WO2021073492A1

WO2021073492A1 - Vacuum soaking plate with supporting structure and terminal

Info

Publication number: WO2021073492A1
Application number: PCT/CN2020/120571
Authority: WO
Inventors: 王志国; 张晶
Original assignee: 深圳市英维克科技股份有限公司
Priority date: 2019-10-14
Filing date: 2020-10-13
Publication date: 2021-04-22
Also published as: CN211346467U

Abstract

Disclosed is a vacuum soaking plate with a supporting structure. The vacuum soaking plate comprises a bottom plate and a cover plate fixed on the bottom plate, wherein a cavity in a vacuum state is formed between the bottom plate and the cover plate, capillary structures/a capillary structure are/is arranged on the inner surface of the bottom plate and/or the inner surface of the cover plate, a plurality of bosses formed by stamping are arranged on the inner surface of the bottom plate and/or the inner surface of the cover plate, and the plurality of bosses serve as the supporting structure and fixedly abut against the inner surface opposite the bosses. The present application not only has a simple structure and convenient manufacture, but can also effectively reduce costs and play a certain supporting role.

Description

Vacuum soaking plate and terminal with supporting structure

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office with the application number 201921718526.8 and titled "Vacuum Soaking Plate with Supporting Structure" on October 14, 2019, the entire content of which is incorporated into this application by reference .

Technical field

This application relates to the field of electronic technology, and in particular to a vacuum soaking plate with a supporting structure.

Background technique

With the development of science and technology, the computing speed of electronic products such as smart terminals is getting faster and faster. At the same time, the related electronic chips used in electronic products are becoming more and more lightweight, thinner, and miniaturized. However, electronic chips The above-mentioned structural design will make the heating density per unit area become higher and higher, that is, the phenomenon of excessive local temperature may be caused during the operation process, so the heat dissipation efficiency of the electronic chip becomes an important factor in determining the service life and stability of the electronic product factor. At present, in the chip heat sink, the material with better heat transfer efficiency is the soaking plate for liquid phase change heat transfer.

However, the capillary structure of the existing soaking plate is formed by sintering metal mesh and powder on the upper and lower smooth surfaces. The upper and lower plates are then fused at high temperature to form a cavity, filled with liquid inside, and vacuum-sealed to form a vacuum cavity. Polishing etc. form a vacuum soaking plate. The conventional vacuum soaking plate needs to be formed with a supporting cavity inside to prevent the depression after the plate surface is formed and the expansion of the inner plate surface subjected to high temperature and high pressure; but the supporting structure of the existing vacuum soaking plate is made of metal copper pillars, The powder column is combined on the inner wall of the vacuum chamber through high-temperature sintering, or an integrated columnar structure is processed inside the vacuum soaking plate. The above-mentioned supporting structure has disadvantages such as difficulty in sintering and complicated process.

Summary of the invention

The embodiment of the present application provides a vacuum soaking plate with a supporting structure, which is not only simple in structure, but also relatively convenient to manufacture.

In the first aspect, an embodiment of the present application provides a vacuum soaking plate with a supporting structure, including a bottom plate and a cover plate fixed on the bottom plate, and a cavity in a vacuum state is formed between the bottom plate and the cover plate. Body, the inner surface of the bottom plate and/or the inner surface of the cover plate is provided with a capillary structure, and the inner surface of the bottom plate and/or the inner surface of the cover plate is provided with a number of stamped and formed bosses, the A number of bosses are used as supporting structures and fixedly abutted on the inner surfaces opposite to them.

Further, the inner surface of the bottom plate is provided with a first cavity, the cover plate is a first straight plate, the inner surface of the first straight plate and the inner surface of the bottom plate provided with the first cavity To form the cavity together, wherein the bosses are stamped on the first flat plate and fixedly abut against the inner surface of the bottom plate; or

The inner surface of the cover plate is provided with a second cavity, the bottom plate is a second straight plate, and the inner surface of the second straight plate and the inner surface of the cover plate provided with the second cavity are formed together In the cavity, the boss is stamped and arranged on the second flat plate, and fixedly abuts against the inner surface of the cover plate.

