CN111315183B

CN111315183B - Heat conduction assembly for electronic component, refrigerating device and electronic equipment

Info

Publication number: CN111315183B
Application number: CN201811518722.0A
Authority: CN
Inventors: 周维; 袁乃华; 周瑞军
Original assignee: Chengdu TD Tech Ltd
Current assignee: Chengdu TD Tech Ltd
Priority date: 2018-12-12
Filing date: 2018-12-12
Publication date: 2022-02-01
Anticipated expiration: 2038-12-12
Also published as: CN111315183A

Abstract

The invention provides a heat conduction assembly for an electronic component, a refrigerating device and electronic equipment, and belongs to the heat dissipation technology of the electronic component. The heat conduction assembly comprises a heat conduction base, a floating heat conductor and a cover plate, wherein the cover plate is arranged at a first opening of a mounting groove of the heat conduction base, a flange at the lower part of the floating heat conductor is arranged at the lower side of the cover plate, when the floating heat conductor moves downwards under pressure, a gap between the floating heat conductor and the cover plate can be increased, the heat conduction material of a first heat conduction medium layer can flow to the gap between the floating heat conductor and the cover plate through the lower part of the floating heat conductor and the gap between side groove walls in the mounting groove, namely the gap between the floating heat conductor and the cover plate can contain part of heat conduction material, so that the overflow of the heat conduction material is avoided, and the pollution of the heat conduction material to electronic equipment and the loss of the heat conduction material are avoided.

Description

Heat conduction assembly for electronic component, refrigerating device and electronic equipment

Technical Field

The invention relates to a heat dissipation technology of an electronic component, in particular to a heat conduction assembly for the electronic component, a refrigeration device and electronic equipment.

Background

Electronic components such as chips, modules and components of electronic equipment such as computers can generate a lot of heat in the working process, and after the temperature of the electronic components is increased, the working performance of the electronic components can be reduced, and the service life of the electronic components can be shortened. Therefore, it is necessary to cool the electronic components during their operation and transfer the heat generated therein to the outside of the electronic components. The method for cooling the electronic component basically comprises the steps that the surface of the electronic component is contacted with one end of a heat conduction structure, the other end of the heat conduction structure is contacted with a cold end of a radiator or an equipment heat dissipation shell and the like, and the heat of the electronic component is transferred to the cold end through the heat conduction structure, so that the heat dissipation effect is achieved.

At present, most of heat conducting structures of electronic components are composed of rigid heat conductors and heat conducting media such as heat conducting pads, heat conducting silicone grease, heat conducting paste and the like. The rigid heat conductor is closely contacted with the electronic component, and in the heat conduction process, after the temperatures of the heat conduction structure and the electronic component are increased, extrusion force can be generated between the heat conduction structure and the electronic component due to the existence of thermal stress between the heat conduction structure and the electronic component, so that the electronic component is damaged; in addition, due to the fact that assembly tolerance causes overvoltage or undervoltage between the heat conducting structure of the device and the electronic component, the electronic component can be damaged after long-term use.

The floating heat conduction structure is used for solving the technical problems in the prior art, the heat conduction medium is filled between the floating heat conductor and the base, but in the moving process of the floating heat conductor, the heat conduction material is extruded by the heat conductor and then overflows from a gap between the floating heat conductor and the base, so that the pollution of electronic equipment and the loss of the heat conduction material are caused.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides a heat conduction assembly for an electronic component, a refrigerating device and electronic equipment.

The invention provides a heat conduction assembly for an electronic component, which comprises: the heat conduction base is provided with a mounting groove with a first opening, the floating heat conductor is slidably arranged in the mounting groove, an elastic piece is further abutted between the floating heat conductor and the mounting groove, the telescopic direction of the elastic piece is parallel to the sliding direction of the floating heat conductor, and a first gap is formed between the lower portion of the floating heat conductor, which deviates from the first opening, and a side groove wall in the mounting groove.

The mounting groove comprises a mounting groove and is characterized in that a cover plate is covered at a first opening of the mounting groove, the cover plate is provided with a cover plate opening through which the floating heat conductor can penetrate out towards the upper part of the first opening, the lower part of the floating heat conductor extends in the direction away from the central line of the floating heat conductor to form a flange, the flange is positioned at the lower side of the cover plate, a containing cavity is formed by the cover plate, the floating heat conductor and the groove wall of the mounting groove in a surrounding mode, a first heat-conducting medium layer is arranged in the containing cavity, and at least part of the first heat-conducting medium layer is positioned between the floating heat conductor and the groove wall of the mounting groove.

Further, a buffer channel is formed between the flange of the lower portion of the floating heat conductor and the lower surface of the cover plate.

Further, the mounting groove has an upper end facing the first opening, and a sidewall of the upper end of the mounting groove is recessed in a direction away from the mounting groove to form a support boss at the upper end of the mounting groove for supporting the cover plate.

Further, the cover plate is fixedly connected with the heat-conducting base through a plurality of fasteners.

Further, the elastic element comprises a spring, wherein the spring is sleeved on at least one fastener.

Furthermore, mounting holes are formed in the floating heat conductor and the mounting groove, and two ends of the elastic piece are respectively arranged in the mounting holes of the floating heat conductor and the mounting groove.

Furthermore, a second heat-conducting medium layer is arranged on the upper surface of the floating heat conductor.

The first heat-conducting medium layer further comprises at least one of a heat-conducting paste layer, a heat-conducting silicone grease layer and a heat-conducting silicone rubber layer.

The invention also provides a refrigerating device for the electronic component, which comprises a refrigerator and the heat conducting assembly; the heat conducting assembly is arranged at the cold end of the refrigerator.

The invention also provides electronic equipment which comprises the electronic component to be radiated and the refrigerating device, wherein the heat conducting assembly in the refrigerating device is arranged between the electronic component to be radiated and the cold end of the refrigerator of the refrigerating device.

The invention has the beneficial effects that: according to the heat conduction assembly for the electronic component, the refrigeration device and the electronic equipment, the cover plate is arranged at the first opening of the mounting groove, the flange at the lower part of the floating heat conductor is arranged at the lower side of the cover plate, when the floating heat conductor is pressed to move downwards, the gap between the floating heat conductor and the cover plate can be increased, the heat conduction material of the first heat conduction medium layer can flow to the gap between the floating heat conductor and the cover plate through the gap between the lower part of the floating heat conductor and the side groove wall in the mounting groove, namely the gap between the floating heat conductor and the cover plate can contain part of the heat conduction material, and therefore the pollution to the electronic equipment caused by overflow of the heat conduction material is avoided.

Drawings

Fig. 1 is a cross-sectional view of a heat conducting assembly for an electronic component according to one embodiment;

fig. 2 is a side view of a heat conducting assembly for an electronic component according to one embodiment;

fig. 3 is an exploded schematic view of a heat conducting assembly for an electronic component according to an embodiment.

Description of reference numerals: 1-a thermally conductive base; 2-a floating heat conductor; 21-a flange; 3-cover plate; 31-cover plate opening; 4-a second heat-conducting medium layer; 5-a fastener; 6-an elastic member; 7-a first heat conducting medium layer; 8-mounting grooves; 101-first gap out; 102-buffer channel.

With the above figures, certain embodiments of the invention have been illustrated and described in more detail below. The drawings and the description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate it by those skilled in the art with reference to specific embodiments.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.

All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

The terms "upper" and "lower" are used for describing relative positions of the structures in the drawings, and are only for the sake of clarity, but not for limiting the scope of the present invention, and the relative relationship changes or adjustments are also considered to be within the scope of the present invention without substantial technical changes.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In addition, in the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Example one

As shown in fig. 1 to 3, the heat conducting assembly for an electronic component according to the present embodiment includes: a heat conducting base 1 and a floating heat conductor 2. The heat conduction base 1 is provided with a mounting groove 8 with a first opening, the floating heat conductor 2 is slidably arranged in the mounting groove 8, an elastic part 6 is further arranged between the floating heat conductor 2 and the mounting groove 8 in a supporting manner, the expansion direction of the elastic part 6 is parallel to the sliding direction of the floating heat conductor 2, and a first gap 101 is formed between the lower part of the floating heat conductor 2 and a side groove wall in the mounting groove 8.

