CN105222627B - Thermal conduction plate sealing method and its structure - Google Patents
Thermal conduction plate sealing method and its structure Download PDFInfo
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- CN105222627B CN105222627B CN201410267557.1A CN201410267557A CN105222627B CN 105222627 B CN105222627 B CN 105222627B CN 201410267557 A CN201410267557 A CN 201410267557A CN 105222627 B CN105222627 B CN 105222627B
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Abstract
The present invention discloses a kind of thermal conduction plate sealing method and its structure, including：A) base plate and cover plate for mutually covering be provided；B) weldering frame is provided；C) weldering frame is arranged between base plate and cover plate；D) solder is placed on weldering frame；E) the weldering frame clamping of solder will be provided between base plate and cover plate；And solder f) is heated to seal base plate and cover plate；Sealing when thereby strengthening sealing structure, and improving sealing.
Description
Technical field
The present invention relates to a kind of thermal conduction plate structure, more particularly to a kind of thermal conduction plate sealing method and its structure.
Background technology
The operation principle of thermal conduction plate is same with thermal conducting tube phase, mainly sets working fluid in the tabular cavity of closing, and
The function of rapid thermal conduction is reached using the ringing of evaporation and the condensation of working fluid.
In the technique of traditional thermal conduction plate, the sealing between the lower house and upper shell of seal cavity is typically with welding and makees
Industry, after the periphery docking of lower house and upper shell is covered, then imposes solder to seal periphery, finally in thermal conduction plate again
Fill in working fluid and carry out degasification operation in portion.
Furthermore, the working fluid in thermal conduction plate is to transmit heat by reflux cycle and phase change.Due to thermal conduction plate
Inside is often in the change expanded with heat and contract with cold, therefore the sealing sealing of thermal conduction plate is particularly important.Therefore, side is sealed in thermal conduction plate
In weld job, when complete or weld job is not bad for solder laying, thermal conduction plate can occur sealing and split, and cause inner vacuum to be lost
The serious conditions such as mistake, working solution leakage；Further, since the housing of thermal conduction plate is extremely frivolous, cause structural strength not enough, particularly
Apply the peripheral part of solder, it is easier to be deformed under external force and influence sealing, causing thermal conduction plate to lose should
Some heat conduction functions.
In view of this, the present inventor, to reach above-mentioned purpose, is that spy concentrates on studies and coordinates the utilization of scientific principle, is proposed finally
The present invention that is a kind of reasonable in design and being effectively improved above-mentioned missing.
The content of the invention
A purpose of the invention, is to provide a kind of thermal conduction plate sealing method and its structure, to strengthen sealing structure, and is carried
The sealing of sealing structure high.
In order to reach above-mentioned purpose, the present invention provides a kind of thermal conduction plate sealing method, including：A) provide what is mutually covered
Base plate and cover plate；B) the weldering frame with multiple welding beads is provided, welding bead encloses the periphery of weldering frame, and welding bead exists comprising inner ring welding bead and position
Outer ring welding bead on the outside of inner ring welding bead；C) weldering frame is arranged between base plate and cover plate and d) solder is placed on welding bead；E) will
The weldering frame clamping of solder is provided between base plate and cover plate；And solder f) is heated, and then seal base plate and cover plate.
In order to reach above-mentioned purpose, the present invention also provides a kind of thermal conduction plate, including base plate, cover plate, weldering frame, solder and hair
Thin tissue.Cover plate correspondence covers base plate and sets；Weldering frame is arranged between base plate and cover plate, and weldering frame has multiple welding beads, welding bead
The periphery of weldering frame is enclosed, welding bead includes the outer ring welding bead of inner ring welding bead and position on the outside of inner ring welding bead；Multiple solder correspondences are arranged
On those welding beads；Capillary structure is arranged between base plate and cover plate；Wherein, be between base plate and cover plate by heating solder and
Sealed.
