CN205825776U - Temperature equalizing plate structure - Google Patents
Temperature equalizing plate structure Download PDFInfo
- Publication number
- CN205825776U CN205825776U CN201620175505.6U CN201620175505U CN205825776U CN 205825776 U CN205825776 U CN 205825776U CN 201620175505 U CN201620175505 U CN 201620175505U CN 205825776 U CN205825776 U CN 205825776U
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- China
- Prior art keywords
- metal
- internal face
- capillary structure
- metallic body
- hollow metallic
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- Expired - Fee Related
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000012530 fluid Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 8
- 239000000428 dust Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007872 degassing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a temperature-uniforming plate structure, which comprises a lower metal shell, an upper metal shell, a plurality of support columns and working fluid, wherein the upper metal shell is hermetically connected with the lower metal shell correspondingly, and a containing cavity is formed between the upper metal shell and the lower metal shell; each support column is accommodated in the accommodating cavity and positioned between the upper metal shell and the lower metal shell, each support column comprises a hollow metal body and a capillary structure formed in the hollow metal body, and one end of the hollow metal body is fixedly arranged on the upper metal shell; the working fluid is filled in the cavity. Therefore, the process can be simplified, the manufacturing time can be shortened, and the quality stability of the temperature equalizing plate can be ensured.
Description
Technical field
This utility model relates to a kind of temperature-uniforming plate, a kind of equalizing plate structure for electronic heating element.
Background technology
Along with the arithmetic speed of electronic component constantly promotes, produced by it, heat is more and more higher, for the problem efficiently solving this golf calorific value, the temperature-uniforming plate (Vapor Chamber) with good heat conductive characteristic has been carried out the use of popularity by industry, but such temperature-uniforming plate whether heat conduction efficiency, cost of manufacture still make the space that easness etc. all there is a need to be improved.
The manufacture method of known temperature-uniforming plate, first capillary structure on fits in a upper shell send into a heating furnace carries out thermal, then once will fit in a lower house and send into a heating furnace carries out thermal by capillary structure, then a supporting construction is arranged in lower house, after the most again upper shell being closed corresponding to lower house cover and sends into together and a heating furnace carries out thermal.
But, the manufacture method of known temperature-uniforming plate and manufactured goods thereof, although having heat conduction efficiency, but there is problems with, owing to its manufacturing process must carry out thermal by use heating furnace repeatedly, its not only process complicated and expend substantial amounts of Production Time and cost, and each capillary structure and each housing are after the comprehensive heating carried out repeatedly and cooling, its structure will be made to produce irregular deformation and make internal capillary tissue cause the unfavorable conditions such as stripping, and then cause its heat conduction efficiency the best, it would be highly desirable to improved.
Utility model content
A purpose of the present utility model, is to provide a kind of equalizing plate structure, and it not only can simplify operation and shorten Production Time, additionally it is possible to guarantee the quality stability of temperature-uniforming plate.
In order to reach above-mentioned purpose, this utility model provides a kind of equalizing plate structure, including metal-back once, metal-back, multiple support column and a working fluid on one, on this, metal-back is to descending metal-back sealing engagement, and is formed with a cavity volume between metal-back and this lower metal-back on this；Respectively this support column is contained in this cavity volume and between metal-back and this lower metal-back on this, and this support column each comprises a hollow metallic body and is formed at the capillary structure within this hollow metallic body, and one end of this hollow metallic body is fixedly arranged on metal-back on this；This working fluid is filled in this cavity volume.
This utility model also has the effect that, utilizes each capillary structure to attach the back-flow velocity contacting and then improving working fluid with the internal face of substrate.It is that metal dust is beneficially inserted by cone body and structure is sturdy by hollow metallic body.
Accompanying drawing explanation
Fig. 1 is the method flow diagram of temperature-uniforming plate of the present utility model.
Fig. 2 is the upper metal-back of first embodiment of the present utility model and each hollow metallic body constitutional diagram.
