CN110567304A - Thin capillary structure supporting temperature equalizing plate - Google Patents
Thin capillary structure supporting temperature equalizing plate Download PDFInfo
- Publication number
- CN110567304A CN110567304A CN201910975856.3A CN201910975856A CN110567304A CN 110567304 A CN110567304 A CN 110567304A CN 201910975856 A CN201910975856 A CN 201910975856A CN 110567304 A CN110567304 A CN 110567304A
- Authority
- CN
- China
- Prior art keywords
- capillary
- support structure
- cover plate
- plate
- convex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 238000005245 sintering Methods 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 22
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
the invention provides a thin type temperature-equalizing plate supported by a capillary structure, which enables the capillary structure in an inner cavity of the temperature-equalizing plate to have the function of a supporting force structure while being used as a phase-change medium capillary force structure of the temperature-equalizing plate, and improves the heat conduction capability and the heat dissipation efficiency of the temperature-equalizing plate. The improved structure of the novel capillary support structure comprises a first cover plate and a second cover plate, wherein an upward convex cavity is arranged in the center area of the first cover plate, the second cover plate is of a flat plate structure, the outer frame of the first flat plate is covered in the peripheral area of the second cover plate, the novel capillary support structure further comprises a capillary support structure, a plurality of convex support parts are arranged on one surface of the whole plane surface area of the capillary support structure, the capillary support structure is located in the upward convex cavity and is arranged, the plane surface of the whole plane surface area of the capillary support structure is attached to the inner surface of the upward convex cavity, all the convex points of the support parts form an equivalent plane, and the convex points of all the support parts are attached to the inner surface of the second cover plate.
Description
Technical Field
The invention relates to the technical field of temperature equalizing plate structures, in particular to a thin type temperature equalizing plate supported by a capillary structure.
background
with the development of science and technology, the living standard of people is improved, and high heat flow density heat dissipation and high temperature uniformity are trends of the development of the current load heat dissipation technology. The temperature-equalizing plate has good heat-conducting property, so that the temperature-equalizing plate is more and more widely applied, electronic chips and devices are more and more light and thin, and the temperature-equalizing plate with light and thin property and simple processing technology is more and more required.
The temperature-equalizing plate in the prior art has the following defects in the aspects of process and structure:
1, the cover plate is generally manufactured into a supporting structure by adopting a CNC/etching processing technology, so that the soaking area is reduced, the rejection rate is high, the pollution is large, the cost is high, and the real lightening and thinning are difficult to realize;
2, other auxiliary structures are adopted to support the temperature equalizing plate, such as a column shape or a concave-convex body, so that the processing flow and difficulty of the temperature equalizing plate are increased, and the temperature equalizing plate is difficult to thin and light;
3, an extra sleeve is needed for external connection operation of the air suction and liquid injection port, and complex (pressing and welding) sealing operation is needed after air suction and liquid injection;
under the circumstances, a novel temperature equalizing plate structure is urgently needed.
disclosure of Invention
In order to solve the problems, the invention provides a thin type temperature-uniforming plate supported by a capillary structure, which enables the capillary structure in an inner cavity of the temperature-uniforming plate to have the function of a supporting force structure while being used as a phase change medium capillary force structure of the temperature-uniforming plate, and improves the heat conduction capability and the heat dissipation efficiency of the temperature-uniforming plate.
Thin capillary structure supports temperature-uniforming plate, its characterized in that: the improved structure of the novel capillary support structure comprises a first cover plate and a second cover plate, wherein an upward convex cavity is arranged in the center area of the first cover plate, the second cover plate is of a flat plate structure, the outer frame of the first flat plate is covered in the peripheral area of the second cover plate, the novel capillary support structure further comprises a capillary support structure, a plurality of convex support parts are arranged on one surface of the whole plane surface area of the capillary support structure, the capillary support structure is located in the upward convex cavity and is arranged, the plane surface of the whole plane surface area of the capillary support structure is attached to the inner surface of the upward convex cavity, all the convex points of the support parts form an equivalent plane, and the convex points of all the support parts are attached to the inner surface of the second cover plate.