Further, the inner surface of the bottom plate is provided with a first cavity, the inner surface of the cover plate is provided with a second cavity, and the first cavity and the second cavity together form the cavity; among them:

The bottom plate and the cover plate are stamped with mutually staggered bosses, the bosses on the bottom plate are fixed and abutted against the inner surface of the cover plate, and the bosses on the cover plate are fixed and abutted against the inner surface of the cover plate. The inner surface of the bottom plate; or

The bottom plate is stamped with a boss, the cover plate is stamped with a boss at a position corresponding to the boss of the bottom plate, and the boss on the bottom plate is fixed with the boss on the cover plate Abut.

Further, the capillary structure is any one or both of a powdered sintered capillary structure formed by sintering metal powder and a mesh type sintered capillary structure formed by sintering a metal mesh and metal powder.

Further, the metal powder is any one of copper powder, aluminum powder or nickel powder.

Further, the capillary structure includes:

One or more of the following structures provided on the inner surface of the bottom plate: mesh sintered capillary structure, powdered sintered capillary structure; and one or more of the following structures provided on the inner surface of the cover plate: powder Sintered capillary structure, mesh sintered capillary structure; or

The powdered sintered capillary structure respectively provided on the inner surface of the bottom plate and the inner surface of the cover plate, and the mesh type sintered capillary structure provided above the powdered sintered capillary structure on the bottom plate and/or the cover plate structure.

Further, the several bosses all have the same shape and size, and are arranged evenly at intervals.

Further, the shape of the boss is any one of a circle, a polygon and a curved side.

In the second aspect, the embodiments of the present application also provide a terminal, the terminal including a microprocessor, a radiator, and the vacuum equalizing plate with a supporting structure as described in the first aspect, and the vacuum equalizing plate is arranged at Between the microprocessor and the heat sink.

Further, the radiator is arranged on the bottom plate of the vacuum uniform heating plate, and the microprocessor is arranged on the top plate of the vacuum uniform heating plate.

The vacuum soaking plate with supporting structure provided by the embodiments of the present application has a capillary structure on the inner surface of the bottom plate and/or the cover plate and a number of stamped and formed bosses. The structure is relatively simple and easy to manufacture. In addition, the support structure can also play a certain supporting role, effectively reducing the plate surface depression of the vacuum soaking plate and the risk of plate expansion during use.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the following will briefly introduce the drawings used in the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present application. Ordinary technicians can obtain other drawings based on these drawings without creative work.

Fig. 1 is a schematic structural diagram of a vacuum soaking plate with a supporting structure provided by an embodiment of the present application;

2 is a schematic structural diagram of a vacuum soaking plate with a supporting structure provided by another embodiment of the present application;

3 is a schematic structural diagram of a vacuum soaking plate with a supporting structure provided by another embodiment of the present application;

Fig. 4 is a structural diagram of the bottom plate in the present application.

Reference signs: 10, bottom plate; 11, first cavity; 20, cover plate; 21, second cavity; 30, cavity; 40, capillary structure; 50, boss.

Detailed ways

The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

It should be understood that when used in this specification and appended claims, the terms "including" and "including" indicate the existence of the described features, wholes, steps, operations, elements and/or components, but do not exclude one or The existence or addition of multiple other features, wholes, steps, operations, elements, components, and/or collections thereof.

It should also be understood that the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in the specification of this application and the appended claims, unless the context clearly indicates other circumstances, the singular forms "a", "an" and "the" are intended to include plural forms. It should be further understood that the term "and/or" used in the specification and appended claims of this application refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations .

1 to 4, an embodiment of the present application provides a vacuum heat equalizing plate with a supporting structure. In this embodiment, the vacuum equalizing plate is made of titanium. It is understandable that in other embodiments The vacuum soaking plate can also be made of sheet metal such as copper, aluminum and nickel. The vacuum soaking plate with a supporting structure includes a bottom plate 10 and a cover plate 20 fixed on the bottom plate 10, a cavity 30 in a vacuum state is formed between the bottom plate 10 and the cover plate 20, and the bottom plate 10 Capillary structure 40 is provided on the inner surface of the inner surface and/or the inner surface of the cover plate 20, and the inner surface of the bottom plate 10 and/or the inner surface of the cover plate 20 are provided with a number of stamped and formed bosses 50, the Several bosses 50 serve as supporting structures and are fixedly abutted on the inner surfaces opposite to them.

Wherein, the cover plate 20 can cover the bottom plate 10 and together with the bottom plate 10 form a closed cavity 30 in a vacuum state. In general, the cavity 30 is provided with a filling liquid as an actuating medium, that is, the cavity 30 is filled with a filling liquid, and the filling liquid can be used as an actuating medium and distributed in the capillary structure 40 In order to form a heat dissipation cycle in the capillary structure 40, the bottom plate 10 can be used as a heat dissipation plate to contact an external heat sink. Furthermore, in addition to the capillary structure 40 provided on the inner surface of the bottom plate 10 and/or the inner surface of the cover plate 20, a number of stamped and formed bosses 50 may also be provided. Specifically, the inner surface of the bottom plate 10 may be provided with a capillary structure 40, while the inner surface of the cover plate 20 is not provided with a capillary structure 40; or the inner surface of the cover plate 20 may also be provided with a capillary structure 40, and the bottom plate 10 The inner surface is not provided with a capillary structure 40; or both the inner surface of the bottom plate 10 and the inner surface of the cover plate 20 are provided with a capillary structure 40. In the same way, the inner surface of the bottom plate 10 may be provided with a plurality of stamped and formed bosses 50, while the inner surface of the cover plate 20 is not provided with a number of stamped and formed bosses 50; or the inner surface of the cover plate 20 may also be A number of stamped and formed bosses 50 are provided, and the inner surface of the bottom plate 10 is not provided with several stamped and formed bosses 50; or the inner surface of the bottom plate 10 and the inner surface of the cover plate 20 are both provided with a number of stamped and formed bosses 50 Boss 50.

Generally, the inside of the cavity 30 can also be provided with a supporting structure to support on the inner surface of the bottom plate and the changed inner surface, so as to further maintain the shape of the cavity 30 and reduce the deformation of the soaking plate. The time boss 50 can be used as a supporting structure and fixed to the opposite inner surface. The bottom plate 10 and the cover plate 20 and the corresponding bosses 50 can be integrated up and down in a high temperature and high pressure environment, that is, the bosses 50 can be combined with the opposite side of the plate surface to interfere with each other to form an integrated structure, thereby reducing the corresponding Sintering process reduces production costs. In addition, in this embodiment, the boss 50 may also be directly integrally formed with the bottom plate 10 or the cover plate 20.

In addition, as an option, the bosses 50 may be bosses having the same shape and size, or evenly distributed on the bottom plate 10 and/or the cover plate 20 at intervals. For example, as shown in Figure 4, when the number of bosses 50 is 16, they can be distributed through a 4*4 structure; the evenly distributed arrangement of bosses 50 can better realize the Support. Of course, the boss 50 can also be configured as bosses with different shapes and sizes according to actual requirements.

As a further step, the shape of the boss may be any one of a circle, a polygon, and a curved side. Among them, the user can select the shape of the boss according to corresponding requirements, which is not specifically limited in this embodiment.

In one embodiment, as in this embodiment, the inner surface of the bottom plate 10 is provided with a first cavity 11, the cover plate 20 is a first straight plate, and the inner surface of the first straight plate is The inner surface of the bottom plate 10 provided with the first cavity 11 together constitutes the cavity 30, wherein the boss 50 is stamped on the first flat plate and fixedly abuts against the bottom plate 10的内面。 The inner surface. Wherein, the inner surface of the bottom plate 10 can be recessed as a first cavity 11, and the cover plate 20 is a first flat plate. At this time, the first flat plate covers the bottom plate 10 and can form a first The cavity 11 is the cavity 30 of the main body. At this time, the related capillary structure 40 and the like are arranged in the cavity 30. Furthermore, as shown in FIG. 1, when the boss 50 is stamped and arranged on the first flat plate, its protruding end can be fixed and abutted on the inner surface of the bottom plate 10 accordingly, so that it can perform better. Supporting effect.

