CN210092066U - Porous flat plate type radiator and system - Google Patents
Porous flat plate type radiator and system Download PDFInfo
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- CN210092066U CN210092066U CN201920782528.7U CN201920782528U CN210092066U CN 210092066 U CN210092066 U CN 210092066U CN 201920782528 U CN201920782528 U CN 201920782528U CN 210092066 U CN210092066 U CN 210092066U
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Abstract
The utility model discloses a porous flat plate type radiator and a system, the radiator comprises a radiator body, a cavity is formed inside the radiator body, and a porous structure is formed on the inner wall of the bottom of the cavity; a heat pipe working medium is arranged in the cavity; the bottom outer surface of the cavity is ground flat to act as a heat transfer contact plane. The porous structure is formed on the inner wall of the bottom of the cavity opposite to the heat transfer contact plane, so that heat conduction can be effectively and quickly realized, heat generated by a heating element (such as a CPU) contacted with the heat transfer contact plane is quickly and efficiently conducted, and the porous structure is used as a core of vaporization, so that the heat transfer efficiency can be effectively improved; meanwhile, the heat transfer contact plane is a plane formed by grinding, and the flatness of the contact position of the heat transfer contact plane and the heating element is high, so that the contact thermal resistance can be reduced, and the heat transfer efficiency can be further improved.
Description
Technical Field
The utility model relates to a radiator, concretely relates to porous flat radiator and system
Background
The heat pipe adopted by the existing electronic product chip radiator is a flat pipe which is changed into a plane which is contacted with a chip, the flatness of the flat pipe is difficult to ensure, a gap exists between the flat pipe and the chip to cause thermal resistance, meanwhile, the inner wall of the round pipe is generally not provided with porous materials, the vaporization core is less, and the heat dissipation efficiency is not high.
Disclosure of Invention
In order to solve the problem that current electronic product chip radiator radiating efficiency is not high, the embodiment of the utility model provides a porous flat radiator and system.
In order to achieve the above purpose, the technical scheme of the utility model is that:
in a first aspect, an embodiment of the present invention provides a porous flat plate type heat sink, which includes a heat sink body, a cavity is formed inside the heat sink body, and a porous structure is formed on an inner wall of a bottom of the cavity; a heat pipe working medium is arranged in the cavity; the bottom outer surface of the cavity is ground flat to act as a heat transfer contact plane.
Preferably, the radiator body includes a rectangular cavity and a top cover fixedly mounted to the rectangular cavity in a fitting manner.
As another preferable mode of the above heat sink, the porous structure is formed by sintering 10-100 micron copper fiber and 10-100 micron copper powder.
As another preferable mode of the heat sink, the rectangular cavity and the top cover are both made of copper.
Specifically, the working medium of the heat pipe is one or more of ammonia, Freon-21, Freon-11 and Freon-113.
In a second aspect, embodiments of the present invention provide a multi-hole flat plate radiator system, including:
the radiator comprises a radiator body, wherein a cavity is formed in the radiator body, and a porous structure is formed on the inner wall of the bottom of the cavity; the bottom outer surface of the cavity is ground to be a plane to serve as a heat transfer contact plane; the heat radiator is provided with two heat radiators, wherein the heat transmission contact plane of one heat radiator is used for contacting with an object to be radiated, and the heat transmission contact plane of the other heat radiator is used for contacting with a cooling source;
and the connecting pipe is communicated between the two radiators and filled with the working medium of the heat pipe.
Compared with the prior art, the utility model, its beneficial effect lies in:
the porous structure is formed on the inner wall of the bottom of the cavity opposite to the heat transfer contact plane, so that heat conduction can be effectively and quickly realized, heat generated by a heating element (such as a CPU) contacted with the heat transfer contact plane is quickly and efficiently conducted, and the porous structure is used as a core of vaporization, so that the heat transfer efficiency can be effectively improved; meanwhile, the heat transfer contact plane is a plane formed by grinding, and the flatness of the contact position of the heat transfer contact plane and the heating element is high, so that the contact thermal resistance can be reduced, and the heat transfer efficiency can be further improved.
Drawings
Fig. 1 is an expanded schematic view of a heat sink according to an embodiment of the present invention;
fig. 2 is a schematic view of an overall structure of a heat sink according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat sink system according to an embodiment of the present invention;
fig. 4 is a schematic application diagram of a heat sink system according to an embodiment of the present invention;
in the figure: 1. a heat sink body; 11. a cavity; 12. a porous structure; 13. a top cover; 100. a heat sink; 200. a connecting pipe; 300. a chip; 400. and a cooling fan.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Example 1:
referring to fig. 1-2, the heat sink provided in this embodiment includes a heat sink body 1, a cavity 11 is formed inside the heat sink body 1, and a porous structure 12 is formed on an inner wall of a bottom of the cavity 11; a heat pipe working medium is arranged in the cavity 12; the bottom outer surface of the chamber 11 is ground flat to serve as a heat transfer contact plane. The porous structure is formed on the inner wall of the bottom of the cavity 11 opposite to the heat transfer contact plane, so that heat conduction can be effectively and quickly realized, heat generated by a heating element (such as a CPU) contacted with the heat transfer contact plane is quickly and efficiently conducted, and the porous structure is used as a core of vaporization, so that the heat transfer efficiency can be effectively improved; meanwhile, the heat transfer contact plane is a plane formed by grinding, and the flatness of the contact position of the heat transfer contact plane and the heating element is high, so that the contact thermal resistance can be reduced, and the heat transfer efficiency can be further improved.
Specifically, the heat sink body 1 includes a rectangular copper cavity 11 and a copper top cover 13 fixedly mounted in cooperation with the rectangular copper cavity 11. That is, the whole radiator body 1 is rectangular, the rectangular cavity is easy to manufacture and reduce the manufacturing cost, and the rectangular cavity 11 and the top cover 13 are separated from each other in the initial state, and after the porous structure 12 is formed on the inner wall of the bottom of the rectangular cavity 11, the top cover 13 is welded and fixed on the opening of the rectangular cavity 11, so that the porous structure can be conveniently generated, and meanwhile, the rectangular cavity 11 and the top cover 13 are both made of copper, and have good thermal conductivity.
While the porous structure 12 is formed by sintering 10-100 micron copper fiber and 10-100 micron copper powder, illustratively, in the present embodiment, the porous structure 12 is formed by sintering 30 micron copper fiber and 30 micron copper powder, since the diameters of the copper fiber and the copper powder are very small, the porous structure can be sintered to form a fine porous structure, so as to further improve the heat transfer efficiency. The working medium of the heat pipe is one or more of ammonia, Freon-21 (CHCI2F), Freon-11 (CCI3F) and Freon-113 (CCI2F. CCIF2).
Example 2:
referring to fig. 3, a schematic structural diagram of the radiator system according to the present embodiment is shown, which mainly includes two radiators 100 and a connecting pipe 200 connected between the two radiators 100. The two radiators 100 are the radiators described in embodiment 1, and the heat pipe medium can be injected after the connecting pipe 200 is communicated with the two radiators. As shown in fig. 4, in a specific application, the heat transfer contact plane of one heat sink 100 is in contact with the chip 300, and the heat transfer contact plane of the other heat sink 100 is in contact with the cooling fan 400, so that the heat generated by the chip can be quickly transferred to the fan for cooling. In addition, in order to further improve the heat transfer efficiency, the connecting pipe is also made of copper.
Example 3:
the embodiment provides a manufacturing method of a porous flat plate type radiator, which comprises the following steps:
preparing a rectangular copper containing cavity;
mixing and stirring 20-80% of 10-100 micron copper fiber and 80-20% of 10-100 micron copper powder;
placing the copper fiber and copper powder mixture in a containing cavity;
sintering the rectangular copper containing cavity filled with copper fiber and copper powder in a vacuum sintering furnace at a sintering vacuum degree of less than 5 × 10-2Pa, the sintering temperature is 800-; because a fine and uniform porous structure is formed in the copper containing cavity body by sintering, the copper containing cavity body is beneficial to rapid and uniform heat conduction, thereby greatly improving the heat dissipation efficiency;
polishing the bottom of the sintered cavity body into a plane to serve as a heat transfer contact plane, and welding and fixing a copper top cover on an opening of the cavity body;
heat pipe working media such as ammonia, Freon-21 (CHCI2F), Freon-11 (CCI3F), Freon-113 (CCI2F. CCIF2) and the like are injected into the cavity, and then a single radiator can be formed.
Compared with the traditional heat pipe radiator, the radiator manufactured by the steps has the advantage that the radiating efficiency is improved by 165%.
In the practical application process, after the copper top covers are welded and fixed on the two radiators, the two copper fiber copper powder porous flat plate heat exchangers can be connected through copper pipes in a full-welding mode, then a heat pipe working medium is injected, the heat transfer contact plane of one radiator is in contact with the chip, the heat transfer contact plane of the other radiator is in contact with the cooling fan, and therefore heat generated by the chip can be rapidly transferred to the fan for cooling.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (10)
1. A porous flat plate type radiator is characterized by comprising a radiator body, wherein a cavity is formed inside the radiator body, and a porous structure is formed on the inner wall of the bottom of the cavity; a heat pipe working medium is arranged in the cavity; the bottom outer surface of the cavity is ground flat to act as a heat transfer contact plane.
2. The perforated flat plate heat sink of claim 1 wherein the heat sink body comprises a rectangular cavity and a top cover fixedly mounted in cooperation with the rectangular cavity.
3. The porous plate heat sink of claim 1 or 2 wherein the porous structure is sintered from 10-100 micron copper fibers and 10-100 micron copper powder.
4. The perforated plate heat sink of claim 2 wherein the rectangular cavity and the top cover are both copper.
5. The porous plate heat sink of claim 1 wherein the heat pipe working fluid is one or more of ammonia, freon-21, freon-11, freon-113.
6. A multi-aperture flat plate heat sink system, comprising:
the radiator comprises a radiator body, wherein a cavity is formed in the radiator body, and a porous structure is formed on the inner wall of the bottom of the cavity; the bottom outer surface of the cavity is ground to be a plane to serve as a heat transfer contact plane; the heat radiator is provided with two heat radiators, wherein the heat transmission contact plane of one heat radiator is used for contacting with an object to be radiated, and the heat transmission contact plane of the other heat radiator is used for contacting with a cooling source;
and the connecting pipe is communicated between the two radiators and filled with the working medium of the heat pipe.
7. The perforated plate heat sink system of claim 6 wherein the connecting tubes are copper tubes.
8. The system of claim 6 or 7 wherein the heat spreader body comprises a rectangular copper cavity and a copper cap fixedly secured to the rectangular copper cavity.
9. The porous plate heat spreader system of claim 6 wherein the porous structure is sintered from 10-100 micron copper fibers and 10-100 micron copper powder.
10. The perforated plate heat sink system of claim 6 wherein the heat pipe working fluid is one or more of ammonia, freon-21, freon-11, freon-113.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920782528.7U CN210092066U (en) | 2019-05-28 | 2019-05-28 | Porous flat plate type radiator and system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920782528.7U CN210092066U (en) | 2019-05-28 | 2019-05-28 | Porous flat plate type radiator and system |
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| CN210092066U true CN210092066U (en) | 2020-02-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364498A (en) * | 2019-05-28 | 2019-10-22 | 广东省智能制造研究所 | A kind of porous flat plate formula radiator, system and manufacturing method |
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2019
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364498A (en) * | 2019-05-28 | 2019-10-22 | 广东省智能制造研究所 | A kind of porous flat plate formula radiator, system and manufacturing method |
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Address after: Room 612, Building 13, Compound 100, Xianlie Middle Road, Yuexiu District, Guangzhou City, Guangdong Province, 510070 Patentee after: Institute of intelligent manufacturing, Guangdong Academy of Sciences Address before: Room 612, Building 13, Compound 100, Xianlie Middle Road, Yuexiu District, Guangzhou City, Guangdong Province, 510070 Patentee before: GUANGDONG INSTITUTE OF INTELLIGENT MANUFACTURING |
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