CN2699477Y - Heat-pipe radiator construction - Google Patents
Heat-pipe radiator construction Download PDFInfo
- Publication number
- CN2699477Y CN2699477Y CN 200420049978 CN200420049978U CN2699477Y CN 2699477 Y CN2699477 Y CN 2699477Y CN 200420049978 CN200420049978 CN 200420049978 CN 200420049978 U CN200420049978 U CN 200420049978U CN 2699477 Y CN2699477 Y CN 2699477Y
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- radiator
- heat
- loam cake
- metal sintering
- heat radiation
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Abstract
The utility model relates to a heat-pipe radiator construction. The radiator is vacuum, and a metallic agglomerate is arranged inside the radiator. The metallic agglomerate absorbs and is filled with working liquid. When the heating segment of the radiator of a heat pipe absorbs the heat energy generated by computer chips, the working liquid is changed into gas and moves to the heat dissipating fin part. When the working liquid of gas state contacts the heat dissipating fin part with low temperature, the working liquid of gas state cools to be liquid and is absorbed by the metallic agglomerate, and then the working liquid flows to the heating segment under the capillary effect. Repeated circulation in this way achieves the heat dissipating effect.
Description
Technical field
The utility model is constructed relevant for a kind of heat-pipe radiator, refer in particular to the good heat transfer or the capacity of heat transmission of utilizing heat pipe and cooperate the hollow heat radiation fin collocation fan that vacuumizes again, as the cooling section of heat pipe, can significantly promote the heat-pipe radiator structure of radiator usefulness.
Background technology
Point out in the mole theorem that the leading founder Gordon of the Intel Company mole of computer chip industry (Gorden Moore) proposed in nineteen sixty-five (Moore ' s Law), improvement along with the computer chip processing procedure, chip usefulness every 18～24 months same units areas can promote one times, the growth rate of duration computer chip today is also advanced as the pointed quick paces of mole theorem, and usefulness is constantly turned over liter, grown up.
Yet computer chip usefulness (being so-called work time pulse) constantly promotes, and incident but is the thorny problem of chip cooling; For the electric crystal quantity that chip can higher work time pulse be operated in the chip not only must increase, power consumption also must increase, and high power consumption has also just produced high heat, if radiating efficiency is not good, to cause the situation generation of failure of chip or computer when machine, especially central processing unit of computer (CPU) and drawing chip (GPU) are topmost two pyrotoxins in the host computer;
So relevant dealer drops into the radiator 5 that exploitation is used for computer chip one after another, see also shown in Figure 10, this is commonly used radiator 5 and has several radiating fins 51, and a fan 52 is installed in radiator 5 computer chip 54 across one deck heat-conducting cream 53 top is installed in radiating fin 51 tops, the thermal energy conduction that computer chip 54 is produced is to radiating fin 51 thus, again by the wind-force cooling heat dissipation fin 51 of fan 52 to reach the purpose of computer chip 54 heat radiations, make the sustainable and stable running of computer.
So, above-mentioned commonly using in practical application, still have the utmost point and treat improved disappearance, no matter each tame manufacturer makes radiating fin with different procedure for processing such as the type of extruding, die-casting die, planer processing type and forging types, purpose is nothing but to reduce the spacing of two radiating fins, increase the sheet number of radiating fin, but reach the area of increase air feed power heat radiation, quick heat radiating thus.Yet thin ribs makes that the heat energy of fin bottom can't be effectively and conduct to the top fully, fast, moreover the wind-force of fan arrives when the radiating fin bottom, blast reduces already, thus, caused the temperature difference of radiating fin top and bottom to strengthen, radiating efficiency is not good; In addition, for better radiating efficiency is arranged, have to strengthen radiating fin and the rotating speed that changes the outfit is faster, wind-force is stronger fan; So, the radiator of this kind large volume certainly will not be suitable for and is particular about compact, as to be particular about mobility notebook computer.
