CN2739690Y - Uniform temperature board - Google Patents
Uniform temperature board Download PDFInfo
- Publication number
- CN2739690Y CN2739690Y CN 200420009686 CN200420009686U CN2739690Y CN 2739690 Y CN2739690 Y CN 2739690Y CN 200420009686 CN200420009686 CN 200420009686 CN 200420009686 U CN200420009686 U CN 200420009686U CN 2739690 Y CN2739690 Y CN 2739690Y
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- Prior art keywords
- temperature
- uniforming plate
- housing
- tissue
- passage
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Abstract
The utility model discloses a uniform temperature board, comprising a casing body and a capillary organization; and wherein, the casing body comprises an upper casing body and a lower casing body, and has a hollow containing cavity. A plurality of supporters are separated from each other between the upper and the lower casing bodies. An open area and a plurality of passages are formed between the supporters. The capillary organization is arranged in the casing body. The capillary organization comprises a first organization and a second organization. The first organization is arranged in the open area of the casing body. The second organization is arranged among the each passage of the casing body. Thereby, operating fluid can be distributed in the interior of the casing body of the uniform temperature board to prevent the aggregation phenomenon of the operating fluid when the uniform temperature board is in an uneven position.
Description
Technical field
The utility model relates to a kind of temperature-uniforming plate, relates in particular on a kind of microprocessor or heat generating component that is arranged on computing machine, can prevent when the out-of-flatness of residing position, and cause working fluid the temperature-uniforming plate of clustering phenomena to occur.
Background technology
Progress along with Information technology and computer industry, the thermal value of electronic package such as central processing unit chip, internal memory etc. is more and more high, and size is more and more little, for this intensive heat effectively being distributed in the outer environment of computer system, keep the following operation of assembly in permissive temperature, usually be attached on the electronic package surface of heating with heat radiator, or, increase its overall radiating efficiency to increase the rotating speed of radiator fan with big base area; So, will produce relevant issues such as noise, weight, cost and system complexity, make that each above-mentioned scheme is not the heat radiation good plan that solves electronic package.
This area is aspect the heat radiation of electronic package at present, utilize characteristics such as high thermal conduction capability that temperature-uniforming plate has, flash heat transfer, high thermoconductivity, in light weight, simple in structure and multi-usage, can transmit a large amount of heat and not consume electric power, therefore be fit to very much the radiating requirements of electronic product; Therefore with temperature-uniforming plate in conjunction with the formed heat abstractor of radiator, become the important topic that solves heat radiation.
Known equalizing plate structure, as shown in Figure 1, it mainly includes a housing 10a, a capillary structure 20a and a supporter 30a, its middle shell 10a is made up of a upper shell 11a and a lower house 12a, and portion has a hollow reservoir within it, is provided with capillary structure 20a and supporter 30a in this hollow reservoir.Capillary structure 20a is coated on the wavy supporter 30a, the outer periphery of capillary structure 20a can be attached on the inwall of housing 10a, again an amount of working fluid is injected the inside of housing 10a, and vacuumize and sealing operation, can be combined into a temperature-uniforming plate.
Yet, above-mentioned known equalizing plate structure, because the bottom of the hollow reservoir of housing 10a is a burnishing surface, when this temperature-uniforming plate is arranged on the top of electronic package, because of the end face of this electronic package or its residing operating environment is not to be one horizontal, make will be towards the position low place of working fluid of housing 10a inside flow, thereby cause the phase change path contraction of fluid and thermal conduction effect not good; And supporter 30a abuts in capillary structure 20a on the inwall of housing 10a in the mode of point or line contact, and the structural strength deficiency that it can support usually makes the downward depressed deformation of end face of capillary structure 20a, thereby significantly reduces the radiating efficiency of this temperature-uniforming plate.
The design people is because the defective that exists in the above-mentioned prior art, rely on the sector experience for many years of being engaged in, at carrying out improved defective, through concentrating on studies and cooperating actual utilization, in line with excelsior spirit, propose a kind of reasonable in design and effectively improve the utility model of above-mentioned defective finally.
Content of the present utility model
Fundamental purpose of the present utility model is to provide a kind of temperature-uniforming plate, and the setting that it utilizes spacious district and passage makes working fluid be distributed in the inside of temperature-uniforming plate housing, prevents when temperature-uniforming plate residing position out-of-flatness, and causes the working fluid clustering phenomena to occur.
