JP3193011U - Thermal conduction plate structure - Google Patents

Abstract

The present invention provides a heat conductive plate structure capable of strengthening the close-sealing structure of a heat sink and improving the sealing performance at the close-sealing time.
The structure of a heat conduction plate 1 includes a bottom plate 10, a cover plate 20 to be installed corresponding to the bottom plate 10, a welding frame 30, solder at a plurality of locations, and a capillary tissue. The capillary tissue and the welding frame 30 are installed between the bottom plate 10 and the cover plate 20, and the welding frame 30 includes a plurality of hollow welding routes 31. The welding route 31 surrounds the periphery of the welding frame 30 and is welded on the inner periphery. A route 32 and an outer periphery welding route 33 located outside the route 32 are provided. The solder is applied and filled on the entire welding route 31, and the peripheral edges of the bottom plate 10 and the cover plate 20 are closely heated via the welding frame 30 to be sealed. To do. Thereby, the tightly sealed structure can be strengthened, and the sealing performance at the tightly sealed state can be improved.
[Selection] Figure 2

Description

The present invention relates to a heat conductive plate structure in a heat sink, and more particularly, to a close sealing structure of the heat conductive plate.

The operating principle of the heat conducting plate is the same as that of the heat conducting tube.
In this method, a sealed plate-shaped cavity is filled with a working fluid, and the function of evaporation and condensation of the working fluid is utilized to achieve a rapid heat transfer function.

In the conventional manufacturing process of a heat conductive plate, a welding operation is usually employed for the tight sealing between the lower casing and the upper casing of the sealed cavity.
Thus, after aligning the peripheral edges of the lower and upper casings in correspondence, the peripheral edges are tightly sealed with solder, and finally, the working fluid is injected into the heat conduction plate to perform the air venting operation.
Thus, the working fluid in the heat conducting plate conducts heat through circulation circulation and phase change.

Since the inside of the heat conducting plate is often exposed to changes in thermal expansion and cold shrinkage, the tight sealing performance of the heat conducting plate is extremely important.
If the solder application is incomplete or the welding operation is poor in the welding operation of the tightly sealed side of the heat conduction plate, the heat conduction plate will open, the internal vacuum will be lost, and the operation will be lost. It causes serious situations such as liquid leakage.

Furthermore, since the frame of the heat conduction plate is extremely light and thin, the structural strength is not sufficient, especially at the peripheral part where solder is applied, it is easily deformed by the action of external force, affecting the sealing performance, and heat. The heat conduction function of the conductive plate is lost.
The present invention has been made in view of the above-described drawbacks of the conventional heat conductive plate structure.

JP 2002-327993 A

  The problem to be solved by the present invention is to provide a heat conductive plate structure that can reinforce the tight-sealing structure and enhance the sealing performance of the tight-sealing structure.

In order to solve the above problems, the present invention provides the following heat conduction plate structure.
In the heat conduction plate structure, the heat conduction plate comprises a bottom plate, a cover plate, a welding frame, solder and a capillary tissue,
The cover plate is placed over the bottom plate,
The welding frame is installed between the bottom plate and the lid plate,
The welding frame includes a plurality of welding routes and surrounds the periphery of the welding route welding frame, and the welding route includes an inner circumferential welding route and an outer circumferential welding route located outside the inner circumferential welding route,
The plurality of solders are applied correspondingly on each welding route,
The capillary tissue is placed between the bottom plate and the lid plate, and the bottom plate and the lid plate are heat-dissolved and tightly sealed with solder,
Compared to the conventional structure, the heat conducting plate of the present invention has a welding frame installed between the bottom plate and the peripheral surface of the lid plate, and the welding frame has a plurality of welding routes surrounding the periphery of the welding frame. The welding route includes an inner circumference welding route and an outer circumference welding route, and solder is installed correspondingly on the welding route, and finally the solder is thermally melted so that the periphery of the bottom plate and the lid plate are in close contact with each other. Let it block,
Thereby, the heat conduction plate can be strengthened by the installation of the welding frame, the strength of the tight sealing structure,
Furthermore, since the inner circumference welding route and the outer circumference welding route of the welding frame are installed so as to intersect with each other, the sealing performance after welding joining can be improved by a multi-layer welding method.

The heat conductive plate structure of the present invention can reinforce the tight sealing structure and improve the sealing performance of the tight sealing structure.

It is a three-dimensional decomposition schematic diagram of the present invention heat conduction plate. It is an external appearance schematic diagram of this invention heat conductive board. It is combination sectional drawing of this invention heat conductive board. FIG. 5 is a view showing another embodiment of the welding frame of the heat conducting plate of the present invention.

The best mode for carrying out the present invention will be described below in detail with reference to the drawings.
[Embodiment]

1 to 3 are a schematic diagram of a heat conductive plate adhesion sealing method of the present invention, a three-dimensional exploded schematic diagram of the heat conductive plate, a schematic external view of the heat conductive plate, and a combined sectional view.

As shown in the figure, the heat conducting plate 1 of the present invention includes a bottom plate 10, a lid plate 20, a welding frame 30, solder 40 at a plurality of locations, and a capillary tissue 50.

The lid plate 20 is placed so as to cover the bottom plate 10.

The welding frame 30 is installed between the bottom plate 10 and the lid plate 20, and the welding frame 30 includes a plurality of welding routes 31.

Each welding route 31 is disposed so as to surround the periphery of the welding frame 30.

Preferably, each welding route 31 is a hollow portion.