In addition, be the action schematic diagram of heat pipe 7 as shown in figure 12, this heat pipe 7 is a shell 71, hydraulic fluid (heating agent liquid) and capillaries fabricated thing 72 are formed, after this heat pipe 7 vacuumized, refill an amount of hydraulic fluid, and absorbed by capillaries fabricated thing 72, be full of behind the hydraulic fluid heat pipe sealed 7 again, heat pipe 7 one ends are bringing-up section, and the other end is a cooling end, when heat energy makes the hydraulic fluid carburation by evaporation of bringing-up section, under the pressure reduction of vapour pressure, flow to cooling section, to discharge heat energy, be condensed into liquid state simultaneously and absorb by capillaries fabricated thing 72, and flow back to bringing-up section by capillary force, by hydraulic fluid constantly circulation reach the purpose of heat radiation to take away heat energy; The capacity of heat transmission of heat pipe 7 surpasses the capacity of heat transmission of any known metal, so heat pipe is also likened to hot superconductor, and the movable piece of its light weight, the no consumption energy, have higher isothermal characteristics again, so can be the good member of heat transfer.
So, industry develops again and a kind of radiator 6 with heat pipe structure, see also shown in Figure 11ly, this commonly uses radiator, in radiating fin 61 installings one heat pipe 62, and the other end of heat pipe 62 is equiped with a sheet metal 63, sheet metal 63 is fitted across one deck heat-conducting cream 64 with the computer chip 65 on the motherboard 66 thus, walks the heat energy of computer chip 65 with absorption band, simultaneously by the good heat-conductive characteristic of heat pipe 62, transferring heat energy is in radiating fin 61, and by the wind-force heat radiation of fan 67.
Though heat pipe has good heat-conductive characteristic, it is the superconductor of heat, but itself only have an effect of transferring heat energy, still must rely on radiating fin and fan heat radiation, and as previously mentioned, radiating fin still has the disappearance of demanding urgently improving, can't take away heat with high efficiency, moreover heat pipe, sheet metal, radiating fin are to assemble with welding manner, thus, the thermal resistance that has increased each assembly has also influenced radiating efficiency.
In view of this inventor adheres to the abundant research and development and the actual experience of producing of making of relevant industries for many years, studies improvement again at the disappearance of commonly using now, provides a kind of heat-pipe radiator structure, in the hope of improving all disappearances of commonly using fully.
Summary of the invention
The purpose of this utility model is to provide a kind of heat-pipe radiator structure, it is the heat radiation fin that the cooling section in heat pipe forms hollow and vacuumizes, the isothermal height of this any position of heat radiation fin, make by the heat energy of the hydraulic fluid transmission of the steam state fan of can arranging in pairs or groups and be pulled away fast, make computer chip unlikely overheated, and continuable stable running.
The purpose of this utility model is to realize like this, a kind of heat-pipe radiator structure, this radiator has loam cake, metal sintering piece and bottom, the metal sintering piece is placed in the loam cake again with bottom and loam cake encapsulation, and radiator inside is vacuumized by the metal tube that is installed in bottom, and the filling hydraulic fluid, sealing forms radiator again; Loam cake has number heat radiation fin, and the two sides of this heat radiation fin are wavy; Metal sintering piece, inside have the gas passage that number is hollow tubular, and approaching heat radiation fin has breach to this gas passage in the bringing-up section caliber is less.
Bottom can be wavy plate.
In between the loam cake of two correspondences up and down, a metal sintering piece is set.
A kind of heat-pipe radiator structure, this radiator has loam cake, metal sintering piece and bottom, the metal sintering piece is placed in the loam cake bottom and loam cake are encapsulated again, and by the metal tube that is installed in bottom radiator inside is vacuumized, and the filling hydraulic fluid, sealing forms radiator again; This loam cake has the heat radiation fin that is long rectangle, and is provided with support chip in the heat radiation fin, and this support chip has perforation.
A kind of heat-pipe radiator structure, this radiator has loam cake, metal sintering piece and bottom, the metal sintering piece is placed in the loam cake bottom and loam cake are encapsulated again, and by the metal tube that is installed in bottom radiator inside is vacuumized, and the filling hydraulic fluid, sealing forms radiator again; Loam cake has the heat radiation fin, and the two sides of this heat radiation fin are wavy; The metal sintering piece is installed on the heating part of radiator; The capillaries fabricated thing can be glass fabric or adhesive-bonded fabric felt, is installed in the top of bottom, and the one end contacts with the metal sintering piece.
Its periphery of metal sintering piece is the curve of concavo-convex complications.
Description of drawings
Fig. 1: one embodiment three-dimensional exploded view of the present utility model.
Fig. 2: one embodiment profile of the present utility model.
Fig. 3: its two embodiment profile of the present utility model.
Fig. 4: its three embodiment three-dimensional exploded view of the present utility model.
Fig. 5: its four embodiment three-dimensional exploded view of the present utility model.
Fig. 6: its five embodiment three-dimensional exploded view of the present utility model.
Fig. 7: its five embodiment profile of the present utility model.
Fig. 8: its six enforcement handstand body exploded view of the present utility model.
Fig. 9: its seven embodiment three-dimensional exploded view of the present utility model.
Figure 10: one is commonly used the embodiment profile of structure.
Figure 11: its two embodiment profile of commonly using structure.
Figure 12: its three generalized section of commonly using structure.
1 radiator, 11 loam cakes
111 heat radiation fins, 112 sheet metals
113 concave arcs, 12 metal sintering pieces
121 gas passages, 122 breach
13 bottoms, 131 metal tubes
22 metal sintering pieces, 23 capillaries fabricated things
3 loam cakes, 31 top layers
311 heat radiation fins, 312 support chips
313 perforation, 32 metal sintering pieces
4 loam cakes, 41 top layers
411 heat radiation fins, 412 sheet metals
413 concave arcs, 5 radiators
51 radiating fins, 52 fans
53 heat-conducting creams, 54 computer chips
55 motherboards, 6 radiators
61 radiating fins, 62 heat pipes
63 sheet metals, 64 heat-conducting creams
65 computer chips, 66 motherboards
67 fans, 7 heat pipes
71 shells, 72 capillaries fabricated things
Embodiment
At first, please consult Fig. 1, shown in Figure 2 earlier, the utility model radiator 1 is to combine with loam cake 11, metal sintering piece 12 and bottom 13; Wherein:
Metal sintering piece 12, be to form with metal powder sintered, its inside has densely covered micropore, this metal sintering piece 12 has the gas passage 121 that number is hollow tubular, this gas passage 121 is less in the bringing-up section caliber, with the minimizing thermal resistance, and the hydraulic fluid of build-up of pressure official post vaporization flows to cooling section; In addition, gas passage 121 has breach 122 near the cooling section place.
During the utility model combination, with the bringing-up section of metal sintering piece 12 and loam cake 11 with the higher material solder bond of conductive coefficient, cover bottom 13 again and weld the seam crossing of bottom 13 and loam cake 11, utilize the metal tube 131 of bottom 13 to vacuumize back filling operation liquid again and go into radiator inside closed metal pipe 131 again, so promptly finish the assembling of heat-pipe radiator 1; In addition, after vacuumizing, because of the contraction on heat radiation fin 111 surfaces, so its surface is wavy, distortion is just like several upright tubes.
The utility model is when practical application, with the left side of sheet metal 112 applying computer chips with conduction heat energy heating of metal agglomerate 12, flow to breach 122 and enter heat radiation fin 111 and the hydraulic fluid that metal sintering piece 12 is absorbed changes steam state into after being heated and following gas passage 121, and heat radiation fin 111 more in addition fan brush cooling to take away the heat energy that transmits by the vaporization hydraulic fluid, thus hydraulic fluid again condensation be transformed into liquid state and drip, absorbed by metal sintering piece 12, and flow to bringing-up section by the effect of capillary force, so perseveration is to reach the purpose of quickening heat radiation.
In addition, see also shown in Figure 3ly, also can make 13 of metal sintering piece 12 and bottoms be formed with several microscler grooves bottom 13 moulding as wavy plates, more can quicken to be the flowing velocity and the efficient of steam state hydraulic fluid.
It is shown in Figure 4 to review, also can be in 11 ccontaining metal sintering pieces 12 of two loam cakes, the surface area that supplies hydraulic fluid to carry out heat exchange is doubled, more can promote the efficient of heat radiation, this kind radiator is bigger because of volume, so be applicable to desktop computer, or giant brain, and must upright use, can behind metal sintering piece 12, flow to the heating part again by gravity current in order to the hydraulic fluid of heat radiation fin 111 condensations, in order to the circulation heat radiation of hydraulic fluid.
Yet above-mentioned heat radiation fin 111 is to make with punching press, the worker's method of extending, and it is made material and is limited to the good metal material of ductility, and yield is lower, has caused influence for production efficiency, the production cost of production firm, so, the inventor studies several processing methods again, with details are as follows:
See also shown in Figure 5, at first stamp out the heat radiation fin 311 that several are long rectangle in loam cake 3 top layers 31 1 ends, stamp out several support chips 312 with a metal plate spare again, has number perforation 313 on this support chip 312, support chip 312 is inserted in the heat radiation fin 311, and settle metal sintering piece 12 in regular turn, vacuumize again behind the bottom 13, fill hydraulic fluid, finish the radiator assembling, because heat radiation fin 311 inside are vacuum, so atmospheric pressure will make 311 distortion of heat radiation fin compress, at this moment, support chip 312 just plays a role, make that heat radiation fin 311 is unlikely to suffer atmospheric pressure and torsional deformation influences its radiating efficiency, and the hydraulic fluid that is gaseous state can be circulated still by perforation 313 in heat radiation fin 311.
In addition, because the cost of metal sintering piece 12 is higher, so, the inventor proposes a solution more again, see also Fig. 6, shown in Figure 7, metal sintering piece 22 can be dwindled the size of only putting in bringing-up section, install a capillaries fabricated thing 23 in bottom 13 tops again, this capillaries fabricated thing 23 can be glass fabric or adhesive-bonded fabric felt, in addition, when vacuumizing, loam cake 11 meeting depressed deformations, but loam cake 11 punching presses are counted concave arc 113 and capillaries fabricated thing 23 and bottom 13 are assembled and vacuumized, filling operation liquid is promptly finished the assembling of radiator, heat energy conducts heat energy in metal sintering piece 22 by bringing-up section during the utility model running, make hydraulic fluid change steam state into, flow to heat radiation fin 111 simultaneously, when the hydraulic fluid contact that is steam state, during by fan-cooled heat radiation fin 111, can carry out thermal conversion, and the hydraulic fluid that is steam state is condensed into the thin structure 23 of fluid drips fuds fuddled, and flow to metal sintering piece 22 more again by capillarity, be steam state and be heated once again, heat radiation is thought in circulation so repeatedly.
See also shown in Figure 8, can strengthen the quantity of heat radiation fin 411, strengthen for forming heat radiation fin 411 in the top layer of loam cake 4 41 1 ends, and be provided with sheet metal 412 in the heating part, and top layer 41 is provided with many concave arcs 413, make radiating efficiency better, this kind radiator is fit to be used on desktop computer or the giant brain.
Please consult shown in Figure 9 again, also metal sintering piece 32 can be shaped as the blocks with concavo-convex tortuous edge, so not only save the material of metal sintering piece, cooperate capillaries fabricated thing 23, the surface area that can supply hydraulic fluid to flash to steam has increased, so radiating efficiency has also promoted simultaneously.
Sum up the utility model of above-described several processing methods, commonly use and have following advantage:
1. the utility model carries out heat exchange by the characteristics that the heat radiation fin that vacuumizes has high isothermal, to reach the purpose of quick heat radiating, the radiating fin of commonly using up and down temperature inequality and wind-force is difficult to blow the bottom that reaches radiating fin and the radiating efficiency gastrointestinal disease patient, has more the value of application in fact.
The utility model by must not the energy, the radiator of the heat pipe principle creation of no movable piece, must not dispel the heat with the fan of the large scale of high rotating speed, high blast, highly energy-consuming, high noisy value, for quiet degree and the power saving of using computer great benefit is arranged all.
Claims (6)
1. a heat-pipe radiator is constructed, it is characterized in that: this radiator has loam cake, metal sintering piece and bottom, the metal sintering piece is placed in the loam cake again with bottom and loam cake encapsulation, and radiator inside is vacuumized by the metal tube that is installed in bottom, and the filling hydraulic fluid, sealing forms radiator again; Loam cake has number heat radiation fin, and the two sides of this heat radiation fin are wavy; Metal sintering piece, inside have the gas passage that number is hollow tubular, and approaching heat radiation fin has breach to this gas passage in the bringing-up section caliber is less.
2. heat-pipe radiator structure as claimed in claim 1, it is characterized in that: bottom can be wavy plate.
3. heat-pipe radiator as claimed in claim 1 structure is characterized in that: between the loam cake of two correspondences up and down, a metal sintering piece is set.
4. a heat-pipe radiator is constructed, it is characterized in that: this radiator has loam cake, metal sintering piece and bottom, the metal sintering piece is placed in the loam cake again with bottom and loam cake encapsulation, and radiator inside is vacuumized by the metal tube that is installed in bottom, and the filling hydraulic fluid, sealing forms radiator again; This loam cake has the heat radiation fin that is long rectangle, and is provided with support chip in the heat radiation fin, and this support chip has perforation.
5. a heat-pipe radiator is constructed, it is characterized in that: this radiator has loam cake, metal sintering piece and bottom, the metal sintering piece is placed in the loam cake again with bottom and loam cake encapsulation, and radiator inside is vacuumized by the metal tube that is installed in bottom, and the filling hydraulic fluid, sealing forms radiator again; Loam cake has the heat radiation fin, and the two sides of this heat radiation fin are wavy; The metal sintering piece is installed on the heating part of radiator; The capillaries fabricated thing can be glass fabric or adhesive-bonded fabric felt, is installed in the top of bottom, and the one end contacts with the metal sintering piece.
6. heat-pipe radiator structure as claimed in claim 5, it is characterized in that: its periphery of metal sintering piece is the curve of concavo-convex complications.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420049978 CN2699477Y (en) | 2004-05-17 | 2004-05-17 | Heat-pipe radiator construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420049978 CN2699477Y (en) | 2004-05-17 | 2004-05-17 | Heat-pipe radiator construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2699477Y true CN2699477Y (en) | 2005-05-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420049978 Expired - Fee Related CN2699477Y (en) | 2004-05-17 | 2004-05-17 | Heat-pipe radiator construction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2699477Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336067B (en) * | 2007-06-29 | 2010-06-02 | 奇鋐科技股份有限公司 | Mechanism of media for vacuum sealed radiating and method thereof |
| CN101452897B (en) * | 2007-12-05 | 2011-03-30 | 富准精密工业(深圳)有限公司 | Heat radiating device for LED |
| CN102290388A (en) * | 2011-08-11 | 2011-12-21 | 深圳市润芯科技有限公司 | Electronic control device, heat pipe radiator and manufacturing method of heat pipe radiator |
| CN104615219A (en) * | 2013-11-05 | 2015-05-13 | 3M新设资产公司 | Filtering noise reduction assembly, cooling module comprising the same and portable electronic apparatus |
| JP2020080381A (en) * | 2018-11-13 | 2020-05-28 | Ｎｅｃプラットフォームズ株式会社 | Heat radiation structure |
-
2004
- 2004-05-17 CN CN 200420049978 patent/CN2699477Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336067B (en) * | 2007-06-29 | 2010-06-02 | 奇鋐科技股份有限公司 | Mechanism of media for vacuum sealed radiating and method thereof |
| CN101452897B (en) * | 2007-12-05 | 2011-03-30 | 富准精密工业(深圳)有限公司 | Heat radiating device for LED |
| CN102290388A (en) * | 2011-08-11 | 2011-12-21 | 深圳市润芯科技有限公司 | Electronic control device, heat pipe radiator and manufacturing method of heat pipe radiator |
| CN102290388B (en) * | 2011-08-11 | 2013-09-11 | 深圳市润芯科技有限公司 | Electronic control device, heat pipe radiator and manufacturing method of heat pipe radiator |
| CN104615219A (en) * | 2013-11-05 | 2015-05-13 | 3M新设资产公司 | Filtering noise reduction assembly, cooling module comprising the same and portable electronic apparatus |
| JP2020080381A (en) * | 2018-11-13 | 2020-05-28 | Ｎｅｃプラットフォームズ株式会社 | Heat radiation structure |
| CN112997595A (en) * | 2018-11-13 | 2021-06-18 | Nec平台株式会社 | Heat radiation structure |
| CN112997595B (en) * | 2018-11-13 | 2024-02-13 | Nec平台株式会社 | Heat dissipation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |