TWM513988U - Structure of temperature equilibration plate - Google Patents

Description

Temperature uniform plate structure

The present invention relates to a temperature equalizing plate, and more particularly to a temperature equalizing plate structure for an electronic heating element.

As the computing speed of electronic components continues to increase, the heat generated by them is becoming higher and higher. In order to effectively solve this problem of high heat generation, the Vapor Chamber with good thermal conductivity has been widely used in the industry. Use, but these homogenizing plates have room for improvement, such as their thermal conductivity, production cost and ease of fabrication.

The conventional method for manufacturing a uniform temperature plate firstly attaches an upper capillary structure to an upper casing and feeds it into a heating furnace for thermal bonding, and then attaches the capillary structure to the lower casing and feeds it into a heating furnace. The thermal bonding is performed, and then a supporting structure is disposed in the lower casing, and finally the upper casing is covered corresponding to the lower casing and then fed into a heating furnace for thermal bonding.

However, the conventional method for producing a uniform temperature plate and its finished product, although having thermal conductivity, have the following problems. Since the heating furnace must be used for heat bonding multiple times during the manufacturing process, it is not only complicated. However, it takes a lot of production time and cost, and after each capillary structure and each shell is subjected to multiple comprehensive heating and cooling, the structure is deformed irregularly and the internal capillary structure is peeled off, which leads to Its thermal conductivity is not good and needs to be improved.

One of the aims of the present invention is to provide a temperature equalizing plate structure which not only simplifies the process and shortens the production time, but also ensures the quality stability of the temperature equalizing plate.

In order to achieve the above purpose, the present invention provides a temperature equalizing plate structure, comprising a lower metal shell, an upper metal shell, a plurality of support columns and a working fluid, the upper metal shell being closely sealed to the lower metal shell, and Forming a cavity between the upper metal shell and the lower metal shell; each of the support pillars is received in the cavity and between the upper metal shell and the lower metal shell, and each of the support pillars comprises a hollow metal And a capillary structure formed inside the hollow metal body, one end of the hollow metal body being fixed to the upper metal shell; the working fluid is filled in the cavity.

The creation also has the following effects: the capillary structure is attached to the inner wall surface of the substrate to increase the reflow speed of the working fluid. The hollow metal body is a conical tube body to facilitate the filling of the metal powder and the structure is dense.

The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.

Please refer to FIG. 1 and FIG. 4 , wherein the method for manufacturing the temperature equalizing plate includes the following steps:

a) having an upper metal shell 10 and a plurality of hollow metal bodies 21, the upper metal shell 10 having an inner wall surface 112; the upper metal shell 10 in this step may be made of a conductive material such as copper, aluminum or alloy thereof, The utility model mainly comprises a rectangular substrate 11 and a plurality of heat dissipation fins 12. The substrate 11 has an outer surface 111 and an inner wall surface 112 formed on the back side of the outer surface 111. The heat dissipation fins 12 extend from the outer surface 111 and are integrally formed. The sheet 12 can be formed by a process such as extrusion or shovel. The hollow metal body 21 is also made of a conductive material such as copper, aluminum or an alloy thereof. The hollow metal body 21 of the present embodiment comprises a circular tube 211 and a cover 212 enclosing one end of the circular tube 211.

b) The hollow metal bodies 21 are fixed to the inner wall surface 112 by means of a welding means; the welding means in this step may be a spot welding or a plasma welding process, and the hollow metal bodies 21 are sleeved in the welding during the production. After the current is applied to the electrodes of the machine, the inner wall surface 112 of the upper metal shell 10 is welded and fixed by the maximum resistance between the cover plate 212 of the hollow metal body 21 and the inner wall surface 112 of the upper metal shell 10.

c) a capillary structure 22 is filled into each of the hollow metal bodies 21 to form a plurality of support columns 20; the capillary structure 22 in this step may be a metal woven mesh, a fiber bundle or a metal powder, etc., which are separately filled. A plurality of support columns 20 are formed inside each of the hollow metal bodies 21, and each of the support columns 20 includes a hollow metal body 21 and a capillary structure 22 formed inside the hollow metal body 21.

d) the lower metal shell 30 is closely sealed to the upper metal shell 10, and a cavity A for accommodating the support columns 20 is formed between the upper metal shell 10 and the lower metal shell 30; The metal shell 30 is also made of a conductive material such as copper, aluminum or an alloy thereof, and the upper metal shell 10 and the lower metal shell 30 are vertically overlapped and welded to each periphery thereof, and the respective support pillars 20 are formed. In the cavity A formed by the upper metal shell 10 and the lower metal shell 30.

e) A working fluid 40 is filled into the cavity A and degassed and sealed. The working fluid in this step may be water, filled into the cavity A formed by the upper metal shell 10 and the lower metal shell 30, and subjected to degassing and sealing operations, thereby completing the creation of the uniform temperature plate. .

Further, the method for manufacturing the temperature equalizing plate further comprises a step a1) after the step a), the step a1) fixing the upper capillary structure 50 to the inner wall surface 112 by a welding means; the upper capillary structure in this step 50 may be a metal woven mesh, and a plurality of perforations 51 may be disposed at intervals of the upper capillary structure 50 to provide a space for the hollow metal body 21; the welding means may be a spot welding or a plasma welding process. In addition, the step a1) may be performed after the step b). After the hollow metal bodies 21 are welded and fixed to the inner wall surface 112, the respective through holes 51 of the above capillary structure 50 are respectively sleeved on the hollow metal bodies 21 and then placed therein. The wall 112 is welded and fixed.

Referring to FIG. 4 again, the foregoing manufacturing method can produce a temperature equalizing plate, which comprises an upper metal shell 10, a plurality of support columns 20, a lower metal shell 30 and a working fluid 40, and the upper metal shell 10 corresponds to the lower metal shell 30. a tight seal is formed, and a cavity A is formed between the upper metal shell 10 and the lower metal shell 30; each support post 20 is received in the cavity A and interposed between the upper metal shell 10 and the lower metal shell 30, each A support column 20 includes a hollow metal body 21 and a capillary structure 22 formed inside the hollow metal body 21. One end of the hollow metal body 21 is welded and fixed to the inner wall surface 112 of the upper metal shell 10; the working fluid 40 is filled in the volume Inside cavity A.

Further, the temperature equalizing plate of the present invention further includes an upper capillary structure 50. The upper capillary structure 50 may be a metal woven mesh which is laid and welded to the inner wall surface 112 of the upper metal shell 10, and the upper capillary structure 50 A plurality of perforations 51 are provided at intervals to provide a space for the hollow metal body 21 to be placed.

Further, the temperature equalizing plate of the present invention further includes a capillary structure 60. The lower capillary structure 60 may also be a metal woven mesh which is laid and welded to the inner wall surface of the lower metal shell 30, and the lower capillary structure 60 is clamped. The crucible is between the bottom end of each support post 20 and the inner wall surface of the lower metal shell 30.

Referring to FIG. 5 to FIG. 8 , the support column 20 in the present temperature equalizing plate may be the exception of the above embodiment, wherein the hollow metal body 21 a of FIG. 5 is only a circular tube, wherein the top end of the capillary structure 22 and the substrate The inner wall surface 112 of the 11 is attached to the contact. The hollow metal body 21b of FIG. 6 includes a circular tube 211, a cover 212 connected to one end of the circular tube 211, and a through hole 213 formed in the cover 212, wherein the top end of the capillary structure 22 passes through the through hole 213 and The inner wall surface 112 of the substrate 11 is attached to the contact. Further, the hollow metal body 21c of FIG. 7 is a conical tube 211c in which the tip end of the capillary structure 22 is in contact with the inner wall surface 112 of the substrate 11. Furthermore, the hollow metal body 21d of FIG. 8 includes a conical tube 211c, a cover 212 connected to one end of the conical tube 211c, and a through hole 213 formed in the cover 212, wherein the top end of the capillary structure 22 penetrates the through hole 213 and The inner wall surface 112 of the substrate 11 is attached to the contact.

In summary, the average temperature board structure of this creation can achieve the intended purpose of use, and solve the lack of conventional knowledge. Because of its novelty and progress, it fully meets the requirements of new patent applications and applies for patent law. Please carefully check and grant the patent in this case to protect the rights of the creator.

10‧‧‧Upper metal shell

11‧‧‧Substrate

111‧‧‧ outer surface

112‧‧‧ inner wall

12‧‧‧ Heat sink fins

20‧‧‧Support column

21, 21a, 21b, 21c, 21d‧‧‧ hollow metal bodies

211‧‧‧round tube

211c‧‧‧Conical tube

212‧‧‧ cover

213‧‧‧through hole

22‧‧‧Capillary structure

30‧‧‧Under metal shell

40‧‧‧Working fluid

50‧‧‧Upper capillary tissue

51‧‧‧Perforation

60‧‧‧ Lower capillary tissue

A‧‧‧ cavity

Fig. 1 is a combination view of an upper metal shell and each hollow metal body of the first embodiment of the present invention.

Fig. 2 is a combination view of the upper metal shell and the respective support columns of the first embodiment of the present invention.

Figure 3 is a perspective exploded view of the first embodiment of the present creation.

Figure 4 is a cross-sectional view showing the first embodiment of the present invention.

Figure 5 is a combined cross-sectional view of a second embodiment of the present creation.

Figure 6 is a combined cross-sectional view of a third embodiment of the present creation.

Figure 7 is a combined cross-sectional view of a fourth embodiment of the present invention.

Figure 8 is a sectional view showing the combination of the fifth embodiment of the present creation.

10‧‧‧Upper metal shell

11‧‧‧Substrate

111‧‧‧ outer surface

112‧‧‧ inner wall

12‧‧‧ Heat sink fins

20‧‧‧Support column

21‧‧‧ hollow metal body

211‧‧‧round tube

212‧‧‧ cover

22‧‧‧Capillary structure

30‧‧‧Under metal shell

40‧‧‧Working fluid

50‧‧‧Upper capillary tissue

51‧‧‧Perforation

60‧‧‧ Lower capillary tissue

A‧‧‧ cavity

Claims (10)

A uniform temperature plate structure, comprising: a metal shell; an upper metal shell, the lower metal shell is closely sealed, and a cavity is formed between the upper metal shell and the lower metal shell; In the cavity and between the upper metal shell and the lower metal shell, each of the support columns comprises a hollow metal body and a capillary structure formed inside the hollow metal body, one end of the hollow metal body being solid On the upper metal shell; and a working fluid, filled in the cavity. The uniform temperature plate structure of claim 1, wherein the upper metal case comprises a substrate and a plurality of heat dissipation fins, the substrate has an inner wall surface and an outer surface formed on a back side of the inner wall surface, each of the heat dissipation fins Extending from the outer surface and integrally forming. The uniform temperature plate structure according to claim 2, wherein the hollow metal body comprises a circular tube and a cover plate covering one end of the circular tube, the cover plate being fixed to the inner wall surface. The uniform temperature plate structure according to claim 2, wherein the hollow metal body comprises a circular tube, one end of the circular tube is fixed to the inner wall surface, and the capillary structure passes through the circular tube and is attached to the inner wall surface. Attached to the contact. The uniform temperature plate structure according to claim 2, wherein the hollow metal body comprises a circular tube, a cover plate connected to one end of the circular tube, and a through hole formed in the cover plate, the cover plate being fixed The inner wall surface of the substrate, the capillary structure passes through the through hole and is in contact with the inner wall surface. The uniform temperature plate structure according to claim 2, wherein the hollow metal body comprises a conical tube, one end of the conical tube is fixed to the inner wall surface, and the capillary structure passes through the conical tube to be in contact with the inner wall surface. The uniform temperature plate structure according to claim 2, wherein the hollow metal body comprises a conical tube, a cover plate connected to one end of the conical tube, and a through hole formed in the cover plate, the cover plate being fixed on the substrate The inner wall surface of the capillary structure passes through the through hole and is in contact with the inner wall surface. The uniform temperature plate structure according to claim 2, further comprising an upper capillary structure, wherein the upper capillary structure is a metal woven mesh, the metal woven mesh is provided with a plurality of perforations spaced apart, and each of the perforations respectively provides the support column Set up. The uniform temperature plate structure according to claim 8, further comprising a capillary structure disposed inside the lower metal shell and sandwiched between each of the support columns and the lower metal shell. The uniform temperature plate structure according to claim 2, wherein the capillary structure is a metal woven mesh, a fiber bundle or a metal powder.