CN217181498U - Server radiator - Google Patents
Server radiator Download PDFInfo
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- CN217181498U CN217181498U CN202220659262.9U CN202220659262U CN217181498U CN 217181498 U CN217181498 U CN 217181498U CN 202220659262 U CN202220659262 U CN 202220659262U CN 217181498 U CN217181498 U CN 217181498U
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- heat
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- heat conduction
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application discloses server radiator can reduce the bulk temperature of air current in the server. The server radiator in this application includes: the heat conduction block is fixed in the server, and heat conduction silica gel is arranged on the surface of the heat conduction block; the heat dissipation fins are fixed in the server; the heat conducting pipe penetrates through the heat conducting block and is embedded in the heat radiating fin partially; the air inlet fan is fixed at the shell of the server, the air inlet direction of the air inlet fan is right opposite to one side of the radiating fins and faces the radiating fins, and the heat conduction pipe and the heat conduction block are both located at the other side positions of the radiating fins.
Description
Technical Field
The application relates to the technical field of server radiators, in particular to a server radiator.
Background
With the continuous development of information technology, the demand for information data processing and analysis is increasing, and in a high-power high-computing-performance server device, a Central Processing Unit (CPU) is a main heating component, and the heat dissipation performance of the CPU is particularly important.
In the prior art, the heat sink is generally directly installed right above the CPU, and the intake air flow of the intake fan is heated into a hotter air flow after passing through the heat sink above the CPU, and then blown into a rear power supply and a Graphics Processing Unit (GPU).
However, because the heat generated by the CPU is high, the intake airflow passing through the CPU may be heated to a high temperature, resulting in a local over-temperature of the airflow blowing toward the rear GPU and the power supply, which may cause damage to the GPU and the power supply.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem, the present application provides a server heat sink capable of reducing the overall temperature of the airflow in the server, and specifically refers to the following examples.
The application provides a server radiator, includes:
the heat conduction block is fixed in the server, and heat conduction silica gel is arranged on the surface of the heat conduction block;
the heat dissipation fins are fixed in the server;
the heat conducting pipe penetrates through the heat conducting block and is embedded in the heat radiating fin partially;
the air inlet fan is fixed at the shell of the server, the air inlet direction of the air inlet fan is right opposite to one side of the radiating fins and faces the radiating fins, and the heat conduction pipe and the heat conduction block are both located at the other side positions of the radiating fins.
Optionally, the heat conducting block includes a plurality of heat conducting pipes, and a plurality of heat conducting pipes are embedded in any one of the heat conducting blocks.
Optionally, the distances between every two of the heat pipes embedded in the heat dissipation fins are the same.
Optionally, the heat pipe is an elbow pipe, the heat pipe is embedded in the heat conducting block in a transverse penetrating manner, and part of the heat pipe is embedded in the heat radiating fin in a vertical penetrating manner from the bottom of the heat radiating fin.
Optionally, a heat dissipation coil is disposed in the heat conduction block, and the heat conduction pipe partially penetrates through the heat conduction block and is in conduction connection with the heat dissipation coil.
Optionally, the server radiator further includes a heat insulation support fixing frame, and the heat insulation support fixing frame is located in the server and fixedly connected to the heat conducting block.
Optionally, the air intake fan includes a plurality of air intake fans, the plurality of air intake fans are all located on the same fan plane, the fan plane is a plane parallel to the surface of the heat dissipation fin, and the distances between each two of the plurality of air intake fans are the same.
Optionally, the intake fan is an axial fan.
Optionally, the heat conducting block is a copper plate.
According to the technical scheme, the method has the following advantages:
the heat conduction block is fixed in the server, the surface of the heat conduction block is provided with heat conduction silica gel to be connected with the CPU, the radiating fin is fixed in the server, the heat conduction pipe is partially penetrated and embedded in the heat conduction block, the part is penetrated and embedded in the radiating fin, the air inlet fan is fixed in the shell of the server, the air inlet direction of the air inlet fan is just opposite to one side of the radiating fin and faces the radiating fin, the heat conduction pipe and the heat conduction block are both positioned at the other side of the radiating fin, the heat on the CPU is guided to the radiating fin through the heat conduction block and the heat conduction pipe, the heat transfer efficiency in the radiating fin is high, the integral temperature distribution of the radiating fin is uniform, the air inlet flow is uniformly heated through the radiating fin, and the integral temperature of the air inlet flow can be reduced under the condition that the heat generated by the CPU is a certain value.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic perspective view of a server heat sink in the present application;
fig. 2 is a schematic structural layout diagram of a server where a server heat sink is located in the present application.
