CN205303440U - Built -in many racks electrode ceramic encapsulation shell of IGBT - Google Patents
Built -in many racks electrode ceramic encapsulation shell of IGBT Download PDFInfo
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- CN205303440U CN205303440U CN201520994004.6U CN201520994004U CN205303440U CN 205303440 U CN205303440 U CN 205303440U CN 201520994004 U CN201520994004 U CN 201520994004U CN 205303440 U CN205303440 U CN 205303440U
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Abstract
The utility model relates to an independent electrode ceramic of the built -in many racks of IGBT encapsulates the shell, and include and to cover ceramic submount and upper cover together each other, ceramic submount includes anode flange, porcelain ring, anode seal bowl, gate pole fairlead and built -in many racks absolute electrode, anode flange welds the up end at porcelain ring with one heart, and the up end of anode seal bowl welds the lower terminal surface at porcelain ring with one heart, anode flange, porcelain ring and anode seal bowl from last under to the coincide weld with one heart, the cross -under of gate pole fairlead is on the porcelain ring conch wall, the upper cover includes negative pole obturating cup and built -in negative pole electrode, and the negative pole obturating cup is placed in to built -in negative pole electrode.
Description
Technical field
The utility model relates to electric and electronic technical field, in particular to a kind of IGBT built-in multiple stage absolute electrode ceramic packing shell.
Background technology
IGBT is as the main flow device of power electronics, and Application Areas is very extensive, and market outlook are unquestionable. IGBT has two kinds of packaged types, and one is welding type, and shell adopts High Performance Insulation material, and chip and lead-in wire adopt welding and bonding techniques, its technique relative maturity, but owing to one side heat radiation can only be realized, because which limit its use in high-power field. Another kind is flat-plate compressed direct type, shell adopts 95% alumina-ceramic and metal to carry out soldering, design multiple stage electrode and chip, molybdenum sheet carry out full compression joint type encapsulation, this kind of stressless encapsulation structure of two-side radiation has the advantage of thermal fatigue resistance, high efficiency and heat radiation, will progressively replace welding type IGBT in high-power field.
Though flat-plate compressed direct type IGBT superior performance, there is a following difficult problem in this kind of encapsulation technology:
Make tens of independent IGBT or FRD chips comprehensively long-pending evenly by power when encapsulating, the working accuracy of various parts is proposed very harsh requirement, particularly ceramic package, owing to be carried out high temperature brazing, and pottery and oxygen free copper electrode two kinds of material expansion have a long way to go, the welding stress produced can affect the planeness of electrode, thus causes whole process failure. Therefore this also becomes the technical bottleneck that restriction flat-plate compressed direct type IGBT applies.
Practical novel content
Technical problem to be solved in the utility model provides a kind of built-in multiple stage absolute electrode ceramic packing shell for above-mentioned prior art, it is possible to avoids the distortion of electrode high temperature brazing, it is achieved the encapsulation requirement of flat-plate compressed direct type IGBT.
The technical scheme in the invention for solving the above technical problem is: a kind of IGBT built-in multiple stage absolute electrode ceramic packing shell, include and can mutually cover ceramic base together and upper cover, described ceramic base includes anode flange, porcelain ring, anode seal bowl, gate lead pipe and built-in multiple stage absolute electrode, described anode flange is welded on the upper surface of porcelain ring with one heart, the upper surface of anode seal bowl is welded on the lower surface of porcelain ring with one heart, described anode flange, porcelain ring and anode seal bowl be superimposed concentric welding from top to bottom, described gate lead pipe is connected on porcelain ring shell wall, described upper cover includes negative electrode sealing bowl and built-in cathode electrode, and built-in cathode electrode is placed in negative electrode sealing bowl.
Preferably, described built-in multiple stage absolute electrode comprises the multiple stage group in anode pilot hole and the front offered at the back side, and anode pilot hole and the anode locating dowel at anode seal bowl center on described built-in multiple stage electrode are agreed with.
Preferably, the center of described negative electrode sealing bowl and built-in cathode electrode is respectively arranged with the negative electrode locating dowel and negative electrode pilot hole mutually agreed with.
Compared with prior art, the utility model has the advantage of:
Anode seal bowl of the present utility model seals bowl with negative electrode and adopts oxygen-free copper stripe punching and become, welding or the rear hardness of annealing are less than 40HV, can realizing comprehensively long-pending seamless crimping with built-in multiple stage absolute electrode and built-in cathode electrode, built-in multiple stage absolute electrode does not need through welding with built-in cathode electrode. Therefore can the original working accuracy of holding electrode, built-in multiple stage absolute electrode can the assembling of complete independently and chip, molybdenum sheet, location mould bases etc., reduce technology difficulty. Locating dowel design on anode and negative electrode sealing bowl and on built-in electrode, the design of pilot hole can the concentricity assembled of precise positioning upper cover and ceramic base.
Accompanying drawing explanation
Fig. 1 is the structural representation of the ceramic base in the utility model embodiment.
Fig. 2 is that the A of Fig. 1 is to sectional view.
Fig. 3 is the structural representation of the gate lead pipe position in the utility model embodiment.
Fig. 4 is the sectional view of the upper cover in the utility model embodiment.