The first opening part of mounting groove 8 is covered and is equipped with apron 3, apron 3 is provided with the apron opening 31 that can supply the heat conductor 2 that floats to wear out towards first open-ended upper portion, the lower part of the heat conductor 2 that floats extends along the direction of keeping away from the central line of the heat conductor 2 that floats and forms flange 21, flange 21 is located the downside of apron, and apron 3, enclose jointly between the cell wall of the heat conductor 2 that floats and mounting groove 8 and become to accept the chamber, it is provided with first heat-conducting medium layer 7 in the chamber to accept, at least partial first heat-conducting medium layer 7 is located between the cell wall of the heat conductor 2 that floats and mounting groove 8.

The upper end of the heat conduction assembly is provided with an electronic component to be cooled, and the lower end of the heat conduction assembly can be used for being connected with the cold end of the refrigerator so as to transfer the heat of the electronic component to be cooled to the cold end of the refrigerator. Of course, the upper end of the heat conducting assembly can also be connected with the cold end of the refrigerator, and the lower end of the heat conducting assembly can be provided with the electronic component to be cooled so as to transfer the heat of the electronic component to be cooled to the cold end of the refrigerator. Of course, the connection between the heat conducting assembly and the electronic component and the refrigerator to be cooled is not particularly limited in this embodiment, as long as the heat conducting assembly can achieve the corresponding functions. In addition, regarding the connection mode of the heat conducting assembly, the electronic component and the refrigerator to be cooled, conventional settings in the field can be adopted, and details are not repeated here.

The structure, function and implementation process of the heat conduction assembly of the electronic component provided by this embodiment are exemplified below by taking the case that the upper end of the heat conduction assembly is provided with the electronic component to be cooled, and the lower end of the heat conduction assembly is connected with the cold end of the refrigerator.

Heat conduction base 1 can be for having certain thickness, and have good heat conductivity's rigid plate body or block, and heat conduction base 1 can be rectangle, circular, oval etc. and this embodiment does not specifically limit to heat conduction base 1's shape here, as long as can satisfy it can bear other parts of heat conduction subassembly and be favorable to the heat conduction heat can. The material of the heat conductive base 1 is generally a metal material with excellent heat conductive performance, such as copper or aluminum.

The heat conducting base 1 is provided with a mounting groove 8 with a first opening, and the mounting groove 8 is provided with a slidable floating heat conductor 2. Wherein, mounting groove 8 provides sufficient motion space for floating heat conductor 2, and first opening can supply floating heat conductor 2 to stretch out from mounting groove 8 to floating heat conductor 2 is connected with the electronic components who treats the heat dissipation.

The floating heat conductor 2 may be a cylinder, a cuboid or other shapes. The floating heat conductor 2 comprises an upper part and a lower part, the upper part of the floating heat conductor 2 being passable through the cover plate opening 31 of the cover plate 3. The lower part of the floating heat conductor 2 extends in a direction away from the centre line of the floating heat conductor 2 forming a flange 21.

In this embodiment, the flange is disposed at the lower portion of the floating heat conductor 2 and disposed at the lower side of the cover plate 3, so that the floating heat conductor 2 can be restricted from moving in the mounting groove 8, and the flange can be restricted in the mounting groove 8, thereby preventing the floating heat conductor 2 from sliding out of the mounting groove 8.

In addition, in the process that the floating heat conductor 2 moves downwards, the distance between the upper surface of the flange 21 and the cover plate 2 is increased, that is, the volume of the buffer channel 102 formed between the upper surface of the flange 21 and the lower surface of the cover plate 2 is increased, so that after the first heat-conducting medium layer 7 is subjected to the squeezing action, part of the heat-conducting material of the first heat-conducting medium layer 7 can flow to the buffer channel 102 from the first gap 101 between the lower part of the floating heat conductor 2 and the side groove wall in the mounting groove 8, and therefore, the heat-conducting material forming the first heat-conducting medium layer 7 is prevented from overflowing from the first opening of the mounting groove, and the pollution to electronic components is also avoided.