Detailed Description
In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used only for explaining relative positional relationships between the respective members or components, and do not particularly limit specific mounting orientations of the respective members or components.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In addition, the structures, the proportions, the sizes, and the like, which are illustrated in the accompanying drawings and described in the present application, are intended to be considered illustrative and not restrictive, and therefore, not limiting, since those skilled in the art will understand and read the present application, it is understood that any modifications of the structures, changes in the proportions, or adjustments in the sizes, which are not necessarily essential to the practice of the present application, are intended to be within the scope of the present disclosure without affecting the efficacy and attainment of the same.
The application provides a server radiator, can reduce the bulk temperature of air current in the server.
Referring to fig. 1 to 2, a server heat sink of the present application includes:
the server comprises a heat conduction block 1, wherein the heat conduction block 1 is fixed in the server, and heat conduction silica gel is arranged on the surface of the heat conduction block 1;
the heat dissipation fins 2 are fixed in the server;
the heat conduction pipe 3 is partially penetrated and embedded in the heat conduction block 1, and partially penetrated and embedded in the radiating fin 2;
The heat conductive silicone is connected to a component in the server, where the local temperature rise speed is fast, such as a CPU overall or a CPU local core, and the like, which is not limited herein.
Wherein, radiating fin 2 can have good inside heat transfer performance owing to the fin structure of self for the heat on the CPU that comes through heat conduction piece 1 and the transmission of heat pipe 3 can evenly scatter the distribution fast on radiating fin 2, so that the inlet air current is the thermally equivalent when passing through.
The air intake fan 4 may be located in the housing of the server at a position corresponding to the air intake hole on the housing, or may be embedded in the housing of the server, and the specific position of the air intake fan 4 is not limited here.
Wherein, the air inlet air current that air inlet fan 4 blew into can be blockked and blow off to all around by radiating fin 2's surface behind radiating fin 2 to reduce the position of the higher CPU of temperature, heat conduction piece 1 and the heat pipe 3 in air inlet air current process radiating fin 2 rear as far as possible, thereby reduce the local condition that leads to local air current high temperature that is heated of air inlet air current.
The heat conducting pipe is internally sealed, liquid is filled under negative pressure, heat is taken away by utilizing liquid phase change heat exchange, and the internal axial heat transfer rate can reach 10000 w/mk.
In this application, heat conduction block 1 is fixed in the server, heat conduction block 1 surface is provided with heat conduction silica gel and is connected with CPU, fin 2 is fixed in the server, heat pipe 3 part runs through embedded in heat conduction block 1, the part runs through embedded in fin 2, air intake fan 4 is fixed in the shell department of server, air intake fan 4's the direction of admitting air is just to fin 2's one side and towards fin 2, heat pipe 3 and heat conduction block 1 all are located fin 2's the other side position, heat direction fin 2 on with CPU through heat conduction block 1 and heat pipe 3, heat transfer efficiency in fin 2 is high, thereby make fin 2 holistic temperature distribution even, the air inlet flow is through fin 2 thermally equivalent, can make the whole temperature reduction of air inlet flow under the heat that CPU produced is a definite value.
Optionally, the heat conducting block 1 includes a plurality of heat conducting pipes 3, and a plurality of heat conducting pipes 3 are embedded in any one of the heat conducting blocks 1.
It can be understood that, the number of the heat conduction blocks 1 is matched with the number of CPUs in the server or the number of positions where heat dissipation is required, for example, when three CPUs are arranged in the server, the heat conduction blocks 1 are respectively attached to the three CPUs through heat conduction silica gel, and the rate of heat conduction from the heat conduction blocks 1 to the heat dissipation fins 2 can be increased by the plurality of heat conduction pipes 3 arranged in a single heat conduction block 1.
Wherein, the distance between every two of a plurality of heat pipes 3 embedded in the radiating fin 2 is the same.
It can be understood that, a plurality of heat pipes 3 in the heat dissipation fin 2 are the positions with higher temperature, and the distances between the plurality of heat pipes 3 are the same, so that the heating rates of the positions of the heat dissipation fin 2 are similar, and the temperatures of the parts of the heat dissipation fin 2 are more uniform.
Wherein, a plurality of heat pipe 3 can be located the most middle position of radiating fin 2, for example heat pipe 3 is provided with two rows, and the number of heat pipe 3 in every row is 4, and the distance between every two heat pipe 3 in every row is 10mm, and two rows of heat pipe 3 are located the coplanar, and the distance of this plane to radiating fin 2 both sides surface is 20mm, and the distance between two rows of heat pipe 3 is also 10 mm.
Optionally, the heat pipe 3 is an elbow, and the heat pipe 3 partially penetrates through and is embedded in the heat conducting block 1, and partially penetrates through and is embedded in the heat radiating fin 2 vertically from the bottom of the heat radiating fin 2.
It should be noted that, the heat pipe 3 partially penetrates and is embedded in the heat conduction block 1 in a transverse manner, which means that the heat pipe 3 penetrates through a thinner cross section of the heat conduction block 1, so that the distance between the heat pipe 3 and the surface of the heat conduction block 1 is shortened, and the heat transfer distance is reduced, thereby improving the heat transfer rate, and the portion vertically penetrates and is embedded in the heat dissipation fin 2 from the bottom of the heat dissipation fin 2 in a vertical manner, which means that the heat pipe 3 penetrates through a thinner vertical section of the heat dissipation fin 2, the function of which is similar to that of the above description portion, and the description is omitted here.
Optionally, a heat dissipation coil is disposed in the heat conduction block 1, and the heat conduction pipe 3 partially penetrates through the heat conduction block 1 and is in conduction connection with the heat dissipation coil.
The heat dissipation coil is distributed at each position in the heat conduction block 1 to increase the contact area with the heat conduction block 1, thereby accelerating the heat conductivity rate between the heat conduction block 1 and the heat dissipation coil and the heat conduction pipe 3.
Optionally, the server radiator further includes a heat insulation support fixing frame, and the heat insulation support fixing frame is located in the server and is fixedly connected with the heat conduction block 1.
It can be understood that the heat insulation support fixing frame has good heat insulation capability, so that the condition that the heat on the heat conduction block 1 is transferred to the shell of the server through the heat insulation support fixing frame is reduced.
Optionally, the number of the intake fans 4 is multiple, the intake fans 4 are all located on the same fan plane, the fan plane is a plane parallel to the surface of the heat dissipation fin 2, and the distances between every two intake fans 4 are the same.
Alternatively, the intake fan 4 is an axial flow fan.
Optionally, the heat conducting block 1 is a copper plate.
It can be understood that the material of the heat conducting pipe 3 is also copper, and the thermal conductivity of copper is 401W/mK, which has good heat conducting property.
It should be noted that the above-mentioned application contents and the specific embodiments are intended to demonstrate the practical application of the technical solutions provided in the present application, and should not be construed as limiting the scope of protection of the present application. Various modifications, equivalent substitutions, or improvements may be made by those skilled in the art within the spirit and principles of the present application. The protection scope of this application is subject to the appended claims.
Claims (9)
1. The utility model provides a server radiator, is applied to for the server heat dissipation, its characterized in that includes:
the heat conduction block is fixed in the server, and heat conduction silica gel is arranged on the surface of the heat conduction block;
the heat dissipation fins are fixed in the server;
the heat conducting pipe penetrates through the heat conducting block and is embedded in the heat radiating fin partially;
the air inlet fan is fixed at the shell of the server, the air inlet direction of the air inlet fan is right opposite to one side of the radiating fins and faces the radiating fins, and the heat conduction pipe and the heat conduction block are both located at the other side positions of the radiating fins.
2. The server heat sink of claim 1, wherein the heat conducting block comprises a plurality of heat conducting pipes, and wherein a plurality of heat conducting pipes are embedded in any one of the heat conducting blocks.
3. The server heat sink as claimed in claim 2, wherein the plurality of heat pipes embedded in the heat dissipation fins have the same distance therebetween.
4. The server radiator of claim 1, wherein the heat conducting pipe is an elbow pipe, and the heat conducting pipe is partially inserted through the heat conducting block in a transverse direction and partially inserted through the heat radiating fin in a vertical direction from the bottom of the heat radiating fin.
5. The server heatsink of claim 1, wherein the thermally conductive block has a heat-dissipating coil disposed therein, and the thermally conductive tube extends partially through the thermally conductive block and is in fluid communication with the heat-dissipating coil.
6. The server heat sink according to any one of claims 1 to 5, further comprising a thermally insulating support fixture located in the server and fixedly connected to the thermally conductive block.
7. The server heat sink according to any one of claims 1 to 5, wherein the air intake fan includes a plurality of air intake fans, the plurality of air intake fans are all located on a same fan plane, the fan plane is a plane parallel to the surface of the heat dissipation fin, and the distance between each two of the plurality of air intake fans is the same.
8. The server heatsink of any one of claims 1 to 5, wherein the intake fan is an axial fan.
9. The server heat sink of any one of claims 1 to 5, wherein the heat conducting block is a copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220659262.9U CN217181498U (en) | 2022-03-24 | 2022-03-24 | Server radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220659262.9U CN217181498U (en) | 2022-03-24 | 2022-03-24 | Server radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217181498U true CN217181498U (en) | 2022-08-12 |
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ID=82745401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220659262.9U Active CN217181498U (en) | 2022-03-24 | 2022-03-24 | Server radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217181498U (en) |
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2022
- 2022-03-24 CN CN202220659262.9U patent/CN217181498U/en active Active
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