CN107396617A - Floating type heat abstractor and the electronic building brick for being provided with the floating type heat abstractor - Google Patents
Floating type heat abstractor and the electronic building brick for being provided with the floating type heat abstractor Download PDFInfo
- Publication number
- CN107396617A CN107396617A CN201710794991.9A CN201710794991A CN107396617A CN 107396617 A CN107396617 A CN 107396617A CN 201710794991 A CN201710794991 A CN 201710794991A CN 107396617 A CN107396617 A CN 107396617A
- Authority
- CN
- China
- Prior art keywords
- flotator
- temperature
- uniforming plate
- floating type
- type heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses a kind of floating type heat abstractor, for the chip cooling on printed circuit board (PCB), including radiator, flotator and temperature-uniforming plate, wherein：The flotator is arranged on the radiator, the temperature-uniforming plate is space cantilever formula structure, the head end of the temperature-uniforming plate is adjacent on the flotator and the tail end of the temperature-uniforming plate is adjacent to the radiator, when the head end of the temperature-uniforming plate is by ambient pressure, the flotator moves to horizontal direction and axial direction, so that the head end of the temperature-uniforming plate is subjected to displacement in the horizontal direction；When the ambient pressure suffered by the head end of the temperature-uniforming plate disappears, the flotator returns to initial position.The floating type heat abstractor of the present invention can reduce thermal resistance of the chip to the heat transfer path of box body, improve radiating efficiency, can effectively reduce the size and weight of box body.
Description
Technical field
The present invention relates to a kind of heat sink technology field, more particularly to a kind of floating type heat abstractor and to be provided with this floating
The electronic building brick of dynamic formula heat abstractor.
Background technology
With the Highgrade integration of electronic component, lead on printed circuit board (PCB) (Printed Circuit Board, PCB)
Often it is integrated with multiple chips.These chips can produce a large amount of heat energy at work, so that chip temperature raises, may cause core
Piece damages.
As shown in figure 1, to solve heat dissipation problem, usually using electronic information processing casing 100 on vehicle-mounted or airborne.But
The radiating efficiency of electronic information processing casing 100 is relatively low, and its reason is：(1) there is the euthermic chip of multiple different sizes simultaneously
Solve；(2) the height dimension tolerance of chip is larger, and casing can not be directly bonded, it is necessary to is led between gap using thicker
Heat pad；(3) its thermal conductivity factor of heat conductive pad hardly matches metal, and thermal resistance is big, and temperature loss is big.With informationization high speed development,
The power consumption lifting of chip is very fast, and heat dissipation problem is increasingly severe, does the volume of big casing or seeks leading for more high thermal conductivity coefficient
Heat pad is all a kind of improvement mode, but weight, volume, cost can all be significantly increased, can be by vehicle-mounted, airborne scene application
Limitation.
Fig. 2 is the sectional view and heat radiating structure schematic diagram that electronic information handles casing 200.Electronic information handles casing 200
It may include that a finned box body 204 is used as radiator, pcb board 214 is fixed on box body 204 (the mounting surface of pcb board 214
It is designated as 216), then bottom 212 is installed to protect pcb board 214.As shown in Fig. 2 multiple cores in electronic information processing casing 200
Piece (for example, chip 208_1 and 208_2) shares a radiator.However, specification and size due to chip 208_1 and 208_2
May be completely inconsistent, cause electronic information processing casing 200 to need different boss (for example, boss 202) to compensate height
Gap.The installation of pcb board 214 and the fitting of chip are not and the height of chip 208_1 and 208_2 in itself on a step surface
It is larger to spend tolerance so that gap is certainly existed between chip and boss, and the gap is larger, it is necessary to use the heat conductive pad for having decrement
To fill.In addition, to the chip (for example, chip 208_3) of indivedual bare tape types, in order to reduce heat consumption density and reduce heat conductive pad
Thickness, it is necessary in advance measure pcb board 214 on chip height and box body 204 on boss height, first mended in boss and chip chamber
A metallic plate 206 is repaid, reduces the thickness of filling heat conductive pad with this, but is difficult to possess the operable of production to bulk article
Property.
The shortcomings that this prior art, is：The gap of chip and box body boss certainly exists, with heat conductive pad filling temp
Loss is big.In addition, to meet that chip works under controllable temperature specification, whole box sizes are big, weight is big.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of improved heat abstractor and is provided with the heat abstractor
Electronic building brick.
In order to solve the above technical problems, the invention provides a kind of floating type heat abstractor, for positioned at printed circuit board (PCB)
On chip cooling, including radiator, flotator and temperature-uniforming plate, wherein：The flotator is arranged on the radiator, institute
It is space cantilever formula structure to state temperature-uniforming plate, and the head end of the temperature-uniforming plate is adjacent on the flotator and the tail of the temperature-uniforming plate
End is adjacent to the radiator, and when the head end of the temperature-uniforming plate is by ambient pressure, the flotator is to horizontal direction and axial direction side
To movement, so that the head end of the temperature-uniforming plate is subjected to displacement in the horizontal direction；When outer suffered by the head end of the temperature-uniforming plate
During boundary's distress resolves, the flotator returns to initial position.
Preferably, the heat sink is finned box body.
Preferably, the temperature-uniforming plate is space zigzag shape, inner hollow and filled with liquid medium.
Preferably, the temperature-uniforming plate is space C word shapes, inner hollow and filled with liquid medium.
Preferably, heat-conducting medium is provided between the back side of the temperature-uniforming plate and the chip, it is described for reducing
Thermal resistance between temperature-uniforming plate and the chip.
Preferably, the flotator includes flotator shell, flotator pillar, elastic component and back-up ring, wherein the floating
Device shell and the flotator pillar are shaft hole matchings, and the elastic component is placed on the flotator shell and the flotator branch
In cavity body structure between post, and the back-up ring is positioned over the outside of the flotator shell.
Preferably, the flotator pillar has supporting surface, support and table for the head end to the temperature-uniforming plate
Face is adjacent to.
Preferably, there is flange on the flotator shell, for being bonded with the radiator, peace is included on the flange face
Hole is filled, there are containing cavities described for placing for the flotator is fixed on the radiator, and on the flange face
Back-up ring.
Preferably, the flotator shell and the flotator pillar are manufactured using Heat Conduction Material, and described floating
Heat-conducting medium is filled at shaft hole matching in dynamic device shell and the flotator pillar.
Present invention also offers a kind of electronic building brick, including printed circuit board (PCB) and the core on the printed circuit board (PCB)
Piece, it is characterised in that also consolidate including any of the above-described floating type heat abstractor, the radiator of the floating type heat abstractor
Surely the printed circuit board (PCB) is connected to, and the temperature-uniforming plate of the floating type heat abstractor is connected with the back side of the chip
Connect.
Preferably, heat-conducting medium is provided between the back side of the temperature-uniforming plate and the chip, it is described for reducing
Thermal resistance between temperature-uniforming plate and the chip.
Advantageously, floating type heat abstractor of the invention can reduce thermal resistance of the chip to the heat transfer path of box body,
Radiating efficiency is improved, can effectively reduce the size and weight of box body.
Brief description of the drawings
Below by way of the description that some embodiments of the present invention are combined with its accompanying drawing, it will be further appreciated that the mesh of the present invention
, specific structural features and advantage, wherein the component that similar symbology is similar.
Fig. 1 is the schematic diagram of the processing casing of the electronic information including radiator of prior art.
Fig. 2 is the sectional view and heat radiating structure schematic diagram of the electronic information processing casing of prior art.
Fig. 3 is the sectional view of floating type heat abstractor according to embodiments of the present invention.
Fig. 4 is the configuration diagram of the flotator and temperature-uniforming plate in floating type heat abstractor according to embodiments of the present invention.
Fig. 5 is the structural representation of flotator according to embodiments of the present invention.
Embodiment
Embodiments of the invention will be provided with detailed reference below.Although the present invention is explained by these embodiments
State and illustrate, but should be noted that the present invention is not merely confined to these embodiments.On the contrary, the present invention cover it is appended
All substitutes, variant and equivalent defined in claim in spirit and invention scope.
In addition, in order to better illustrate the present invention, numerous details is given in embodiment below.
It will be understood by those skilled in the art that without these details, the present invention can equally be implemented.It is right in other example
It is not described in detail in known method, formality, element and circuit, in order to highlight the purport of the present invention.