The material of the floating heat conductor 2 is generally a metal material with excellent heat conductivity, such as copper or aluminum. The floating heat conductor 2 itself needs a certain rigidity, which is advantageous for the transfer of pressure to achieve the close contact of the floating heat conducting assembly with the refrigerator and the electronic components. The floating heat conductor 2 is made of metal material with excellent heat conductivity, so that good force transfer and heat conduction among the heat conducting assembly, the refrigerator and the electronic component can be realized.

The cover plate 3 is a plate structure having a certain thickness and provided with a cover plate opening 31. As shown in fig. 2, the shape of the cover plate 3 may be square. Of course, the shape of the cover plate 3 of the present embodiment is not limited to this, for example, the cover plate 3 may also be provided in a circular shape, a triangular shape, or the like, as long as the cover plate 3 can realize the function that the cover plate 3 described in the present embodiment should have. When the floating heat conductor 2 compresses the elastic member 6 to the extreme position, the height of the cover plate 3 should be no greater than the height of the upper portion of the floating heat conductor 2 at that time so as not to interfere with the close fit of the upper portion of the floating heat conductor 2 to the surface of the electronic component.

The shape of the cover opening 31 should be the same as the shape of the upper part of the floating heat conductor 2, and the distance between the cover opening 31 and the upper part of the floating heat conductor 2 should not be too large, as long as the floating heat conductor 2 can slide up and down smoothly relative to the cover 3. Optionally, the upper portion of the floating thermal conductor 2 is sealably engaged with the cover plate opening 31 to further avoid spillage of the thermally conductive material.

In this embodiment, the size of the first opening of the mounting groove 8 may be adapted to the cover plate, at this time, a supporting boss for supporting the cover plate 3 may be formed on the groove wall of the upper end of the mounting groove 8, and the cover plate 3 is set up on the supporting boss of the mounting groove 8. The first opening of the mounting groove 8 may also be smaller than the cover plate 3, and at this time, the cover plate 3 may be directly placed on the heat conducting base 1, and the shape of the cover plate 3 may be adapted to the shape of the heat conducting base 1.

In order to further improve the installation reliability of the cover plate 3, the cover plate 3 can be tightly connected with the heat conducting base 1 by a fastener 5. Wherein, the cover plate 3 can be arranged in the first opening, and the shape of the first opening can be matched with the cover plate 3, so that the cover plate 3 is matched with the mounting groove 8. The fastening member 5 may be a screw, a stud, a bolt, or the like, as long as the heat conductive base 1 and the cover plate 3 can be fixed. Of course, the fixing manner of the heat conducting base 1 and the cover plate 3 is not limited thereto, and this embodiment is only illustrated here, for example, the heat conducting base 1 may also be connected with the cover plate 3 by means of clamping, screwing, interference fit, and the like.

In order to make the structure of the heat conducting assembly more compact, the flange of the floating heat conductor 1 may be provided with through holes, and the fasteners 5 may also pass through the through holes in the flange of the floating heat conductor 2. Furthermore, the fastening 5 also ensures that the floating heat conductor 2 moves only in its axial direction.

The cover plate opening 31 and the mounting groove 8, as well as the shape of the cross section of the heat conductor 2 in a direction perpendicular to its axial direction, can be adapted to further avoid leakage of the heat conductive material and facilitate smooth floating of the floating heat conductor 2.

The accommodating cavity defined by the cover plate 3, the floating heat conductor 2 and the wall of the mounting groove 8 together comprises a first gap 101, a buffer channel 102 and a second gap formed between the lower surface of the floating heat conductor 2 and the upper surface of the mounting groove 8. During the process of moving the floating heat conductor 2 up and down relative to the mounting groove 8, the minimum volume of the accommodating cavity should be larger than the volume of the heat conducting material used by the first heat conducting medium layer 7, for example, the volume of the heat conducting material used by the first heat conducting medium layer 7 may be less than or equal to 70% of the minimum volume. In order to avoid that the heat-conducting material escapes from the gap between the cover plate 3 and the floating heat conductor 2.

When the floating heat conduction assembly is used, the upper surface of the floating heat conductor 2 is attached to the surface of an electronic component to be radiated, and the lower surface of the heat conduction base 1 can be attached to the cold end of a refrigerator so as to transfer heat generated by the electronic component to the cold end of the refrigerator; the heat transfer sequence is that the electronic component, the floating heat conductor 2, the first heat conducting medium layer 7, the heat conducting base 1 and the cold end of the refrigerator are arranged in sequence. The heat conduction assembly of this embodiment has floating capacity and excellent heat-conduction ability, not only can solve because temperature stress and assembly tolerance lead to electronic components's damage problem, is favorable to the cooling effect of full play refrigerator moreover.

A second heat-conducting medium layer 4 can be further arranged on the upper surface of the floating heat conductor 2, the second heat-conducting medium layer 4 is attached to the surface of the electronic component to be radiated, and the lower surface of the heat-conducting base 1 is attached to the cold end of the electronic equipment; at this time, the order of heat transfer is the second heat conducting medium layer 4, the floating heat conductor 2, the first heat conducting medium layer 7, the heat conducting base 1 and the cold end of the refrigerator in sequence.

The second heat conducting medium layer 4 is made of a solid heat conducting material, has certain compressibility, and is generally made of a heat conducting pad which is mainly arranged on the surface of the heat conducting structure contacting with the electronic component. The second heat-conducting medium layer 4 is adhered to the upper surface of the floating heat conductor 2, and the second heat-conducting medium layer 4 has certain compressibility, so that the floating heat conductor 2 can be in closer contact with the surface of an electronic component, and heat generated by the electronic component can be transferred more favorably.

When the heat-conducting assembly is installed in an electronic device, the assembly tolerance between the second heat-conducting medium layer 4 and the electronic component can be compensated by compressing or extending the elastic member 6, so as to ensure that the floating heat conductor 2 is tightly attached to the electronic component to be cooled, and thus the heat-conducting effect is ensured; meanwhile, the elastic coefficient of the elastic member 6 should ensure that the electronic components are not mechanically damaged when the maximum compression amount is reached, so that the elongation, the elastic coefficient and the original length of the elastic member 6 are reasonably designed according to the range of assembly tolerance, the variation range of the distance between the heat-conducting base and the electronic components caused by temperature stress, the depth of the mounting groove 8, the height of the floating heat conductor 2 and other factors.

In this embodiment, after unsteady heat conductor 2 received electronic components's extrusion, unsteady heat conductor 2 passed through the extrusion force elastic component 6 with the transmission for heat conduction base 1 to make heat conduction base 1 and refrigerator in close contact with, also promptly, the heat conduction subassembly of this embodiment can keep in close contact with electronic components, refrigerator's cold junction all the time. After the heat conductor 2 that floats received electronic components's extrusion simultaneously, the heat conductor 2 extrusion elastic component 6 that floats for elastic component 6 takes place deformation, and the deformation through elastic component 6 comes the removal of buffering heat conductor 2 that floats or makes the motion of heat conductor 2 that floats more steady.

The heat conduction assembly for electronic components that this embodiment provided sets up apron 3 through the first opening part at mounting groove 8, and the flange setting of the heat conductor 2 lower part that floats is at apron 3 downside, when the heat conductor 2 pressurized downward movement that floats, the clearance between the heat conductor 2 that floats and apron 3 can increase, the heat conduction material of first heat conduction medium layer 7 can flow the clearance between the heat conductor 2 that floats and apron 3 through the lower part of the heat conductor 2 that floats with the clearance between the side slot wall in the mounting groove 8, also the clearance between heat conductor 2 that floats and the apron 3 can hold some heat conduction materials promptly to avoid the heat conduction material to spill over and cause the pollution to electronic equipment.

Alternatively, as shown in fig. 1, the mounting groove 8 has an upper end facing the first opening, and a side wall of the upper end of the mounting groove 8 is recessed in a direction away from the mounting groove to form a support boss at the upper end of the mounting groove 8 for supporting the cover plate. Wherein the cover plate 3 can be set up on the support boss.

Illustratively, after the cover plate 3 is fastened to the heat-conducting base 1 by the fasteners 5, the cover plate 3 may be pressed against the supporting bosses to further avoid the heat-conducting material from escaping between the cover plate and the heat-conducting base 1.

In some examples, at least one seal may be provided between the cover plate 3 and the support boss to further avoid the thermally conductive material from escaping between the cover plate 3 and the thermally conductive base 1. Optionally, as shown in fig. 1 to 3, the cover plate 3 is fastened and connected to the heat conducting base 1 by a plurality of fasteners 5, so as to ensure the connection reliability of the cover plate 3 and the heat conducting base 1. Illustratively, the plurality of fasteners 5 may be evenly distributed; for example, when the cover plate 3 is a rectangular plate body, the number of the fastening members 5 may be greater than or equal to 4, wherein 4 fastening members 4 may be respectively located at four top corners of the cover plate 3.

The elastic member 6 may comprise a spring, wherein the spring is sleeved on at least one of the fastening members 5. Therefore, the fastening piece 5 has a certain guiding function for the stretching movement of the spring, that is, the fastening piece 5 can guide the spring sleeved on the fastening piece to stretch along the axial direction so as to prevent the spring from deflecting along the axial direction. For example, when only one fastener is sleeved with a spring, the spring can be used in cooperation with the other elastic member 6, so that the floating heat conductor 2 stably moves along a direction parallel to the axial direction of the fastener 5; it is also possible to provide springs on all the fasteners 5 to keep the floating heat conductor 2 in balance when moving in a direction parallel to the axial direction of the fasteners 5.

Of course, the elastic element 6 may also comprise a rubber column which is arranged between the floating heat conductor 2 and the heat conducting base 1; at this time, the rubber column may also be disposed between the floating heat conductor 2 and the cover plate 3.

Alternatively, as shown in fig. 1 to 3, mounting holes are provided in the floating heat conductor 2 and the mounting groove 8, and both ends of the elastic member 6 are disposed in the mounting holes of the floating heat conductor 2 and the mounting groove 8.

For example, a blind hole communicating with the mounting groove may be provided on a lower groove wall of the mounting groove 8, and the lower end of the elastic member 6 may be fixed in the blind hole. In some examples, the lower surface of the floating thermal conductor 2 may be provided with a blind hole in which the upper end of the elastic member 6 may be fixed; in other examples, the floating heat conductor 2 is provided with a through hole through which the fastener 5 can pass, and the inner diameter of the lower portion of the through hole is larger than that of the upper portion of the through hole, so that a fixing surface can be formed at the junction of the upper portion and the lower portion of the through hole, and the upper end of the elastic member 6 can abut against the fixing surface.

Of course, the fixing manner of the elastic element 6 is not limited to this, and this embodiment is only illustrated here, and can be specifically configured according to actual needs.

Optionally, the first heat-conducting medium layer 7 includes at least one of a heat-conducting paste layer, a heat-conducting silicone grease layer, and a heat-conducting silicone rubber layer. That is, the material of the first heat-conducting medium layer 7 may be one of or any combination of heat-conducting paste, heat-conducting silicone grease, or heat-conducting silicone gel.

The heat conducting paste is commonly used for filling a gap between the electronic component and the refrigerator and conducting heat emitted by the electronic component to the refrigerator, so that the temperature of the electronic component can be kept at a stable level suitable for working, the electronic component is prevented from being damaged due to poor heat dissipation, and the purpose of prolonging the service life of the electronic component is achieved.

The heat-conducting silicone grease is a heat-conducting silicone grease-like compound prepared by taking organic silicone as a main material and adding metal oxide with excellent heat resistance, heat-conducting property and insulating property, and is commonly used for heat conduction and heat dissipation of electronic devices such as power amplifiers, transistors, electron tubes, CPUs and the like, so that the stability of the electrical properties of electronic instruments, meters and the like is ensured. The heat-conducting silicone grease has the advantages of wide use working temperature range of-50 ℃ to +250 ℃, heat resistance, no drying and no melting at high temperature.

The heat-conducting silica gel is a heat-conducting compound and a high-performance elastomer which cannot be solidified, has the characteristic of no electric conduction, and can avoid risks such as circuit short circuit and the like. Has excellent cold and hot alternation resistance, aging resistance and electrical insulation performance. The heat conducting silica gel can be continuously used at-60 to +280 ℃, the performance is maintained, the heat conducting silica gel does not swell, and the heat conducting silica gel has good adhesion to most of metal and non-metal materials of electronic components.

When the first heat-conducting medium layer 7 is made of the above materials, the bottom of the first groove 7 and the coated surface of the flange 21 of the floating heat conductor 2 need to be cleaned to be free of impurities, and the upper surface of the first groove 7 and the coated surface of the first heat conductor 21 can be cleaned by using a high-purity solvent such as high-purity isoamyl alcohol or acetone and lint-free cloth such as cloth for wiping a lens; in the using process, if a small amount of air is entrained in the heat conducting material, the air in the bubbles can be exhausted by a standing, pressurizing or vacuum method; the key to the application of the heat conducting material is to be uniform, bubble-free, impurity-free, as thin as possible. When the heat conduction material is used, if air is doped in the heat conduction material, the heat conduction effect of the heat conduction material can be greatly reduced.

In heat dissipation and conduction applications, even two flat surfaces with very clean surfaces will have voids when they are in contact with each other, and the air in these voids is a poor conductor of heat and impedes the conduction of heat to the refrigerator. The gap of the filling contact surface that above-mentioned material that first heat conduction medium layer 7 chose for use can be fine extrudes the contact surface with the air, has had the replenishment of above-mentioned heat conduction material, can make the better abundant contact of contact surface, can reach the difference in temperature as little as possible in the change on the temperature, makes thermal conduction more smooth and easy rapid.

For a common bottom surface of a heat sink, the thickness of the first heat-conducting medium layer 7 is about the thickness of one piece of common paper, i.e., 0.003-0.005 inches, and if the bottom surface of the heat sink is bright and flat, the heat-dissipating paste can be thin to be translucent. When the material selected for the first heat-conducting medium layer 7 is used, the more the material is, the better the material is, the thinner the material is, the better the material is, the more the material is, the heat-conducting efficiency is affected.

Example two

The embodiment provides a refrigeration device for electronic components, which comprises a refrigerator and the heat conducting assembly described in the above embodiment; the heat conduction assembly is arranged on the refrigerator, and the cold end of the refrigerator is attached to the end face of the heat conduction base 1 or the floating heat conductor 2 of the heat conduction assembly.

The structure, function and implementation process of the heat conducting assembly are the same as those of the foregoing embodiments, and are not described herein again.

There are many kinds of refrigerators, and this embodiment will be described with a semiconductor refrigerator as an example.

The semiconductor refrigerator is formed by connecting two different metals by a conductor, and when direct current is switched on, the temperature of one joint is reduced, and the temperature of the other joint is increased. If the power supply is reversed, the temperature at the junction will change inversely. The principle of operation is the peltier effect, or the thermo-electric effect. The thermo-electric effect of pure metal is generally small, and is much larger if one N-type semiconductor and one P-type semiconductor are used for replacing the pure metal.

After the power supply is switched on, electron-hole pairs are generated near the cold end of the semiconductor refrigerator, the internal energy is reduced, the temperature is reduced, and heat is absorbed to the outside. The heat end of the semiconductor refrigerator increases internal energy due to electron-hole pair recombination, increases temperature, and releases heat to the environment.

Because the temperature difference and the cold energy generated by a pair of semiconductor thermoelectric elements are very small, the semiconductor refrigerator is a thermopile formed by combining a plurality of pairs of thermoelectric elements in parallel and series. The single-stage thermopile can obtain a temperature difference of about 60 ℃, namely the temperature of the cold end can reach-10 to-20 ℃. The temperature difference at two ends can be increased by increasing the number of stages of the thermopile, so that the number of stages of the thermopile is generally 2-3. Semiconductor refrigerators are mainly used for cooling some components in electronic equipment and radio communication equipment; some are also used in domestic refrigerators.

Therefore, if the heat conducting assembly described in the foregoing embodiment is directly installed at the cold end of the original refrigerator to improve the existing refrigerator, the refrigeration function of the refrigerator can be better realized without the need to find a heat conducting assembly matching with a different type of refrigerator to match with the refrigerator, and the refrigerator also has all the advantages of this embodiment.

EXAMPLE III

The embodiment provides an electronic device, which comprises an electronic component to be cooled and a refrigerating device in the foregoing embodiment.

The structure, function and implementation process of the refrigeration device are the same as those of the foregoing embodiments, and are not described herein again.

