CN2494036Y - Heat sink assembly - Google Patents
Heat sink assembly Download PDFInfo
- Publication number
- CN2494036Y CN2494036Y CN 01229492 CN01229492U CN2494036Y CN 2494036 Y CN2494036 Y CN 2494036Y CN 01229492 CN01229492 CN 01229492 CN 01229492 U CN01229492 U CN 01229492U CN 2494036 Y CN2494036 Y CN 2494036Y
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- shell cover
- cover plate
- plate material
- radiator
- composite set
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Abstract
The utility model relates to a combined unit of a radiator, comprising a group of upper and lower thin shell cover plates which can cooperate with each other, two reticular capillary structure layers which are attached tightly to the inner wall surface of the thin shell cover plates above, a porous support plate which is a hollow plate body formed by the bending of a metal plate, on the surface of which a plurality of round, triangle and polygonal perforations are arranged through punching holes, a plurality of braced columns arranged in the perforations of the porous support plate between two corresponding thin shell cover plates, and a plurality of elastomers which are more than the braced columns. Therefore, the utility model has a better heat scattering effect and a higher stability, and is ensured to be prevented from short circuit.
Description
Technical field
The utility model relates to a kind of composite set of radiator, is meant a kind of composite set that can reach the radiator of more perfect radiating effect especially.
Background of invention
Press, microelectric technique is progressive fast in recent years, and relative also makes electronics, information product when design, and the heat dissipation problem of element and system becomes more and more important.Especially day by day light, thin, short and small PC.And micro heat pipe can transmit a large amount of heat and not consume electric power under the very little temperature difference, therefore, is fit to very much the radiating requirements of following portable type electronic product.And based on micro heat pipe have reaction fast, have a narrow range of temperature, hot biography amount reaches advantages such as volume is little greatly, and make can widely be applied in the heat radiation of portable type electronic product in future by a definite date, so the micro heat pipe of commonly seeing at present has tubulose or dull and stereotyped pattern at least on shaped design, look demand and freely select for use for industry.
Yet, tradition is used for the tree sealing of wrapping IC potted element, its heat-sinking capability is not good, cause the radiating effect that can't provide enough, to adapt to the more and more high IC potted element of present caloric value, the practice up to now is additional one deck heating panel on a side of semiconductor wafer, to promote radiating effect, these heating panels are mostly by being made of individual layer sheet metal (as aluminium, copper, iron, nickel, chromium or its alloy), so have disappearance described as follows:
1, because the heat conduction speed of single-layer metal sheet is fixing, so, this kind commonly use heating panel all can't at, different semiconductor element produces the radiating efficiency that the different heat amount changes or control heating panel.As with semiconductor wafer of the same area, the wafer that adopts the deep-sub-micrometer processing procedure to be produced is because of its current densities height, so its caloric value may be the several times of general micron system wafer even tens of times more than; And for example, (CPU or 3D figure quicken wafer (3DVGA ChiP) or the like, and its caloric value also may be for the several times of the dynamic memory body wafer (DRAM Chip) of only making simple on/off switch even more than tens of times for being exclusively used in the wafer that carries out the complex mathematical computing such as processor.Therefore, commonly use the heating panel that the individual layer sheet metal is constituted, its radiating effect is limited, and is difficult for adjusting at the radiating requirements of different chips.
2, cover the heating panel that synusia shape sheet metal is constituted, be easy to generate the thermal stress concentration effect in the wafer adstante febre; This substrate that to be its thermal coefficient of expansion of heating panel (CTE value) of being constituted because of individual layer sheet sheet metal constituted with the resin material is difference to some extent, therefore, under the situation of being heated, just be easy to generate relatively large thermal stress, so be easier to cause the reduction in wafer instability or useful life relatively.Thermal stress is concentrated when serious, even the fin prying can take place, and further causes the situation of whole IC damage.
Summary of the invention
Main purpose of the present utility model is to provide a kind of composite set of radiator, uses the heat that central microprocessor is produced, can be fully via netted heat pipe directly conduction reach heat radiation, its better heat-radiation effect, stability are higher.