Compared to existing, thermal conduction plate of the invention is that weldering frame is provided between base plate and the circumferential surface of cover plate, weldering frame tool
There are the multiple welding beads for enclosing weldering frame periphery, welding bead includes inner ring welding bead and outer ring welding bead, continuous that solder is correspondingly arranged on welding bead,
Solder is finally heated, and then seals base plate and cover plate periphery；Accordingly, thermal conduction plate strengthens sealing structure by welding the setting of frame
Intensity；Furthermore, due to welding the inner ring welding bead and outer ring welding bead of frame in being staggered, by the mode that this kind of multilayer is welded, can be true
Protect sealing of the sealing structure after solder joints.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Brief description of the drawings
The schematic flow sheet of Fig. 1 thermal conduction plate sealing methods of the present invention；
The perspective exploded view of Fig. 2 thermal conduction plates of the present invention；
The schematic appearance of Fig. 3 thermal conduction plates of the present invention；
The assembled sectional view of Fig. 4 thermal conduction plates of the present invention；
Another implementation aspect of the weldering frame of Fig. 5 thermal conduction plates of the present invention.
Wherein, reference
1... thermal conduction plate
10... base plate
20... cover plate
30th, 30a... welderings frame
31st, 31a... welding beads
32nd, 32a... inner rings welding bead
320a... internal clearances
321st, 321a... inner sides welding bead
33rd, 33a... outer rings welding bead
330a... external series gaps
331st, welding bead on the outside of 331a...
34... the second inner ring welding bead
40... solder
50... capillary structure
Step a~f
Specific embodiment
Detailed description for the present invention and technology contents, coordinate brief description of the drawings as follows, but appended accompanying drawing is only provided
Used with reference to explanation, not for being any limitation as to the present invention.
Refer to Fig. 1 to Fig. 4, schematic flow sheet, the solid of thermal conduction plate of thermal conduction plate sealing method respectively of the invention
Decomposing schematic representation, the schematic appearance of thermal conduction plate and assembled sectional view.Thermal conduction plate sealing method of the invention includes：A) phase is provided
The base plate 10 and a cover plate 20 for mutually covering；B) providing has a weldering frame 30 of multiple welding beads 31, and those welding beads 31 enclose the weldering
The periphery of frame 30, an outer ring welding bead 33 of those welding beads 31 32 sides outside the inner ring welding bead comprising an inner ring welding bead 32 and position；c)
The weldering frame 30 is arranged between the base plate 10 and the cover plate 20；D) solder 40 is placed on those welding beads 31；E) will set
There is the clamping of weldering frame 30 of solder 40 between the base plate 10 and the cover plate 20；And those solders 40 f) are heated, and then sealing should
Base plate 10 and the cover plate 20.
In a) step of the present embodiment, the setting capillary structure 50 on the base plate 10 or the cover plate 20 is further included.Also, should
Weldering frame 30 is provided between the base plate 10 and the periphery of the cover plate 20.In addition, in b) step, between the inner ring welding bead 32 is included
Every the multiple inner side welding beads 321 for setting, the outer ring welding bead 33 includes spaced multiple outside welding beads 331, those interior lap weldings
It is in be staggered that road 321 and those outer ring welding beads 331 are.Additionally, in d) step, the solder 40 is to be covered with those welding beads 31
(comprising inner ring welding bead 32 and outer ring welding bead 33).The structure of thermal conduction plate 1 is illustrated in greater detail as after.
Thermal conduction plate 1 includes base plate 10, cover plate 20, weldering frame 30, solder 40 and capillary structure 50.The cover plate 20 correspondence is covered
The base plate 10 and set.The weldering frame 30 is arranged between the base plate 10 and the cover plate 20, and the weldering frame 30 has multiple welding beads 31,
Those welding beads 31 are the peripheries for enclosing the weldering frame 30；It is preferred that those welding beads 31 are respectively a hollow-out parts.
Also, outer ring welding bead 33 of those welding beads 31 comprising inner ring welding bead 32 and position on the outside of the inner ring welding bead 32.The inner ring
Welding bead 32 includes spaced multiple inner side welding beads 321, and the outer ring welding bead 33 includes spaced multiple outside welding beads
331, it is in be staggered and partly overlap that welding beads 321 and those outside welding beads 331 are on the inside of those, in the present embodiment, in those
Two ends of side welding bead 321 and those outside welding beads 331 are overlap.
