CN111124090A - Heat dissipation system for passive heat dissipation of computer - Google Patents
Heat dissipation system for passive heat dissipation of computer Download PDFInfo
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- CN111124090A CN111124090A CN202010062927.3A CN202010062927A CN111124090A CN 111124090 A CN111124090 A CN 111124090A CN 202010062927 A CN202010062927 A CN 202010062927A CN 111124090 A CN111124090 A CN 111124090A
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- heat
- heat dissipation
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- collector
- transfer pipe
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention provides a heat dissipation system for passive heat dissipation of a computer, which is characterized by comprising a shell, a CPU heat dissipation device and a heating source heat dissipation device, wherein the CPU heat dissipation device comprises a heat dissipation cover, the outer surface of the heat dissipation cover is provided with heat dissipation fins, the heat dissipation cover is connected with the shell to form a totally enclosed case, and inert gas is filled in the case; the CPU heat dissipation device also comprises a first heat collector and a first heat transfer pipe, wherein the first heat collector is positioned in the case and connected with the CPU, and the first heat transfer pipe is coiled on the inner surface of the heat dissipation cover and connected with the first heat collector; the heating source heat dissipation device is arranged in the case and comprises a second heat collector connected with the heating element and a second heat transfer pipe connected with the second heat collector and the inner surface of the shell; the heat-radiating cover and the inner surface of the shell are covered with a heat-insulating coating in the area not contacted with the heat-transfer pipe, and heat-conducting silicone grease is coated at the connecting position of each device. The invention realizes the passive heat dissipation of the computer, and improves the service life and the use safety of the heat dissipation equipment while obtaining excellent heat dissipation effect.
Description
Technical Field
The present invention relates to the field of heat dissipation technologies, and in particular, to a heat dissipation system for passive heat dissipation of a computer.
Background
When a computer works, all components inside the computer can generate a large amount of heat when running, if no heat dissipation system can discharge the heat in time, the normal work of the computer can be seriously affected, and the problems that the running speed of the computer is slow, the computer is halted, and even core components such as a CPU (central processing unit) and the like can be burnt out are caused.
The existing computer heat dissipation methods are generally divided into water-cooling heat dissipation and air-cooling heat dissipation, both of which belong to active heat dissipation.
The air-cooled heat dissipation system comprises a heat dissipation sheet and a heat dissipation fan, and the principle is that heat of a heating source is conducted to the heat dissipation sheet, and then the fan drives air to flow so as to realize heat dissipation; the computer case has the disadvantages that in order to ensure the effectiveness of fan heat dissipation, the case of the computer must be designed into an open structure, so that the inside of the case is communicated with the outside, after long-time use, the fan can bring external dust into the inside of the computer, the cleanliness of the inside of the case is influenced, and the heat dissipation effect of the heat dissipation fins is reduced or even fails due to the fact that a large amount of dust is accumulated on the heat dissipation fins.
The water-cooling heat dissipation system comprises a pipeline, water-cooling liquid and a water pump, and the principle is that the water-cooling liquid circularly flows in the case along the pipeline by the pressure generated by the water pump so as to take away heat; the water-cooling heat dissipation system has the advantages that the water-cooling heat dissipation system is completely sealed, the number of connecting points of the pipeline is too many, high requirements are provided for production and installation processes, once a certain connecting point leaks, serious potential safety hazards can be caused to a computer, meanwhile, the water pump is an electric product with low safety coefficient, power consumption is high, faults are easily generated in the using process, the water pump is not convenient to maintain, once the water pump stops working, the whole water-cooling heat dissipation system can cause problems, heat cannot be dissipated, and the computer is damaged.
Therefore, how to satisfy the heat dissipation requirement of the computer while avoiding the problems of the active heat dissipation method is an urgent technical problem to be solved.
Disclosure of Invention
The invention aims to provide a closed heat dissipation system which changes a computer heat dissipation mode and does not relate to cooling fluid, and the specific technical scheme is as follows:
a heat dissipation system for passive heat dissipation of a computer comprises a shell, a CPU heat dissipation device and a heating source heat dissipation device, wherein the CPU heat dissipation device comprises a heat dissipation cover, the outer surface of the heat dissipation cover is provided with heat dissipation fins, and the heat dissipation cover is connected with the shell to form a totally enclosed case;
the CPU heat dissipation device also comprises a first heat collector and a first heat transfer pipe which are positioned in the case, the first heat collector is connected with the CPU on the computer mainboard in a heat conduction manner, and the first heat transfer pipe is coiled on the inner surface of the heat dissipation cover and is connected with the first heat collector;
the heating source heat dissipation device is arranged in the case and comprises a second heat collector and a second heat transfer pipe, the second heat collector is connected with a heating element on the computer mainboard in a heat conduction mode, part of pipe body of the second heat transfer pipe is arranged in the second heat collector, and the pipe body penetrates through the second heat collector and then is tightly attached to the inner surface of the shell.