In one embodiment, in this embodiment, the inner surface of the cover plate 20 is provided with a second cavity 21, the bottom plate 10 is a second flat plate, and the inner surface of the second flat plate is The inner surface of the bottom plate 10 with the second cavity 21 together constitutes the cavity 30, wherein the boss 50 is stamped on the second flat plate and fixedly abuts against the cover plate 20的内面。 The inner surface. Wherein, the inner surface of the cover plate 20 can be recessed as a second cavity 21, and the bottom plate 10 is a second flat plate. At this time, the cover plate 20 covers the second flat plate and can form a The two cavities 21 are the cavity 30 of the main body, and the related capillary structure 40 is set in the cavity 30 at this time. Furthermore, when the boss 50 is stamped and arranged on the second flat plate, its protruding end can be fixed and abutted on the inner surface of the cover plate 20 accordingly, so that it has a better supporting effect.

In one embodiment, in this embodiment, the inner surface of the bottom plate 10 is provided with a first cavity 11, and the inner surface of the cover plate 20 is provided with a second cavity 21, the first cavity 11 The cavity 30 is formed together with the second cavity 21, wherein the bottom plate 10 and the cover plate 20 are stamped with mutually staggered bosses 50, and the bosses 50 on the bottom plate 10 are fixed and abutted. To the inner surface of the cover plate 20, the boss 50 on the cover plate 20 is fixedly abutted against the inner surface of the bottom plate 10. Wherein, the bottom plate 10 and the cover plate 20 may be respectively provided with a first cavity 11 and a second cavity 21, and when the cover plate 20 is covered on the bottom plate 10, the first cavity 11 and the second cavity can be made Two cavities 21 form a cavity 30. Furthermore, as shown in FIG. 2, when the bosses 50 are stamped on the bottom plate 10 and the cover plate 20, the protruding end of the boss of the bottom plate 10 can be fixed and abutted to the cover plate 20 accordingly. On the inner surface of the cover plate 20, the protruding end of the boss of the cover plate 20 can be fixed and abutted to the inner surface of the bottom plate 10 accordingly, so that it has a better supporting effect.

In another embodiment, in this embodiment, the inner surface of the bottom plate 10 is provided with a first cavity 11, and the inner surface of the cover plate 20 is provided with a second cavity 21, and the first cavity 11 and the second cavity 21 together form the cavity 30, wherein a boss 50 is stamped on the bottom plate 10, and the cover plate 20 is positioned at a position corresponding to the boss 50 of the bottom plate 10. The upper punching is provided with a boss 50, and the boss 50 on the bottom plate 10 is fixedly abutted against the boss 50 on the cover plate 20. Wherein, the bottom plate 10 and the cover plate 20 may be respectively provided with a first cavity 11 and a second cavity 21, and when the cover plate 20 is covered on the bottom plate 10, the first cavity 11 and the second cavity can be made Two cavities 21 form a cavity 30. Furthermore, as shown in FIG. 3, when the bosses 50 are stamped on the bottom plate 10 and the cover plate 20, the bosses 50 on the bottom plate 10 are fixed to the bosses 50 on the cover plate 20. Butt, so that it plays a better supporting effect.

Therefore, it can be seen that the arrangement of the above-mentioned three cavities 30 can be selected accordingly according to the needs of users, so as to improve the applicability of the vacuum soaking plate with the supporting structure. Of course, in this embodiment, the manner of setting the cavity is not limited to the above manner. At the same time, the setting of the boss 50 can also be set according to the needs of the user, which is not limited in this embodiment.

