CN108710424A - A kind of reinforcing VPX module heat dissipating methods - Google Patents
A kind of reinforcing VPX module heat dissipating methods Download PDFInfo
- Publication number
- CN108710424A CN108710424A CN201810585217.1A CN201810585217A CN108710424A CN 108710424 A CN108710424 A CN 108710424A CN 201810585217 A CN201810585217 A CN 201810585217A CN 108710424 A CN108710424 A CN 108710424A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- cold plate
- dissipation cold
- heat
- buckle teeth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
Abstract
The present invention provides a kind of reinforcing VPX module heat dissipating methods, is related to ruggedized computer technical field, and reinforcing VPX modules of the invention play boss using heat dissipation cold plate substrate and are integrally machined the structure type welded together with top heat dissipation buckle teeth.To ensure that heat dissipation area and radiating efficiency, buckle teeth part are ensured dimensional accuracy using mold form processing, welded together buckle teeth part with boss heat dissipation cold plate substrate using brazing mode.The integral heat sink area for increasing heat dissipation cold plate, reduces the thermal resistance of heat dissipation cold plate itself.
Description
Technical field
The present invention relates to ruggedized computer technical field more particularly to a kind of reinforcing VPX module heat dissipating methods.
Background technology
VPX specifications are to organize to propose by VITA, it is with the development of high speed serialization interconnection technique, integrated circuit integrated level
It improves, component miniaturization, and the calculating density and cooling requirements thus brought are higher and higher, IO type and quantity constantly increase
The states of the art and the application demand such as add and propose, target is as follows：6U, 3U module standard are defined, to meet adverse circumstances need
It wants；The high speed connector of suitable module is defined, and additional IO abilities are provided for module；It is serial that switch type is provided in intermodule
Interconnection provides corresponding open technical standard, with the various high speed transport protocols of compatibility；Compatible VME buses；Provide two-stage repair
LRM modular capabilities, user can select as needed.
Support a variety of high-speed serial bus agreements.Including Serial RapidIO, PCI Express, Ethernet.It supports
Higher single module power consumption.Support air-cooled, conduction cooling, liquid cooling, through-flow air-cooled（The centre of PMC and support plate is distinguished and admirable）Equal radiating modes.
VPX reinforces military computing platform framework, defines 0.8/0.85/1.0 inches of module thickness, front/top is increased to module
Portion, back/bottom metal lid are supported, and increase the built-in ESD defencive functions of high bandwidth connector on the connectors；It provides existing
Field replaceable module（LRM）Robustness needed for on-site maintenance, relatively often dismounting, the field changeable for replacing comprehensive subsystem
Unit（LRU）, reduce cost and complexity.Support 5V, 12 or, 48 V power voltage supplies, maximum power dissipation is up to 768 W.Most
It is big to support 192 high-speed differential interface@, 6.25 GHz.Structure size：233.35x160mm thickness 5HP.
The board and heat dissipation heat dissipation cold plate for reinforcing VPX modules are screwed together, and each board passes through VPX standard rails
It is inserted on backboard, is not then fallen off on screw fixingtype material crossbeam by drawing-aid device and panel.The heat of heater element on board
It is transmitted to heat dissipation heat dissipation cold plate, heat is shed by air-cooled mode.
As the performance for reinforcing the components such as CPU and each functional chip in VPX modules has obtained significant increase, calorific value
Also it dramatically increases.In entire case radiation scheme, dissipating for cabinet can be conveniently solved by way of replacing fan
Heat condition radiates so reinforce and how more effectively to increase by the heat derives of each euthermic chip and as far as possible in VPX modules
Area becomes the bottleneck in heat sink conception.
Invention content
The present invention proposes a kind of reinforcing VPX module heat dissipating methods.To overcome reinforcing VPX modules in above-mentioned technical background to dissipate
The problem that hot area is inadequate and intrinsic conduction thermal resistance is excessive.
The technical solution adopted by the present invention to solve the technical problems is：
A kind of reinforcing VPX module heat dissipating methods, reinforcing VPX modules are played boss and be integrally machined using heat dissipation cold plate substrate to be dissipated with top
The structure type that hot buckle teeth welds together.To ensure that heat dissipation area and radiating efficiency, buckle teeth part use mold form processing
Ensure dimensional accuracy, is welded together buckle teeth part with boss heat dissipation cold plate substrate using brazing mode.
After buckle teeth welding structure, the heat dissipation area of heat dissipation cold plate can be effectively solved the problems, such as.But it is copper or aluminum to dissipate
The heat conductivility of hot cold plate substrate itself cannot still be met the requirements, and still have larger thermal resistance.To solve heat dissipation cold plate substrate certainly
The thermal resistance problem of body, by heat dissipation cold plate substrate design at hollow structure, heat dissipation cold plate substrate hollow part liquid filling body and
Capillary structure carries out heat conduction using phase transformation.Heat dissipation cold plate substrate after completion change, which is equivalent to, is connected in parallel multiple heat pipes,
Thus there is high heat conductivility.
By the transformation of above-mentioned heat dissipation cold plate, both solved the problems, such as the heat dissipation area of heat dissipation cold plate, and increased heat dissipation cold plate
Integral heat sink area, and utilize heat conduction with phase change principle, reduce the thermal resistance of heat dissipation cold plate itself.Therefore, from the hair of module
The thermally conductive pathways thermal resistance in thermal element to cabinet air duct has obtained great reduction.
The beneficial effects of the invention are as follows：
1. solving the problems, such as the heat dissipation area of heat dissipation cold plate, the integral heat sink area of heat dissipation cold plate is increased；
2. using the principle of heat conduction with phase change, the thermal resistance of heat dissipation cold plate itself is reduced.
Description of the drawings
Fig. 1 is modular structure explosive view of the present invention；
Fig. 2 is structure of the invention design diagram.
Wherein, 1, VPX mainboards；2, heater element；3, VPX connectors；4, heat dissipation cold plate substrate；5, buckle teeth；6, handle；7,
Module front panel；8, fixing screws；9, capillary structure.
Specific implementation mode
More detailed elaboration is carried out to present disclosure below：
To solve the problems, such as that reinforcing VPX module heat dissipatings area is inadequate and intrinsic conduction thermal resistance is excessive, the present invention is on heat dissipation cold plate
It increases buckle teeth structure and devises interlayer.As shown in Figure 1, welding buckle teeth 5 on heat dissipation cold plate substrate 4.It is welded on VPX mainboards 1
Be connected to various heater elements 2, VPX connectors 3 be connected on one side in VPX mainboards 1, another side be connected with module front panel 7 and
Handle 6, and be connected and fixed each section by fixing screws 8.The entirety that 5 structure of buckle teeth can greatly increase module dissipates
Hot area.
It is designed with an interlayer in heat dissipation cold plate substrate 4, is hollow structure in interlayer, capillary structure 9 is filled in hollow part
It is evacuated with after liquid.Filling position is equivalent to a heat pipe, and entire interlayer is equivalent to the heat pipe of multiple parallel connections, utilizes phase
The principle of change carries out heat conduction, and the heat of heat dissipation cold plate substrate 4 can be efficiently transmitted on heat dissipation cold plate buckle teeth 5 rapidly, makes entire
The thermal resistance heat dissipation cold plate smaller more without dissection of heat dissipation cold plate.
It reduces the thermal resistance of heat dissipation cold plate itself simultaneously by the above method and increases module heat dissipating area, make from module
Heater element 2 obtained great reduction to the thermally conductive pathways thermal resistance outside heat dissipation cold plate buckle teeth 5.
In Fig. 1, using 6U VPX modules as structural representation.Meanwhile the present invention is not only applicable to 6U or 3U VPX and adds
Solid model block, for having the module of CPCI, CPCI-E, LRM of similar structures and other forms equally applicable.
Claims (3)
1. a kind of reinforcing VPX module heat dissipating methods, which is characterized in that
VPX modules will be reinforced and play boss using heat dissipation cold plate substrate and be integrally machined and welded together with top heat dissipation buckle teeth；To protect
Heat dissipation area and radiating efficiency are demonstrate,proved, buckle teeth part ensures dimensional accuracy using mold form processing, using brazing mode by buckle teeth
Part welds together with band boss heat dissipation cold plate substrate.
2. according to the method described in claim 1, it is characterized in that,
After buckle teeth welding structure, by heat dissipation cold plate substrate design at hollow structure, in the hollow part of heat dissipation cold plate substrate
Liquid filling body and capillary structure carry out heat conduction using phase transformation so that the heat dissipation cold plate substrate after completion change is equivalent to will be multiple
Heat pipe is connected in parallel.
3. according to the method described in claim 2, it is characterized in that,
In the heat transfer of heat dissipation cold plate substrate to heat dissipation cold plate buckle teeth, the thermal resistance of entire heat dissipation cold plate is made to reduce.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810585217.1A CN108710424A (en) | 2018-06-08 | 2018-06-08 | A kind of reinforcing VPX module heat dissipating methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810585217.1A CN108710424A (en) | 2018-06-08 | 2018-06-08 | A kind of reinforcing VPX module heat dissipating methods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108710424A true CN108710424A (en) | 2018-10-26 |
Family
ID=63871566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810585217.1A Pending CN108710424A (en) | 2018-06-08 | 2018-06-08 | A kind of reinforcing VPX module heat dissipating methods |
Country Status (1)
| Country | Link |
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| CN (1) | CN108710424A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1878451A (en) * | 2005-06-10 | 2006-12-13 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| CN104168744A (en) * | 2014-07-30 | 2014-11-26 | 太仓陶氏电气有限公司 | Intensive radiator |
| CN205755222U (en) * | 2016-05-13 | 2016-11-30 | 北京自动化控制设备研究所 | A kind of heat abstractor of high power digital circuit plate |
| CN106546116A (en) * | 2015-09-23 | 2017-03-29 | 迈萪科技股份有限公司 | Temperature-uniforming plate and preparation method thereof |
| CN206441100U (en) * | 2017-01-03 | 2017-08-25 | 华胜信泰信息产业发展有限公司 | Radiator structure, two-way processor and multichannel process device heat abstractor and server |
-
2018
- 2018-06-08 CN CN201810585217.1A patent/CN108710424A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1878451A (en) * | 2005-06-10 | 2006-12-13 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| CN104168744A (en) * | 2014-07-30 | 2014-11-26 | 太仓陶氏电气有限公司 | Intensive radiator |
| CN106546116A (en) * | 2015-09-23 | 2017-03-29 | 迈萪科技股份有限公司 | Temperature-uniforming plate and preparation method thereof |
| CN205755222U (en) * | 2016-05-13 | 2016-11-30 | 北京自动化控制设备研究所 | A kind of heat abstractor of high power digital circuit plate |
| CN206441100U (en) * | 2017-01-03 | 2017-08-25 | 华胜信泰信息产业发展有限公司 | Radiator structure, two-way processor and multichannel process device heat abstractor and server |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181026 |
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| RJ01 | Rejection of invention patent application after publication |