CN211451989U - Thin capillary structure supporting temperature equalizing plate - Google Patents
Thin capillary structure supporting temperature equalizing plate Download PDFInfo
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- CN211451989U CN211451989U CN201921720127.5U CN201921720127U CN211451989U CN 211451989 U CN211451989 U CN 211451989U CN 201921720127 U CN201921720127 U CN 201921720127U CN 211451989 U CN211451989 U CN 211451989U
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Abstract
The utility model provides a slim capillary structure supports temperature-uniforming plate, its capillary structure that makes the temperature-uniforming plate inner chamber when as temperature-uniforming plate phase transition medium capillary structure, have the function of holding power structure, its heat-conduction ability and the radiating efficiency that has improved the temperature-uniforming plate. The improved structure of the novel capillary support structure comprises a first cover plate and a second cover plate, wherein an upward convex cavity is arranged in the center area of the first cover plate, the second cover plate is of a flat plate structure, the outer frame of the first flat plate is covered in the peripheral area of the second cover plate, the novel capillary support structure further comprises a capillary support structure, a plurality of convex support parts are arranged on one surface of the whole plane surface area of the capillary support structure, the capillary support structure is located in the upward convex cavity and is arranged, the plane surface of the whole plane surface area of the capillary support structure is attached to the inner surface of the upward convex cavity, all the convex points of the support parts form an equivalent plane, and the convex points of all the support parts are attached to the inner surface of the second cover plate.
Description
Technical Field
The utility model relates to a technical field of vapor chamber structure specifically is slim capillary structure supports vapor chamber.
Background
With the development of science and technology, the living standard of people is improved, and high heat flow density heat dissipation and high temperature uniformity are trends of the development of the current load heat dissipation technology. The temperature-equalizing plate has good heat-conducting property, so that the temperature-equalizing plate is more and more widely applied, electronic chips and devices are more and more light and thin, and the temperature-equalizing plate with light and thin property and simple processing technology is more and more required.
The temperature-equalizing plate in the prior art has the following defects in the aspects of process and structure:
1, the cover plate is generally manufactured into a supporting structure by adopting a CNC/etching processing technology, so that the soaking area is reduced, the rejection rate is high, the pollution is large, the cost is high, and the real lightening and thinning are difficult to realize;
2, other auxiliary structures are adopted to support the temperature equalizing plate, such as a column shape or a concave-convex body, so that the processing flow and difficulty of the temperature equalizing plate are increased, and the temperature equalizing plate is difficult to thin and light;
3, an extra sleeve is needed for external connection operation of the air suction and liquid injection port, and complex (pressing and welding) sealing operation is needed after air suction and liquid injection;
under the circumstances, a novel temperature equalizing plate structure is urgently needed.
Disclosure of Invention
In view of the above problem, the utility model provides a slim capillary structure supports temperature-uniforming plate, its capillary structure that makes the temperature-uniforming plate inner chamber when as temperature-uniforming plate phase change medium capillary structure, have the function of holding power structure, its heat-conduction ability and the radiating efficiency who has improved the temperature-uniforming plate.
Thin capillary structure supports temperature-uniforming plate, its characterized in that: the novel capillary support structure comprises a first cover plate and a second cover plate, wherein an upward convex cavity is arranged in the center area of the first cover plate, the second cover plate is of a flat plate structure, the outer frame of the first cover plate is covered in the peripheral area of the second cover plate, the novel capillary support structure further comprises a capillary support structure, a plurality of convex support parts are arranged on one surface of the whole plane surface area of the capillary support structure, the capillary support structure is located in the upward convex cavity and is arranged, the plane surface of the whole plane surface area of the capillary support structure is attached to the inner surface of the upward convex cavity, all the convex points of the support parts form an equivalent plane, and the convex points of all the support parts are attached to the inner surface of the second cover plate.
It is further characterized in that:
the side wall of the upper convex cavity is provided with a working medium injection hole, and the working medium injection hole is sealed after phase change media are injected and vacuumized;
the surface area of the capillary support structure covers the corresponding surface area of the upper convex cavity body, so that the heat conduction capability and the heat dissipation efficiency of the temperature equalization plate are ensured;
when the capillary support structure is a powder sintering support structure, sintering the powder sintering support structure according to a preset thickness, arranging a plurality of convex support parts on the inner surface of the powder sintering support structure, facing the second cover plate, integrally sintering and molding the support parts and the powder sintering support structure, forming a guide passage of a cooling working medium in front of powder in the sintered and molded powder sintering support structure, wherein the guide passage covers a passage in the corresponding support part;
the supporting parts include, but are not limited to, cylindrical, cubic, hemispherical and ellipsoidal, and all the supporting parts are arranged on the corresponding surface of the powder sintering supporting structure in a rectangular array, so that the manufacturing is simple and convenient;
the capillary support structure is specifically a mesh support structure formed by assembling capillary metal tubes, working media are filled in the capillary metal tubes of the mesh support structure, a plurality of convex three-dimensional woven protrusions are arranged on the inner surface, corresponding to the second cover plate, of the mesh support structure, convex points of the three-dimensional woven protrusions form an equivalent plane, and all the convex points of the three-dimensional woven protrusions are attached to corresponding positions of the inner surface of the second cover plate.
