CN210835959U - Liquid cooling radiator for server - Google Patents

Liquid cooling radiator for server Download PDF

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Publication number
CN210835959U
CN210835959U CN201922233156.5U CN201922233156U CN210835959U CN 210835959 U CN210835959 U CN 210835959U CN 201922233156 U CN201922233156 U CN 201922233156U CN 210835959 U CN210835959 U CN 210835959U
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CN
China
Prior art keywords
liquid cooling
heat pipe
plate
liquid
cooling plate
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Active
Application number
CN201922233156.5U
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Chinese (zh)
Inventor
魏芳伟
凌强威
龙锦华
汪广武
耿曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Goaland Energy Conservation Tech Co Ltd
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Guangzhou Goaland Energy Conservation Tech Co Ltd
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Publication date
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Priority to CN201922233156.5U priority Critical patent/CN210835959U/en
Application granted granted Critical
Publication of CN210835959U publication Critical patent/CN210835959U/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

Abstract

The utility model discloses a server liquid cooling radiator, including the liquid cooling board, be equipped with the heat pipe on this liquid cooling board, be connected with aluminum plate and fin on the heat pipe, the inside coolant liquid runner that is equipped with of liquid cooling board, thereby this coolant liquid runner forms water route circulation with outside pipeline intercommunication, the vortex fan is installed near the position of pipeline to the liquid cooling board, adopts the all standing cooling mode, has solved because of the too much problem that causes easy leakage of liquid cooling board interface, and the general drop of will letting out is to minimum, improves the factor of safety of product greatly.

Description

Liquid cooling radiator for server
Technical Field
The utility model relates to a heat exchanger technical field especially relates to a server liquid cooling radiator.
Background
From the development trend of the server, as the functions of the server are more and more integrated, the heating power of chips is more and more large, and the heat dissipation problem is more and more severe, the traditional air cooling cannot solve the heat problem generated by the high power of the existing server, so the liquid cooling is a better way for solving the heat dissipation problem of the server in the future, while the liquid cooling can solve the high power heating problem of more servers, the safety of the server is a problem.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an overcome the problem that exists among the above-mentioned, provide a server liquid cooling radiator, adopt the all standing cooling mode, solved because of the too much problem that causes easy leakage of liquid cooling board interface, will reveal the dew and fall to minimumly, improve the factor of safety of product greatly.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a server liquid cooling radiator, including the liquid cooling board, be equipped with the heat pipe on this liquid cooling board, be connected with aluminum plate and fin on the heat pipe, the inside coolant liquid runner that is equipped with of liquid cooling board, thereby this coolant liquid runner forms the water route circulation with outside pipeline intercommunication, the vortex fan is installed to the position that the liquid cooling board is close to the pipeline.
Preferably, the liquid cooling plate is formed by hermetically mounting an upper plate and a lower plate, the top surface of the upper plate is connected with the heat pipe, the bottom surface of the upper plate is provided with an annular groove and forms a closed cooling liquid flow channel with the lower plate, and the bottom surface of the lower plate is coated with heat conducting paste.
Preferably, the heat pipe is mounted on the liquid cooling plate by welding or interference fit.
Preferably, the heat pipe includes first heat pipe and second heat pipe, its one end of liquid cooling plate top is located to first heat pipe symmetry and is connected with the liquid cooling plate, and the other end welding has aluminum plate, and this aluminum plate both sides still have the laminating to lead the heat pad, its one end of liquid cooling plate top is located to the pipeline to the second heat pipe and is connected with the liquid cooling plate, and the other end welding has the fin.
Preferably, the liquid cooling plate is symmetrically provided with positioning devices, each positioning device comprises a screw rod, a spring and a clamp spring, the screw rod penetrates through the liquid cooling plate, the clamp spring sleeves the position where the screw rod penetrates through and extends out of the liquid cooling plate, and the spring sleeves the screw rod and abuts against the liquid cooling plate.
Compared with the prior art, the utility model discloses the beneficial effect who has does: this liquid cooling radiator adopts the full coverage cooling mode, can shift the generating heat of all components and parts to the liquid cooling board through heat pipe and vortex fan on, solved because of the too much easy problem of leaking that causes of liquid cooling board interface, will reveal the dew and fall to minimumly, improve the factor of safety of product greatly.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic view of an axial measurement structure of a liquid cooling radiator of a server according to the present invention;
fig. 2 is a schematic view of an axial measurement structure of a liquid cooling radiator of a server according to the present invention;
fig. 3 is a schematic diagram of a liquid cooling plate structure of a liquid cooling radiator of a server according to the present invention;
FIG. 4 is an enlarged partial schematic view of FIG. 2;
fig. 5 is an assembly view of a liquid cooling radiator of a server according to the present invention.
Description of the drawings: 1. a liquid-cooled plate; 101. an upper plate; 102. a lower plate; 2. a heat pipe; 201. a first heat pipe; 202. a second heat pipe; 3. an aluminum plate; 4. a heat sink; 5. a coolant flow passage; 6. a pipeline; 7. a turbulent fan; 8. heat conducting paste; 9. a positioning device; 901. a screw; 902. a spring; 903. and a clamp spring.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.
The utility model discloses at the concrete implementation as follows: as shown in fig. 1-5, a liquid cooling radiator for a server includes a liquid cooling plate 1, a heat pipe 2 is disposed on the liquid cooling plate 1, the heat pipe 2 is mounted on the liquid cooling plate 1 by welding or interference fit, an aluminum plate 3 and a heat sink 4 are connected to the heat pipe 2, a cooling liquid channel 5 is disposed inside the liquid cooling plate 1, the cooling liquid channel 5 is communicated with an external pipe 6 to form a water circuit, a turbulent fan 7 is mounted at a position of the liquid cooling plate 1 close to the pipe 6, the liquid cooling radiator adopts a full-coverage cooling method, and can transfer heat generated by all components to the liquid cooling plate 1 through the heat pipe 2 and the turbulent fan 7, and take away the heat through cooling liquid in the liquid cooling plate 1, thereby solving the problem of easy leakage caused by excessive interfaces of the liquid cooling plate 1, minimizing the leakage point, greatly improving the safety factor of the product, the liquid cooling plate 1 is formed by hermetically mounting an upper plate 101 and a lower plate 102, the top surface of the upper plate 101 is connected with the heat pipe 2, the bottom surface of the upper plate is provided with an annular groove, a closed cooling liquid flow channel 5 is formed by the upper plate and the lower plate, the upper plate 101 is fully distributed with the cooling liquid flow channel 5, the largest area of cooling liquid is contacted with a heating source, the best heat dissipation efficiency is achieved, the bottom surface of the lower plate 102 is coated with heat conducting paste 8, the heat conducting paste 8 is colloidal substance which can transfer heat and has high heat conductivity coefficient, a gap between the liquid cooling plate 1 and the CPU can be filled, and the heat dissipation performance.
The heat pipe 2 comprises a first heat pipe 201 and a second heat pipe 202, the first heat pipe 201 is symmetrically arranged at one end of the top of the liquid cooling plate 1 and is connected with the liquid cooling plate 1, the other end of the first heat pipe is welded with an aluminum plate 3, the two sides of the aluminum plate 3 are also attached with heat conducting pads, the memory bank of the first heat pipe 201 attached product is arranged, the heat generated by the memory bank is transmitted to the liquid cooling plate 1 through the first heat pipe 201, the heat radiating efficiency of the memory bank is ensured, meanwhile, the heat radiating efficiency of the memory can be improved through the heat conducting pads, the second heat pipe 202 is just arranged on the pipeline 6 and connected with the liquid cooling plate 1 at the top of the liquid cooling plate 1, the other end of the second heat pipe 202 is welded with a heat radiating fin 4, the heat generated by the array plate card is transmitted to the.
The positioning device 9 is symmetrically arranged on the liquid cooling plate 1 and comprises a screw 901, a spring 902 and a clamp spring 903, the screw 901 penetrates through the liquid cooling plate 1, the clamp spring 903 is sleeved on a part where the screw 901 penetrates and extends out of the liquid cooling plate 1, the spring 902 is sleeved on the screw 901 and abuts against the liquid cooling plate 1, the radiator is integrally fixed on a server mainboard through the screw 901, the liquid cooling plate 1 can be tightly attached to a CPU through deformation generated after the spring 902 is compressed, the contact area of the liquid cooling plate 1 is ensured, the heat dissipation effect is improved, the clamp spring 903 is used for fixing the position of the screw 901 on the liquid cooling plate 1, and the installation is convenient.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (5)

1. A server liquid cooling radiator which characterized in that: including the liquid cooling board, be equipped with the heat pipe on this liquid cooling board, be connected with aluminum plate and fin on the heat pipe, the inside coolant liquid runner that is equipped with of liquid cooling board, thereby this coolant liquid runner forms the water route circulation with outside pipeline intercommunication, the vortex fan is installed to the position that the liquid cooling board is close to the pipeline.
2. The server liquid-cooled heat sink of claim 1, wherein: the liquid cooling plate is formed by hermetically installing an upper plate and a lower plate, the top surface of the upper plate is connected with the heat pipe, the bottom surface of the upper plate is provided with an annular groove and forms a closed cooling liquid flow channel with the lower plate, and the bottom surface of the lower plate is coated with heat conducting paste.
3. The server liquid-cooled heat sink of claim 1, wherein: the heat pipe is mounted on the liquid cooling plate in a welding or interference fit mode.
4. The server liquid-cooled heat sink of claim 1, wherein: the heat pipe comprises a first heat pipe and a second heat pipe, the first heat pipe is symmetrically arranged at the top of the liquid cooling plate, one end of the first heat pipe is connected with the liquid cooling plate, the other end of the first heat pipe is welded with an aluminum plate, heat conducting pads are attached to two sides of the aluminum plate, the second heat pipe is opposite to a pipeline, one end of the second heat pipe is arranged at the top of the liquid cooling plate, the second heat pipe is connected with the liquid cooling plate, and.
5. The server liquid-cooled heat sink of claim 1, wherein: the liquid cooling plate is symmetrically provided with positioning devices, each positioning device comprises a screw rod, a spring and a clamp spring, the screw rods penetrate through the liquid cooling plate, the clamp springs are sleeved at the positions where the screw rods penetrate through and extend out of the liquid cooling plate, and the springs are sleeved on the screw rods and abut against the liquid cooling plate.
CN201922233156.5U 2019-12-13 2019-12-13 Liquid cooling radiator for server Active CN210835959U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922233156.5U CN210835959U (en) 2019-12-13 2019-12-13 Liquid cooling radiator for server

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201922233156.5U CN210835959U (en) 2019-12-13 2019-12-13 Liquid cooling radiator for server
PCT/CN2019/127026 WO2021114376A1 (en) 2019-12-13 2019-12-20 Liquid-cooling radiator for server

Publications (1)

Publication Number Publication Date
CN210835959U true CN210835959U (en) 2020-06-23

Family

ID=71281374

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922233156.5U Active CN210835959U (en) 2019-12-13 2019-12-13 Liquid cooling radiator for server

Country Status (2)

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CN (1) CN210835959U (en)
WO (1) WO2021114376A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114006246A (en) * 2021-10-27 2022-02-01 光惠(上海)激光科技有限公司 Laser with high-power multi-mode beam combiner

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3070787B2 (en) * 1991-12-19 2000-07-31 株式会社日立製作所 Electronic equipment
CN2726113Y (en) * 2004-09-03 2005-09-14 黄维诚 Liquid cooled heat radiation water tank structure with heat conductor
CN201638132U (en) * 2010-01-14 2010-11-17 锘威科技(深圳)有限公司 Heat dissipation module
CN203786651U (en) * 2014-03-06 2014-08-20 北京芯铠电子散热技术有限责任公司 Liquid cooling system of server and server comprising liquid cooling system
CN206895085U (en) * 2017-04-24 2018-01-16 深圳市万景华科技有限公司 Video card integrated water-cooling device
CN207611345U (en) * 2017-12-04 2018-07-13 广州高澜节能技术股份有限公司 Integrated service device water-filled radiator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114006246A (en) * 2021-10-27 2022-02-01 光惠(上海)激光科技有限公司 Laser with high-power multi-mode beam combiner

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WO2021114376A1 (en) 2021-06-17

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