In one embodiment of the invention, those welding beads 31 further include one second inner ring of the position in the inner side of inner ring welding bead 32
Welding bead 34.The second inner ring welding bead 34 and the outer ring welding bead 33 are the dual side-edges for being correspondingly arranged at the inner ring welding bead 22.This second
The setting of inner ring welding bead 34 can provide more preferably sealing effectiveness, and reduction welding quality causes the possibility of fluid leakage when bad.
Furthermore, the weldering frame 30 and those solders 40 seal the base plate 10 and the periphery of the cover plate 20, and in the base plate 10 and
An inner space 100 is formed between the cover plate 20, the capillary structure 50 is provided in the inner space 100.In addition, those are welded
Material 40 is to fill out cloth on those welding beads 30, wherein, it is to be somebody's turn to do by after the weldering frame 30 and hot melt between the base plate 10 and the cover plate 20
A little solders 40 and sealed.
In one embodiment of the invention, the weldering frame 30 is a hollow deckle board, and the size of the weldering frame 30 is to should bottom
The periphery size of plate 10 and the cover plate 20 and set.It is noted that the weldering frame 30 and those solders 40 are in addition to sealing function,
Also there is the supporting role for maintaining the inner space 100.Further, since base plate 10 and cover plate 20 are a sheet metal, therefore, should
Thermal conduction plate 1 can strengthen the intensity of thermal conduction plate periphery (sealing structure) by the setting of the weldering frame 30.
Please continue reference picture 5, be another implementation aspect of the weldering frame of thermal conduction plate of the invention.As shown in figure 5, weldering frame 30a tools
It is the periphery for enclosing weldering frame 30a to have multiple welding bead 31a, those welding beads 31a；It is preferred that those welding beads 31a is respectively a hollow out
Portion.In the present embodiment, outer ring welding bead 33as of those welding beads 31a comprising inner ring welding bead 32a and position on the outside of inner ring welding bead 32a.
The inner ring welding bead 32 includes spaced two inner sides welding bead 321a, and an internal clearance is left between two inner side welding bead 321a
320a.Outer ring welding bead 33a includes spaced two outsides welding bead 331a, and an outer room is left between two outside welding bead 331a
Gap 330a.It is preferred that the position of internal clearance 320a and external series gap 330a is in staggeredly.Thereby outer ring welding bead 33a and inner ring
The setting of welding bead 32a come reach multilayer welding, with more ensure engagement after adaptation.
Certainly, the present invention can also have other various embodiments, ripe in the case of without departing substantially from spirit of the invention and its essence
Know those skilled in the art and work as and various corresponding changes and deformation, but these corresponding changes and change can be made according to the present invention
Shape should all belong to the protection domain of appended claims of the invention.
Claims (12)
1. a kind of thermal conduction plate sealing method, it is characterised in that including：
A) base plate and a cover plate for mutually covering be provided；
B) providing has a weldering frame of multiple welding beads, and those welding beads enclose the periphery of the weldering frame and exist comprising an inner ring welding bead and position
An outer ring welding bead on the outside of the inner ring welding bead；
C) the weldering frame is arranged between the base plate and the cover plate；
D) solder is placed on those welding beads；
E) the weldering frame clamping of the solder will be provided between the base plate and the cover plate；And
F) those solders are heated, and then seals the base plate and the cover plate.
2. thermal conduction plate sealing method according to claim 1, it is characterised in that in a) step, further include in the base plate
Or capillary structure is set on the cover plate.
3. thermal conduction plate sealing method according to claim 1, it is characterised in that in b) step, the weldering frame is arranged on this
Between base plate and the periphery of the cover plate.
4. thermal conduction plate sealing method according to claim 1, it is characterised in that in b) step, the inner ring welding bead is included
Spaced multiple inner side welding bead, the outer ring welding bead includes spaced multiple outside welding beads, those inner ring welding beads and should
A little outer rings welding bead is in be staggered.
5. thermal conduction plate sealing method according to claim 1, it is characterised in that in d) step, the solder is covered with those
Welding bead.
6. a kind of thermal conduction plate, it is characterised in that including：
One base plate；
One cover plate, correspondence covers the base plate and sets；
One weldering frame, is arranged between the base plate and the cover plate, and the weldering frame has multiple welding beads, and those welding beads enclose the week of the weldering frame
Edge, those welding beads include the outer ring welding bead of an inner ring welding bead and position on the outside of the inner ring welding bead；
Multiple solders, fill out cloth on those welding beads；
One capillary structure, is arranged between the base plate and the cover plate；
Wherein, sealed by the weldering frame and those solders between the base plate and the cover plate.
