.
Accompanying drawing explanation
Fig. 1 is the exploded perspective view of temperature-uniforming plate of the present invention;
Fig. 2 is the combination stereogram of temperature-uniforming plate of the present invention;
Fig. 3 is the combination section of temperature-uniforming plate of the present invention;
Fig. 4 is the partial enlarged drawing of the position A of Fig. 3, and wherein scolder is not yet inserted in scolder accommodating area;
Fig. 5 is another partial enlarged drawing of the position A of Fig. 3, and wherein scolder has been inserted in scolder accommodating area;
Fig. 6 is the combination stereogram of temperature-uniforming plate of the present invention, has wherein completed degasification and encapsulation step;
Fig. 7 is the combination stereogram of the temperature-uniforming plate of another embodiment of the present invention.
Main element symbol description:
1,1'. temperature-uniforming plate; 10. lower house;
11. base plates; 12. lower side panels;
121. except pore; 13,13'. gas removing pipe;
20. upper shells; 21. top boards;
22. annular grooves; 23. epipleurals;
231. through hole; 30. capillary structures;
31. times capillary portions; Capillary portion on 32.;
40. working fluids; 50. supporting constructions;
51. plate bodys; 52,53. support protrusion;
100. scolder; Z. scolder accommodating area.
The specific embodiment
Relevant detailed description of the present invention and technology contents, be described as follows cooperation accompanying drawing, yet accompanying drawing is only as illustrative purposes, not for limiting to the present invention.
Please refer to Fig. 1 to Fig. 5, the invention provides a kind of temperature-uniforming plate and manufacture method thereof.Temperature-uniforming plate 1 of the present invention comprises: a lower house 10, a upper shell 20, a capillary structure 30, a working fluid 40 and a supporting construction 50.
Similarly, upper shell 20 is roughly in the form of annular discs and can be metal or ceramic material is made, lower house 20 is made into be had a top board 21, take shape in an annular groove 22 of these top board 21 outer rims and extends an epipleural 23 of these annular groove 22 peripheries, and epipleural 23 also offers a through hole 231 and for these gas removing pipe 13 cross-under.
Comparison diagram 4 and Fig. 5, the external diameter of upper shell 20 is slightly less than the internal diameter of lower house 10, causes when upper shell 20 cover caps are during in lower house 10, and epipleural 23 supports and pastes lower side panel 12, and makes to surround between annular groove 22 and lower side panel 12 a scolder accommodating area Z.In addition, the upper limb of lower side panel 12 surpasses the level height of annular groove 22 and roughly flushes in top board 21, and thus, scolder 100 can be undertaken in the Z of scolder accommodating area as shown in Figure 5, and lower side panel 12 can block scolder 100 and avoid scolder 100 leak outside or peel off simultaneously.Certainly, from Fig. 5, can imagine and draw, the upper limb of lower side panel 12 can bend to envelope scolder 100 towards annular groove 22, makes again the periphery of temperature-uniforming plate 1 produce a lead angle simultaneously.
In addition, the inwall of upper shell 20 is integral sintered goes out capillary portion 32 on, and therefore, the upper capillary portion 32 of the lower capillary portion 31 of lower house 10 and upper shell 20 is common forms capillary structure 30 of the present invention.Working fluid 40 (for example: water) fill between lower house 10 and upper shell 20, liquid phase by working fluid 40 changes and the circulation between lower capillary portion 31 and upper capillary portion 32, and the heat that the base plate of lower house 10 11 can be absorbed conducts to the top board 21 of upper shell 20.About the operation principle of temperature-uniforming plate 1, owing to belonging to prior art and not being technical characterictic of the present invention, so omit related description in order to avoid repeat at this.
As shown in Figure 1, between lower house 10 and upper shell 20, be also provided with a supporting construction 50, in order to be supported between the base plate 11 of lower house 10 and the top board 21 of upper shell 20, to prevent that base plate 11 from making whole temperature-uniforming plate 1 depression go down because of ambient pressure or external force with top board 21.Supporting construction 50 comprises a plate body 51 and protrudes from the lip-deep a plurality of support protrusion 52 of this plate body 51 2 and 53, these support protrusion 52,53 against the base plate 11 of lower house 10 and the top board 21 of upper shell 20, increase the structural strength of whole temperature-uniforming plate 1 with this respectively.
With reference to figure 6, after temperature-uniforming plate 1 of the present invention completes assembling and welding, by gas removing pipe 13, temperature-uniforming plate 1 inside can be evacuated, last the more exposed one section of mode with welding or pressing of gas removing pipe 13 is sealed.
With reference to figure 7, it shows another embodiment of the present invention, the difference of the present embodiment and previous embodiment is: the temperature-uniforming plate 1 of previous embodiment is in the form of annular discs, and the temperature-uniforming plate 1' of the present embodiment is square, and gas removing pipe 13' is arranged on a wherein corner of this square structure.Although the lower house 10 of temperature-uniforming plate 1' and upper shell 20 make into squarely in this embodiment, the periphery of upper shell 20 is still provided with an annular groove 22, and jointly surrounds a scolder accommodating area Z with the lower side panel 12 of lower house 10, uses for scolder 100 and is undertaken in wherein.
The present invention also provides a kind of method of manufacturing temperature-uniforming plate, comprises following steps:
(a) moulding one lower house 10, this lower house 10 has a base plate 11 and extends a lower side panel 12 of these base plate 11 peripheries, and this base plate 11 surperficial sintering upward has a capillary structure (that is: lower capillary portion 31);
(b) moulding one upper shell 20, this upper shell 20 has a top board 21, take shape in an annular groove 22 of these top board 21 outer rims and extend an epipleural 23 of these annular groove 22 peripheries, and the inwall sintering of this upper shell 20 has another capillary structure (that is: upper capillary portion 32);
(c) by a working fluid 40 (for example: water) inject this lower house 10 inside;
(d) by these upper shell 20 cover caps in this lower house 10 so that this epipleural 23 supports, paste this lower side panel 12, and make to surround between this annular groove 22 and this lower side panel 12 a scolder accommodating area Z;
(e) scolder 100 is coated with and is welded in the Z of this scolder accommodating area, with soldering and sealing, live this upper shell 20 and this lower house 10;
(f) by a gas removing pipe 13, the space between this lower house 10 and this upper shell 20 is evacuated; And
(g) seal this gas removing pipe 13.
In addition, between step (b) and step (c), can optionally set up a step (b'): a supporting construction 50 is arranged between this lower house 10 and this upper shell 20.As shown in Figure 1, this supporting construction 50 is in order to be supported between the base plate 11 of lower house 10 and the top board 21 of upper shell 20, to prevent that base plate 11 from making whole temperature-uniforming plate 1 depression go down because of ambient pressure or external force with top board 21.Supporting construction 50 comprises a plate body 51 and protrudes from the lip-deep a plurality of support protrusion 52 of this plate body 51 2 and 53, these support protrusion 52 and 53 against the base plate 11 of lower house 10 and the top board 21 of upper shell 20, increase the structural strength of whole temperature-uniforming plate 1 with this respectively.
Compared to prior art, the present invention has following beneficial effect: because temperature-uniforming plate 1 of the present invention has a lower house 10 and a upper shell 20, and top board 21 peripheries of upper shell 20 form an annular groove 22, when upper shell 20 cover caps are during in lower house 10, between the annular groove 22 of upper shell 20 and the lower side panel 12 of lower house 10, be enclosed to form a scolder accommodating area Z.By this structure, when upper shell 20 and lower house 10 are welded together, scolder 100 splashes in the Z of scolder accommodating area and is undertaken in the Z of scolder accommodating area from the top of upper shell 20, so scolder 100 can not drop onto on temperature-uniforming plate 1 working top around, make the working environment of production line keep clean.
In addition, because scolder 100 is undertaken in the Z of scolder accommodating area, so the scolder 100 after hardening by cooling can firmly be undertaken in the Z of scolder accommodating area, and be subject to lower side panel 121 bracketings of lower house 10 and incrust, contribute to maintain the sealing effectiveness of weld strength and temperature-uniforming plate 1.