Furthermore, in an embodiment, the capillary structure 40 includes:

One or more of the following structures provided on the inner surface of the bottom plate 10: mesh sintered capillary structure, powdered sintered capillary structure; and one or more of the following structures provided on the inner surface of the cover plate 20 : Powdered sintered capillary structure, mesh sintered capillary structure; or

The powdery sintered capillary structure respectively provided on the inner surface of the bottom plate 10 and the inner surface of the cover plate 20, and the mesh provided above the powdery sintered capillary structure on the bottom plate 10 and/or the cover plate 20 Mesh sintered capillary structure.

Specifically, the capillary structure 40 is a powdered sintered capillary structure formed by sintering metal powder. As a further step, the capillary structure 40 may also be a mesh sintered capillary structure formed by sintering a metal mesh and metal powder. Of course, the capillary structure may also be a capillary structure such as nano-scale oxide, which is not limited in this embodiment. Optionally, the metal powder may be any of copper powder, aluminum powder or nickel powder, of course, it is not limited in this embodiment. Among them, the material of the metal mesh in the mesh type sintered capillary structure is generally the same as that of the metal powder. Of course, it can also be selected accordingly according to user requirements.

In one embodiment, the capillary structure 40 includes a mesh sintered capillary structure arranged on the inner surface of the bottom plate 10 and a powdered sintered capillary structure arranged on the inner surface of the cover plate 20.

In another embodiment, the capillary structure 40 may further include a powdered sintered capillary structure provided on the inner surface of the bottom plate 10 and a mesh type sintered capillary structure provided on the inner surface of the cover plate 20. In another embodiment, the capillary structure 40 may further include powdered sintered capillary structures respectively disposed on the inner surface of the bottom plate 10 and the inner surface of the cover plate 20, and also include powders disposed on the bottom plate 10. The mesh type sintered capillary structure above the sintered capillary structure.

In another embodiment, the capillary structure 40 may further include powdered sintered capillary structures respectively provided on the inner surface of the bottom plate 10 and the inner surface of the cover plate 20, and further include a powdered sintered capillary structure provided on the cover plate 20. The mesh sintered capillary structure above the powdered sintered capillary structure. The capillary structure 40 also includes powdered sintered capillary structures respectively provided on the inner surface of the bottom plate 10 and the inner surface of the cover plate 20, and also includes powdered sintered capillary structures respectively provided on the bottom plate 10 and the cover plate 20. The mesh sintered capillary structure above the structure. Of course, the specific arrangement of the capillary structure 40 described above is not limited in this embodiment. Wherein, on the basis of the powdery sintered capillary structure provided on the inner surface of the bottom plate 10 and the inner surface of the cover plate 20, a mesh type sintered capillary structure can be compounded on the powdery sintered capillary structure, which can pass The recombination of different types of capillary structures further enhances the capillary force of the vacuum soaking plate with a supporting structure, and further improves the thermal conductivity of the product.

The vacuum soaking plate with a supporting structure provided by the embodiments of the present application is not only able to effectively improve the heat conduction performance by providing a capillary structure on the inner surface of the bottom plate and/or the cover plate and providing a number of stamped and formed bosses. , Can also play a certain supporting role. In particular, the structure of the present application is simple to set up, convenient to manufacture, can effectively reduce the cost, and effectively avoid the surface depression of the vacuum soaking plate and the risk of plate expansion during use.

In addition, this embodiment also provides a terminal. The terminal may be a smart terminal or a vehicle-mounted terminal. The terminal may include a microprocessor radiator and a vacuum soaking device with a supporting structure as described in the above-mentioned embodiment. The plate, usually the vacuum soaking plate is arranged between the microprocessor and the radiator, so as to accelerate the heat dissipation rate and the efficiency of heat conduction.