It is further characterized in that:
The side wall of the upper convex cavity is provided with a working medium injection hole, and the working medium injection hole is sealed after phase change media are injected and vacuumized;
The surface area of the capillary support structure covers the corresponding surface area of the upper convex cavity body, so that the heat conduction capability and the heat dissipation efficiency of the temperature equalization plate are ensured;
When the capillary support structure is a powder sintering support structure, sintering the powder sintering support structure according to a preset thickness, arranging a plurality of convex support parts on the inner surface of the powder sintering support structure, facing the second cover plate, integrally sintering and molding the support parts and the powder sintering support structure, forming a guide passage of a cooling working medium in front of powder in the sintered and molded powder sintering support structure, wherein the guide passage covers a passage in the corresponding support part;
the supporting parts include, but are not limited to, cylindrical, cubic, hemispherical and ellipsoidal, and all the supporting parts are arranged on the corresponding surface of the powder sintering supporting structure in a rectangular array, so that the manufacturing is simple and convenient;
The capillary support structure is specifically a mesh support structure formed by assembling capillary metal tubes, working media are filled in the capillary metal tubes of the mesh support structure, a plurality of convex three-dimensional woven protrusions are arranged on the inner surface, corresponding to the second cover plate, of the mesh support structure, convex points of the three-dimensional woven protrusions form an equivalent plane, and all the convex points of the three-dimensional woven protrusions are attached to corresponding positions of the inner surface of the second cover plate.
after the technical scheme is adopted, the heat source end of the first cover plate is heated, the working medium is boiled and evaporated into gas, the gaseous working medium is liquefied at the position, far away from the heat source end, of the two cover plates to release energy, the liquid working medium returns to the heat source position under the action of the capillary core and works in cycles, the capillary support structure is used as a phase change working medium capillary force structure of the temperature equalization plate and is simultaneously formed with a support part with a support force structure, the two cover plates of the temperature equalization plate do not need to be processed with a complex structure any more so as to carry out thickness direction positioning, the material thickness can be processed by using a metal plate material which is as thin as 0.05mm at the minimum, and the; and traditional bearing structure occupies the temperature-uniforming plate inner space, and the back flow of the phase change material gas-liquid of the inner cavity is hindered, so that the heat conduction of the temperature-uniforming plate is not facilitated, and the temperature-uniforming plate supported by the capillary structure does not have an additional supporting part, so that the bearing structure can have a good capillary function, the inner space is larger, the heat conduction capability is better, and the heat dissipation efficiency is improved.
Drawings
FIG. 1 is an exploded view of an embodiment of the present invention;
FIG. 2 is a schematic diagram of an exploded view of a second embodiment of the present invention;
FIG. 3 is a schematic diagram of a three-exploded view structure of an embodiment of the present invention;
FIG. 4 is an enlarged view of a portion A of FIG. 3;
FIG. 5 is a schematic top view of the present invention;
The names corresponding to the sequence numbers in the figure are as follows:
the device comprises a first cover plate 1, an upward convex cavity 11, an outer frame 12, a working medium injection hole 13, a seal 14, a second cover plate 2, a powder sintering support structure 3, a support part 31, a mesh support structure 4 and a three-dimensional woven protrusion 41.
Detailed Description
thin capillary structure supported vapor chamber, see fig. 1-5: the novel flat plate type heat exchanger comprises a first cover plate 1 and a second cover plate 2, wherein an upward convex cavity 11 is arranged in the central area of the first cover plate 1, the second cover plate 2 is of a flat plate structure, an outer frame 12 of the first flat plate 1 covers the peripheral area of the second cover plate 2, the novel flat plate type heat exchanger further comprises a capillary support structure, a plurality of outward convex support parts are arranged on one surface of the integral plane surface area of the capillary support structure, the capillary support structure is arranged in the upward convex cavity 11, the plane surface of the integral plane surface area of the capillary support structure is attached to the inner surface of the upward convex cavity 11, the outward convex points of all the support parts form an equivalent plane, the outward convex points of all the support parts are attached to the inner surface of the second cover plate 2,
A working medium injection hole 13 is formed in the side wall of the upward convex cavity 11, and a seal 14 is formed after the phase change medium is injected into the working medium injection hole 13 and vacuumized;
the surface area of the capillary support structure covers the corresponding surface area of the upper convex cavity 11, so that the heat conduction capability and the heat dissipation efficiency of the temperature equalization plate are ensured.