Wherein:
Ceramic base 1, upper cover 2, anode flange 1.1, porcelain ring 1.2, anode seal bowl 1.3, gate lead pipe 1.4, built-in multiple stage absolute electrode 1.5, anode pilot hole 1.5.1, multiple stage group 1.5.2, anode locating dowel 1.3.1, negative electrode sealing bowl 2.1, built-in cathode electrode 2.2, negative electrode locating dowel 2.1.1, negative electrode pilot hole 2.2.1.
Embodiment
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail.
As shown in Fig. 1 Fig. 3, a kind of IGBT built-in multiple stage absolute electrode ceramic packing shell in the present embodiment, include the ceramic base 1 and upper cover 2 that can mutually cover together, described ceramic base 1 includes anode flange 1.1, porcelain ring 1.2, anode seal bowl 1.3, gate lead pipe 1.4 and built-in multiple stage absolute electrode 1.5, described anode flange 1.1 is welded on the upper surface of porcelain ring 1.2 with one heart, the upper surface of anode seal bowl 1.3 is welded on the lower surface of porcelain ring 1.2 with one heart, described anode flange 1.1, porcelain ring 1.2 and anode seal bowl 1.3 be superimposed concentric welding from top to bottom, described gate lead pipe 1.4 is connected on porcelain ring 1.2 shell wall.
Described built-in multiple stage absolute electrode 1.5 comprises the multiple stage group 1.5.2 in anode pilot hole 1.5.1 and the front offered at the back side, the upper end of built-in multiple stage absolute electrode 1.5 crimps with chip, each stand can encapsulate an IGBT or FRD chip, lower end crimps with anode seal bowl 1.3, and anode pilot hole 1.5.1 and the anode locating dowel 1.3.1 at anode seal bowl 1.3 center on described built-in multiple stage electrode 1.5 agree with.
Built-in multiple stage absolute electrode 1.5 can take out from ceramic base 1, is placed in anode seal bowl 1.3 after assembling with chip, molybdenum sheet, location mould bases etc. again.
As shown in Figure 4, described upper cover 2 includes negative electrode sealing bowl 2.1 and built-in cathode electrode 2.2. The center of described negative electrode sealing bowl 2.1 is provided with negative electrode locating dowel 2.1.1, and on described built-in cathode electrode 2.2, there is negative electrode pilot hole 2.2.1 at center. During assembling, negative electrode locating dowel 2.1.1 agrees with negative electrode pilot hole 2.2.2 phase.
In addition to the implementation, the utility model also includes other enforcement modes, the technical scheme that all employing equivalents or equivalence replacement mode are formed, and all should fall within the protection domain of the utility model claim.
Claims (3)
1. an IGBT built-in multiple stage absolute electrode ceramic packing shell, include and can mutually cover ceramic base together (1) and upper cover (2), it is characterized in that: described ceramic base (1) includes anode flange (1.1), porcelain ring (1.2), anode seal bowl (1.3), gate lead pipe (1.4) and built-in multiple stage absolute electrode (1.5), the front of described built-in multiple stage absolute electrode (1.5) is provided with multiple stage group (1.5.2), described anode flange (1.1) is welded on the upper surface of porcelain ring (1.2) with one heart, the upper surface of anode seal bowl (1.3) is welded on the lower surface of porcelain ring (1.2) with one heart, described anode flange (1.1), the superimposed concentric welding from top to bottom of porcelain ring (1.2) and anode seal bowl (1.3), described gate lead pipe (1.4) is connected on porcelain ring (1.2) shell wall, described upper cover (2) includes negative electrode sealing bowl (2.1) and built-in cathode electrode (2.2), and built-in cathode electrode (2.2) is placed in negative electrode sealing bowl (2.1).
2. a kind of IGBT built-in multiple stage absolute electrode ceramic packing shell according to claim 1, it is characterized in that: described built-in multiple stage absolute electrode (1.5) comprises the multiple stage group (1.5.2) in anode pilot hole (1.5.1) and the front offered at the back side, the anode pilot hole (1.5.1) on described built-in multiple stage electrode (1.5) agrees with the anode locating dowel (1.3.1) at anode seal bowl (1.3) center.
3. a kind of IGBT built-in multiple stage absolute electrode ceramic packing shell according to claim 1 and 2, it is characterised in that: the center of described negative electrode sealing bowl (2.1) and built-in cathode electrode (2.2) is respectively arranged with the negative electrode locating dowel (2.1.1) and negative electrode pilot hole (2.2.1) mutually agreed with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520994004.6U CN205303440U (en) | 2015-12-05 | 2015-12-05 | Built -in many racks electrode ceramic encapsulation shell of IGBT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520994004.6U CN205303440U (en) | 2015-12-05 | 2015-12-05 | Built -in many racks electrode ceramic encapsulation shell of IGBT |
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| Publication Number | Publication Date |
|---|---|
| CN205303440U true CN205303440U (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520994004.6U Active CN205303440U (en) | 2015-12-05 | 2015-12-05 | Built -in many racks electrode ceramic encapsulation shell of IGBT |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448848A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with internal multi-stand electrode for IGBT |
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2015
- 2015-12-05 CN CN201520994004.6U patent/CN205303440U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448848A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with internal multi-stand electrode for IGBT |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |