CN106328612A - Chip heat radiation apparatus and electronic assembly thereof - Google Patents
Chip heat radiation apparatus and electronic assembly thereof Download PDFInfo
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- CN106328612A CN106328612A CN201510366096.8A CN201510366096A CN106328612A CN 106328612 A CN106328612 A CN 106328612A CN 201510366096 A CN201510366096 A CN 201510366096A CN 106328612 A CN106328612 A CN 106328612A
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Abstract
The invention provides a chip heat radiation apparatus and an electronic assembly thereof. The chip heat radiation apparatus comprises a heat radiation body which comprises a first radiator and a second radiator. The first radiator has a heat-conducting bottom surface and a heat-conducting side surface. The side surface of the first radiator is vertical to the bottom surface of the first radiator. The second radiator has a heat-conducting top surface and a heat-conducting side surface, and the side surface of the second radiator is in heat-conducting movable connection with the side surface of the first radiator. The electronic assembly comprises at least one chip. The chip is fixedly connected to a mainboard which is fixed in a housing. The chip is in heat-conducting connection with the chip heat radiation apparatus. The chip heat radiation apparatus and the electronic assembly can be in a thermal conduction connection (heat-conducting connection) state without increasing additional pressure onto the chip, so that the chip is prevented from being damaged due to compressive deformation, and the pin deformation and the solder joint creep deformation of the chip are prevented. In addition, the chip heat radiation effect is improved.
Description
Technical field
The present invention relates to chip cooling technical field, in particular to a kind of chip heat radiator and electronic building brick thereof.
Background technology
In electron trade, it is frequently necessary to that chip is arranged at many applied environments complicated, and require the scene of high reliability, such as scene, the scene etc. of one radiator of multi-chip common of airtight fan-free, chip cooling and reliability thereof are often technical bottleneck place therein.
As it is shown in figure 1, in the application scenarios of airtight fan-free, chip 3 is close to shell 6 often through metal heat-conducting block 1, transfer heat in thermo-conducting manner product casing 6 surface, then be dispelled the heat by shell 6 surface.But in actual production is processed, shell 6, heat-conducting block 1, chip 3, PCB main board 4 etc. all exist certain tolerance, can cause cannot being in close contact between chip end face and heat-conducting block 1 bottom surface after these tolerances are accumulative, the effect of impact heat radiation.
Currently in order to eliminate the impact of this type of tolerance, between chip 3 end face and heat-conducting block 1, often add one layer of compressible heat conductive pad 9, utilize the compressibility of heat conductive pad 9, absorb the impact of accumulated tolerance, it is ensured that be in close contact between chip 3 and heat-conducting block 1.But at present there are two problems in heat conductive pad 9, one be heat conductive pad 9 after being compressed, chip 3 will certainly be produced an extrusion stress, thus cause chip 3 to be subject to crushing or the problem such as solder joint generation creep.Two is that its heat conductivity of current heat conductive pad is relatively low compared with metal, have impact on the heat dispersion of chip.
In addition, when electronic product employing is air-cooled or certainly dispels the heat, due to the restriction in various spaces, structure, multiple chip is often used to share the scene of a fin radiator, difference in height and the tolerance of other short transverses between each chip are mainly absorbed by the heat conductive pad of different-thickness, as Figure 1-1.
Find through long-term practice and research; chip thickness differs and causes the thickness of heat conductive pad to select to differ; even and if heat conductive pad have selected more suitably thickness and also cannot eliminate tolerance the most one by one; often produce the extruded problem of heat conductive pad; heat conductive pad can produce compression stress after being squeezed; this stress will be applied directly on chip, thus chip reliability is had a negative impact (if chip package is by breakage, the pin deformation of chip, Ag solder joints creep etc.).The main material of heat conductive pad is silicone rubber, and heat conductivity is usually less than 10w/m k (fine aluminium 237w/m k, fine copper 398w/m k), therefore leverages the effect of heat radiation.
Summary of the invention
The technical purpose of the present invention is that the defect solving above-mentioned prior art, a kind of chip heat radiator and electronic building brick thereof are provided, this chip heat radiator and electronic building brick thereof need not increase extra pressure to chip and may be in the state of conduction of heat connection (i.e. heat conduction connection), chip compressive deformation can be avoided to damage, the pin avoiding chip deforms, Ag solder joints creep, meanwhile, improve the radiating effect of chip.
For reaching the technical purpose of the present invention, the invention provides a kind of chip heat radiator, including radiator, radiator includes the first radiator and the second radiator, first radiator has the bottom surface of heat conduction and the side of heat conduction, the side of the first radiator is perpendicular to the bottom surface of this first radiator, second radiator has the end face of heat conduction and the side of heat conduction, the side view of the second radiator is suitable with the side view of the first radiator, and between the side of the second radiator and the side of described first radiator, heat conduction is flexibly connected.
Present invention also offers a kind of electronic building brick, including at least one chip, described chip is fixing with mainboard to be connected, described mainboard is fixed in shell, described chip is connected with shell heat conduction by chip heat radiator, and described chip heat radiator is chip heat radiator recited above, wherein, the bottom surface of described first radiator is fixed heat conduction with the end face of described chip and is connected, and the end face of described second radiator is connected with described shell heat conduction.
The technical program is owing to have employed the structure of two radiators, the technological means that between the side of two radiators, heat conduction is flexibly connected, so, the chip heat radiator of the present invention and electronic building brick thereof need not increase extra pressure to chip and may be in the state of conduction of heat connection (i.e. heat conduction connection), chip can be avoided to damage because of compressive deformation, the pin avoiding chip deforms, Ag solder joints creep, meanwhile, improves the radiating effect of chip.
Accompanying drawing explanation
Fig. 1 is the electronic component structure schematic diagram in prior art with a chip；
Fig. 1-1 is the electronic component structure schematic diagram in prior art with two chips；
Fig. 2 is the structural representation of the first chip heat radiator of present embodiment；
Fig. 3 is the structural representation of present embodiment the second chip heat radiator；
Fig. 4 is the structural representation of the third chip heat radiator of present embodiment；
Fig. 5 is the structural representation of the 4th kind of chip heat radiator of present embodiment；
Fig. 6 is the structural representation of the 5th kind of chip heat radiator of present embodiment；
Fig. 7 is the sectional structure schematic diagram of line A-A in Fig. 6；
Fig. 8 is the structural representation of the 6th kind of chip heat radiator of present embodiment；
Fig. 9 is the sectional structure schematic diagram of line B-B in Fig. 8；
Figure 10 is the structural representation of the first elastic connecting element in Fig. 1 to Fig. 5；
Figure 11 is the structural representation of the second elastic connecting element in Fig. 1 to Fig. 5；
Figure 12 is the structural representation of the third elastic connecting element in Fig. 1 to Fig. 5；
Figure 13 is the structural representation of the 4th kind of elastic connecting element in Fig. 1 to Fig. 5；
Figure 14 is the structural representation of the 5th kind of elastic connecting element in Fig. 1 to Fig. 5；
Figure 15 is the structural representation (lid lid state) of the first electronic building brick of present embodiment；
Figure 16 is the structural representation (lid lid state) of present embodiment the second electronic building brick；
Figure 17 is the structural representation (uncapped state) of the third electronic building brick of present embodiment；
Figure 18 is the structural representation (lid lid state) of the third electronic building brick of present embodiment；
Figure 19 is the structural representation (lid lid state) of the 4th kind of electronic building brick of present embodiment；
Figure 20 is the structural representation (uncapped state) of the 5th kind of electronic building brick of present embodiment；
Figure 21 is the structural representation (lid lid state) of the 5th kind of electronic building brick of present embodiment；
Figure 22 is the main TV structure schematic diagram (lid lid state) of the 6th kind of electronic building brick of present embodiment；
Figure 23 is the plan structure schematic diagram of Figure 22；
Figure 24 is the main TV structure schematic diagram (lid lid state) of the 7th kind of electronic building brick of present embodiment；
Figure 25 is the main TV structure schematic diagram (lid lid state) of the 8th kind of electronic building brick of present embodiment；
Description of reference numerals:
1, radiator；1-1, the first radiator；1-2, the second radiator；1-3, Heat Conduction Material；1-4, passage；2, elastic connecting element；2-1, cylindrical helical spring；2-2, pointed elastic chuck；2-3, countersunk head screw dop；2-4, countersunk head screw guide rod；3, chip；4, mainboard；5, soldered ball；6, shell；6-1, housing；6-2, cap；6-3, boss；7, fixing Heat Conduction Material；8, other head；9, heat conductive pad；10, fin radiator.
Detailed description of the invention
Hereinafter embodiments of the present invention are described in detail, but the multitude of different ways that the present invention can be defined by the claims and cover is implemented.
As shown in Figures 2 to 5, a kind of chip heat radiator, including radiator 1, radiator 1 includes the first radiator 1-1 and the second radiator 1-2, first radiator 1-1 has the bottom surface of heat conduction and the side of heat conduction, the side of the first radiator 1-1 is perpendicular to the bottom surface of this first radiator 1-1, second radiator 1-2 has the end face of heat conduction and the side of heat conduction, the side view of the second radiator 1-2 is suitable with the side view of the first radiator 1-1, and between the side of the second radiator 1-2 and the side of the first radiator 1-1, heat conduction is flexibly connected.
Present embodiment is owing to have employed the structure of two radiators, the technological means that between the side of two radiators, heat conduction is flexibly connected, so, the chip heat radiator of the present invention and electronic building brick thereof need not increase extra pressure to chip and may be in the state of conduction of heat connection (i.e. heat conduction connection), chip can be avoided to damage because of compressive deformation, the pin avoiding chip deforms, Ag solder joints creep, meanwhile, improves the radiating effect of chip.Can be independent of chip and the chip heat radiator of shell as one, its machining accuracy is easy to control (being easy to processing and manufacturing).
Preferably, as shown in Figures 2 to 4, the second radiator 1-2 is configured with for the end face of this second radiator 1-2 and inner surface of outer cover being led hot linked elastic connecting element 2 (seeing Figure 15 to Figure 16) by mainboard.It is of course also possible to be that the second radiator 1-2 is configured with for the end face of this second radiator 1-2 and inner surface of outer cover being led hot linked elastic connecting element 2 (seeing Figure 20 to Figure 21) by shell.Can also is that the second radiator 1-2 is configured with for the end face of this second radiator 1-2 and inner surface of outer cover being led hot linked elastic connecting element 2 (seeing Figure 17 to Figure 19) by mainboard and shell.Described second radiator 1-2 is configured with for the end face of this second radiator 1-2 and fin radiator 10 lower surface being led hot linked elastic connecting element 2 (seeing Figure 24 to 25) by mainboard and/or shell.
Above technological means all need not apply extra pressure to chip just can make heat abstractor be in the state of good conduction of heat connection (i.e. heat conduction connection).
Beneficial effect is because the second radiator 1-2 and is not fixed on the inner surface (or contact surface of fin radiator) of shell, namely annexation is activity heat conduction annexation between the two, therefore the produced horizontal displacement tolerance aborning of the chip on pcb board, the connection of this heat abstractor with inner surface of outer cover will not be impacted, easy to assembly.
Preferably, as shown in Figure 10, elastic connecting element 2 is cylindrical helical spring 2-1；It is of course also possible to be as shown in figure 11, elastic connecting element 2 includes that cylindrical helical spring 2-1, the two ends of cylindrical helical spring 2-1 are each configured with pointed elastic chuck 2-2 (English name is: pushpin).Can also is that as shown in figure 12, the two ends of cylindrical helical spring 2-1 are each configured with countersunk head screw dop 2-3.Can also is that as shown in figure 13, one end of cylindrical helical spring 2-1 is configured with pointed elastic chuck 2-2, and the other end of cylindrical helical spring 2-1 is configured with countersunk head screw dop 2-3.As the most preferably, countersunk head screw dop 2-3 is long countersunk head screw dop (seeing Figure 17 to Figure 18), it is also possible to be short countersunk head screw dop (seeing Figure 20 to Figure 21).Can also is that as shown in figure 14, elastic connecting element 2 includes that cylindrical helical spring 2-1 and countersunk head screw guide rod 2-4, countersunk head screw guide rod 2-4 run through the axial hole of cylindrical helical spring 2-1.The two ends of Flexible Connector are provided with the location any of the above elastic connecting element of end face can meet different processing technique and the requirement of mounting process according to practical situation reasonable selection.The location end face providing the benefit that Flexible Connector can be avoided the second radiator to depart from Flexible Connector when not installing or remove outer casing upper cover (or radiator) and cause assembling inconvenience, or the problem such as other devices on damaged in collision pcb board when the second radiator drops.
Preferably, as shown in Figures 2 to 5, the first radiator 1-1 and the heat conductivity of the second radiator 1-2 or equivalent heat conductivity are more than 3 watts/ meter Du.In this way it can be ensured that the heat dispersion of chip heat radiator.
Preferably, as in figure 2 it is shown, the first radiator 1-1 is made of metal.It is of course also possible to be as shown in Figure 4, the first radiator 1-1 is made up of heat pipe, it is also possible to be as it is shown on figure 3, the first radiator 1-1 is made up of metal and/or heat pipe, and heat pipe embeds in reguline metal.Second radiator 1-2 is made up of metal and/or heat pipe.Can select according to real work situation.
Preferably, as shown in Figures 2 to 5, the area of the first radiator 1-1 bottom surface is more than or equal to the area of chip end face.So, chip can be solved further and produce the assembly problem that horizontal displacement is brought in process of production.
Preferably, as shown in Figures 2 to 5, it is filled with Heat Conduction Material 1-3 between side and the side of the first radiator 1-1 of the second radiator 1-2.It is of course also possible to be only to scribble Heat Conduction Material in the side of the second radiator 1-2.Can also is that only side at the first radiator 1-1 scribbles Heat Conduction Material 1-3.More i.e. side at the second radiator 1-2 can scribble Heat Conduction Material and also scribble Heat Conduction Material 1-3 in the side of the first radiator 1-1.Optionally, the Heat Conduction Material 5 mentioned in embodiments of the invention is heat dissipation interface material.
Preferably, as shown in Figures 2 to 5, Heat Conduction Material 1-3 is thermal conductive silicon lipid materials.This Heat Conduction Material can not only reduce the thermal contact resistance produced between the side of the first radiator and the side of the second radiator, can also well fill the space between thermal conductive surface, air is extruded thermal conductive surface, air (air is hot non-conductor) between avoiding due to thermal conductive surface, hinders heat transmission between thermal conductive surface.And had supplementing of Heat Conduction Material that the contact between thermal conductive surface can also be made more abundant, it is truly realized aspectant contact.
Preferably, as in figure 2 it is shown, the first radiator 1-1 is solid cylinder, the second radiator 1-2 is the hollow cylinder of bottom end opening, and the second radiator 1-2 is nested with on the first radiator 1-1.Can also be the first radiator 1-1 be the hollow cylinder of top end opening, the second radiator 1-2 is solid cylinder, and the second radiator 1-2 inserts in the first radiator 1-1.The simple in construction of above chip heat radiator, production cost is low.
nullCertainly，Can also be as shown in Figure 7 and Figure 8，The top of the first radiator 1-1 is the vertical fin of multi-disc，Multiple vertical fin are parallel to each other，The thickness of multiple vertical fin is the most equal，In multiple vertical fin, the gap between adjacent two vertical fin is the most equal，Gap between adjacent two vertical fin is equal to the thickness of vertical fin，Correspondingly，The bottom of the second radiator 1-2 is the vertical fin of multi-disc，Multiple vertical fin are parallel to each other，The thickness of multiple vertical fin is the most equal，In multiple vertical fin, the gap between adjacent two vertical fin is the most equal，Gap between adjacent two vertical fin is equal to the thickness of vertical fin，The thickness of the second vertical fin in radiator 1-2 bottom is equal to or less than the gap between the first adjacent two vertical fin in radiator 1-1 top，Gap between second adjacent two the vertical fin in radiator 1-2 bottom is equal to or more than the thickness of the first vertical fin in radiator 1-1 top，The vertical fin of multi-disc of the second radiator 1-2 bottom inserts in the gap between the vertical fin of multi-disc on the first radiator 1-1 top.
nullCan also be the top of the first radiator 1-1 be the vertical fin of multi-disc，Multiple vertical fin are parallel to each other，The thickness of multiple vertical fin is the most equal，In multiple vertical fin, the gap between adjacent two vertical fin is the most equal，Gap between adjacent two vertical fin is more than the thickness of vertical fin，Correspondingly，The bottom of the second radiator 1-2 is the vertical fin of multi-disc，Multiple vertical fin are parallel to each other，The thickness of multiple vertical fin is the most equal，In multiple vertical fin, the gap between adjacent two vertical fin is the most equal，Gap between adjacent two vertical fin is less than the thickness of vertical fin，The thickness of the second vertical fin in radiator 1-2 bottom is equal to or less than the gap between the first adjacent two vertical fin in radiator 1-1 top，Gap between second adjacent two the vertical fin in radiator 1-2 bottom is equal to or more than the thickness of the first vertical fin in radiator 1-1 top，The vertical fin of multi-disc of the second radiator 1-2 bottom inserts in the gap between the vertical fin of multi-disc on the first radiator 1-1 top.
nullCan also be the top of the first radiator 1-1 be the vertical fin of multi-disc，Multiple vertical fin are parallel to each other，The thickness of multiple vertical fin is the most equal，In multiple vertical fin, the gap between adjacent two vertical fin is the most equal，Gap between adjacent two vertical fin is less than the thickness of vertical fin，Correspondingly，The bottom of the second radiator 1-2 is the vertical fin of multi-disc，Multiple vertical fin are parallel to each other，The thickness of multiple vertical fin is the most equal，In multiple vertical fin, the gap between adjacent two vertical fin is the most equal，Gap between adjacent two vertical fin is more than the thickness of vertical fin，The thickness of the second vertical fin in radiator 1-2 bottom is equal to or less than the gap between the first adjacent two vertical fin in radiator 1-1 top，Gap between second adjacent two the vertical fin in radiator 1-2 bottom is equal to or more than the thickness of the first vertical fin in radiator 1-1 top，The vertical fin of multi-disc of the second radiator 1-2 bottom inserts in the gap between the vertical fin of multi-disc on the first radiator 1-1 top.
nullCan also be as shown in Fig. 8 to Fig. 9，The top of the first radiator 1-1 is the vertical fin of multi-disc，Multiple vertical fin constitute the vertical fin of concentric annular，The thickness of the vertical fin of multiple concentric annular is the most equal，In the vertical fin of multiple concentric annular, the gap between adjacent two vertical fin of concentric annular is the most equal，Gap between adjacent two vertical fin of concentric annular is equal to the thickness of the vertical fin of concentric annular，Correspondingly，The bottom of the second radiator 1-2 is the vertical fin of multi-disc，Multiple vertical fin constitute the vertical fin of concentric annular，The thickness of the vertical fin of multiple concentric annular is the most equal，In the vertical fin of multiple concentric annular, the gap between adjacent two vertical fin of concentric annular is the most equal，Gap between adjacent two vertical fin of concentric annular is equal to the thickness of the vertical fin of concentric annular，The thickness of the second radiator 1-2 bottom vertical fin of concentric annular is equal to or less than the gap between adjacent two the vertical fin of concentric annular in the first radiator 1-1 top，Gap between adjacent two the vertical fin of concentric annular in second radiator 1-2 bottom is equal to or more than the thickness of the first radiator 1-1 top vertical fin of concentric annular，The vertical fin of multi-disc concentric annular of the second radiator 1-2 bottom inserts in the gap between the vertical fin of multi-disc concentric annular on the first radiator 1-1 top.
nullCan also be the top of the first radiator 1-1 be the vertical fin of multi-disc，Multiple vertical fin constitute the vertical fin of concentric annular，The thickness of the vertical fin of multiple concentric annular is the most equal，In the vertical fin of multiple concentric annular, the gap between adjacent two vertical fin of concentric annular is the most equal，Gap between adjacent two vertical fin of concentric annular is more than the thickness of the vertical fin of concentric annular，Correspondingly，The bottom of the second radiator 1-2 is the vertical fin of multi-disc，Multiple vertical fin constitute the vertical fin of concentric annular，The thickness of the vertical fin of multiple concentric annular is the most equal，In the vertical fin of multiple concentric annular, the gap between adjacent two vertical fin of concentric annular is the most equal，Gap between adjacent two vertical fin of concentric annular is less than the thickness of the vertical fin of concentric annular，The thickness of the second radiator 1-2 bottom vertical fin of concentric annular is equal to or less than the gap between adjacent two the vertical fin of concentric annular in the first radiator 1-1 top，Gap between adjacent two the vertical fin of concentric annular in second radiator 1-2 bottom is equal to or more than the thickness of the first radiator 1-1 top vertical fin of concentric annular，The vertical fin of multi-disc concentric annular of the second radiator 1-2 bottom inserts in the gap between the vertical fin of multi-disc concentric annular on the first radiator 1-1 top.
nullCan also be the top of the first radiator 1-1 be the vertical fin of multi-disc，Multiple vertical fin constitute the vertical fin of concentric annular，The thickness of the vertical fin of multiple concentric annular is the most equal，In the vertical fin of multiple concentric annular, the gap between adjacent two vertical fin of concentric annular is the most equal，Gap between adjacent two vertical fin of concentric annular is less than the thickness of the vertical fin of concentric annular，Correspondingly，The bottom of the second radiator 1-2 is the vertical fin of multi-disc，Multiple vertical fin constitute the vertical fin of concentric annular，The thickness of the vertical fin of multiple concentric annular is the most equal，In the vertical fin of multiple concentric annular, the gap between adjacent two vertical fin of concentric annular is the most equal，Gap between adjacent two vertical fin of concentric annular is more than the thickness of the vertical fin of concentric annular，The thickness of the second radiator 1-2 bottom vertical fin of concentric annular is equal to or less than the gap between adjacent two the vertical fin of concentric annular in the first radiator 1-1 top，Gap between adjacent two the vertical fin of concentric annular in second radiator 1-2 bottom is equal to or more than the thickness of the first radiator 1-1 top vertical fin of concentric annular，The vertical fin of multi-disc concentric annular of the second radiator 1-2 bottom inserts in the gap between the vertical fin of multi-disc concentric annular on the first radiator 1-1 top.As the most preferably, the root of the first radiator 1-1 top vertical fin of multi-disc concentric annular is respectively arranged with passage 1-4, each passage 1-4 be positioned at same diametrically, the root of the second radiator 1-2 bottom vertical fin of multi-disc concentric annular is respectively arranged with passage 1-5, each passage 1-5 be positioned at same diametrically.The heat conductivility of above chip heat radiator is greatly increased.
Any of the above chip heat radiator structure can select according to actual needs.
Preferably, as it is shown in figure 5, the top edge of the second radiator 1-2 extends radially outward formation annular flange flange.The chip heat radiator maintenance of this structure is convenient.
As shown in Figure 15 to Figure 23, a kind of electronic building brick, including two chips 3, it is of course also possible to be a chip, it is also possible to be multiple chips, chip 3 is connected by soldered ball 5 is fixing with mainboard 4, it is also possible to be to be connected by chip contacts is fixing with mainboard 4.Mainboard 4 is fixed in shell 6, chip 3 is connected with shell 6 heat conduction by chip heat radiator, and chip heat radiator is foregoing chip heat radiator, wherein, the bottom surface of the first radiator 1-1 is fixed heat conduction with the end face of chip 3 and is connected, and the end face of the second radiator 1-2 is connected with shell 6 heat conduction.
Present embodiment is owing to have employed the structure of foregoing two radiators, the technological means that between the side of two radiators, heat conduction is flexibly connected, so, the chip heat radiator of the present invention and electronic building brick thereof need not increase extra pressure to chip and may be in the state of conduction of heat connection (i.e. heat conduction connection), chip can be avoided to damage because of compressive deformation, the pin avoiding chip deforms, Ag solder joints creep, meanwhile, improves the radiating effect of chip.
Preferably, as shown in Figure 15 to Figure 23, fixing heat conduction by fixing Heat Conduction Material 7 and be connected between the bottom surface of the first radiator 1-1 and the end face of chip 3, fixing Heat Conduction Material 7 is heat conduction glue class material or heat conduction adhesive tape (film) class material.This is fixing leads material and can play the adhesive effect between device as binding agent.This fixing Heat Conduction Material can not only reduce the thermal contact resistance produced between chip surface and chip heat radiator thermal conductive surface, can also well fill the space between thermal conductive surface, air is extruded thermal conductive surface, air (air is hot non-conductor) between avoiding due to thermal conductive surface, hinders heat transmission between thermal conductive surface.And had supplementing of fixing Heat Conduction Material that the contact between thermal conductive surface can also be made more abundant, it is truly realized aspectant contact.
Preferably, as shown in Figure 15 to Figure 23, shell 6 includes housing 6-1 and cap 6-2；Mainboard 4 is fixed on the inner bottom surface of housing 6-1 by screw and by boss, and the underrun elastic connecting element 2 of the second radiator 1-2 is connected with mainboard 4.It is of course also possible to be that the underrun elastic connecting element 2 of the second radiator 1-2 is connected with the inner bottom surface of housing 6-1.Can also is that the underrun elastic connecting element 2 of the second radiator 1-2 is connected (seeing Figure 17 to Figure 19) with the inner bottom surface of mainboard 4 and housing 6-1.By the elastic connecting element 2 floating action to the second radiator 1-2, the end face of the second radiator 1-2 is made to be connected with the inner top surface heat conduction of cap 6-2.
Certainly, can also be that mainboard 4 is fixed on the inner top surface of cap 6-1 by screw and by boss, the underrun elastic connecting element 2 of the second radiator 1-2 is connected with the inner top surface of mainboard 4 and/or cap 6-2, by the elastic connecting element 2 floating action to the second radiator 1-2, the end face of the second radiator 1-2 is made to be connected with the inner bottom surface heat conduction of housing 6-1.
Preferably, as shown in Figure 15 to Figure 21, the bottom surface edge of the second radiator 1-2 is circumferentially distributed connection installation position, and mainboard 4 is correspondingly distributed connection installation position round chip 3, and the inner bottom surface of housing 6-1 is correspondingly distributed connection installation position.The connection installation position of the second radiator 1-2 is pit or the projection of fixing spring 2-1 end, certainly, can also be the connection installation position of the second radiator 1-2 be the reducing hole (seeing Figure 15) of the enlarged head for fixing the pointed nose of pointed elastic chuck 2-2 or countersunk head screw dop 2-3, it is also possible to be the connection installation position of the second radiator 1-2 be the pilot hole of countersunk head screw guide rod 2-4 termination.The connection installation position of mainboard 4 is pit or the projection of fixing spring 2-1 end, it is also possible to be the connection installation position of mainboard 4 be to may pass through countersunk head screw guide rod 2-4, countersunk head screw dop 2-3 or the open-work of spring 2-1.The connection installation position of housing 6-1 inner bottom surface is pit or the projection of fixing spring 2-1 end, can also be the connection installation position of housing 6-1 inner bottom surface be the open-work of the pointed nose for fixing pointed elastic chuck 2-2, it is also possible to be the connection installation position of housing 6-1 inner bottom surface be for fixing countersunk head screw dop 2-3 or the countersunk head screwed hole of countersunk head screw guide rod 2-4.
As can be seen from Figure 15, elastic connecting element 2 includes that cylindrical helical spring 2-1, the lower end of cylindrical helical spring 2-1 are configured with pointed elastic chuck 2-2, and the upper end of cylindrical helical spring 2-1 is configured with countersunk head screw dop 2-3.Elastic connecting element 2 is utilized to be installed on PCB main board 4 second radiator 1-2.And PCB main board 4 freely can be fixed in shell 6 according to practical situation.The mounting means of the second radiator 1-2 is: when making chip heat radiator, the upper end countersunk head screw dop 2-3 of elastic connecting element 2 is fixed in the reducing hole of the second radiator 1-2 bottom surface in advance, when mounted, then by the lower end pointed elastic chuck 2-2 of elastic connecting element 2 it is fixed in the hole on PCB main board 4.Such mounting structure is greatly improved installation effectiveness.
As can be seen from Figure 16, elastic connecting element 2 includes that cylindrical helical spring 2-1, the two ends of cylindrical helical spring 2-1 are each configured with pointed elastic chuck 2-2 (English name is: pushpin).Elastic connecting element 2 is utilized to be installed on PCB main board 4 second radiator 1-2.And PCB main board 4 freely can be fixed in shell 6 according to practical situation.The mounting means of the second radiator 1-2 is: be first fixed in the reducing hole of the second radiator 1-2 bottom surface by the upper end pointed elastic chuck 2-2 of elastic connecting element 2, then is fixed in the open-work on PCB main board 4 by the lower end pointed elastic chuck 2-2 of elastic connecting element 2.Such mounting structure can improve installation effectiveness, and the making of chip heat radiator and elastic connecting element 2 is easier.
It can be seen that elastic connecting element 2 includes that cylindrical helical spring 2-1, the upper end of cylindrical helical spring 2-1 are configured with pointed elastic chuck 2-2 from Figure 17 to Figure 18, the lower end of cylindrical helical spring 2-1 is configured with long countersunk head screw dop 2-3.Second radiator 1-2 is utilized elastic connecting element 2 and is installed on the inner bottom surface of housing 6-1 by PCB main board 4.And PCB main board 4 freely can be fixed in shell 6 according to practical situation.The mounting means of the second radiator 1-2 is: in the countersunk head screwed hole of the bottom surface first long countersunk head screw dop 2-3 of the lower end of elastic connecting element 2 being fixed on housing 6-1, the head of long countersunk head screw dop 2-3 forms dop through PCB main board 4, being fixed in the reducing hole of the second radiator 1-2 by the upper end pointed elastic chuck 2-2 of elastic connecting element 2, the lower end of elastic connecting element 2 is fixed on the head of long countersunk head screw dop 2-3 again.Mainboard can be played fixation by such mounting structure, can save the fixed component of mainboard.
It can be seen that elastic connecting element 2 includes that cylindrical helical spring 2-1, the upper end of cylindrical helical spring 2-1 are configured with pointed elastic chuck 2-2 from Figure 20 to Figure 21, the lower end of cylindrical helical spring 2-1 is configured with short countersunk head screw dop 2-3.Elastic connecting element 2 is utilized to be installed on the inner bottom surface of housing 6-1 the second radiator 1-2.And PCB main board 4 freely can be fixed in shell 6 according to practical situation.The mounting means of the second radiator 1-2 is: in the countersunk head screwed hole of the bottom surface first short countersunk head screw dop 2-3 of the lower end of elastic connecting element 2 being fixed on housing 6-1, the head of short countersunk head screw dop 2-3 forms dop through the inner bottom surface of housing 6-1, being fixed in the reducing hole of the second radiator 1-2 by the upper end pointed elastic chuck 2-2 of elastic connecting element 2, the lower end of elastic connecting element 2 is fixed on the head of short countersunk head screw dop 2-3 through the open-work of PCB main board 4 again.Such mounting structure can reduce the difficulty of processing of shell, gives the PCB back side more layout freedom, and installs succinct, quickly, effectively.
As can be seen from Figure 19, elastic connecting element 2 includes cylindrical helical spring 2-1 and countersunk head screw guide rod 2-4.Second radiator 1-2 is utilized elastic connecting element 2 and is installed on the inner bottom surface of housing 6-1 by PCB main board 4.And PCB main board 4 freely can be fixed in shell 6 according to practical situation.The mounting means of the second radiator 1-2 is: first countersunk head screw guide rod 2-4 is fixed on the inner bottom surface of housing 6-1 by the countersunk head screwed hole by bottom surface, in the pilot hole of the bottom surface that the head of countersunk head screw guide rod 2-4 extend into the second radiator 1-2 after running through the axial hole of cylindrical helical spring 2-1 again through PCB main board 4.Such mounting structure can improve the stability of chip heat radiator, mainboard can be played fixation, can save the fixed component of mainboard.
Certainly, can also be that the bottom surface edge of the second radiator 1-2 is circumferentially distributed has connection installation position, mainboard 4 is correspondingly distributed connection installation position round chip 3, the inner top surface of cap 6-2 is correspondingly distributed connection installation position, and the connection installation position of the second radiator 1-2 is pit or the projection of fixing spring 2-1 end.The connection installation position that may also be the second radiator 1-2 is the reducing hole of the enlarged head for fixing the pointed nose of pointed elastic chuck 2-2 or countersunk head screw dop 2-3, it is also possible to be the connection installation position of the second radiator 1-2 be the pilot hole of countersunk head screw guide rod 2-4 termination.The connection installation position of mainboard 4 is pit or the projection of fixing spring 2-1 end, it is also possible to be the connection installation position of mainboard 4 be to may pass through countersunk head screw guide rod 2-4, countersunk head screw dop 2-3 or the open-work of spring 2-1.The connection installation position of cap 6-2 inner top surface is pit or the projection of fixing spring 2-1 end, can also be the connection installation position of cap 6-2 inner top surface be the open-work of the pointed nose for fixing pointed elastic chuck 2-2, it is also possible to be the connection installation position of cap 6-2 inner top surface be for fixing countersunk head screw dop 2-3 or the countersunk head screwed hole of countersunk head screw guide rod 2-4.
The inner bottom surface of housing 6-1 is distributed at connection installation position and is provided with boss 6-3.Such structure can protect mainboard.
Shell 6 includes housing 6-1 and cap 6-2, on cap 6-2, corresponding chip 3 offers the open-work of the second radiator 1-2 for fixed installation with annular flange flange, the second radiator 1-2 with annular flange flange penetrates open-work from outside to inside, annular flange flange is stuck in the edge of open-work, the circumferential distribution of open-work is hinged with the most indivedual 8, and other 8 end face being allocated to the second radiator 1-2 fixes this second radiator 1-2.Such structure is conducive to maintenance.
Preferably, as shown in figure 24, the cap 6-2 of described shell 6 is fabricated to fin radiator 10.
Preferably, as shown in figure 25, the chip heat radiator of the present invention can be used for connecting multiple chip (highly can differ) and connects by shared fin radiator 10 heat conduction in shell 6, the technique for fixing sharing fin radiator 10 is same as the prior art, can be fixed by modes such as stickup, screw, pushpin.
The foregoing is only the preferred embodiment of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (10)
1. a chip heat radiator, including radiator (1), it is characterised in that described radiator (1) includes
First radiator (1-1) and the second radiator (1-2), described first radiator (1-1) has heat conduction
Bottom surface and the side of heat conduction, the side of described first radiator (1-1) is perpendicular to this first radiator (1-1)
Bottom surface, described second radiator (1-2) has the end face of heat conduction and a side of heat conduction, and described second dissipates
The side view of hot body (1-2) is suitable with the side view of described first radiator (1-1), described
Between side and the side of described first radiator (1-1) of the second radiator (1-2), heat conduction activity is even
Connect.
Chip heat radiator the most according to claim 1, it is characterised in that described second radiator (1-2)
Be configured with for by mainboard and/or shell by the end face of this second radiator (1-2) and inner surface of outer cover
Lead hot linked elastic connecting element (2).
Chip heat radiator the most according to claim 1, it is characterised in that described second radiator (1-2)
Be configured with for by mainboard and/or shell by the end face of this second radiator (1-2) and fin radiator
(10) lower surface leads hot linked elastic connecting element (2).
Chip heat radiator the most according to claim 1, it is characterised in that described first radiator (1-1)
The area of bottom surface is more than or equal to the area of chip end face.
Chip heat radiator the most according to claim 1, it is characterised in that described second radiator (1-2)
Side and the side of described first radiator (1-1) between be filled with Heat Conduction Material (1-3), or,
The side of described second radiator (1-2) scribbles Heat Conduction Material and/or described first radiator (1-1)
Side scribbles Heat Conduction Material (1-3).
Chip heat radiator the most according to claim 1, it is characterised in that described second radiator (1-2)
Top edge extend radially outward formation annular flange flange.
7. an electronic building brick, including at least one chip (3), described chip (3) is fixing with mainboard (4) even
Connecing, described mainboard (4) is fixed in shell (6), and described chip (3) passes through chip heat radiator
Be connected with shell (6) heat conduction, it is characterised in that described chip heat radiator be as claim 1 to
One of 6 described chip heat radiators, wherein, the bottom surface of described first radiator (1-1) and described core
The end face of sheet (3) is fixed heat conduction and is connected, the end face of described second radiator (1-2) and described shell (6)
Or fin radiator (10) heat conduction connects.
Electronic building brick the most according to claim 7, it is characterised in that described first radiator (1-1)
It is connected by the fixing heat conduction of fixing Heat Conduction Material (7) between bottom surface with the end face of described chip (3), institute
Stating fixing Heat Conduction Material (7) is heat conductive silica gel.
Electronic building brick the most according to claim 7, it is characterised in that described shell (6) includes housing (6-1)
With cap (6-2)；
Described mainboard (4) is fixed on the inner bottom surface of described housing (6-1), described second radiator (1-2)
Underrun described in elastic connecting element (2) and described mainboard (4) and/or described housing (6-1)
Inner bottom surface connect, by the elastic connecting element (2) floating action to the second radiator (1-2),
The end face of the second radiator (1-2) is made to be connected with the inner top surface heat conduction of described cap (6-2)；Or,
Described mainboard (4) is fixed on the inner top surface of described cap (6-1), described second radiator (1-2)
Underrun described in elastic connecting element (2) and described mainboard (4) and/or described cap (6-2)
Inner top surface connect, by the elastic connecting element (2) floating action to the second radiator (1-2),
The end face of the second radiator (1-2) is made to be connected with the inner bottom surface heat conduction of described housing (6-1).
Electronic building brick the most according to claim 7, it is characterised in that described shell (6) includes housing (6-1)
With cap (6-2), the upper corresponding described chip (3) of described cap (6-2) offers for fixedly mounting
There is the open-work of described second radiator (1-2) of annular flange flange, described in there is the described of annular flange flange
Second radiator (1-2) penetrates described open-work from outside to inside, and described annular flange flange is stuck in described open-work
Edge, the circumferential distribution of described open-work is hinged with many indivedual heads (8), and described other head (8) is allocated to described
The end face of the second radiator (1-2) fixes this second radiator (1-2)；Or, described fin dissipates
Hot device (10) be arranged in described shell (6) or described shell (6) outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510366096.8A CN106328612A (en) | 2015-06-25 | 2015-06-25 | Chip heat radiation apparatus and electronic assembly thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510366096.8A CN106328612A (en) | 2015-06-25 | 2015-06-25 | Chip heat radiation apparatus and electronic assembly thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106328612A true CN106328612A (en) | 2017-01-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510366096.8A Pending CN106328612A (en) | 2015-06-25 | 2015-06-25 | Chip heat radiation apparatus and electronic assembly thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106328612A (en) |
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| CN107396617A (en) * | 2017-09-05 | 2017-11-24 | 中微冷却技术（深圳）有限公司 | Floating type heat abstractor and the electronic building brick for being provided with the floating type heat abstractor |
| CN107578886A (en) * | 2017-09-22 | 2018-01-12 | 安徽柏桦电力科技有限公司 | A kind of energy-saving power transformer |
| CN107731764A (en) * | 2017-09-30 | 2018-02-23 | 长电科技（宿迁）有限公司 | A kind of semiconductor package |
| CN107749408A (en) * | 2017-09-30 | 2018-03-02 | 长电科技（宿迁）有限公司 | A kind of elastic conducting warmware exposes encapsulating structure |
| CN110148590A (en) * | 2018-02-14 | 2019-08-20 | 华为技术有限公司 | Radiator and electronic equipment |
| CN111954428A (en) * | 2019-05-15 | 2020-11-17 | 浙江宇视科技有限公司 | Heat radiation structure and electronic assembly with same |
| TWI718873B (en) * | 2020-02-18 | 2021-02-11 | 四零四科技股份有限公司 | Electronic device having movable heat conducting assembly and related heat dissipating module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107396617A (en) * | 2017-09-05 | 2017-11-24 | 中微冷却技术（深圳）有限公司 | Floating type heat abstractor and the electronic building brick for being provided with the floating type heat abstractor |
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| CN110148590A (en) * | 2018-02-14 | 2019-08-20 | 华为技术有限公司 | Radiator and electronic equipment |
| CN110148590B (en) * | 2018-02-14 | 2021-07-16 | 华为技术有限公司 | Heat dissipation device and electronic equipment |
| CN111954428A (en) * | 2019-05-15 | 2020-11-17 | 浙江宇视科技有限公司 | Heat radiation structure and electronic assembly with same |
| CN111954428B (en) * | 2019-05-15 | 2023-09-01 | 浙江宇视科技有限公司 | Heat radiation structure and electronic component with same |
| TWI718873B (en) * | 2020-02-18 | 2021-02-11 | 四零四科技股份有限公司 | Electronic device having movable heat conducting assembly and related heat dissipating module |
| US11109514B1 (en) | 2020-02-18 | 2021-08-31 | Moxa Inc. | Electronic device with a heat dissipating function and heat dissipating module thereof |
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