7. thermal conduction plate according to claim 6, it is characterised in that the weldering frame and those solders seal the base plate and the cover plate
Periphery, and an inner space is formed between the base plate and the cover plate, the capillary structure is arranged in the inner space.
8. thermal conduction plate according to claim 6, it is characterised in that the weldering frame is a hollow deckle board, and the weldering frame size
To should base plate and the cover plate periphery size and set.
9. thermal conduction plate according to claim 6, it is characterised in that those welding beads are respectively a hollow-out parts.
10. thermal conduction plate according to claim 6, it is characterised in that the inner ring welding bead includes spaced multiple inner sides
Welding bead, the outer ring welding bead includes spaced multiple outside welding beads, and those inner ring welding beads and those outer ring welding beads set in interlocking
Put.
11. thermal conduction plates according to claim 10, it is characterised in that two ends of those inner side welding beads and those outside welding beads
To overlap.
12. thermal conduction plates according to claim 6, it is characterised in that those welding beads further include position on the inside of the inner ring welding bead
One second inner ring welding bead, the second inner ring welding bead and the outer ring welding bead are correspondingly arranged at the dual side-edge of the inner ring welding bead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410267557.1A CN105222627B (en) | 2014-06-13 | 2014-06-13 | Thermal conduction plate sealing method and its structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410267557.1A CN105222627B (en) | 2014-06-13 | 2014-06-13 | Thermal conduction plate sealing method and its structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105222627A CN105222627A (en) | 2016-01-06 |
| CN105222627B true CN105222627B (en) | 2017-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410267557.1A Active CN105222627B (en) | 2014-06-13 | 2014-06-13 | Thermal conduction plate sealing method and its structure |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI612266B (en) * | 2016-06-28 | 2018-01-21 | Cai Ming Kun | Method for manufacturing cavity of uniform temperature device and structure thereof |
| WO2019056506A1 (en) * | 2017-09-19 | 2019-03-28 | 华为技术有限公司 | Thin type heat uniformizing plate formed by stamping process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3680189A (en) * | 1970-12-09 | 1972-08-01 | Noren Products Inc | Method of forming a heat pipe |
| US4461343A (en) * | 1982-01-28 | 1984-07-24 | Mcdonnell Douglas Corporation | Plated heat pipe |
| CN102149266A (en) * | 2010-02-04 | 2011-08-10 | 台烨科技股份有限公司 | Temperature equalizing plate |
| CN201960275U (en) * | 2010-12-31 | 2011-09-07 | 浙江银轮机械股份有限公司 | Capillary tube type controllable soldering structure of core of cooler |
| CN103629961A (en) * | 2012-08-21 | 2014-03-12 | 邱维廉 | Uniform temperature plate and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7926418B2 (en) * | 2004-10-07 | 2011-04-19 | All-Clad Metalcrafters Llc | Griddle plate having a vacuum bonded cook surface |
-
2014
- 2014-06-13 CN CN201410267557.1A patent/CN105222627B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3680189A (en) * | 1970-12-09 | 1972-08-01 | Noren Products Inc | Method of forming a heat pipe |
| US4461343A (en) * | 1982-01-28 | 1984-07-24 | Mcdonnell Douglas Corporation | Plated heat pipe |
| CN102149266A (en) * | 2010-02-04 | 2011-08-10 | 台烨科技股份有限公司 | Temperature equalizing plate |
| CN201960275U (en) * | 2010-12-31 | 2011-09-07 | 浙江银轮机械股份有限公司 | Capillary tube type controllable soldering structure of core of cooler |
| CN103629961A (en) * | 2012-08-21 | 2014-03-12 | 邱维廉 | Uniform temperature plate and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN105222627A (en) | 2016-01-06 |
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Address after: 215326 No.7, Shuanghe Road, Dianshanhu Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Nico Juzhong Electronics (Kunshan) Co.,Ltd. Address before: Double Road and Kunshan Dianshan Lake town of Jiangsu province 215326 City No. 7 Patentee before: KUNSHAN JUZHONG ELECTRONICS Co.,Ltd. |
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