Each welding route 31 includes an inner periphery welding route 32 and an outer periphery welding route 33 located outside the inner periphery welding route 32.

The inner circumference welding route 32 includes a plurality of inner welding routes 321 installed at intervals.

The outer periphery welding route 33 is provided with a plurality of outer welding routes 331 that are installed at intervals.

The inner welding routes 321 and the outer welding routes 331 are installed so as to intersect with each other, and a part thereof overlaps.

In the present embodiment, both ends of each inner welding route 321 and each outer welding route 331 overlap each other.

In an embodiment of the present invention, each welding route 31 further includes a second inner circumferential welding route 34 located inside the inner circumferential welding route 32.

The second inner circumference welding route 34 and the outer circumference welding route 33 are installed corresponding to both sides of the inner circumference welding route 22.

By installing the second inner circumference welding route 34, a better sealing effect can be provided, and the possibility that the welding quality becomes poor and fluid leaks can be reduced.

The welding frame 30 and each solder 40 tightly seal the periphery of the bottom plate 10 and the lid plate 20, and form an internal space 100 between the bottom plate 10 and the lid plate 20, and the capillary tissue 50 is installed in the internal space 100.

Each solder 40 is applied over the entire welding route 30.

The bottom plate 10 and the lid plate 20 are tightly sealed by the welding frame 30 and the solder 40 after being melted by heat.

In an embodiment of the present invention, the welding frame 30 is a hollow frame plate, and the size of the welding frame 30 is set according to the size of the periphery of the bottom plate 10 and the lid plate 20. .

The welding frame 30 and each solder 40 have a support function for maintaining the internal space 100 in addition to a close-sealing function.

Since the bottom plate 10 and the cover plate 20 are thin metal pieces, the strength of the periphery of the heat conductive plate (adhesion sealing structure) of the heat conducting plate 1 is enhanced by the installation of the welding frame 30.

FIG. 4 shows another embodiment of the welding frame of the heat conducting plate of the present invention.

As shown in FIG. 5, the welding frame 30a includes a plurality of welding routes 31a, and each welding route 31a surrounds the periphery of the welding frame 30a.

Preferably, each welding route 31a is a hollow portion.

In the present embodiment, each welding route 31a includes an inner periphery welding route 32a and an outer periphery welding route 33a located outside the inner periphery welding route 32a.

The inner circumferential welding route 32 includes two inner welding routes 321a that are installed with a space therebetween, and an inner gap 320a remains between the two inner welding routes 321a.

The outer periphery welding route 33a includes two outer welding routes 331a that are installed with a space therebetween, and an outer gap 330a remains between the two outer welding routes 331a.

Preferably, the positions of the inner gap 320a and the outer gap 330a intersect.

Thus, by installing the outer periphery welding route 33a and the inner periphery welding route 32a, multilayer welding can be achieved and adhesion after joining can be ensured.

The names and contents of the present invention described above are only used for explaining the technical contents of the present invention, and do not limit the present invention. All equivalent applications based on the spirit of the present invention, parts (structures) conversion, replacement, and quantity increase / decrease shall be included in the protection scope of the present invention.

  The present invention has the novelty that is a requirement for utility model registration, has sufficient progress compared to similar products of the past, has high practicality, meets the needs of society, and has a very high industrial utility value. large.

1 Heat conduction plate
10 Bottom plate
20 Cover plate
30, 30a welding frame
31, 31a Welding route
32, 32a inner circumference welding route
320a Internal gap
321 and 321a inner welding route
33, 33a Perimeter welding route
330a Outer gap
331, 331a Outer welding route
34 Second inner circumference welding route
40 Solder
50 capillary tissue

Claims (7)

Equipped with a bottom plate, lid plate, welding frame, solder in several places, capillary tissue,
The cover plate is installed with its peripheral edge corresponding to the bottom plate,
The welding frame is installed at the periphery between the bottom plate and the cover plate as a shape corresponding to the periphery of the cover plate,
The welding frame includes an inner circumference welding route that surrounds the periphery of the welding frame to apply and fill with solder, and an outer circumference welding route that is located outside the welding route. And
The capillary tissue is placed between the bottom plate and the lid plate,
A heat conductive plate structure for a heat sink, wherein the welding frame is disposed between the bottom plate and the lid plate and is tightly sealed with solder filled and filled in each welding route. The welding frame and each solder tightly seal the peripheral edges of the bottom plate and the lid plate, and form an internal space between the bottom plate and the lid plate, and the capillary tissue is in the internal space. The heat conduction plate structure for a heat sink according to claim 1, wherein the heat conduction plate structure is installed. 2. The heat sink according to claim 1, wherein the welding frame is a hollow frame plate, and the size of the welding frame is set in accordance with the size of the periphery of the bottom plate and the cover plate. Conductive plate structure. The heat conduction plate structure of a heat sink according to claim 1, wherein each of the welding routes is a hollow portion. The inner circumference welding route comprises a plurality of inner welding routes installed at intervals,
The outer circumference welding route has a plurality of outer welding routes installed at intervals,
The heat conduction plate structure for a heat sink according to claim 1, wherein the inner circumference welding routes and the outer circumference welding routes are installed so as to intersect each other. 6. The heat conducting plate structure of a heat sink according to claim 5, wherein both ends of each inner welding route and each outer welding route overlap each other. Each welding route further includes a second inner circumference welding route located inside the inner circumference welding route,
2. The heat conduction plate structure for a heat sink according to claim 1, wherein the second inner circumference welding route and the outer circumference welding route are installed corresponding to both sides of the inner circumference welding route.

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