After the technical scheme is adopted, the heat source end of the first cover plate is heated, the working medium is boiled and evaporated into gas, the gaseous working medium is liquefied at the position, far away from the heat source end, of the two cover plates to release energy, the liquid working medium returns to the heat source position under the action of the capillary core and works in cycles, the capillary support structure is used as a phase change working medium capillary force structure of the temperature equalization plate and is simultaneously formed with a support part with a support force structure, the two cover plates of the temperature equalization plate do not need to be processed with a complex structure any more so as to carry out thickness direction positioning, the material thickness can be processed by using a metal plate material which is as thin as 0.05mm at the minimum, and the; and traditional bearing structure occupies the temperature-uniforming plate inner space, and the back flow of the phase change material gas-liquid of the inner cavity is hindered, so that the heat conduction of the temperature-uniforming plate is not facilitated, and the temperature-uniforming plate supported by the capillary structure does not have an additional supporting part, so that the bearing structure can have a good capillary function, the inner space is larger, the heat conduction capability is better, and the heat dissipation efficiency is improved.
Drawings
Fig. 1 is an exploded view of an embodiment of the present invention;
FIG. 2 is a schematic diagram of an exploded view according to a second embodiment of the present invention;
fig. 3 is a schematic structural view of three exploded views of an embodiment of the present invention;
FIG. 4 is an enlarged view of a portion A of FIG. 3;
fig. 5 is a schematic top view structure of the present invention;
the names corresponding to the sequence numbers in the figure are as follows:
the device comprises a first cover plate 1, an upward convex cavity 11, an outer frame 12, a working medium injection hole 13, a seal 14, a second cover plate 2, a powder sintering support structure 3, a support part 31, a mesh support structure 4 and a three-dimensional woven protrusion 41.
Detailed Description
Thin capillary structure supported vapor chamber, see fig. 1-5: the novel flat plate type heat exchanger comprises a first cover plate 1 and a second cover plate 2, wherein an upward convex cavity 11 is arranged in the central area of the first cover plate 1, the second cover plate 2 is of a flat plate structure, an outer frame 12 of the first cover plate 1 covers the peripheral area of the second cover plate 2, the novel flat plate type heat exchanger further comprises a capillary support structure, a plurality of outward convex support parts are arranged on one surface of the integral plane surface area of the capillary support structure, the capillary support structure is arranged in the upward convex cavity 11, the plane surface of the integral plane surface area of the capillary support structure is attached to the inner surface of the upward convex cavity 11, the outward convex points of all the support parts form an equivalent plane, the outward convex points of all the support parts are attached to the inner surface of the second cover plate 2,
a working medium injection hole 13 is formed in the side wall of the upward convex cavity 11, and a seal 14 is formed after the phase change medium is injected into the working medium injection hole 13 and vacuumized;
the surface area of the capillary support structure covers the corresponding surface area of the upper convex cavity 11, so that the heat conduction capability and the heat dissipation efficiency of the temperature equalization plate are ensured.
The specific embodiments are shown in fig. 1 and fig. 2: when the capillary support structure is specifically a powder sintering support structure 3, according to a preset thickness, sintering the powder sintering support structure 3, arranging a plurality of convex support parts 31 on the inner surface of the powder sintering support structure 3 facing the second cover plate, integrally sintering and molding the support parts 31 and the powder sintering support structure 3, forming a guide passage of a cooling working medium in front of powder in the sintered and molded powder sintering support structure 3, wherein the guide passage covers the passage in the corresponding support part 31; all the support members 31 are arranged in a rectangular array on the corresponding surface of the powder sintering support structure 3, ensuring simple and convenient manufacture.
The first specific embodiment is shown in fig. 1: the support member 31 is specifically cylindrical.
The second embodiment is shown in fig. 2: the support member 31 is embodied in a cubic shape.
In the third embodiment, see fig. 3 and 4: the capillary support structure is specifically a mesh support structure 4 formed by assembling capillary metal tubes, working media are filled in the capillary metal tubes of the mesh support structure 4, a plurality of convex three-dimensional woven protrusions 41 are arranged on the inner surface, corresponding to the second cover plate 2, of the mesh support structure 4, convex points of the three-dimensional woven protrusions 41 arranged in an array form an equivalent plane, and the convex points of all the three-dimensional woven protrusions 41 are attached to corresponding positions of the inner surface of the second cover plate.
The beneficial effects are as follows:
the capillary structure is used as a phase change medium capillary structure of the temperature-uniforming plate, and simultaneously, the function of a supporting force structure is formed, the two cover plates of the temperature-uniforming plate do not need to be processed into a complex structure any more, the thickness of materials can be processed by using sheet metal materials with the thinnest of 0.05mm, and the cost is greatly reduced; the supporting structure in the prior art occupies the internal space of the temperature-uniforming plate, and hinders the gas-liquid backflow of the phase-change substances in the internal cavity, so that the heat conduction of the temperature-uniforming plate is not facilitated. The capillary structure supporting temperature-uniforming plate has no additional supporting component, the supporting structure can also have a good capillary function, the internal space is larger, the heat conduction capability is better, and the heat dissipation efficiency is improved; the technology can ensure that the thickness of the temperature equalizing plate can reach 0.3mm at the thinnest, the thickness is light and thin, the structure is simpler, the processing technology is less, the production cost is reduced, and the heat dissipation efficiency is also improved. And the method also conforms to the development trend of modern electronic products for light and thin.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. Thin capillary structure supports temperature-uniforming plate, its characterized in that: the novel capillary support structure comprises a first cover plate and a second cover plate, wherein an upward convex cavity is arranged in the center area of the first cover plate, the second cover plate is of a flat plate structure, the outer frame of the first cover plate is covered in the peripheral area of the second cover plate, the novel capillary support structure further comprises a capillary support structure, a plurality of convex support parts are arranged on one surface of the whole plane surface area of the capillary support structure, the capillary support structure is located in the upward convex cavity and is arranged, the plane surface of the whole plane surface area of the capillary support structure is attached to the inner surface of the upward convex cavity, all the convex points of the support parts form an equivalent plane, and the convex points of all the support parts are attached to the inner surface of the second cover plate.
2. The thin capillary structure supported vapor panel of claim 1, wherein: and a working medium injection hole is formed in the side wall of the upward convex cavity, and the working medium injection hole is sealed after phase change media are injected and vacuumized.
3. The thin capillary structure supported vapor plate of claim 1 or 2, wherein: the face area of the capillary support structure covers the corresponding face area of the upper convex cavity.
4. The thin capillary structure supported vapor panel of claim 1, wherein: when the capillary support structure is a powder sintering support structure, according to a preset thickness, sintering the powder sintering support structure, arranging a plurality of convex support parts on the inner surface of the powder sintering support structure facing the second cover plate, integrally sintering and molding the support parts and the powder sintering support structure, forming a guide passage of a cooling working medium in front of powder in the sintered and molded powder sintering support structure, wherein the guide passage covers a passage in the corresponding support part.
5. The thin capillary structure supported vapor plate of claim 4, wherein: the support members include, but are not limited to, cylindrical, cubic, hemispherical, ellipsoidal, all arranged in a rectangular array on the corresponding surface of the powder sintered support structure.
6. The thin capillary structure supported vapor panel of claim 1, wherein: the capillary support structure is specifically a mesh support structure formed by assembling capillary metal tubes, working media are filled in the capillary metal tubes of the mesh support structure, a plurality of convex three-dimensional woven protrusions are arranged on the inner surface, corresponding to the second cover plate, of the mesh support structure, convex points of the three-dimensional woven protrusions form an equivalent plane, and all the convex points of the three-dimensional woven protrusions are attached to corresponding positions of the inner surface of the second cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921720127.5U CN211451989U (en) | 2019-10-15 | 2019-10-15 | Thin capillary structure supporting temperature equalizing plate |
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| CN201921720127.5U CN211451989U (en) | 2019-10-15 | 2019-10-15 | Thin capillary structure supporting temperature equalizing plate |
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| CN211451989U true CN211451989U (en) | 2020-09-08 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110567304A (en) * | 2019-10-15 | 2019-12-13 | 联德精密材料（中国）股份有限公司 | Thin capillary structure supporting temperature equalizing plate |
| WO2022088335A1 (en) * | 2020-10-31 | 2022-05-05 | 瑞声声学科技(深圳)有限公司 | Method for improving heat transfer efficiency of vapor chamber |
| WO2022110366A1 (en) * | 2020-11-30 | 2022-06-02 | 瑞声声学科技(深圳)有限公司 | Vapor chamber processing method and vapor chamber |
-
2019
- 2019-10-15 CN CN201921720127.5U patent/CN211451989U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110567304A (en) * | 2019-10-15 | 2019-12-13 | 联德精密材料（中国）股份有限公司 | Thin capillary structure supporting temperature equalizing plate |
| WO2022088335A1 (en) * | 2020-10-31 | 2022-05-05 | 瑞声声学科技(深圳)有限公司 | Method for improving heat transfer efficiency of vapor chamber |
| WO2022110366A1 (en) * | 2020-11-30 | 2022-06-02 | 瑞声声学科技(深圳)有限公司 | Vapor chamber processing method and vapor chamber |
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