The specific embodiments are shown in fig. 1 and fig. 2: when the capillary support structure is specifically a powder sintering support structure 3, according to a preset thickness, sintering the powder sintering support structure 3, arranging a plurality of convex support parts 31 on the inner surface of the powder sintering support structure 3 facing the second cover plate, integrally sintering and molding the support parts 31 and the powder sintering support structure 3, forming a guide passage of a cooling working medium in front of powder in the sintered and molded powder sintering support structure 3, wherein the guide passage covers the passage in the corresponding support part 31; all the support members 31 are arranged in a rectangular array on the corresponding surface of the powder sintering support structure 3, ensuring simple and convenient manufacture.
The first specific embodiment is shown in fig. 1: the support member 31 is specifically cylindrical.
The second embodiment is shown in fig. 2: the support member 31 is embodied in a cubic shape.
In the third embodiment, see fig. 3 and 4: the capillary support structure is specifically a mesh support structure 4 formed by assembling capillary metal tubes, working media are filled in the capillary metal tubes of the mesh support structure 4, a plurality of convex three-dimensional woven protrusions 41 are arranged on the inner surface, corresponding to the second cover plate 2, of the mesh support structure 4, convex points of the three-dimensional woven protrusions 41 arranged in an array form an equivalent plane, and the convex points of all the three-dimensional woven protrusions 41 are attached to corresponding positions of the inner surface of the second cover plate.
The beneficial effects are as follows:
The capillary structure is used as a phase change medium capillary structure of the temperature-uniforming plate, and simultaneously, the function of a supporting force structure is formed, the two cover plates of the temperature-uniforming plate do not need to be processed into a complex structure any more, the thickness of materials can be processed by using sheet metal materials with the thinnest of 0.05mm, and the cost is greatly reduced; the supporting structure in the prior art occupies the internal space of the temperature-uniforming plate, and hinders the gas-liquid backflow of the phase-change substances in the internal cavity, so that the heat conduction of the temperature-uniforming plate is not facilitated. The capillary structure supporting temperature-uniforming plate has no additional supporting component, the supporting structure can also have a good capillary function, the internal space is larger, the heat conduction capability is better, and the heat dissipation efficiency is improved; the technology can ensure that the thickness of the temperature equalizing plate can reach 0.3mm at the thinnest, the thickness is light and thin, the structure is simpler, the processing technology is less, the production cost is reduced, and the heat dissipation efficiency is also improved. And the method also conforms to the development trend of modern electronic products for light and thin.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. thin capillary structure supports temperature-uniforming plate, its characterized in that: the improved structure of the novel capillary support structure comprises a first cover plate and a second cover plate, wherein an upward convex cavity is arranged in the center area of the first cover plate, the second cover plate is of a flat plate structure, the outer frame of the first flat plate is covered in the peripheral area of the second cover plate, the novel capillary support structure further comprises a capillary support structure, a plurality of convex support parts are arranged on one surface of the whole plane surface area of the capillary support structure, the capillary support structure is located in the upward convex cavity and is arranged, the plane surface of the whole plane surface area of the capillary support structure is attached to the inner surface of the upward convex cavity, all the convex points of the support parts form an equivalent plane, and the convex points of all the support parts are attached to the inner surface of the second cover plate.
2. The thin capillary structure supported vapor panel of claim 1, wherein: and a working medium injection hole is formed in the side wall of the upward convex cavity, and the working medium injection hole is sealed after phase change media are injected and vacuumized.
3. the thin capillary structure supported vapor plate of claim 1 or 2, wherein: the face area of the capillary support structure covers the corresponding face area of the upper convex cavity.
4. the thin capillary structure supported vapor panel of claim 1, wherein: when the capillary support structure is a powder sintering support structure, according to a preset thickness, sintering the powder sintering support structure, arranging a plurality of convex support parts on the inner surface of the powder sintering support structure facing the second cover plate, integrally sintering and molding the support parts and the powder sintering support structure, forming a guide passage of a cooling working medium in front of powder in the sintered and molded powder sintering support structure, wherein the guide passage covers a passage in the corresponding support part.
5. The thin capillary structure supported vapor plate of claim 4, wherein: the support members include, but are not limited to, cylindrical, cubic, hemispherical, ellipsoidal, all arranged in a rectangular array on the corresponding surface of the powder sintered support structure.
6. The thin capillary structure supported vapor panel of claim 1, wherein: the capillary support structure is specifically a mesh support structure formed by assembling capillary metal tubes, working media are filled in the capillary metal tubes of the mesh support structure, a plurality of convex three-dimensional woven protrusions are arranged on the inner surface, corresponding to the second cover plate, of the mesh support structure, convex points of the three-dimensional woven protrusions form an equivalent plane, and all the convex points of the three-dimensional woven protrusions are attached to corresponding positions of the inner surface of the second cover plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910975856.3A CN110567304A (en) | 2019-10-15 | 2019-10-15 | Thin capillary structure supporting temperature equalizing plate |
| PCT/CN2020/099393 WO2021073158A1 (en) | 2019-10-15 | 2020-06-30 | Thin capillary structure supporting vapor chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910975856.3A CN110567304A (en) | 2019-10-15 | 2019-10-15 | Thin capillary structure supporting temperature equalizing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110567304A true CN110567304A (en) | 2019-12-13 |
Family
ID=68784771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910975856.3A Pending CN110567304A (en) | 2019-10-15 | 2019-10-15 | Thin capillary structure supporting temperature equalizing plate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110567304A (en) |
| WO (1) | WO2021073158A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111322891A (en) * | 2020-02-25 | 2020-06-23 | 张于光 | Uniform temperature plate radiator |
| CN112461025A (en) * | 2020-12-15 | 2021-03-09 | 爱美达（深圳）热能系统有限公司 | Temperature equalizing plate |
| WO2021073158A1 (en) * | 2019-10-15 | 2021-04-22 | 昆山联德电子科技有限公司 | Thin capillary structure supporting vapor chamber |
| CN113865396A (en) * | 2021-10-26 | 2021-12-31 | 惠州奥诺吉散热技术有限公司 | Temperature equalizing plate |
| WO2022027740A1 (en) * | 2020-08-03 | 2022-02-10 | 昆山联德电子科技有限公司 | Thin vapor chamber |
| WO2022110366A1 (en) * | 2020-11-30 | 2022-06-02 | 瑞声声学科技(深圳)有限公司 | Vapor chamber processing method and vapor chamber |
| WO2023216482A1 (en) * | 2022-05-13 | 2023-11-16 | 华为技术有限公司 | Mobile terminal, vapor chamber, and method for manufacturing vapor chamber |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747758B (en) * | 2021-08-24 | 2022-08-12 | 苏州浪潮智能科技有限公司 | Electronic equipment and heat dissipation device thereof |
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- 2019-10-15 CN CN201910975856.3A patent/CN110567304A/en active Pending
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- 2020-06-30 WO PCT/CN2020/099393 patent/WO2021073158A1/en active Application Filing
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| CN201715908U (en) * | 2010-06-07 | 2011-01-19 | 锘威科技(深圳)有限公司 | Integral sintered flat heat pipe |
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| WO2021073158A1 (en) * | 2019-10-15 | 2021-04-22 | 昆山联德电子科技有限公司 | Thin capillary structure supporting vapor chamber |
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| WO2022027740A1 (en) * | 2020-08-03 | 2022-02-10 | 昆山联德电子科技有限公司 | Thin vapor chamber |
| WO2022110366A1 (en) * | 2020-11-30 | 2022-06-02 | 瑞声声学科技(深圳)有限公司 | Vapor chamber processing method and vapor chamber |
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| CN113865396A (en) * | 2021-10-26 | 2021-12-31 | 惠州奥诺吉散热技术有限公司 | Temperature equalizing plate |
| WO2023216482A1 (en) * | 2022-05-13 | 2023-11-16 | 华为技术有限公司 | Mobile terminal, vapor chamber, and method for manufacturing vapor chamber |
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|---|---|
| WO2021073158A1 (en) | 2021-04-22 |
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Effective date of registration: 20200723 Address after: 215300 workshop 5, No.128 weita Road, Zhangpu Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshan Liande Electronic Technology Co.,Ltd. Address before: Suzhou City, Jiangsu province 215300 Zhangpu town Kunshan city Wei Road No. 128 Applicant before: LIANDE PRECISION MATERIALS (CHINA) Co.,Ltd. |