And the cold end of the refrigerator is attached to the surface of the electronic component to be cooled through the heat conduction assembly. The electronic equipment can be a computer, a mobile phone or other electronic equipment with electronic components which need to be cooled during work.

In the working process of electronic equipment such as mobile phones and computers used in daily life, electronic components such as CPUs generally generate a large amount of heat due to long-time use or running of programs with large power consumption during use. If heat accumulates, the performance of the equipment may be reduced, and the service life of the equipment may be shortened, so that these electronic equipment may not be separated from the cooling device during operation. The refrigeration device provided by the foregoing embodiment and including the heat conducting component is directly used for the electronic equipment, and has a positive effect on improving the overall performance of the electronic equipment.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A thermally conductive assembly for an electronic component, comprising:

the heat conduction device comprises a heat conduction base (1) and a floating heat conductor (2), wherein the heat conduction base (1) is provided with a mounting groove (8) with a first opening, the floating heat conductor (2) can be arranged in the mounting groove (8) in a vertically sliding manner, an elastic piece (6) is further arranged between the floating heat conductor (2) and the mounting groove (8) in a propping manner, the telescopic direction of the elastic piece (6) is parallel to the sliding direction of the floating heat conductor (2), and a first gap (101) is formed between the lower part of the floating heat conductor (2) departing from the first opening and a side groove wall in the mounting groove (8);

a cover plate (3) is covered at a first opening of the mounting groove (8), a cover plate opening (31) through which the floating heat conductor (2) can penetrate towards the upper part of the first opening is formed in the cover plate (3), the lower part of the floating heat conductor (2) extends in the direction away from the central line of the floating heat conductor (2) to form a flange (21), the flange (21) is positioned at the lower side of the cover plate, accommodating cavities are formed by the cover plate (3), the floating heat conductor (2) and the groove wall of the mounting groove (8) in a surrounding mode, a first heat-conducting medium layer (7) is arranged in the accommodating cavity, and at least part of the first heat-conducting medium layer (7) is positioned between the floating heat conductor (2) and the groove wall of the mounting groove (8); in the process that the floating heat conductor (2) slides up and down relative to the mounting groove (8), the minimum volume of the accommodating cavity is larger than the volume of the heat conduction material used by the first heat conduction medium layer (7); the first heat-conducting medium layer (7) comprises at least one of a heat-conducting paste layer, a heat-conducting silicone grease layer and a heat-conducting silicone rubber layer.

2. A heat conductive assembly for electronic components as claimed in claim 1, wherein:

a buffer channel (102) is formed between the flange (21) at the lower part of the floating heat conductor (2) and the lower surface of the cover plate (3).

3. A heat conductive assembly for electronic components as claimed in claim 1, wherein:

the mounting groove (8) has an upper end facing the first opening, and a sidewall of the upper end of the mounting groove (8) is recessed in a direction away from the mounting groove to form a support boss at the upper end of the mounting groove for supporting the cover plate.

4. A heat conductive assembly for electronic components as claimed in claim 1, wherein:

the cover plate (3) is fixedly connected with the heat conduction base (1) through a plurality of fasteners (5).

5. A heat conductive assembly for electronic components as claimed in claim 4, wherein:

the elastic piece (6) comprises a spring, wherein the spring is sleeved on at least one fastener (5).

6. A heat conductive assembly for electronic components as claimed in claim 1, wherein:

mounting holes are formed in the floating heat conductor (2) and the mounting groove (8), and two ends of the elastic piece are respectively arranged in the mounting holes of the floating heat conductor (2) and the mounting groove (8).

7. A heat conductive assembly for electronic components as claimed in claim 1, wherein:

and a second heat-conducting medium layer (4) is arranged on the upper surface of the floating heat conductor (2).

8. A refrigerating plant for electronic components which characterized in that:

comprising a refrigerator and a heat conducting assembly as claimed in any one of claims 1 to 7; the heat conducting assembly is arranged at the cold end of the refrigerator.

9. An electronic device, characterized in that:

comprising an electronic component to be cooled and a refrigerating device as claimed in claim 8, the heat-conducting assembly in the refrigerating device being arranged between the electronic component to be cooled and a cold end of the refrigerator of the refrigerating device.