CN217064420U - Heat dissipation assembly and terminal equipment - Google Patents
Heat dissipation assembly and terminal equipment Download PDFInfo
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- CN217064420U CN217064420U CN202220677157.8U CN202220677157U CN217064420U CN 217064420 U CN217064420 U CN 217064420U CN 202220677157 U CN202220677157 U CN 202220677157U CN 217064420 U CN217064420 U CN 217064420U
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Abstract
The utility model provides a radiator unit and terminal equipment, wherein, radiator unit includes: one end of the heat conducting piece is connected with the heat source, and the other end of the heat conducting piece is connected with the cold area; the first semiconductor is arranged on one side of the heat conducting piece, one end of the first semiconductor is connected with the heat source, and the other end of the first semiconductor is connected with the cold area; the second semiconductor, the second semiconductor sets up the one side of keeping away from first semiconductor at the heat-conducting piece, and the one end of second semiconductor links to each other with the heat source, and the other end of second semiconductor links to each other with the cold district, and the conductivity type of first semiconductor and second semiconductor is opposite, and first semiconductor links to each other with the second semiconductor electrical property, the utility model discloses compare with the correlation technique and have the advantage to be: the heat dissipation mode that heat energy is converted to electric energy and is utilized is realized, the overall heat dissipation efficiency of the terminal equipment is effectively improved, the overall temperature of the terminal equipment is prevented from being too high, and the terminal equipment is enabled to always keep high-performance operation.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a radiator unit and terminal equipment.
Background
When the terminal equipment is used in each application scene, if the heat dissipation is not timely, the temperature of the terminal equipment is easily overhigh, the heat output can be reduced only by the modes of reducing the frequency, reducing the voltage and the like and sacrificing the performance, and the user experience is seriously influenced.
Disclosure of Invention
The present invention aims at solving at least one of the technical problems in the related art to a certain extent.
Therefore, the utility model aims to provide a radiator unit and terminal equipment.
To achieve the above object, the present invention provides in a first aspect a heat dissipation assembly, including: one end of the heat conducting piece is connected with a heat source, and the other end of the heat conducting piece is connected with a cold area; the first semiconductor is arranged on one side of the heat conducting piece, one end of the first semiconductor is connected with the heat source, and the other end of the first semiconductor is connected with the cold area; the second semiconductor is arranged on one side, far away from the first semiconductor, of the heat conducting piece, one end of the second semiconductor is connected with the heat source, the other end of the second semiconductor is connected with the cold area, the conductivity types of the first semiconductor and the second semiconductor are opposite, and the first semiconductor is electrically connected with the second semiconductor.
The heat conduction member includes: one end of the vacuum cavity soaking plate is connected with the heat source, the other end of the vacuum cavity soaking plate is connected with the cold area, the first semiconductor is arranged on one side of the vacuum cavity soaking plate, and the second semiconductor is arranged on one side, far away from the first semiconductor, of the vacuum cavity soaking plate.
The heat conductive member further includes: the first glue layer is arranged on one side of the vacuum cavity soaking plate, and the first semiconductor is arranged on one side, far away from the vacuum cavity soaking plate, of the first glue layer; the second glue layer is arranged on one side, away from the first glue layer, of the vacuum cavity vapor chamber, and the second semiconductor is arranged on one side, away from the vacuum cavity vapor chamber, of the second glue layer.
The heat dissipation assembly further includes: graphene layer, graphene layer sets up heat-conducting piece first semiconductor with the second semiconductor is kept away from the one end in cold district, graphene layer keeps away from the one end in cold district with the heat source links to each other.
The heat dissipation assembly further includes: the third glue film, the third glue film sets up graphite alkene layer is kept away from the one end in cold district, the third glue film is kept away from the one end in cold district with the heat source links to each other.
The heat dissipation assembly further includes: and the input end of the load is electrically connected with the first semiconductor and the second semiconductor respectively.
The heat dissipation assembly further includes: the flexible circuit board is electrically connected with the first semiconductor and the second semiconductor respectively, the output end of the flexible circuit board is electrically connected with the input end of the load, the first semiconductor is electrically connected with the second semiconductor through the flexible circuit board, and the input end of the load is electrically connected with the first semiconductor and the second semiconductor through the flexible circuit board respectively.