To achieve these goals, the utility model provides a kind of temperature-uniforming plate, comprising:
One housing is made up of a upper shell and a lower house, and this housing has a hollow reservoir, separates to be provided with a plurality of supporters between upper and lower casing, is formed with a spacious district and an a plurality of passage between this supporter; And
One capillary structure is arranged in the described housing, and this capillary structure includes first tissue and second tissue.This first tissue is arranged in the spaciousness district of housing, and second tissue is arranged on respectively this interchannel of housing, thereby realizes above-mentioned purpose.
Temperature-uniforming plate of the present utility model can make working fluid be distributed in the inside of temperature-uniforming plate housing, prevent when temperature-uniforming plate residing position out-of-flatness, and cause the working fluid clustering phenomena to occur and can reduce cost, and can realize simplification composition assembly and be easy to processing and manufacturing.
Brief description of drawings
Fig. 1 is known equalizing plate structure synoptic diagram;
Fig. 2 is the three-dimensional exploded view of the utility model embodiment;
Fig. 3 is the assembled sectional view of the utility model embodiment;
Fig. 4 is the assembled sectional view of the other direction of the utility model embodiment;
Fig. 5 is applied to the user mode figure of pyrotoxin for the utility model embodiment;
Fig. 6 is the assembled sectional view of another embodiment of the utility model.
In the accompanying drawing, the list of parts of each label representative is as follows:
The 10a-housing
11a-upper shell 12a-lower house
The 20a-capillary structure
The 30a-supporter
The 10-housing
11-upper shell 12-lower house
The spacious district of 13-supporter 14-
15-passage 151-first passage
152-second channel 16-hole
17-fills pipe
The 20-capillary structure
21-first organizes 22-second tissue
The 3-pyrotoxin
The 4-radiator
Embodiment
In order to make those skilled in the art further understand feature of the present utility model and technology contents, consult clearly following about detailed description of the present utility model and accompanying drawing, accompanying drawing only provide with reference to and usefulness is described, be not to be used for limiting the utility model.
Fig. 2, Fig. 3 and Fig. 4 are respectively the assembled sectional view of three-dimensional exploded view, assembled sectional view and the other direction of the utility model embodiment.The utility model provides a kind of temperature-uniforming plate, as Fig. 2, Fig. 3 and shown in Figure 4, mainly includes a housing 10 and a capillary structure 20, wherein:
Fig. 5 is applied to the user mode figure of pyrotoxin for the utility model embodiment.As shown in Figure 5, this temperature-uniforming plate can be arranged on the top of a pyrotoxin 3, and pyrotoxin 3 is positioned at the bottom surface centre of lower house 12, and corresponding to the spaciousness district 14 of lower house 12 and first tissue 21 of capillary structure 20.One radiator 4 can be set on this temperature-uniforming plate, and radiator 4 can be extruded by materials such as aluminium, copper and form, also can be for forming by a plurality of copper fins, aluminium fin or the two stacked combination, and present embodiment is an extrusion forming.The high heat that pyrotoxin 3 operation is produced can be directly transferred on the lower house 12, and makes the working fluid of housing 10 inside produce gas phase to change, with pyrotoxin 3 high heat rapidly band from, thereby improve the radiating efficiency of temperature-uniforming plate.
Fig. 6 is the assembled sectional view of another embodiment of the utility model.As shown in Figure 6, wherein, upper and lower casing 11,12 is extended with a plurality of supporters 13 of mutual correspondence respectively, thereby make capillary structure 20 be evenly distributed on the middle place of upper and lower casing 11,12, thus, only need offer less mould and reduce cost, and can reach the simplification of forming assembly and be easy to plurality of advantages such as processing and manufacturing.
In sum, temperature-uniforming plate of the present utility model has practicality, novelty and creativeness, and structure of the present utility model also never sees like product and public use, does not more publish before the application on any publication, meets the requirement of utility application fully.
The above only is a preferred embodiment of the present utility model, be not so promptly limit claim of the present utility model, the equivalent structure transformation that every utilization the utility model instructions and accompanying drawing content are done, or directly or indirectly be used in other relevant technical field, all in like manner be included in the claim of the present utility model.
Claims (10)
1. a temperature-uniforming plate is characterized in that, comprising:
One housing is made up of a upper shell and a lower house, and described housing has a hollow reservoir, separates to be provided with a plurality of supporters between described upper and lower casing, is formed with a spacious district and an a plurality of passage between described supporter; And
One capillary structure is arranged in the described housing, and described capillary structure includes first tissue and second tissue, and described first tissue is arranged in the spaciousness district of housing, and second tissue is arranged on each described interchannel of housing.