Optionally, the radiator is arranged on the bottom plate of the vacuum uniform heating plate, and the microprocessor is arranged on the top plate of the vacuum uniform heating plate. At this time, the bottom plate can be used as a heat sink, and heat is circulated through the filling liquid in the vacuum soaking plate, which can effectively realize the rapid heat dissipation of the microprocessor and avoid the phenomenon of excessively high temperature during the operation of the microprocessor.

In addition, the specific structure and related working principles of the vacuum soaking plate with supporting structure in this embodiment have been specifically explained in the above embodiment, so it will not be repeated here.

The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Anyone familiar with the technical field can easily think of various equivalents within the technical scope disclosed in this application. Modifications or replacements, these modifications or replacements shall be covered within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A vacuum heat equalizing plate with a supporting structure, which is characterized in that it comprises a bottom plate and a cover plate fixed on the bottom plate. A cavity in a vacuum state is formed between the bottom plate and the cover plate. The inner surface and/or the inner surface of the cover plate are provided with a capillary structure, and the inner surface of the bottom plate and/or the inner surface of the cover plate are provided with a number of stamped and formed bosses, and the several bosses serve as supports The structure is fixed and abutted on the inner surface opposite to it.
The vacuum soaking plate according to claim 1, characterized in that:

The inner surface of the bottom plate is provided with a first cavity, the cover plate is a first straight plate, and the inner surface of the first straight plate and the inner surface of the bottom plate provided with the first cavity form a joint The cavity, wherein the boss is stamped and arranged on the first flat plate, and fixedly abuts against the inner surface of the bottom plate; or

The inner surface of the cover plate is provided with a second cavity, the bottom plate is a second straight plate, and the inner surface of the second straight plate and the inner surface of the cover plate provided with the second cavity are formed together In the cavity, the boss is stamped and arranged on the second flat plate, and fixedly abuts against the inner surface of the cover plate.
The vacuum soaking plate of claim 1, wherein the inner surface of the bottom plate is provided with a first cavity, the inner surface of the cover plate is provided with a second cavity, and the first cavity is The second cavity jointly constitutes the cavity; wherein:

The bottom plate and the cover plate are stamped with mutually staggered bosses, the bosses on the bottom plate are fixed and abutted against the inner surface of the cover plate, and the bosses on the cover plate are fixed and abutted against the inner surface of the cover plate. The inner surface of the bottom plate; or

The bottom plate is stamped with a boss, the cover plate is stamped with a boss at a position corresponding to the boss of the bottom plate, and the boss on the bottom plate is fixed with the boss on the cover plate Abut.
The vacuum soaking plate according to claim 1, wherein the capillary structure is a powdered sintered capillary structure formed by sintering metal powder and a mesh sintered capillary structure formed by sintering metal mesh and metal powder Either or both of them.
The vacuum soaking plate according to claim 4, wherein the metal powder is any one of copper powder, aluminum powder or nickel powder.
8. The vacuum soaking plate of claim 5, wherein the capillary structure comprises:

One or more of the following structures provided on the inner surface of the bottom plate: mesh sintered capillary structure, powdered sintered capillary structure; and one or more of the following structures provided on the inner surface of the cover plate: powder Sintered capillary structure, mesh sintered capillary structure; or

The powdered sintered capillary structure respectively provided on the inner surface of the bottom plate and the inner surface of the cover plate, and the mesh type sintered capillary structure provided above the powdered sintered capillary structure on the bottom plate and/or the cover plate structure.
4. The vacuum heat equalizing plate according to claim 1, wherein the plurality of bosses all have the same shape and size, and are arranged evenly at intervals.
5. The vacuum soaking plate according to claim 1, wherein the shape of the boss is any one of a circle, a polygon and a curved side.
A terminal, characterized in that the terminal comprises a microprocessor, a radiator, and the vacuum equalizing plate with a supporting structure according to any one of claims 1 to 8, and the vacuum equalizing plate is arranged on the Between the microprocessor and the heat sink.
The terminal according to claim 9, wherein the radiator is arranged on the bottom plate of the vacuum equalizing plate, and the microprocessor is set on the top plate of the vacuum equalizing plate.