CN106546116A - Temperature equalizing plate and manufacturing method thereof - Google Patents
Temperature equalizing plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN106546116A CN106546116A CN201610130024.8A CN201610130024A CN106546116A CN 106546116 A CN106546116 A CN 106546116A CN 201610130024 A CN201610130024 A CN 201610130024A CN 106546116 A CN106546116 A CN 106546116A
- Authority
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- China
- Prior art keywords
- metal
- temperature
- internal face
- capillary structure
- hollow metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000012530 fluid Substances 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 6
- 238000007872 degassing Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a temperature-uniforming plate and a manufacturing method thereof, wherein the temperature-uniforming plate comprises a lower metal shell, an upper metal shell, a plurality of support columns and working fluid, the upper metal shell is hermetically connected with the lower metal shell correspondingly, and a cavity is formed between the upper metal shell and the lower metal shell; each support column is accommodated in the accommodating cavity and positioned between the upper metal shell and the lower metal shell, each support column comprises a hollow metal body and a capillary structure formed in the hollow metal body, and one end of the hollow metal body is fixedly arranged on the upper metal shell; the working fluid is filled in the cavity. Therefore, the process can be simplified, the manufacturing time can be shortened, and the quality stability of the temperature equalizing plate can be ensured.
Description
Technical field
The present invention relates to a kind of temperature-uniforming plate, particularly a kind of temperature-uniforming plate for electronic heating element and its
Manufacture method.
Background technology
As the arithmetic speed of electronic component is constantly lifted, the also more and more higher of the heat produced by which is
The problem of the golf calorific value is efficiently solved, industry is by the temperature-uniforming plate with good heat conductive characteristic
(Vapor Chamber) carries out the use of popularity, but such temperature-uniforming plate whether its heat conduction efficiency,
Cost of manufacture still makes easness etc. and there is the space for needing to be improved.
Capillary structure on one is fitted in upper shell feeding by the manufacture method of known temperature-uniforming plate first
Thermal is carried out in one heating furnace, then once a lower house one heating of feeding will be fitted in by capillary structure
Thermal is carried out in stove, then a supporting construction is arranged in lower casing body, finally again by upper shell pair
Thermal should be carried out after lower house cover is closed and in sending into a heating furnace together.
It is well known, however, that temperature-uniforming plate manufacture method and its manufactured goods, although with heat conduction efficiency, but
But there is problems with, due to must be multiple in its manufacturing process carry out thermal using heating furnace,
Its not only process it is complicated and expend substantial amounts of Production Time and cost, and each capillary structure and each housing exist
After carrying out multiple comprehensive heating and cooling, its structure will be made to produce irregular deformation and make internal hair
Thin tissue causes a problem that peeling off, and then causes its heat conduction efficiency not good, it would be highly desirable to improved.
The content of the invention
One purpose of the present invention, is to provide a kind of temperature-uniforming plate and preparation method thereof, and which can not only simplify work
Sequence simultaneously shortens Production Time, and be able to ensure that the quality stability of temperature-uniforming plate.
In order to reach above-mentioned purpose, the present invention provides a kind of manufacture method of temperature-uniforming plate, and its step includes:a)
Metal-back and multiple hollow metallic bodies on one are had, metal-back has an internal face on this；B) Jiang Gezhong
Empty metallic object is fixedly arranged on the internal face by welding manner；C) capillary structure is respectively filled in each hollow
Multiple support columns are formed with metal body；D) once metal-back will be sealingly engaged to metal-back should be gone up,
And the cavity volume housed for each support column between metal-back and the lower metal-back, is formed with this；And
E) working fluid is inserted in the cavity volume and carries out degasification and sealing.
In order to reach above-mentioned purpose, the present invention provides a kind of temperature-uniforming plate, including gold on metal-back once,
Category shell, multiple support columns and a working fluid, on this metal-back to metal-back should be descended to be sealingly engaged,
And a cavity volume is formed between metal-back and the lower metal-back on this；Each support column is contained in the cavity volume
It is interior and be located at this between metal-back and the lower metal-back, each support column include a hollow metallic body
With the capillary structure being formed in inside the hollow metallic body, one end of the hollow metallic body is fixedly arranged on this
Upper metal-back；The working fluid is filled in the cavity volume.
The present invention is also had the effect that, is attached with the internal face of substrate using each capillary structure and contacted further
Lift the back-flow velocity of working fluid.Be conducive to metal powder for conical body by hollow metallic body
End is inserted and structure is sturdy.
Description of the drawings
Fig. 1 is the method flow diagram of the temperature-uniforming plate of the present invention.
Upper metal-back and each hollow metallic body constitutional diagram of the Fig. 2 for the first embodiment of the present invention.
Upper metal-back and each support column constitutional diagram of the Fig. 3 for the first embodiment of the present invention.
Fig. 4 is first embodiment of the present invention three-dimensional exploded view.
Fig. 5 is first embodiment of the present invention assembled sectional view.
Assembled sectional views of the Fig. 6 for the second embodiment of the present invention.
Assembled sectional views of the Fig. 7 for the third embodiment of the present invention.
Assembled sectional views of the Fig. 8 for the fourth embodiment of the present invention.
Assembled sectional views of the Fig. 9 for the fifth embodiment of the present invention.
List of reference characters
Metal-back on 10
11 substrates
111 outer surfaces
112 internal faces
12 radiating fins
20 support columns
21st, 21a, 21b, 21c, 21d hollow metallic body
211 round tubes
211c conical tubes
212 cover plates
213 through holes
22 capillary structures
30 times metal-backs
40 working fluids
Capillary structure on 50
51 perforation
60 times capillary structures
A cavity volumes
A～e steps
Specific embodiment
Detailed description for the present invention and technology contents, coordinate description of the drawings as follows, but accompanying drawing is only carried
For reference with explanation, it does not limit the scope of the invention.
Refer to shown in Fig. 1 and Fig. 5, the present invention provides a kind of manufacture method of temperature-uniforming plate, its step
Including:
A) metal-back 10 and multiple hollow metallic bodies 21 on one are had, upper metal-back 10 has an inwall
Face 112；Upper metal-back 10 in this step can made by the conductive material such as copper, aluminum or its alloy,
Which mainly includes a rectangular substrate 11 and multiple radiating fins 12, and substrate 11 has an outer surface 111
With the internal face 112 for being formed in 111 dorsal part of outer surface, each radiating fin 12 prolongs from outer surface 111
Stretch and be integrally formed, each radiating fin 12 can be extruded or the processing mode such as backing-off cutting is being spaced molding.In
Empty metallic object 21 is also the hollow metal of the present embodiment made by the conductive materials such as copper, aluminum or its alloy
Body 21 includes the cover plate 212 of a round tube 211 and sealing cover in 211 one end of round tube.
B) each hollow metallic body 21 is fixedly arranged on into internal face 112 by welding manner；In this step
Welding manner can be the processing mode such as spot welding or plasma-based welding, during making be socketed each hollow metallic body 21
On the electrode of bonding machine and after electric current, using cover plate 212 and upper gold in hollow metallic body 21
There is between the internal face 112 of category shell 10 maximum resistance and weld and be fixedly arranged on the interior of metal-back 10
Wall 112.
C) capillary structure 22 is respectively filled in each hollow metallic body 21 and is formed with multiple support columns
20；Capillary structure 22 in this step can be the materials such as metal net, fibre bundle or metal dust,
Which fills in inside each hollow metallic body 21 respectively and forms multiple support columns 20, each support column 20
Comprising a hollow metallic body 21 and the capillary structure 22 being formed in inside hollow metallic body 21.
D) once the upper metal-back 10 of the correspondence of metal-back 30 will be sealingly engaged, and in upper metal-back 10 with
The cavity volume A housed for each support column 20 is formed between metal-back 30；Lower metal in this step
Shell 30 is also made by the conductive materials such as copper, aluminum or its alloy, by upper metal-back 10 and lower metal-back
About 30 it is corresponding splice and its each periphery welded and is sealed, aforementioned each support column 20 is formed in
In the cavity volume A formed by upper metal-back 10 and lower metal-back 30.
E) working fluid 40 is inserted in cavity volume A and carries out degasification and sealing.Work in this step
It can be water to make fluid, inserted in the cavity volume A formed by metal-back 10 and lower metal-back 30,
And degasification and sealing operation are carried out, so as to the temperature-uniforming plate for completing the present invention makes.
Further, the manufacture method of temperature-uniforming plate of the present invention, also includes step a1 after step a)),
This step a1) capillary structure on one 50 is fixedly arranged on into internal face 112 by welding manner；In the step
In upper capillary structure 50 can be metal net, can be arranged at intervals with upper capillary structure 50 multiple
Perforation 51, for wearing accommodating hollow metallic body 21；Welding manner therein can be spot welding or plasma-based
The processing modes such as welding.Additionally, step a1) also can implement after step b), in each hollow metal
After the welding of body 21 is fixedly arranged on internal face 112, each perforation 51 of above capillary structure 50 is sheathed on respectively
Weld fixed with internal face 112 again after each hollow metallic body 21.
Referring again to shown in Fig. 5, aforementioned manufacture method can be obtained a kind of temperature-uniforming plate, and which includes gold on
Category shell 10, once multiple support columns 20, metal-back 30 and working fluid 40,10 correspondence of upper metal-back
Lower metal-back 30 is sealingly engaged, and between upper metal-back 10 and lower metal-back 30 is formed with a cavity volume
A；Each support column 20 is contained in cavity volume A and is located between upper metal-back 10 and lower metal-back 30,
Each support column 20 includes a hollow metallic body 21 and the capillary being formed in inside hollow metallic body 21
Structure 22, one end welding of hollow metallic body 21 are fixedly arranged on the internal face 112 of metal-back 10；Work
Make fluid 40 to fill in cavity volume A.
Further, temperature-uniforming plate of the invention also includes capillary structure 50 on, and on this, capillary structure 50 can
For a metal net, which arranges and welding is fixedly arranged on the internal face 112 of metal-back 10, in upper hair
Thin tissue 50 is arranged at intervals with multiple perforation 51, for wearing accommodating hollow metallic body 21.
Further, temperature-uniforming plate of the invention also includes capillary structure 60, the lower capillary structure 60
Can be a metal net, which arranges and welding is fixedly arranged on the internal face of lower metal-back 30, the lower capillary
Tissue 60 is by folder tug between the internal face of the bottom of each support column 20 and lower metal-back 30.
Refer to shown in Fig. 6 to Fig. 9, the support column 20 in temperature-uniforming plate of the present invention is except being above-mentioned reality
Exception is applied, wherein hollow metallic body 21a of Fig. 6 is only a round tube, the wherein top of capillary structure 22
Hold to attach with the internal face 112 of substrate 11 and contact.In addition, hollow metallic body 21b of Fig. 7 includes one
Round tube 211, the cover plate 212 for being connected to 211 one end of round tube and be opened in cover plate 212 one lead to
Hole 213, the top of wherein capillary structure 22 are passed through hole 213 and are attached with the internal face 112 of substrate 11
Contact.Additionally, hollow metallic body 21c of Fig. 8 is a conical tube 211c, wherein capillary structure 22
Top is attached with the internal face 112 of substrate 11 and is contacted.Additionally, hollow metallic body 21d of Fig. 9 is included
One conical tube 211c, the cover plate 212 for being connected to conical tube 211c one end and it is opened in cover plate 212
One through hole 213, the top of wherein capillary structure 22 penetrate the internal face 112 of through hole 213 and substrate 11
Attach contact.
In sum, temperature-uniforming plate of the invention and preparation method thereof, can reach expected application target,
Prior art problem, great novelty and creativeness can be solved.
Claims (14)
1. a kind of manufacture method of temperature-uniforming plate, its step include:
A () has metal-back and multiple hollow metallic bodies on one, the upper metal-back has an inwall
Face；
B each hollow metallic body is fixedly arranged on the internal face by welding manner by ()；
C () is respectively filled in a capillary structure in each hollow metal body and is formed with multiple support columns；
D () once the metal-back correspondence upper metal-back will be sealingly engaged, and on described metal-back
The cavity volume housed for each support column is formed with and the lower metal-back between；And
E () is inserted a working fluid in the cavity volume and carries out degasification and sealing.
2. the manufacture method of temperature-uniforming plate as claimed in claim 1, wherein described in step (a)
Upper metal-back includes a substrate and multiple radiating fins, and the substrate is carried on the back with the internal face is formed in
One outer surface of side, each radiating fin extend and are integrally formed from the outer surface.
3. the manufacture method of temperature-uniforming plate as claimed in claim 1, wherein described in step (b)
Welding manner is that spot welding or plasma-based are welded.
4. the manufacture method of temperature-uniforming plate as claimed in claim 1, wherein also wraps after step (a)
A step (a1) is included, capillary structure on is fixedly arranged on inwall by welding manner by the step (a1)
Face.
5. the manufacture method of temperature-uniforming plate as claimed in claim 1, wherein also wraps after step (b)
A step (a1) is included, capillary structure on is fixedly arranged on inwall by welding manner by the step (a1)
Face.
6. a kind of temperature-uniforming plate, including:
Once metal-back；
Metal-back on one, the correspondence lower metal-back are sealingly engaged, and on described metal-back and described
A cavity volume is formed between lower metal-back；
Multiple support columns, are contained in the cavity volume and are located at the upper metal-back and the lower metal
Between shell, each support column includes a hollow metallic body and be formed in inside the hollow metallic body
Capillary structure, one end of the hollow metallic body are fixedly arranged on the upper metal-back；And
One working fluid, fills in the cavity volume.
7. temperature-uniforming plate as claimed in claim 6, wherein the upper metal-back includes a substrate and many
Individual radiating fin, the substrate have an internal face and are formed in an outer surface of the internal face dorsal part,
Each radiating fin extends and is integrally formed from the outer surface.
8. temperature-uniforming plate as claimed in claim 7, wherein the hollow metallic body includes a round tube
And sealing cover, in a cover plate of described round tube one end, the cover plate is fixedly arranged on the internal face.
9. temperature-uniforming plate as claimed in claim 7, wherein the hollow metallic body includes a round tube,
One end of the round tube is fixedly arranged on the internal face, and the capillary structure passes the round tube and institute
State internal face and attach contact.
10. temperature-uniforming plate as claimed in claim 7, wherein the hollow metallic body comprising a round tube,
The cover plate for being connected to described round tube one end and the through hole for being opened in the cover plate, the cover plate are solid
Located at the internal face of the substrate, the capillary structure is passed the through hole and is pasted with the internal face
Attachment is touched.
11. temperature-uniforming plates as claimed in claim 7, wherein the hollow metallic body includes a conical tube,
Described conical tube one end is fixedly arranged on the internal face, the capillary structure pass the conical tube with it is described
Internal face attaches contact.
12. temperature-uniforming plates as claimed in claim 7, wherein the hollow metallic body comprising a conical tube,
The cover plate for being connected to described conical tube one end and the through hole for being opened in the cover plate, the cover plate are solid
Located at the internal face of the substrate, the capillary structure is passed the through hole and is pasted with the internal face
Attachment is touched.
13. temperature-uniforming plates as claimed in claim 7, which also includes capillary structure on, the upper hair
A metal net is organized as carefully, the metal net is arranged at intervals with multiple perforation, each perforation point
Accommodating each support column Yong Yu not be worn.
14. temperature-uniforming plates as claimed in claim 13, which also includes capillary structure, it is described under
Capillary structure is arranged at the inside of the lower metal-back and by folder tug in each support column and the lower metal-back
Between.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104131348A TWI592623B (en) | 2015-09-23 | 2015-09-23 | Vapor chamber and manufacturing method thereof |
| TW104131348 | 2015-09-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106546116A true CN106546116A (en) | 2017-03-29 |
Family
ID=58364965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610130024.8A Pending CN106546116A (en) | 2015-09-23 | 2016-03-09 | Temperature equalizing plate and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106546116A (en) |
| TW (1) | TWI592623B (en) |
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| CN107333442A (en) * | 2017-07-24 | 2017-11-07 | 苏州天脉导热科技有限公司 | Ultra-thin soaking plate and preparation method thereof |
| CN107484386A (en) * | 2016-06-08 | 2017-12-15 | 台达电子工业股份有限公司 | The manufacture method of heat conducting device |
| CN108710424A (en) * | 2018-06-08 | 2018-10-26 | 山东超越数控电子股份有限公司 | A kind of reinforcing VPX module heat dissipating methods |
| CN109327994A (en) * | 2017-07-31 | 2019-02-12 | 台达电子工业股份有限公司 | Soaking plate |
| CN109813010A (en) * | 2019-01-14 | 2019-05-28 | 合肥美的电冰箱有限公司 | Evaporator and refrigerator |
| CN110953906A (en) * | 2018-09-27 | 2020-04-03 | 高力热处理工业股份有限公司 | Method for manufacturing lower heat conducting assembly of temperature-equalizing plate and temperature-equalizing plate |
| CN110953907A (en) * | 2018-09-27 | 2020-04-03 | 高力热处理工业股份有限公司 | Manufacturing method of intermediate products of multiple temperature-equalizing plates and temperature-equalizing plate |
| CN111010858A (en) * | 2019-12-30 | 2020-04-14 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
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| CN107484386A (en) * | 2016-06-08 | 2017-12-15 | 台达电子工业股份有限公司 | The manufacture method of heat conducting device |
| CN107333442A (en) * | 2017-07-24 | 2017-11-07 | 苏州天脉导热科技有限公司 | Ultra-thin soaking plate and preparation method thereof |
| CN109327994B (en) * | 2017-07-31 | 2020-06-02 | 台达电子工业股份有限公司 | Vapor chamber |
| CN109327994A (en) * | 2017-07-31 | 2019-02-12 | 台达电子工业股份有限公司 | Soaking plate |
| CN108710424A (en) * | 2018-06-08 | 2018-10-26 | 山东超越数控电子股份有限公司 | A kind of reinforcing VPX module heat dissipating methods |
| CN110953906A (en) * | 2018-09-27 | 2020-04-03 | 高力热处理工业股份有限公司 | Method for manufacturing lower heat conducting assembly of temperature-equalizing plate and temperature-equalizing plate |
| CN110953907A (en) * | 2018-09-27 | 2020-04-03 | 高力热处理工业股份有限公司 | Manufacturing method of intermediate products of multiple temperature-equalizing plates and temperature-equalizing plate |
| CN111386001A (en) * | 2018-12-28 | 2020-07-07 | 赖耀惠 | Vapor chamber with liquid pipe inside |
| CN109813010A (en) * | 2019-01-14 | 2019-05-28 | 合肥美的电冰箱有限公司 | Evaporator and refrigerator |
| CN109813010B (en) * | 2019-01-14 | 2021-08-10 | 合肥美的电冰箱有限公司 | Evaporator and refrigerator |
| CN113424666A (en) * | 2019-02-12 | 2021-09-21 | 华为技术有限公司 | Radiator for radio remote unit |
| CN113424666B (en) * | 2019-02-12 | 2023-03-28 | 华为技术有限公司 | Radiator for radio remote unit |
| CN112665430A (en) * | 2019-10-15 | 2021-04-16 | 惠州惠立勤电子科技有限公司 | Thin type temperature-equalizing plate and manufacturing method thereof |
| CN111010858A (en) * | 2019-12-30 | 2020-04-14 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN111010858B (en) * | 2019-12-30 | 2021-11-16 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN111590073A (en) * | 2020-05-20 | 2020-08-28 | 北京遥感设备研究所 | Integrated flat plate micro-heat pipe structure and 3D printing manufacturing method thereof |
| US12061057B2 (en) | 2021-05-19 | 2024-08-13 | Nidec Corporation | Heat dissipation member including fin groups |
| TWI831243B (en) * | 2021-08-26 | 2024-02-01 | 雙鴻科技股份有限公司 | Heat dissipation module |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI592623B (en) | 2017-07-21 |
| TW201712288A (en) | 2017-04-01 |
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