The heating element of the invention refers to other electronic components except the CPU which can generate heat when in work.
Preferably, the thermally conductive connection comprises: the heat taking end of the heat taking device is closely attached to the CPU/heating element; or the heat taking end of the heat taking device is fixedly connected with the CPU/heating element through a heat taking bottom plate with a micro-groove group on the surface.
Preferably, a part of the pipe body of the first heat transfer pipe is bent towards the direction close to the first heat collector and is fixedly connected with the first heat collector through a heat collecting gland.
Preferably, the height of the heat dissipation fins is 5 mm-20 mm, the thickness of the heat dissipation fins is 0.5 mm-2.0 mm, and the distance between two adjacent heat dissipation fins is 1 mm-5 mm.
Preferably, the distribution area of the heat dissipation fins on the heat dissipation cover corresponds to the position of the coiling area of the first heat transfer pipe.
Preferably, the heat-radiating cover and the inner surface of the housing at the region not in contact with the heat transfer pipe are covered with a thermal insulating coating.
Preferably, the cabinet is filled with an inert gas.
Preferably, the CPU heat sink and the heat source heat sink are made of red copper or aluminum.
Preferably, heat conductive silicone grease is applied or filled at the connection position of each device.
The technical scheme provided by the invention at least has the following beneficial effects:
1. the invention changes the heat radiation mode, cancels the traditional active heat radiation components such as fan, water cooling and the like, utilizes the heat collector and the heat transfer pipe to transfer the heat from the CPU and other heating elements to the heat radiation cover and the shell, and then realizes natural heat radiation by the direct contact of the heat radiation fins on the heat radiation cover and the shell and the outside air, the whole heat radiation process can be realized by matching with a closed case structure, no extra power consumption exists, the problems existing in the existing active heat radiation device are solved, and the service life and the use safety of the computer are improved.
2. The invention adopts red copper or aluminum material with good heat conductivity to manufacture the CPU heat dissipation device and the heating source heat dissipation device, and simultaneously coats or fills heat-conducting silicone grease at the connecting position of each device, thereby being beneficial to improving the heat extraction and heat transfer efficiency in the case.
3. According to the invention, the surface of the heat dissipation cover is provided with a large number of fin structures, so that the contact area between the heat dissipation device and air is enlarged, the air convection heat exchange effect is enhanced, and the heat exchange efficiency is favorably improved; meanwhile, the heat-insulating coating is covered on the inner surfaces of the heat-radiating cover and the shell, which are not in contact with the heat-transfer pipe, and is used for isolating the radiated heat outside the case and preventing the heat from being transferred back to the gas in the case.
4. According to the invention, the case is vacuumized and then filled with inert gases such as helium, the temperature transmission speed in the closed case is effectively reduced by utilizing the characteristic of low heat conductivity of the inert gases, the mutual influence among electronic components with different heat productivity is avoided, and the stable operation of each component in the case is ensured; in addition, because the water vapor in the case is discharged together with the air, the freezing and frosting phenomena do not occur in the case under the cold working environment.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is an isometric view of a heat dissipation system in accordance with embodiment 1 of the present invention;
FIG. 2 is an exploded view of the heat dissipation system of FIG. 1;
FIG. 3 is an exploded view of the CPU heat sink of FIG. 2;
FIG. 4 is a cross-sectional view of the CPU heat sink of FIG. 2;
FIG. 5 is an exploded view of the heat-generating source heat sink of FIG. 2;
fig. 6 is a plan view of the heat-generating source heat sink of fig. 2;
in the figure: 01-computer mainboard, 1-shell, 2-CPU heat sink, 3-heat source heat sink, 21-first heat collector, 22-first heat transfer pipe, 23-heat dissipation cover, 231-heat dissipation fin, 24-heat collection gland, 25-heat collection bottom plate, 31-second heat collector, 32-second heat transfer pipe, and 33-heat transfer gland.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
referring to fig. 1 to 6, a heat dissipation system for passive heat dissipation of a computer includes a housing 1, a CPU heat dissipation device 2 and a heat source heat dissipation device 3, where the CPU heat dissipation device 2 includes a heat dissipation cover 23 having heat dissipation fins 231 on an outer surface thereof, and the heat dissipation cover 23 is connected with the housing 1 to form a totally enclosed chassis.
The CPU heat sink 2 further includes a first heat collector 21, a first heat transfer pipe 22, a heat collecting cover 24, and a heat collecting bottom plate 25 in the case. The heat taking bottom plate 25 is fixedly connected with a CPU on a computer mainboard 01, a microgroove group used for taking heat from the CPU is arranged on the surface of the heat taking bottom plate 25, heat conducting silicone grease is coated on the heat taking connecting position of the heat taking bottom plate and the heat taking connecting position, the heat taking end of the first heat taking device 21 is fixedly connected with the heat taking bottom plate 25, the first heat transfer pipe 22 is arranged on the inner surface of the heat radiating cover 23 in a winding mode, and the pipe body of the middle portion of the first heat transfer pipe 22 is bent towards the direction close to the first heat taking device 21 and is fixedly connected with the other end of the first heat taking device 21 through the heat taking pressing cover 24.
The cross section of each micro groove is rectangular, the width of each micro groove is 0.07-1.5 mm, the depth of each micro groove is 0.07-1.2 mm, and the distance between every two adjacent micro grooves is 0.2-2 mm. The micro-groove is internally packaged with a liquid heat transfer working medium with latent heat of vaporization, the liquid heat transfer working medium generates gas-liquid composite phase change in the micro-groove to generate bubbles, and heat is transferred through mutual exchange between gas and liquid.
A large number of parallel strip-shaped heat dissipation fins 231 are arranged on the heat dissipation cover 23, the height of each heat dissipation fin 231 is 5-20 mm, the thickness of each heat dissipation fin 231 is 0.5-2.0 mm, the distance between every two adjacent heat dissipation fins 231 is 1-5 mm, the number and the size of the fins are increased or decreased according to the heat dissipation power consumption required by a computer, the distribution areas of the fins correspond to the positions of the coiling areas of the first heat transfer pipes 22, so that heat is transferred more efficiently, and the areas, which are not in contact with the first heat transfer pipes, on the inner surface of the heat dissipation cover 23 are also covered with heat insulation coatings, so that heat return is avoided.
The first heat transfer pipe 22 and the heat dissipation cover 23 are welded or screwed, and heat conductive silicone grease with good thermal conductivity is coated between the first heat transfer pipe 22 and the heat dissipation cover 23, and heat is transferred from the first heat collector 21 to the heat dissipation cover 23 through the first heat transfer pipe 22, and then is naturally dissipated by the contact between the heat dissipation fins 231 and the air.
The heat source heat sink 3 is disposed in the casing and includes a second heat collector 31, a second heat transfer pipe 32, and a heat transfer gland 33. The heat-taking end of the second heat-taking device 31 is closely attached to the heating element 01 on the computer main board, and heat-conducting silicone grease with good heat conductivity is coated between the heat-taking end and the heating element 01, one end of the second heat-transfer pipe 32 and the pipe body near the end are embedded in the second heat-taking device 31, the remaining pipe body of the second heat-transfer pipe 32 penetrates out of the second heat-taking device 31 and then is closely attached to the inner surface of the shell 1, and the second heat-transfer pipe 32 is fixedly connected with the inner surface of the shell 1 through a heat-transferring gland 33.
Welding or screw fixing technology is adopted between the second heat transfer pipe 32 and the second heat collector 31, heat-conducting silicone grease with good heat conductivity is coated between the second heat transfer pipe 32 and the second heat collector 31 and between the second heat transfer pipe 32 and the inner surface of the shell 1, heat is transferred to the shell 1 from the second heat collector 31 through the second heat transfer pipe 32, and then the shell 1 is in contact with air to carry out natural heat dissipation. The inner surface of the housing 3 is also covered with a thermal barrier coating in the areas not in contact with the second heat transfer tubes to prevent heat transfer back.
In this embodiment, the CPU heat sink 2 and the heat source heat sink 3 are made of red copper or aluminum. In the production process, the assembled case is vacuumized, and then helium is introduced into the case.
The heat dissipation system provided by the invention is actually tested, and the specific process is as follows:
1) the heat dissipation system in embodiment 1 is assembled, wherein the CPU heat dissipation device 2 is connected to the CPU, and the heat source heat dissipation device 3 is connected to the north-south bridge;
2) placing the heat dissipation system in a test box, adjusting the environmental temperature in the test box to 40 ℃, and keeping the environmental temperature for 2 hours;
3) starting a computer in the test box, keeping the computer running at full load, and still maintaining the environmental temperature in the test box at 40 ℃;
4) after the computer runs for 2 hours, the test results are counted.
The tester finds that the computer adopting the heat dissipation system always keeps normal operation at the ambient temperature of 40 ℃, the heat generated by the CPU is taken out to the heat dissipation cover at the top of the case for heat dissipation, the core temperature of the CPU is kept at about 65-66 ℃, the requirement of the CPU on full load operation can be met, the heat generated by the north bridge and the south bridge is taken out to the shell for heat dissipation, the temperature of the north bridge and the south bridge is kept at about 64-65 ℃, and the operation requirement of the north bridge in the high-temperature ambient state of 40 ℃ can also be met.
The heat dissipation system provided by the invention realizes the passive heat dissipation of the computer, transfers the heat generated by electronic components of the computer to the whole case for heat dissipation, greatly improves the heat dissipation area contacted with air, and can keep the temperature of the closed environment in the computer to be controlled below 45 ℃, so that the components in the equipment cannot be damaged or burnt due to overhigh environment temperature.
The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and various modifications and changes may be made by those skilled in the art. Any improvement or equivalent replacement directly or indirectly applied to other related technical fields within the spirit and principle of the invention and the contents of the specification and the drawings of the invention shall be included in the protection scope of the invention.
Claims (9)
1. A heat dissipation system for passive heat dissipation of a computer is characterized by comprising a shell (1), a CPU heat dissipation device (2) and a heating source heat dissipation device (3), wherein the CPU heat dissipation device (2) comprises a heat dissipation cover (23) with heat dissipation fins (231) arranged on the outer surface, and the heat dissipation cover (23) is connected with the shell (1) to form a totally-enclosed case;
the CPU heat dissipation device (2) further comprises a first heat collector (21) and a first heat transfer pipe (22) which are positioned in the case, the first heat collector (21) is connected with a CPU on a computer mainboard in a heat conduction mode, and the first heat transfer pipe (22) is arranged on the inner surface of the heat dissipation cover (23) in a winding mode and is connected with the first heat collector (21);
the heat source heat dissipation device (3) is arranged in the case and comprises a second heat collector (31) and a second heat transfer pipe (32), the second heat collector (31) is connected with a heating element on the computer mainboard in a heat conduction mode, part of pipe bodies of the second heat transfer pipe (32) are arranged in the second heat collector (31), and the pipe bodies penetrate out of the second heat collector (31) and then are arranged on the inner surface of the shell (1) in a clinging mode.
2. The heat dissipation system for passive heat dissipation of computers of claim 1, wherein the thermally conductive connection comprises: the heat taking end of the heat taking device is closely attached to the CPU/heating element; or the heat taking end of the heat collector is fixedly connected with the CPU/heating element through a heat taking bottom plate (25) with a micro-groove group on the surface.
3. The heat dissipation system for passive heat dissipation of computers according to claim 2, wherein a portion of the tube body of the first heat transfer pipe (22) is bent toward the first heat collector (21) and is fixedly connected to the first heat collector (21) through a heat collecting cover (24).
4. The heat dissipation system for the passive heat dissipation of a computer according to claim 3, wherein the heat dissipation ribs (231) have a height of 5mm to 20mm and a thickness of 0.5mm to 2.0mm, and a distance between two adjacent heat dissipation ribs (231) is 1mm to 5 mm.
5. The heat dissipation system for the passive heat dissipation of a computer according to claim 4, wherein the distribution area of the heat dissipation fins (231) on the heat dissipation cover (23) corresponds to the position of the coiled area of the first heat transfer pipe (22).
6. The heat dissipation system for the passive heat dissipation of computers according to claim 5, characterized in that the areas on the inner surface of the heat dissipation cover (23) and the housing (3) that are not in contact with the heat transfer pipe are covered with a thermal barrier coating.
7. The heat dissipation system for the passive heat dissipation of a computer according to any one of claims 4 to 6, wherein an inert gas is filled in the case.
8. The heat dissipation system for the passive heat dissipation of computers of claim 7, wherein the CPU heat dissipation device (2) and the heat source heat dissipation device (3) are made of copper or aluminum.
9. The heat dissipation system for passive heat dissipation of computers of claim 8, wherein the connection locations of the devices are coated or filled with a thermally conductive silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010062927.3A CN111124090A (en) | 2020-01-19 | 2020-01-19 | Heat dissipation system for passive heat dissipation of computer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010062927.3A CN111124090A (en) | 2020-01-19 | 2020-01-19 | Heat dissipation system for passive heat dissipation of computer |
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| CN111124090A true CN111124090A (en) | 2020-05-08 |
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| CN202010062927.3A Pending CN111124090A (en) | 2020-01-19 | 2020-01-19 | Heat dissipation system for passive heat dissipation of computer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115864741A (en) * | 2023-03-01 | 2023-03-28 | 厚华(天津)动力科技有限公司 | Air-cooled hub motor of electric two-wheeled vehicle |
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2020
- 2020-01-19 CN CN202010062927.3A patent/CN111124090A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115864741A (en) * | 2023-03-01 | 2023-03-28 | 厚华(天津)动力科技有限公司 | Air-cooled hub motor of electric two-wheeled vehicle |
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