Fig. 3 is the upper metal-back of first embodiment of the present utility model and each support column constitutional diagram.
Fig. 4 is first embodiment three-dimensional exploded view of the present utility model.
Fig. 5 is first embodiment assembled sectional view of the present utility model.
Fig. 6 is the assembled sectional view of the second embodiment of the present utility model.
Fig. 7 is the assembled sectional view of the 3rd embodiment of the present utility model.
Fig. 8 is the assembled sectional view of the 4th embodiment of the present utility model.
List of reference characters
Metal-back on 10
11 substrates
111 outer surfaces
112 internal faces
12 radiating fins
20 support columns
21,21a, 21b, 21c, 21d hollow metallic body
211 round tubes
211c conical tube
212 cover plates
213 through holes
22 capillary structures
30 times metal-backs
40 working fluids
Capillary structure on 50
51 perforation
60 times capillary structures
A cavity volume
Detailed description of the invention
Relevant detailed description of the present utility model and technology contents, coordinate accompanying drawing to be described as follows, but accompanying drawing only provide reference and explanation, is not limiting as scope of the present utility model.
Referring to shown in Fig. 1 and Fig. 4, wherein the manufacture method of temperature-uniforming plate, step includes:
A) preparing metal-back 10 and multiple hollow metallic body 21 on, upper metal-back 10 has an internal face 112；Upper metal-back 10 in this step can be made by the conductive materials such as copper, aluminum or its alloy, it mainly includes a rectangular substrate 11 and multiple radiating fin 12, substrate 11 has an outer surface 111 and is formed at an internal face 112 of outer surface 111 dorsal part, each radiating fin 12 extends and one-body molded from outer surface 111, and each radiating fin 12 can extrude or the processing mode such as backing-off cutting is to be spaced molding.Hollow metallic body 21 is also made by the conductive materials such as copper, aluminum or its alloy, and the hollow metallic body 21 of the present embodiment comprises a round tube 211 and the sealing cover cover plate 212 in round tube 211 one end.
B) each hollow metallic body 21 is fixedly arranged on internal face 112 by welding manner；Welding manner in this step can be the processing mode such as spot welding or plasma-based welding, during making, each hollow metallic body 21 is socketed on the electrode of bonding machine and by after electric current, utilizes and there is between the cover plate 212 and the internal face 112 of upper metal-back 10 of hollow metallic body 21 resistance of maximum and carry out welding the internal face 112 being installed in metal-back 10.
C) it is formed with multiple support column 20 in a capillary structure 22 being respectively filled in each hollow metallic body 21；Capillary structure 22 in this step can be the materials such as metal net, fibre bundle or metal dust, it is filled in each hollow metallic body 21 inside respectively and forms multiple support column 20, and each support column 20 comprises a hollow metallic body 21 and is formed at the capillary structure 22 within hollow metallic body 21.
D) by corresponding for metal-back 30 once upper metal-back 10 sealing engagement, and between upper metal-back 10 and lower metal-back 30, the accommodating cavity volume A of each support column 20 it is formed for；Lower metal-back 30 in this step is also made by the conductive materials such as copper, aluminum or its alloy, upper metal-back 10 and lower metal-back about 30 correspondence are spliced and its each periphery is welded and seals, in the cavity volume A that aforementioned each support column 20 is formed at metal-back 10 and lower metal-back 30 is formed.
E) in a working fluid 40 being inserted cavity volume A and carry out degasification and sealing.Working fluid in this step can be water, is inserted metal-back 10 and in cavity volume A that lower metal-back 30 is formed, and carries out degasification and sealing operation, thus completes temperature-uniforming plate of the present utility model and make.
Further, the manufacture method of temperature-uniforming plate of the present utility model, after step a), also include step a1), this step a1) capillary structure on one 50 is fixedly arranged on internal face 112 by welding manner；Upper capillary structure 50 in this step can be metal net, can be arranged at intervals with multiple perforation 51 at upper capillary structure 50, for wearing accommodating hollow metallic body 21；Welding manner therein can be the processing mode such as spot welding or plasma-based welding.Additionally, step a1) also can carry out after step b), after the welding of each hollow metallic body 21 is fixedly arranged on internal face 112, weld fixed then at internal face 112 after being sheathed on each hollow metallic body 21 respectively with each perforation 51 of capillary structure 50.
Referring again to shown in Fig. 4, aforementioned manufacture method can prepare a kind of temperature-uniforming plate, it includes metal-back 10 on, multiple support column 20, once metal-back 30 and working fluid 40, corresponding lower metal-back 30 sealing engagement of upper metal-back 10, and between upper metal-back 10 and lower metal-back 30, it is formed with a cavity volume A；In each support column 20 is contained in cavity volume A and between upper metal-back 10 and lower metal-back 30, each support column 20 comprises a hollow metallic body 21 and is formed at the capillary structure 22 within hollow metallic body 21, and one end welding of hollow metallic body 21 is installed in the internal face 112 of metal-back 10；Working fluid 40 is filled in cavity volume A.
Further, temperature-uniforming plate of the present utility model also includes capillary structure 50 on, and on this, capillary structure 50 can be a metal net, and it arranges and weld the internal face 112 being fixedly arranged on metal-back 10, it is arranged at intervals with multiple perforation 51 at upper capillary structure 50, is used for wearing accommodating hollow metallic body 21.
Further, temperature-uniforming plate of the present utility model also includes capillary structure 60, this lower capillary structure 60 is alternatively a metal net, and it arranges and weld the internal face being fixedly arranged on lower metal-back 30, and this lower capillary structure 60 is pulled between the internal face of the bottom of each support column 20 and lower metal-back 30 by folder.
Referring to shown in Fig. 5 to Fig. 8, the support column 20 in temperature-uniforming plate of the present utility model is except being in addition to above-described embodiment, and wherein hollow metallic body 21a of Fig. 5 is only a round tube, and wherein the top of capillary structure 22 attaches with the internal face 112 of substrate 11 and contacts.Hollow metallic body 21b of another Fig. 6 comprises a round tube 211, the cover plate 212 being connected to round tube 211 one end and is opened in a through hole 213 of cover plate 212, and wherein the top of capillary structure 22 passes through hole 213 and contacts with internal face 112 attaching of substrate 11.It addition, hollow metallic body 21c of Fig. 7 is a conical tube 211c, wherein the top of capillary structure 22 attaches with the internal face 112 of substrate 11 and contacts.Additionally, hollow metallic body 21d of Fig. 8 comprises a conical tube 211c, the cover plate 212 being connected to conical tube 211c one end and is opened in a through hole 213 of cover plate 212, wherein the top of capillary structure 22 penetrates the internal face 112 of through hole 213 and substrate 11 and attaches and contact.
In sum, equalizing plate structure of the present utility model, can reach intended application target, and solve prior art problem, great novelty and creativeness.
Claims (10)
1. an equalizing plate structure, including:
Metal-back once；
Metal-back on one, corresponding described lower metal-back sealing engagement, and on described metal-back and described
It is formed with a cavity volume between lower metal-back；
Multiple support columns, are contained in described cavity volume and are positioned at described upper metal-back and described lower metal
Between shell, each described support column comprises a hollow metallic body and is formed at inside described hollow metallic body
A capillary structure, one end of described hollow metallic body is fixedly arranged on described upper metal-back；And
One working fluid, fills in described cavity volume.
2. equalizing plate structure as claimed in claim 1, wherein said upper metal-back includes a substrate
And multiple radiating fin, described substrate has an internal face and is formed at outside the one of described internal face dorsal part
Surface, each described radiating fin extends and one-body molded from described outer surface.
3. equalizing plate structure as claimed in claim 2, wherein said hollow metallic body comprises a circle
Shape pipe and a sealing cover cover plate in described round tube one end, described cover plate is fixedly arranged on described internal face.
4. equalizing plate structure as claimed in claim 2, wherein said hollow metallic body comprises a circle
Shape pipe, one end of described round tube is fixedly arranged on described internal face, and described capillary structure passes described circle
Manage to attach with described internal face and contact.
5. equalizing plate structure as claimed in claim 2, wherein said hollow metallic body comprises a circle
Shape pipe, it is connected to a cover plate of described round tube one end and is opened in a through hole of described cover plate, described
Cover plate is fixedly arranged on the described internal face of described substrate, and it is interior with described that described capillary structure passes described through hole
Paste on wall attachment is touched.
6. equalizing plate structure as claimed in claim 2, wherein said hollow metallic body comprises a circle
Taper Pipe, described conical tube one end is fixedly arranged on described internal face, and described capillary structure passes described conical tube
Attach with described internal face and contact.
7. equalizing plate structure as claimed in claim 2, wherein said hollow metallic body comprises a circle
Taper Pipe, it is connected to a cover plate of described conical tube one end and is opened in a through hole of described cover plate, described
Cover plate is fixedly arranged on the described internal face of described substrate, and it is interior with described that described capillary structure passes described through hole
Paste on wall attachment is touched.
8. equalizing plate structure as claimed in claim 2, it also includes capillary structure on, described
Upper capillary structure is a metal net, and described metal net is arranged at intervals with multiple perforation, each
Perforation is respectively used to wear each support column accommodating.
9. equalizing plate structure as claimed in claim 8, it also includes capillary structure, described
Lower capillary structure is arranged at the inside of described lower metal-back and is pulled at each support column and described lower metal by folder
Between shell.
10. equalizing plate structure as claimed in claim 2, wherein said capillary structure is metal knitted
Net, fibre bundle or metal dust.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104215320 | 2015-09-23 | ||
| TW104215320U TWM513988U (en) | 2015-09-23 | 2015-09-23 | Structure of temperature equilibration plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205825776U true CN205825776U (en) | 2016-12-21 |
Family
ID=55408956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620175505.6U Expired - Fee Related CN205825776U (en) | 2015-09-23 | 2016-03-09 | Temperature equalizing plate structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205825776U (en) |
| TW (1) | TWM513988U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106546116A (en) * | 2015-09-23 | 2017-03-29 | 迈萪科技股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN109219306A (en) * | 2017-06-30 | 2019-01-15 | 鹏鼎控股(深圳)股份有限公司 | Heat sink and its manufacturing method |
| CN111590073A (en) * | 2020-05-20 | 2020-08-28 | 北京遥感设备研究所 | Integrated flat plate micro-heat pipe structure and 3D printing manufacturing method thereof |
| CN112771344A (en) * | 2019-06-21 | 2021-05-07 | 株式会社村田制作所 | Vapor chamber |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI570541B (en) * | 2015-12-28 | 2017-02-11 | 奇鋐科技股份有限公司 | A vapor chamber structure and a manufacturing method same |
| US10112272B2 (en) | 2016-02-25 | 2018-10-30 | Asia Vital Components Co., Ltd. | Manufacturing method of vapor chamber |
-
2015
- 2015-09-23 TW TW104215320U patent/TWM513988U/en not_active IP Right Cessation
-
2016
- 2016-03-09 CN CN201620175505.6U patent/CN205825776U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106546116A (en) * | 2015-09-23 | 2017-03-29 | 迈萪科技股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN109219306A (en) * | 2017-06-30 | 2019-01-15 | 鹏鼎控股(深圳)股份有限公司 | Heat sink and its manufacturing method |
| CN112771344A (en) * | 2019-06-21 | 2021-05-07 | 株式会社村田制作所 | Vapor chamber |
| CN111590073A (en) * | 2020-05-20 | 2020-08-28 | 北京遥感设备研究所 | Integrated flat plate micro-heat pipe structure and 3D printing manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM513988U (en) | 2015-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161221 Termination date: 20200309 |