CN213548134U - Sound box heat dissipation system - Google Patents
Sound box heat dissipation system Download PDFInfo
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- CN213548134U CN213548134U CN202022749760.6U CN202022749760U CN213548134U CN 213548134 U CN213548134 U CN 213548134U CN 202022749760 U CN202022749760 U CN 202022749760U CN 213548134 U CN213548134 U CN 213548134U
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- heat
- conducting medium
- sound box
- radiator
- heat dissipation
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Abstract
The utility model discloses a sound box cooling system, it belongs to audio amplifier technical field, and this sound box cooling system is used for assisting the audio amplifier to dispel the heat, and the audio amplifier includes the mainboard, and sound box cooling system locates in the audio amplifier, include: the radiator is arranged on the surface of the mainboard; a first heat-conducting medium; the first heat dissipation block is positioned on the side part of the radiator, the first heat-conducting medium is arranged between the radiator and the first heat dissipation block, and the first heat-conducting medium can transfer the heat of the radiator to the first heat dissipation block; a second heat-conducting medium; the second heat-conducting medium can transfer the heat of the first heat-radiating block from the shell to the heat-radiating fin; the loudspeaker box heat dissipation system further comprises a second heat dissipation block, and a third heat conduction medium and a fourth heat conduction medium are arranged on two opposite sides of the second heat dissipation block respectively. The utility model discloses make the audio amplifier can pass through the test of rising temperature and reach the ann rule requirement.
Description
Technical Field
The utility model relates to a audio amplifier technical field especially relates to a sound box cooling system.
Background
The loudspeaker box system can emit a large amount of heat when the power amplifier works, and the generated heat needs to be timely evacuated to the air to ensure the normal work of the loudspeaker box system.
At the audio amplifier design stage, the designer need design audio amplifier cooling system in order to distribute the heat to the air from audio amplifier is inside, guarantee that the audio amplifier passes through the temperature rise test, could pass through the safety standard requirement. However, in some custom-made enclosures, the enclosure heat dissipation system does not allow the design of a guide tube to assist in heat dissipation, nor does it allow for air convection through the openings.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a sound box cooling system to solve the difficult technical problem of sound box system heat dissipation that exists among the prior art.
As the conception, the utility model adopts the technical proposal that:
the utility model provides a sound box cooling system for supplementary sound box dispels the heat, the audio amplifier includes the mainboard, sound box cooling system locates in the audio amplifier, include:
the radiator is arranged on the surface of the mainboard and is made of metal;
a first heat-conducting medium;
the first heat dissipation block is positioned on the side part of the radiator, the first heat-conducting medium is arranged between the radiator and the first heat dissipation block, and the first heat-conducting medium can transfer the heat of the radiator to the first heat dissipation block;
a second heat-conducting medium;
the second heat-conducting medium can transfer the heat of the first heat-radiating block from the shell to the heat-radiating fin;
the loudspeaker box heat dissipation system further comprises a second heat dissipation block, the first heat dissipation block and the second heat dissipation block are arranged at intervals along a first direction, a third heat conducting medium and a fourth heat conducting medium are arranged on two opposite sides of the second heat dissipation block respectively, the third heat conducting medium is arranged between the radiator and the second heat dissipation block, the third heat conducting medium can transfer heat of the radiator to the second heat dissipation block, and the fourth heat conducting medium can transfer heat of the second heat dissipation block to the shell.
Optionally, the heat sink is made of aluminum, and a black oxide layer is disposed on a surface of the heat sink.
Optionally, the first heat-conducting medium is made of heat-conducting silica gel.
Optionally, the first heat dissipation block is made of aluminum, and a black oxide layer is arranged on the surface of the first heat dissipation block.
Optionally, the second heat-conducting medium is made of heat-conducting silica gel.
Optionally, the heat sink is made of aluminum, and a black oxide layer is disposed on the surface of the heat sink.
Optionally, the third heat-conducting medium is made of heat-conducting silica gel.
Optionally, the fourth heat-conducting medium is made of heat-conducting silica gel.
Optionally, the second heat dissipation block is made of aluminum, and a black oxide layer is arranged on the surface of the second heat dissipation block.
Optionally, the radiator with be equipped with the heat conduction silica gel oil reservoir between the mainboard, the heat via of mainboard the heat conduction silica gel oil reservoir transmits to the radiator.
The utility model provides a sound box cooling system can assist the mainboard heat dissipation of audio amplifier. When the mainboard is in power amplification, the chip of mainboard produces the heat, and the heat part of mainboard is via radiator transmission to shell and give off in the air. The mainboard is in addition partial heat in proper order via first heat-conducting medium, first radiating block, the second heat-conducting medium transmits to the shell and gives off the air through the fin, partial heat in addition passes to the shell and gives off the air through the fin via third heat-conducting medium, second radiating block and fourth heat-conducting medium in proper order, multiple heat dissipation way dispels the heat simultaneously, fin and outside air direct contact guarantee that the inside heat of audio amplifier system can be fully derived, guarantee the radiating effect. On the premise that the guide pipe is not allowed to assist in heat dissipation and the holes can not be opened to dissipate heat through air convection, the sound box heat dissipation system successfully solves the heat dissipation problem in the closed space, and ensures that the sound box can pass a temperature rise test and meet safety requirements.
Meanwhile, the first heat-conducting medium can ensure that the heat of the radiator is stably transferred to the first radiating block, and the second heat-conducting medium can ensure that the heat of the first radiating block is stably transferred to the shell and is radiated to the air through the radiating fins; the setting of third heat-conducting medium can guarantee that the heat of radiator stably transmits to the second radiating block, and the setting of fourth heat-conducting medium can guarantee that the heat of second radiating block stably transmits to the shell and gives off to the air through the fin.
Drawings
Fig. 1 is a schematic structural diagram of a sound box heat dissipation system provided by an embodiment of the present invention.
In the figure:
1. a main board; 2. a heat sink; 3. a first heat-conducting medium; 4. a first heat dissipation block; 5. a second heat-conducting medium; 6. a heat sink; 7. a fourth heat-conducting medium; 8. a third heat-conducting medium; 9. and a second heat dissipation block.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements related to the present invention are shown in the drawings.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, this embodiment provides a sound box cooling system for assisting a sound box to dissipate heat, the sound box includes a main board 1, and the sound box cooling system is disposed in the sound box.
The sound box heat dissipation system comprises a radiator 2, a first heat conducting medium 3, a first heat dissipation block 4, a second heat conducting medium 5, a heat dissipation fin 6, a second heat dissipation block 9, a fourth heat conducting medium 7 and a third heat conducting medium 8.
Wherein, radiator 2 locates the surface of mainboard 1, and the material of radiator 2 is the metal.
The first radiating block 4 is located on the side of the radiator 2, the first heat-conducting medium 3 is arranged between the radiator 2 and the first radiating block 4, and the first heat-conducting medium 3 can transfer the heat of the radiator 2 to the first radiating block 4.
The radiating fins 6 are arranged on the outer side surface of the shell of the sound box, and the second heat-conducting medium 5 can transfer the heat of the first radiating block 4 to the radiating fins 6 from the shell. Specifically, in this embodiment, the housing is a plastic part, and the heat sink 6 is mounted on the housing of the sound box.
First radiating block 4 and second radiating block 9 set up along first direction interval, and the relative both sides of second radiating block 9 are equipped with third heat-conducting medium 8 and fourth heat-conducting medium 7 respectively, and third heat-conducting medium 8 is located between radiator 2 and the second radiating block 9, and third heat-conducting medium 8 can be with the heat transfer of radiator 2 to second radiating block 9, and fourth heat-conducting medium 7 can be with the heat transfer of second radiating block 9 to shell.
The sound box heat dissipation system provided by the embodiment can assist the heat dissipation of the main board 1 of the sound box. When the mainboard 1 is in power amplification, the chip of the mainboard 1 generates heat, and the heat part of the mainboard 1 is transferred to the shell through the radiator 2 and is radiated to the air. The mainboard 1 still has partial heat to transmit to the shell and give off the air through fin 6 via first heat-conducting medium 3, first radiating block 4, second heat-conducting medium 5 in proper order, and partial heat passes to the shell and gives off the air through fin 6 via third heat-conducting medium 8, second radiating block 9 and fourth heat-conducting medium 7 in proper order in addition, and multiple heat dissipation way dispels the heat simultaneously, guarantees the radiating effect. On the premise that the guide pipe is not allowed to assist in heat dissipation and the holes can not be opened to dissipate heat through air convection, the sound box heat dissipation system successfully solves the heat dissipation problem in the closed space, and ensures that the sound box can pass a temperature rise test and meet safety requirements.
Preferably, in this embodiment, a heat-conducting silicone oil layer is further disposed between the heat sink 2 and the chip of the motherboard 1, so as to further improve the heat conduction efficiency, and the heat of the motherboard 1 is transferred to the heat sink 2 via the heat-conducting silicone oil layer. Specifically, heat conductive silicone oil is brushed on the chip of the motherboard 1 to form a heat conductive silicone oil layer.
Specifically, in this embodiment, the heat sink 2 is made of aluminum, and the surface of the heat sink 2 is provided with a black oxide layer.
The material of first heat-conducting medium 3 is heat conduction silica gel, can with radiator 2 and the equal abundant contact of first radiating block 4, and then guarantee that the heat of radiator 2 can stably transmit to first radiating block 4. The first heat-conducting medium 3 has a thermal conductivity of 4. Of course, in other embodiments, the thermal conductivity of the first heat-conducting medium 3 may be selected according to the needs, and is not limited herein.
The first heat dissipation block 4 is made of aluminum, and a black oxide layer is disposed on the surface of the first heat dissipation block 4.
The material of second heat-conducting medium 5 is heat conduction silica gel, can all fully contact with first radiating block 4 and shell, and then guarantees that the heat of first radiating block 4 can stably transmit to the shell. The second heat-conducting medium 5 has a thermal conductivity of 4. Of course, in other embodiments, the thermal conductivity of the second heat-conducting medium 5 may be selected according to the needs, and is not limited herein.
The heat sink 6 is made of aluminum, and a black oxide layer is disposed on the surface of the heat sink 6.
The third heat-conducting medium 8 is made of heat-conducting silica gel, and can be in full contact with the radiator 2 and the second radiating block 9, so that stable heat transfer of the radiator 2 to the second radiating block 9 is guaranteed. The third heat transfer medium 8 has a thermal conductivity of 4. Of course, in other embodiments, the thermal conductivity of the third thermal medium 8 may be selected according to the needs, and is not limited herein.
The fourth heat-conducting medium 7 is made of heat-conducting silica gel, and can be in full contact with the second heat-radiating block 9 and the shell, so that the heat of the second heat-radiating block 9 can be stably transferred to the shell. The fourth heat transfer medium 7 has a thermal conductivity of 4. Of course, in other embodiments, the thermal conductivity of the fourth thermal medium 7 may be selected according to the needs, and is not limited herein.
The second heat dissipation block 9 is made of aluminum, and a black oxide layer is disposed on the surface of the second heat dissipation block 9.
The above embodiments have been described only the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and is not departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides a sound box cooling system for supplementary sound box dispels the heat, the sound box includes mainboard (1), its characterized in that, sound box cooling system locates in the sound box, include:
the radiator (2) is arranged on the surface of the mainboard (1), and the radiator (2) is made of metal;
a first heat-conducting medium (3);
the first radiating block (4) is positioned on the side of the radiator (2), the first heat-conducting medium (3) is arranged between the radiator (2) and the first radiating block (4), and the first heat-conducting medium (3) can transfer the heat of the radiator (2) to the first radiating block (4);
a second heat-conducting medium (5);
the radiating fins (6) are arranged on the outer side face of the shell of the sound box, and the second heat-conducting medium (5) can transfer the heat of the first radiating block (4) from the shell to the radiating fins (6);
the loudspeaker box heat dissipation system further comprises a second heat dissipation block (9), the first heat dissipation block (4) and the second heat dissipation block (9) are arranged at intervals along a first direction, a third heat conducting medium (8) and a fourth heat conducting medium (7) are arranged on two opposite sides of the second heat dissipation block (9) respectively, the third heat conducting medium (8) is arranged between the radiator (2) and the second heat dissipation block (9), the third heat conducting medium (8) can transfer heat of the radiator (2) to the second heat dissipation block (9), and the fourth heat conducting medium (7) can transfer heat of the second heat dissipation block (9) to the shell.
2. The sound box cooling system according to claim 1, wherein the heat sink (2) is made of aluminum, and a black oxide layer is disposed on a surface of the heat sink (2).
3. The sound box cooling system according to claim 1, wherein the first heat-conducting medium (3) is made of heat-conducting silica gel.
4. The sound box cooling system according to claim 1, wherein the first heat sink block (4) is made of aluminum, and a black oxide layer is disposed on a surface of the first heat sink block (4).
5. The sound box cooling system according to claim 1, wherein the second heat-conducting medium (5) is made of heat-conducting silica gel.
6. The sound box cooling system according to claim 1, wherein the heat sink (6) is made of aluminum, and a black oxide layer is disposed on a surface of the heat sink (6).
7. The sound box cooling system according to claim 1, wherein the third heat-conducting medium (8) is made of heat-conducting silica gel.
8. The sound box cooling system according to claim 1, wherein the fourth heat-conducting medium (7) is made of heat-conducting silica gel.
9. The sound box cooling system according to claim 1, wherein the second heat sink (9) is made of aluminum, and a black oxide layer is disposed on a surface of the second heat sink (9).
10. The sound box cooling system according to any one of claims 1-9, wherein a heat-conducting silicone oil layer is disposed between the heat sink (2) and the main board (1), and heat of the main board (1) is transferred to the heat sink (2) via the heat-conducting silicone oil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022749760.6U CN213548134U (en) | 2020-11-24 | 2020-11-24 | Sound box heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022749760.6U CN213548134U (en) | 2020-11-24 | 2020-11-24 | Sound box heat dissipation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213548134U true CN213548134U (en) | 2021-06-25 |
Family
ID=76484080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022749760.6U Active CN213548134U (en) | 2020-11-24 | 2020-11-24 | Sound box heat dissipation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213548134U (en) |
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2020
- 2020-11-24 CN CN202022749760.6U patent/CN213548134U/en active Active
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