Fig. 3 is the sectional view of floating type heat abstractor 300 according to embodiments of the present invention.As shown in figure 3, floating type radiating
Device 300 includes radiator 302, flotator 304, temperature-uniforming plate 306, chip 308_1 and 308_2 and pcb board 310.Radiator
302 can be finned box body, and flotator 304 is arranged on radiator 302, and pcb board 310 is fixedly attached to radiator 302.
In one embodiment, temperature-uniforming plate 306 can be used well known to a person skilled in the art structure type, i.e. inner hollow and filled with liquid
State medium.Temperature-uniforming plate 306 can make space zigzag shape or space C word shapes, and it is a kind of space cantilever formula structure, temperature-uniforming plate
306 tail end 404 is adjacent to radiator 302；And when having external force extruding, the head end 402 of temperature-uniforming plate 306 can occur in the horizontal direction
Displacement.The coupled chip 308_1 of temperature-uniforming plate 306 in floating type heat abstractor 300 the back side (that is, with heat abstractor
The surface of contact) between may be provided with heat-conducting medium (such as heat-conducting cream), for realizing the abundant conduction of heat, so as to further reducing
Thermal resistance between chip 308_1 and temperature-uniforming plate 306.The head end 402 of temperature-uniforming plate 306 is adjacent to the floating pillar 408 in flotator 304
On, and the tail end 404 of temperature-uniforming plate 306 is adjacent to radiator 302.
Although note that the number of chips shown in Fig. 3 is 2, in practical application, the quantity not limited to this of chip,
Any number of one can be no less than.
Fig. 4 is the frame of the flotator 304 and temperature-uniforming plate 306 in floating type heat abstractor 400 according to embodiments of the present invention
Structure schematic diagram.Fig. 5 is the structural representation of flotator 500 according to embodiments of the present invention.From the point of view of Fig. 4 and Fig. 5, flotator
304 may include flotator shell 406, flotator pillar 408, elastomer 410 (for example, spring) and back-up ring 412.Outside flotator
Shell 406 and flotator pillar 408 are shaft hole matching (as shown in the axis holes 508 in Fig. 5), pass through fit clearance and length of fit
Design, the top of flotator pillar 408 can be made to keep a good depth of parallelism with horizontal.Elastomer 410 is placed on flotator
In cavity body structure between shell 502 and flotator pillar 408, there is provided the support force of flotator pillar 408 is floated to ensure
The resilient property of device pillar 408.Back-up ring 504 is positioned over the outside of flotator shell 502, and its effect is that flotator 304 is limited
Position, avoids flotator pillar 408 from being separated with flotator shell 502.
Preferably, in one embodiment, flotator pillar 408 devises a larger supporting surface 506, for equal
The excellent support of head end 402 of warm plate 306 and the surface of large area are adjacent to.Flotator pillar 408 is done with flotator shell 502
Accurate shaft hole matching, big inclination angle will not be produced when sliding by ensureing that flotator pillar 408 is relative with flotator.Because temperature-uniforming plate
Z-type structure under external force, be a flexure operation, it is necessary to have a good support, ensure temperature-uniforming plate head end and water
Plane keeps angle as small as possible, could reduce the head end 402 of temperature-uniforming plate 306 and the gap of chip chamber, and then reduce filling
The thickness of heat-conducting medium.
Preferably, in one embodiment, there is flange on flotator shell 502, for being pasted with the box body of radiator 302
Close.Mounting hole can be included on flange face, the entirety of flotator 304 can be fastened on the box body of radiator 302.In flotator shell
On 502 flange face, containing cavities design can have been done, the spacing back-up ring 504 of flotator pillar can be hidden at this, so as to obtain
Smaller flotator height dimension.
When the head end 402 of temperature-uniforming plate 306 is by ambient pressure, flotator 304 can be simultaneously to horizontal X direction and axial Z side
To movement (as shown in Figure 5), so that the head end 402 of temperature-uniforming plate 306 is subjected to displacement on horizontal X direction.In moving process,
Flotator 304 produces the angle with X-direction, and the angle passes through the floating pillar 408 in flotator 304 and flotator shell 406
Size combine and limit.When external force disappears, work of the flotator pillar 408 by the elastomer 410 inside flotator 304
With returning to initial position, and this reciprocal compression and resilience are repeatable.
In one embodiment, when temperature-uniforming plate 306 is not by external force, its initial position and the chip to be pre-installed have a mistake
The amount of being full of.Preferably, the magnitude of interference is designed as 1~1.5mm or so by the present invention.The magnitude of interference can be more than the manufacturing tolerance of chip, weldering
The tolerance sum after rear tolerance, and PCB installations is connect, corresponding chip is bound to extrude samming when thereby ensuring that PCB installations
Plate, external force just come from extruding force of the chip to temperature-uniforming plate 306.In addition, the stress of temperature-uniforming plate 306 and be moved, in X-direction
Angle is controllable (for example, control within 0.5 °), thereby ensure that temperature-uniforming plate 306 head end 402 and corresponding chip it
Between gap within 0.2mm, therefore the gap can be filled using heat-conducting silicone grease or thinner Heat Conduction Material, and samming
The tail end 404 of plate 306 is adjacent on a heat sink by way of fastening, and gap is very small, can also use thinner heat conduction material
Expect to fill, so that the big good fortune of the thermal contact resistance at the interface in this cooling system reduces, reduce temperature loss, improve
Radiating efficiency.For example, in the practical application scene of the application, due to having used the scheme of floating temperature-uniforming plate, temperature income
Reach 17 °, so as to which the adaptive capacity to environment of corresponding product greatly improved.
In one embodiment, cost is further saved in order to substitute temperature-uniforming plate, floating type heat abstractor 300 can use
Heat Conduction Material (for example, copper) manufactures flotator shell 406 and floating pillar 408, and in flotator shell 406 and flotator
Heat-conducting medium is filled at shaft hole matching in pillar 408 (as shown in the axis hole 508 in Fig. 5).
Advantageously, floating type heat abstractor according to embodiments of the present invention can reduce chip to the heat transfer path of box body
On thermal resistance, improve radiating efficiency, and effectively reduce box body size and weight.
Some parts in following specific descriptions be with flow, logical block, processing procedure and it is other to computer store
The symbolic of the operation of data bit represents to present in device.These descriptions and representation are the technology people in data processing field
Other technical staff of the member most effectively into the field pass on them to work substantive method.In this application, flow, logic
Block, processing procedure or similar things, the sequence of coherent step or instruction is contemplated into realize desired result.Institute
The step of stating is the step of needing to carry out physical operations to physical quantity.Generally, but it is not inevitable, the form of these physical quantitys can
For electrical or magnetic signal, can in computer systems be stored, transmitted, merged and compared etc..Primarily for the edge generally used
Therefore it is easy to above-mentioned signal being considered as transaction, bit, numerical value, element, symbol, character, sampling, pixel or other sometimes.
Above according to the frame of the example embodiment reference system of the present invention, method, device, and/or computer program product
Figure and flow chart describe the present invention.It will be understood by those skilled in the art that one or more of block diagram and flow chart frame and
The combination of frame in block diagram and flow chart, it can be realized respectively by computer-executable program instructions.Similarly, according to the present invention
Some embodiments, some frames in block diagram and flow chart will may not necessarily be carried out with the order of presentation, or may not necessarily be entered
OK.
Embodiment and accompanying drawing are only the conventional embodiment of the present invention specifically above.Obviously, attached right will after not departing from
Can there are various supplements, modification on the premise of seeking the spirit and scope of the present invention that book defined and replace.Art technology
Personnel are it should be understood that the present invention in actual applications can be according to specific environment and job requirement before without departing substantially from invention criterion
Put and be varied from form, structure, layout, ratio, material, element, component and other side.Therefore, disclose herein real
Example is applied to be merely to illustrate and unrestricted, the scope of the present invention is defined by appended claim and its legal equivalents, and is not limited to
Description before this.
Claims (11)
1. a kind of floating type heat abstractor, for the chip cooling on printed circuit board (PCB), including radiator, flotator and
Temperature-uniforming plate, wherein：
The flotator is arranged on the radiator,
The temperature-uniforming plate is space cantilever formula structure, and the head end of the temperature-uniforming plate is adjacent on the flotator and the samming
The tail end of plate is adjacent to the radiator,
When the head end of the temperature-uniforming plate is by ambient pressure, the flotator moves to horizontal direction and axial direction, so that
The head end of the temperature-uniforming plate is subjected to displacement in the horizontal direction；
When the ambient pressure suffered by the head end of the temperature-uniforming plate disappears, the flotator returns to initial position.
2. floating type heat abstractor according to claim 1, it is characterised in that the heat sink is finned box body.
3. floating type heat abstractor according to claim 1, it is characterised in that the temperature-uniforming plate is space zigzag shape, interior
Portion is hollow and filled with liquid medium.
4. floating type heat abstractor according to claim 1, it is characterised in that the temperature-uniforming plate is space C word shapes, interior
Portion is hollow and filled with liquid medium.
5. floating type heat abstractor according to claim 1, it is characterised in that the back side of the temperature-uniforming plate and the chip
Between be provided with heat-conducting medium, for reducing the thermal resistance between the temperature-uniforming plate and the chip.
6. floating type heat abstractor according to claim 1, it is characterised in that the flotator include flotator shell,
Flotator pillar, elastic component and back-up ring, wherein the flotator shell and the flotator pillar are shaft hole matchings, the bullet
Property part is placed in the cavity body structure between the flotator shell and the flotator pillar, and the back-up ring is positioned over institute
State the outside of flotator shell.
7. floating type heat abstractor according to claim 6, it is characterised in that the flotator pillar has supporting surface,
Support and surface for the head end to the temperature-uniforming plate are adjacent to.
8. floating type heat abstractor according to claim 6, it is characterised in that have flange on the flotator shell, use
To be bonded with the radiator, mounting hole is included on the flange face, for the flotator is fixed on the radiator,
And there are containing cavities to be used to place the back-up ring on the flange face.
9. floating type heat abstractor according to claim 6, it is characterised in that the flotator shell and the flotator
Pillar is manufactured using Heat Conduction Material, and is filled at the shaft hole matching in the flotator shell and the flotator pillar
Heat-conducting medium.
10. a kind of electronic building brick, including printed circuit board (PCB) and the chip on the printed circuit board (PCB), it is characterised in that
Also include the floating type heat abstractor described in claim any one of 1-8, the radiator of the floating type heat abstractor is consolidated
Surely the printed circuit board (PCB) is connected to, and the temperature-uniforming plate of the floating type heat abstractor is connected with the back side of the chip
Connect.
11. electronic building brick according to claim 10, it is characterised in that between the back side of the temperature-uniforming plate and the chip
Heat-conducting medium is provided with, for reducing the thermal resistance between the temperature-uniforming plate and the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710794991.9A CN107396617B (en) | 2017-09-05 | 2017-09-05 | Floating type radiator and the electronic building brick for being equipped with the floating type radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710794991.9A CN107396617B (en) | 2017-09-05 | 2017-09-05 | Floating type radiator and the electronic building brick for being equipped with the floating type radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107396617A true CN107396617A (en) | 2017-11-24 |
| CN107396617B CN107396617B (en) | 2019-05-03 |
Family
ID=60351692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710794991.9A Active CN107396617B (en) | 2017-09-05 | 2017-09-05 | Floating type radiator and the electronic building brick for being equipped with the floating type radiator |
Country Status (1)
| Country | Link |
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| CN (1) | CN107396617B (en) |
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| CN109068530A (en) * | 2018-07-11 | 2018-12-21 | 上海微小卫星工程中心 | A kind of high heat consumption single machine of the satellite that vibration damping is thermally conductive |
| CN110662389A (en) * | 2018-06-28 | 2020-01-07 | 华为技术有限公司 | Heat dissipation device and electronic equipment |
| CN111315183A (en) * | 2018-12-12 | 2020-06-19 | 成都鼎桥通信技术有限公司 | Heat conduction assembly for electronic component, refrigerating device and electronic equipment |
| CN111558161A (en) * | 2019-12-31 | 2020-08-21 | 广东艾诗凯奇智能科技有限公司 | Neck massager |
| TWI718873B (en) * | 2020-02-18 | 2021-02-11 | 四零四科技股份有限公司 | Electronic device having movable heat conducting assembly and related heat dissipating module |
| WO2021135153A1 (en) * | 2019-12-31 | 2021-07-08 | 未来穿戴技术有限公司 | Neck massager |
| WO2022242510A1 (en) * | 2021-05-18 | 2022-11-24 | 华为技术有限公司 | Heat dissipation apparatus and vehicle-mounted module |
| CN116292390A (en) * | 2023-05-15 | 2023-06-23 | 合肥联宝信息技术有限公司 | Electronic equipment and fan thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107396617B (en) | 2019-05-03 |
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