The above embodiment is only the preferred embodiment for absolutely proving that the present invention lifts, and protection scope of the present invention is not limited to this.Being equal to that those skilled in the art do on basis of the present invention substitutes or conversion, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210298182.6A CN103629961A (en) | 2012-08-21 | 2012-08-21 | Vapor chamber and manufacturing method thereof |
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CN201210298182.6A CN103629961A (en) | 2012-08-21 | 2012-08-21 | Vapor chamber and manufacturing method thereof |
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CN103629961A true CN103629961A (en) | 2014-03-12 |
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CN201210298182.6A Pending CN103629961A (en) | 2012-08-21 | 2012-08-21 | Vapor chamber and manufacturing method thereof |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105222627A (en) * | 2014-06-13 | 2016-01-06 | 昆山巨仲电子有限公司 | Thermal conduction plate sealing method and structure thereof |
CN113465428A (en) * | 2020-03-30 | 2021-10-01 | 超众科技股份有限公司 | Heat conduction member and method for manufacturing heat conduction member |
CN114739220A (en) * | 2022-04-25 | 2022-07-12 | 恒为科技(上海)股份有限公司 | Temperature equalizing plate |
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JPS55137491A (en) * | 1979-04-13 | 1980-10-27 | Furukawa Electric Co Ltd:The | Heat pipe type heat exchanger |
CN2655424Y (en) * | 2003-10-15 | 2004-11-10 | 王勤文 | Flat heat pipe |
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CN2739690Y (en) * | 2004-11-12 | 2005-11-09 | 珍通科技股份有限公司 | vapor chamber |
CN1849049A (en) * | 2006-04-20 | 2006-10-18 | 嘉善华昇电子热传科技有限公司 | Flat column shape thermal tube |
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CN201196545Y (en) * | 2008-02-28 | 2009-02-18 | 索士亚科技股份有限公司 | Temperature equalizing plate and supporting structure thereof |
CN102149266A (en) * | 2010-02-04 | 2011-08-10 | 台烨科技股份有限公司 | Temperature equalizing plate |
CN202014433U (en) * | 2011-03-18 | 2011-10-19 | 索士亚科技股份有限公司 | Vapor chamber with seal |
CN102620453A (en) * | 2012-04-09 | 2012-08-01 | 中国科学院工程热物理研究所 | Unit heat pipe heat absorber and manufacturing method thereof |
-
2012
- 2012-08-21 CN CN201210298182.6A patent/CN103629961A/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55137491A (en) * | 1979-04-13 | 1980-10-27 | Furukawa Electric Co Ltd:The | Heat pipe type heat exchanger |
CN2655424Y (en) * | 2003-10-15 | 2004-11-10 | 王勤文 | Flat heat pipe |
CN2692616Y (en) * | 2004-01-09 | 2005-04-13 | 泰硕电子股份有限公司 | Liquid-gas phase cooling device with sealed structure |
CN2739690Y (en) * | 2004-11-12 | 2005-11-09 | 珍通科技股份有限公司 | vapor chamber |
CN1917753A (en) * | 2005-08-17 | 2007-02-21 | 台达电子工业股份有限公司 | Heat dissipation module and its assembly method |
CN1849049A (en) * | 2006-04-20 | 2006-10-18 | 嘉善华昇电子热传科技有限公司 | Flat column shape thermal tube |
CN200952669Y (en) * | 2006-07-11 | 2007-09-26 | 奥古斯丁科技股份有限公司 | Rapid assembly structure of LED lamps and cooling modules |
CN201196545Y (en) * | 2008-02-28 | 2009-02-18 | 索士亚科技股份有限公司 | Temperature equalizing plate and supporting structure thereof |
CN102149266A (en) * | 2010-02-04 | 2011-08-10 | 台烨科技股份有限公司 | Temperature equalizing plate |
CN202014433U (en) * | 2011-03-18 | 2011-10-19 | 索士亚科技股份有限公司 | Vapor chamber with seal |
CN102620453A (en) * | 2012-04-09 | 2012-08-01 | 中国科学院工程热物理研究所 | Unit heat pipe heat absorber and manufacturing method thereof |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105222627A (en) * | 2014-06-13 | 2016-01-06 | 昆山巨仲电子有限公司 | Thermal conduction plate sealing method and structure thereof |
CN105222627B (en) * | 2014-06-13 | 2017-06-27 | 昆山巨仲电子有限公司 | Thermal conduction plate sealing method and its structure |
CN113465428A (en) * | 2020-03-30 | 2021-10-01 | 超众科技股份有限公司 | Heat conduction member and method for manufacturing heat conduction member |
CN114739220A (en) * | 2022-04-25 | 2022-07-12 | 恒为科技(上海)股份有限公司 | Temperature equalizing plate |
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Application publication date: 20140312 |