The heat dissipation assembly further includes: and the input end of the capacitor boosting circuit is electrically connected with the output end of the flexible circuit board, and the output end of the capacitor boosting circuit is electrically connected with the input end of the load.
The load includes: and the input end of the battery is electrically connected with the output end of the capacitor boosting circuit.
The utility model discloses the second aspect provides a terminal equipment, include: center, heat source, cold district and if the utility model discloses the radiator unit that the first aspect provided, the heat-conducting piece sets up on the center.
The heat source includes: and one ends of the heat conducting piece, the first semiconductor and the second semiconductor, which are far away from the cold area, are connected with the outer surface of the central processing unit.
After the technical scheme is adopted, compared with the correlation technique, the utility model the advantage that has is:
the heat conducting piece transfers the heat at the heat source to the cold area, so that the heat dissipation at the heat source is realized, and the problem of local overheating of the terminal equipment is avoided;
because the temperature difference exists between the heat source and the cold area, electric energy is generated between the first semiconductor and the second semiconductor based on the Seebeck effect, so that a heat dissipation mode that heat energy is converted into electric energy and utilized is realized, the overall heat dissipation efficiency of the terminal equipment is effectively improved, the overall temperature of the terminal equipment is prevented from being too high, and the terminal equipment is enabled to always keep high-performance operation.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention;
as shown in the figure: 1. the device comprises a vapor chamber, a second semiconductor, a load, a first glue layer, a second glue layer, a load, a second glue layer, a graphene layer, a third glue layer, a flexible circuit board, a capacitor boosting circuit, a vapor chamber 2, a first semiconductor, a second semiconductor, a load, a first glue layer, a second glue layer, a graphene layer, a third glue layer, a flexible circuit board 10 and a capacitor boosting circuit.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
In a related embodiment, the terminal device includes a heat conductive member, a heat source, and a cold area, one end of the heat conductive member being connected to the heat source, and the other end of the heat conductive member being connected to the cold area.
It can be understood that the heat-conducting member transfers heat at the heat source to the cold area, and then the heat at the cold area is transferred out by air, thereby achieving heat dissipation at the heat source of the terminal device.
It should be noted that the heat conducting member is used for heat transfer, and is made of a material with a high thermal conductivity, such as: graphite flake, thermally conductive gel, vacuum Chamber Vapor Chamber (VC), and the like.
The heat dissipation mode transfers the heat at the heat source to other parts of the terminal equipment, and finally dissipates the heat through air, the heat conductivity coefficient of the air is about 0.024W/m.K, which is far lower than that of other materials, and the heat dissipation effect is poor, so that the mode can only avoid local overheating of the terminal equipment, and cannot effectively reduce the overall heat of the terminal equipment.
In related embodiments, the terminal device further dissipates heat through the external radiator, and although the external radiator can effectively solve the heat dissipation problem of the terminal device, the terminal device is inconvenient to carry and needs to be connected with a charger, so that user experience is poor.
In order to solve the above technical problem, as shown in fig. 1, an embodiment of the present invention provides a heat dissipation assembly, including a heat conduction member, first semiconductor 2 and second semiconductor 3, the one end of heat conduction member links to each other with the heat source, the other end of heat conduction member links to each other with the cold district, first semiconductor 2 sets up the one side at the heat conduction member, first semiconductor 2's one end links to each other with the heat source, first semiconductor 2's the other end links to each other with the cold district, second semiconductor 3 sets up the one side of keeping away from first semiconductor 2 at the heat conduction member, second semiconductor 3's one end links to each other with the heat source, second semiconductor 3's the other end links to each other with the cold district, first semiconductor 2 is opposite with second semiconductor 3's electrically conductive type, first semiconductor 2 links to each other with second semiconductor 3 electrical property.
It can be understood that the heat-conducting piece transfers the heat at the heat source to the cold area, thereby realizing the heat dissipation at the heat source and avoiding the local overheating problem of the terminal equipment;
because the temperature difference exists between the heat source and the cold area, electric energy is generated between the first semiconductor 2 and the second semiconductor 3 based on the Seebeck effect, so that a heat dissipation mode that heat energy is converted into electric energy and utilized is realized, the overall heat dissipation efficiency of the terminal equipment is effectively improved, the overall temperature of the terminal equipment is prevented from being too high, and the terminal equipment is enabled to always keep high-performance operation.
The seebeck effect is also referred to as a first thermoelectric effect, and refers to a thermoelectric phenomenon in which a voltage difference between two substances is caused by a temperature difference between two different semiconductors.
The first semiconductor 2 may be an N-type semiconductor and the second semiconductor 3 may be a P-type semiconductor, and conversely, as shown in fig. 2, in some embodiments, the first semiconductor 2 may be a P-type semiconductor and the second semiconductor 3 may be an N-type semiconductor.
It should be noted that the heat conduction member is used for heat conduction between the heat source and the cold area, and the heat conduction member should be made of a material with high heat conduction efficiency, such as: vapor chamber, graphite sheet, etc.
As shown in fig. 1, in some embodiments, the heat conductive member includes a vacuum chamber vapor chamber 1, one end of the vacuum chamber vapor chamber 1 is connected to a heat source, the other end of the vacuum chamber vapor chamber 1 is connected to a cold zone, the first semiconductor 2 is disposed on one side of the vacuum chamber vapor chamber 1, and the second semiconductor 3 is disposed on one side of the vacuum chamber vapor chamber 1 remote from the first semiconductor 2.
It can be understood that the heat at the heat source can be quickly transferred to the cold zone by utilizing the higher heat conduction efficiency of the vapor chamber 1, so that the heat dissipation efficiency of the terminal equipment is improved; moreover, the temperature of the first semiconductor 2 and the second semiconductor 3 can be kept constant within a certain range by utilizing the uniformity of the temperature on the vapor chamber 1, so that the problem of damage to a heat source device caused by an overlarge temperature difference between the first semiconductor 2 and the second semiconductor 3 can be avoided, and the problem of influence on the service life caused by overlong time for contacting the heat source of the first semiconductor 2 and the second semiconductor 3 can also be avoided.
The vacuum chamber vapor chamber 1 is used only for heat transfer, and does not conduct current to the first semiconductor 2 and the second semiconductor 3, and therefore an insulating layer needs to be provided between the vacuum chamber vapor chamber 1 and the first semiconductor 2 and the second semiconductor 3.
As shown in fig. 3, in some embodiments, the heat conducting member further includes a first glue layer 5 and a second glue layer 6, the first glue layer 5 is disposed on one side of the vacuum chamber soaking plate 1, the first semiconductor 2 is disposed on one side of the first glue layer 5 away from the vacuum chamber soaking plate 1, the second glue layer 6 is disposed on one side of the vacuum chamber soaking plate 1 away from the first glue layer 5, and the second semiconductor 3 is disposed on one side of the second glue layer 6 away from the vacuum chamber soaking plate 1.
It can be understood that, through the arrangement of the first glue layer 5 and the second glue layer 6, not only the bonding of the first semiconductor 2 and the second semiconductor 3 with the vacuum chamber vapor chamber 1 can be realized, but also the insulation effect can be achieved, and the influence of the vacuum chamber vapor chamber 1 on the electric connection between the first semiconductor 2 and the second semiconductor 3 is avoided.
It should be noted that the first adhesive layer 5 and the second adhesive layer 6 are both made of a high thermal conductivity and insulating adhesive material, such as: thermally conductive gels, and the like.
As shown in fig. 4, in some embodiments, the heat dissipation assembly further includes a graphene layer 7, the graphene layer 7 is disposed at an end of the heat conducting member, the first semiconductor 2 and the second semiconductor 3 away from the cold area, and an end of the graphene layer 7 away from the cold area is connected to a heat source.
It can be understood that, by using the higher thermal conductivity coefficient of the graphene layer 7, not only the heat on the heat source can be rapidly transferred to the heat conducting member to improve the heat dissipation efficiency of the terminal device, but also the heat on the heat source can be rapidly transferred to the first semiconductor 2 and the second semiconductor 3 to make the temperature difference larger and the converted potential difference larger, thereby further improving the heat dissipation efficiency of the terminal device.
In some embodiments, the graphene material is sequentially coated on the heat conducting member, the first semiconductor 2 and the second semiconductor 3 at the end away from the cold zone to form the graphene layer 7.
Since the graphene layer 7 is used only for heat transfer and does not conduct current to a heat source, an insulating layer needs to be provided between the graphene layer 7 and the heat source.
As shown in fig. 4, in some embodiments, the heat dissipation assembly further includes a third adhesive layer 8, where the third adhesive layer 8 is disposed at an end of the graphene layer 7 away from the cold area, and an end of the third adhesive layer 8 away from the cold area is connected to the heat source.
It can be understood that, through the setting of third glue film 8, not only can realize the bonding of graphite alkene layer 7 and heat source, but also can play insulating effect, avoid the heat source to influence the electric connection between first semiconductor 2 and the second semiconductor 3.
It should be noted that the third adhesive layer 8 is made of a material with high thermal conductivity and insulation, such as: thermally conductive gels, and the like.
As shown in fig. 5, in some embodiments, the heat dissipation assembly further includes a load 4, and the input terminal of the load 4 is electrically connected to the first semiconductor 2 and the second semiconductor 3, respectively.
It can be understood that, through the arrangement of the load 4, the heat at the heat source is converted into the electric energy and then utilized, so that the external electric energy consumed by the terminal equipment is reduced, and the performance of the terminal equipment is effectively improved.
As shown in fig. 5, in some embodiments, the heat dissipation assembly further includes a Flexible Printed Circuit (FPC) 9, the FPC 9 is electrically connected to the first semiconductor 2 and the second semiconductor 3 respectively, an output terminal of the FPC 9 is electrically connected to an input terminal of the load 4, the first semiconductor 2 and the second semiconductor 3 are electrically connected through the FPC 9, and an input terminal of the load 4 is electrically connected to the first semiconductor 2 and the second semiconductor 3 through the FPC 9 respectively.
It can be understood that the first semiconductor 2 and the second semiconductor 3 are connected through the flexible circuit board 9, so that the formation of the electric energy is ensured, and the electric energy generated between the first semiconductor 2 and the second semiconductor 3 is output to the load 4 through the flexible circuit board 9, so that the utilization of the electric energy is ensured. Therefore, through the arrangement of the flexible circuit board 9, a heat dissipation circuit of the heat dissipation assembly is formed, and the heat energy is converted into the electric energy and is utilized to realize the heat dissipation mode.
As shown in fig. 5, in some embodiments, the heat dissipation assembly further includes a capacitor voltage boosting circuit 10, an input terminal of the capacitor voltage boosting circuit 10 is electrically connected to an output terminal of the flexible circuit board 9, and an output terminal of the capacitor voltage boosting circuit 10 is electrically connected to an input terminal of the load 4.
It can be understood that, through the arrangement of the capacitor boosting circuit 10, the electric energy generated between the first semiconductor 2 and the second semiconductor 3 can be stably output to the load 4, and the reuse of the converted heat energy to the electric energy is ensured.
In some embodiments, the capacitance boosting circuit 10 is disposed on a motherboard of the terminal device.
In some embodiments, capacitor boosting circuit 10 employs a DC (Direct Current) -DC boost chip, which may operate at a voltage ranging from 50mV to 3V, and an output of 3V to 4.4V.
In some embodiments, load 4 comprises a battery having an input electrically connected to the output of capacitor boosting circuit 10.
It will be appreciated that the thermal energy of the heat source is converted to electrical energy and stored in the battery, allowing greater flexibility in the use of electrical energy.
In some embodiments, the battery may be a lithium battery, a lead storage battery, or the like.
It should be noted that the load 4 may also be other devices of the terminal equipment, and it is understood that the heat energy of the heat source is directly used by other devices of the terminal equipment after being converted into the electric energy.
The embodiment of the utility model provides a still provide a terminal equipment, include: the heat-conducting piece is arranged on the middle frame.
The heat-conducting piece transfers heat at the heat source to the cold area, so that heat dissipation at the heat source is realized, and the problem of local overheating of terminal equipment is avoided;
because the temperature difference exists between the heat source and the cold area, electric energy is generated between the first semiconductor 2 and the second semiconductor 3 based on the Seebeck effect, so that a heat dissipation mode that heat energy is converted into electric energy and utilized is realized, the overall heat dissipation efficiency of the terminal equipment is effectively improved, the overall temperature of the terminal equipment is prevented from being too high, and the terminal equipment is enabled to always keep high-performance operation.
In some embodiments, the terminal device may be a cell phone, a tablet, a wearable device, or the like.
In some embodiments, the cold zone may be an edge region of the terminal device or may be a bottom region of the terminal device.
In some embodiments, the heat source includes a Central Processing Unit (CPU), and the ends of the heat-conducting member, the first semiconductor 2 and the second semiconductor 3 away from the cold area are connected to an outer surface of the CPU.
It can be understood that the central processing unit of the terminal device is radiated by the radiating assembly, the temperature of the central processing unit is prevented from being too high, and the high-performance operation of the central processing unit is ensured.
It should be noted that the heat source may also be other components of the terminal device, such as: power amplifiers, and the like.
It should be noted that, in the description of the present invention, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps in the process, and alternate implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (11)
1. A heat sink assembly, comprising:
one end of the heat conducting piece is connected with a heat source, and the other end of the heat conducting piece is connected with a cold area;
the first semiconductor is arranged on one side of the heat conducting piece, one end of the first semiconductor is connected with the heat source, and the other end of the first semiconductor is connected with the cold area;
the second semiconductor is arranged on one side, far away from the first semiconductor, of the heat conducting piece, one end of the second semiconductor is connected with the heat source, the other end of the second semiconductor is connected with the cold area, the conductivity types of the first semiconductor and the second semiconductor are opposite, and the first semiconductor is electrically connected with the second semiconductor.
2. The heat dissipation assembly of claim 1, wherein the thermally conductive member comprises:
one end of the vacuum cavity soaking plate is connected with the heat source, the other end of the vacuum cavity soaking plate is connected with the cold area, the first semiconductor is arranged on one side of the vacuum cavity soaking plate, and the second semiconductor is arranged on one side, far away from the first semiconductor, of the vacuum cavity soaking plate.
3. The heat dissipation assembly of claim 2, wherein the heat conductive member further comprises:
the first glue layer is arranged on one side of the vacuum cavity vapor chamber, and the first semiconductor is arranged on one side, far away from the vacuum cavity vapor chamber, of the first glue layer;
the second glue layer is arranged on one side, away from the first glue layer, of the vacuum cavity vapor chamber, and the second semiconductor is arranged on one side, away from the vacuum cavity vapor chamber, of the second glue layer.
4. The heat dissipation assembly of claim 1, further comprising:
graphene layer, graphene layer sets up heat-conducting piece first semiconductor with the second semiconductor is kept away from the one end in cold district, graphene layer keeps away from the one end in cold district with the heat source links to each other.
5. The heat dissipation assembly of claim 4, further comprising:
the third glue film, the third glue film sets up graphite alkene layer is kept away from the one end in cold district, the third glue film is kept away from the one end in cold district with the heat source links to each other.
6. The heat dissipation assembly of claim 1, further comprising:
and the input end of the load is electrically connected with the first semiconductor and the second semiconductor respectively.
7. The heat dissipation assembly of claim 6, further comprising:
the flexible circuit board is electrically connected with the first semiconductor and the second semiconductor respectively, the output end of the flexible circuit board is electrically connected with the input end of the load, the first semiconductor is electrically connected with the second semiconductor through the flexible circuit board, and the input end of the load is electrically connected with the first semiconductor and the second semiconductor through the flexible circuit board respectively.
8. The heat dissipation assembly of claim 7, further comprising:
and the input end of the capacitor boosting circuit is electrically connected with the output end of the flexible circuit board, and the output end of the capacitor boosting circuit is electrically connected with the input end of the load.
9. The heat dissipation assembly of claim 8, wherein the load comprises:
and the input end of the battery is electrically connected with the output end of the capacitor boosting circuit.
10. A terminal device, comprising: a middle frame, a heat source, a cold zone, and the heat dissipating assembly of any one of claims 1-9, the thermal conductor member being disposed on the middle frame.
11. The terminal device of claim 10, wherein the heat source comprises:
and one ends of the heat conducting piece, the first semiconductor and the second semiconductor, which are far away from the cold area, are connected with the outer surface of the central processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220677157.8U CN217064420U (en) | 2022-03-24 | 2022-03-24 | Heat dissipation assembly and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220677157.8U CN217064420U (en) | 2022-03-24 | 2022-03-24 | Heat dissipation assembly and terminal equipment |
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| Publication Number | Publication Date |
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| CN217064420U true CN217064420U (en) | 2022-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220677157.8U Active CN217064420U (en) | 2022-03-24 | 2022-03-24 | Heat dissipation assembly and terminal equipment |
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| CN (1) | CN217064420U (en) |
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- 2022-03-24 CN CN202220677157.8U patent/CN217064420U/en active Active
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