2. temperature-uniforming plate as claimed in claim 1 is characterized in that the supporter of described housing forms from downward extension the in the inside of upper shell.
3. temperature-uniforming plate as claimed in claim 1, the supporter that it is characterized in that described housing extend upward from the inside of lower house and form.
4. temperature-uniforming plate as claimed in claim 1, it is characterized in that described housing the spaciousness district be shaped as in circle, rectangle or the polygon any.
5. temperature-uniforming plate as claimed in claim 4 is characterized in that first of described capillary structure organizes shape to match with the spaciousness district shape of housing.
6. temperature-uniforming plate as claimed in claim 1 is characterized in that described passage includes first passage and second channel, and the degree of depth of described first passage is greater than the degree of depth of second channel.
7. temperature-uniforming plate as claimed in claim 1 is characterized in that described first is organized as the porous structure of metal knitted net or the moulding of sintering metal powder institute.
8. temperature-uniforming plate as claimed in claim 1 is characterized in that described first is organized as solid or ducted body.
9. temperature-uniforming plate as claimed in claim 1 is characterized in that the porous structure of described second tissue by metal knitted net or the moulding of sintering metal powder institute.
10. temperature-uniforming plate as claimed in claim 1 is characterized in that described second is organized as solid or ducted body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420009686 CN2739690Y (en) | 2004-11-12 | 2004-11-12 | Uniform temperature board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420009686 CN2739690Y (en) | 2004-11-12 | 2004-11-12 | Uniform temperature board |
Publications (1)
Publication Number | Publication Date |
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CN2739690Y true CN2739690Y (en) | 2005-11-09 |
Family
ID=35354756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200420009686 Expired - Fee Related CN2739690Y (en) | 2004-11-12 | 2004-11-12 | Uniform temperature board |
Country Status (1)
Country | Link |
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CN (1) | CN2739690Y (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008138216A1 (en) * | 2007-05-16 | 2008-11-20 | Sun Yat-Sen University | Uniform temperature loop heat pipe device |
CN101334250B (en) * | 2007-06-26 | 2010-06-16 | 张复佳 | Superconductor component and its implantation process |
CN102494550A (en) * | 2011-12-29 | 2012-06-13 | 四川鋈新能源科技有限公司 | Temperature-equalizing plate and device and method for manufacturing temperature-equalizing plate |
CN103203606A (en) * | 2012-01-12 | 2013-07-17 | 国研高能(北京)稳态传热传质技术研究院有限公司 | Method for producing multi-cavity phase change temperature-equalization plate |
CN103629961A (en) * | 2012-08-21 | 2014-03-12 | 邱维廉 | Uniform temperature plate and manufacturing method thereof |
-
2004
- 2004-11-12 CN CN 200420009686 patent/CN2739690Y/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008138216A1 (en) * | 2007-05-16 | 2008-11-20 | Sun Yat-Sen University | Uniform temperature loop heat pipe device |
CN100460798C (en) * | 2007-05-16 | 2009-02-11 | 中山大学 | Temperature-evenness loop heat pipe device |
AU2008250879B2 (en) * | 2007-05-16 | 2010-03-04 | Sun Yat-Sen University | Uniform temperature loop heat pipe device |
CN101334250B (en) * | 2007-06-26 | 2010-06-16 | 张复佳 | Superconductor component and its implantation process |
CN102494550A (en) * | 2011-12-29 | 2012-06-13 | 四川鋈新能源科技有限公司 | Temperature-equalizing plate and device and method for manufacturing temperature-equalizing plate |
CN103203606A (en) * | 2012-01-12 | 2013-07-17 | 国研高能(北京)稳态传热传质技术研究院有限公司 | Method for producing multi-cavity phase change temperature-equalization plate |
CN103203606B (en) * | 2012-01-12 | 2015-06-24 | 国研高能(北京)稳态传热传质技术研究院有限公司 | Method for producing multi-cavity phase change temperature-equalization plate |
CN103629961A (en) * | 2012-08-21 | 2014-03-12 | 邱维廉 | Uniform temperature plate and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C32 | Full or partial invalidation of patent right | ||
IP01 | Partial invalidation of patent right |
Decision date of declaring invalidation: 20080525 Decision number of declaring invalidation: 11558 |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051109 Termination date: 20121112 |