Secondary objective of the present utility model is to provide a kind of composite set of radiator, by the elasticity of insulating radiation film, makes it have the central microprocessor of suppressing wafer, the effect of its pin and the driving fit of circuit board upper contact, and can guarantee its unlikely short circuit.
The utility model provides a kind of composite set of radiator, and a kind of composite set of radiator comprises one group of upper and lower shell cover plate material that can cooperatively interact; Two netted capillary structure layer of being close to above-mentioned shell cover plate material internal face respectively; A porousness supporting bracket is a metal sheet surface through punching is covered with most circles, triangle, polygonal perforation, and the hollow plate body of bending forming; A plurality of support columns are arranged in the perforation of folded porousness supporting bracket in the two corresponding shell cover plate materials; And a plurality of elastomer formations more than the support column number; Wherein the part elastomer sleeve is located on the support column, and all the other then are distributed in the position in the two shell cover plate material institute clip spaces.
It is the preferable sheet metal of thermal conductivity that the utility model also provides this shell cover plate material.
The thin plate structure that the utility model also provides this netted capillary structure layer to be made of the good material of thermal diffusivity.
The utility model also provides and lays several support columns in this shell cover plate material.
The utility model also provides in this shell cover plate material and inserts fin.
Better heat-radiation effect of the present utility model, stability are higher, and can guarantee its unlikely short circuit.
Description of drawings
The preferred embodiment exploded view of Fig. 1 the utility model radiator.
The preferred embodiment constitutional diagram of Fig. 2 the utility model radiator.
The full embodiment combination section of Fig. 3 the utility model radiator.
The action schematic diagram that Fig. 4,5 the utility model radiators expand by compression.
The juncture generalized section of its upper and lower shell cover plate material of Fig. 6 the utility model radiator.
The multiple enforcement kenel partial enlarged drawing that connects what position of its upper and lower shell cover plate material of Fig. 7 the utility model radiator.
The juncture generalized section of its upper and lower shell cover plate material of Fig. 8 the utility model radiator and pipe (or polygonal pipe).
The application generalized section of its porousness supporting bracket of Fig. 9 the utility model radiator.
Figure 10 the utility model is used the fin schematic appearance.
Figure 11 the utility model is used the partial structurtes enlarged diagram of fin.
The generalized section that combines of Figure 12 shell cover plate of the present utility model and fin.
Embodiment
For making the juror can detail knowledge for characteristics of the present utility model, technology contents and the effect reached thereof, enumerate a preferred embodiment now, cooperate illustrate as follows:
See also shown in Fig. 1,2,3, the composite set of the designed radiator of the utility model, mainly apply to the thermolysis of integrated circuit potted element (IC Package), and this radiator 1 comprises the micro heat pipe of different types in utilization, its type shape comprises tubulose and tabular, and working fluid is water or acetone, and capillaries fabricated wherein is wire netting or sintering pattern (doing an explanation with the pattern of wire netting in the present embodiment); The composite set of this radiator 1 includes at least:
One group of upper and lower shell cover plate material 10 that can cooperatively interact, this upper and lower shell cover plate material 10 are all selected to use the preferable relatively metallic plate of thermal conductivity, and constitute overall structure hardness and all good skin of intensity in view of the above.
Two netted capillary structure layer 20 of being close to above-mentioned shell cover plate material 10 internal faces respectively, it selects the good thin plate endothecium structure that material constituted of thermal diffusivity for use.
A porousness supporting bracket 30 is a metallic plate through suitable cutting processing, and becomes to be covered with to have the kenel of most circular, triangles or polygonal perforation 31 through punching in the surface, again via the hollow plate body of the tool suitable thickness of bending forming; A plurality of support columns 40, getting the appropriate location is laid in the perforation 31 of folded porousness supporting bracket 30 in the two corresponding shell cover plate materials 10, and provide in good time capillarity, and further reach the purpose of heat transfer, and a plurality of elastomers 50 more than the support column number constitute, wherein Yi Bufen elastomer 50 is sheathed on the support column 40, and all the other then are distributed in the appropriate location in 10 clip spaces of two shell cover plate materials (covering sheet material), so as to enough elastic anchorage forces are provided.
So, by the above-mentioned radiator 1 that can constitute a complete netted composite set of porousness; More than be the feature general introduction that constitutes the relevant formation unit of radiator for the utility model, as for its actual applicable cases then as following:
Composite set according to the special radiator of above-mentioned this kind, when its when reality is used, must comply with shell cover plate material 10 down earlier, netted capillary structure layer 20, porousness supporting bracket 30, support column 40, elastomer 50, netted capillary structure layer 20, the order combination of last shell cover plate material 10, and will go up, following shell cover plate material 10 gives solid welding sealing (juncture sees Fig. 5 for details), make other unit all be coated its inside, and form single radiator 1, yet, when entire radiator 1 is in vacuum state, when if its wall thickness is too thin, the wall that will cause dispelling the heat produces depressed deformation, and make elastomer 50, therefore distortion produces hard pressed situation, but because elastomer 50 elastic-restoring forces own are also being oppressed porousness supporting bracket 30 simultaneously, so can impel netted capillary structure layer 20 to be close to porousness supporting bracket 30 and 10 distortion of shell cover plate material.Otherwise, when radiator 1 is heated, if be similarly the too thin situation of wall thickness, the wall that then dispels the heat meeting dilatancy, similarly, the restoring force of elastomer 50 also can be oppressed porousness supporting bracket 30, and forces netted capillary structure layer 20 to be close to porousness supporting bracket 30 and 10 distortion of shell cover plate material, shown in Fig. 4,5.
Please cooperate again and consult shown in Fig. 6,7, aforesaid upper and lower shell cover plate material 10 can be adopted with the various different shape seen in scheming and reach the purpose of its combination on practical combinations, and all can reach firm really in conjunction with benefit.
And for example shown in Figure 8, when radiator 1 practice in the engaging of pipe 2 (or polygon pipe) time, then be to see through welding manner to impose scolder 4, and reach in conjunction with certain degree in its lap-joint, help heat radiation.
Moreover as shown in Figure 9, the radiator of the present utility model netted capillary structure 3 (or netted capillary structure and sintering capillary structure) of further arranging in pairs or groups uses when making it overlap mutually, utilizes the effect of porousness supporting bracket to reach closely and is close to, in order to quick heat radiating.
In addition, please cooperate in the lump again shown in ginseng great Figure 10～12, represent the enforcement kenel of radiator of the present utility model when the general fin 6 of collocation uses; Wherein, this fin 6 structurally is the fin portions of vertical kenel through including of one bending forming, reach and connect upper and lower last connecting portion that is horizontal kenel of this fin portions 60 and following connecting portion 61 respectively, and in descending right position, connecting portion 61 top that panel splice portion 62 is set, then insert the shell cover plate material 10 of the utility model radiator 1 in panel splice portion 62 and 61 of following connecting portions, by this in the use, utilize the effect of closely being close to each other equally, reach the purpose and the effect of quick heat radiating.
Through as shown in the above description, radiator 1, be used in 10 of outer field upper and lower shell cover plate materials be provided with the support column 40 of porousness supporting bracket 30 collocation plural number and elastomer 50 in conjunction with composite set, and impose on porousness by solid-state strength and support on 30 and oppress netted capillary structure layer 20, therefore, the netted capillary structure layer 20 of being impelled upper and lower shell cover plate material 10 to paste mutually with this its forms combines closely, thus, just can strengthen exothermal effect by capillarity along band, and reach perfect heat transfer purpose.
In sum, the composite set of the utility model radiator, not only can reduce thermal stress concentrates, and heat conduction by the net metal paper tinsel, can effectively control the heat dissipation and the contact of radiator and be close to effect, and reach good, the high Practical Benefit that has industrial utilization of stability of heat radiation, the disadvantages that overcomes located by prior art fully and had; Hence one can see that, and practicality of the present utility model and progressive show and should possess.In addition, the utility model is before application and do not seen also possessed the patent key element of practicality, novelty and progressive on determine any public occasion or the publication, files an application in accordance with the law, earnestly asks the juror of an ancient unit of weight office explicit example for reference, grants the quasi patent rights and interests, and the true feeling moral just.
Claims (5)
1, a kind of composite set of radiator is characterized in that: comprise one group of upper and lower shell cover plate material that can cooperatively interact; Two netted capillary structure layer of being close to above-mentioned shell cover plate material internal face respectively; A porousness supporting bracket is a metal sheet surface through punching is covered with most circles, triangle, polygonal perforation, and the hollow plate body of bending forming; A plurality of support columns are arranged in the perforation of folded porousness supporting bracket in the two corresponding shell cover plate materials; And a plurality of elastomer formations more than the support column number; Wherein the part elastomer sleeve is located on the support column, and all the other then are distributed in the position in the two shell cover plate material institute clip spaces.
2, according to the composite set of the described radiator of claim 1, it is characterized in that: this shell cover plate material is the preferable sheet metal of thermal conductivity.
3, according to the composite set of the described radiator of claim 1, it is characterized in that: the thin plate structure that this netted capillary structure layer is made of the good material of thermal diffusivity.
4, according to the composite set of the described radiator of claim 1, it is characterized in that: lay several support columns in this shell cover plate material.
5, according to the composite set of the described radiator of claim 1, it is characterized in that: insert fin in this shell cover plate material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01229492 CN2494036Y (en) | 2001-07-27 | 2001-07-27 | Heat sink assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01229492 CN2494036Y (en) | 2001-07-27 | 2001-07-27 | Heat sink assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2494036Y true CN2494036Y (en) | 2002-05-29 |
Family
ID=33644352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01229492 Expired - Fee Related CN2494036Y (en) | 2001-07-27 | 2001-07-27 | Heat sink assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2494036Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100401864C (en) * | 2004-07-14 | 2008-07-09 | 财团法人工业技术研究院 | Radiating structure having micro-structure layer and manufacturing method thereof |
| CN101749979B (en) * | 2008-12-22 | 2012-11-21 | 富准精密工业(深圳)有限公司 | Radiating fin, radiator and electronic device |
| CN102889635A (en) * | 2012-10-26 | 2013-01-23 | 唐玉敏 | Integrally-molded welding-line-free heating radiator and manufacturing method thereof |
| CN107396617A (en) * | 2017-09-05 | 2017-11-24 | 中微冷却技术（深圳）有限公司 | Floating type heat abstractor and the electronic building brick for being provided with the floating type heat abstractor |
| CN109565945A (en) * | 2017-03-02 | 2019-04-02 | 华为技术有限公司 | Conducting-heat elements and mobile terminal |
-
2001
- 2001-07-27 CN CN 01229492 patent/CN2494036Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100401864C (en) * | 2004-07-14 | 2008-07-09 | 财团法人工业技术研究院 | Radiating structure having micro-structure layer and manufacturing method thereof |
| CN101749979B (en) * | 2008-12-22 | 2012-11-21 | 富准精密工业(深圳)有限公司 | Radiating fin, radiator and electronic device |
| CN102889635A (en) * | 2012-10-26 | 2013-01-23 | 唐玉敏 | Integrally-molded welding-line-free heating radiator and manufacturing method thereof |
| CN102889635B (en) * | 2012-10-26 | 2016-08-24 | 唐玉敏 | A kind of global formation no-welding-seam radiator and production method thereof |
| CN109565945A (en) * | 2017-03-02 | 2019-04-02 | 华为技术有限公司 | Conducting-heat elements and mobile terminal |
| CN109565945B (en) * | 2017-03-02 | 2020-07-28 | 华为技术有限公司 | Heat conduction part and mobile terminal |
| US10831249B2 (en) | 2017-03-02 | 2020-11-10 | Huawei Technologies Co., Ltd. | Heat conduction component and mobile terminal |
| CN107396617A (en) * | 2017-09-05 | 2017-11-24 | 中微冷却技术（深圳）有限公司 | Floating type heat abstractor and the electronic building brick for being provided with the floating type heat abstractor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |